CN102543917A - 集成电路散热装置 - Google Patents
集成电路散热装置 Download PDFInfo
- Publication number
- CN102543917A CN102543917A CN2010106064352A CN201010606435A CN102543917A CN 102543917 A CN102543917 A CN 102543917A CN 2010106064352 A CN2010106064352 A CN 2010106064352A CN 201010606435 A CN201010606435 A CN 201010606435A CN 102543917 A CN102543917 A CN 102543917A
- Authority
- CN
- China
- Prior art keywords
- microchannel
- integrated circuit
- heat dissipation
- dissipation device
- circuit heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title abstract description 24
- 239000012530 fluid Substances 0.000 claims abstract description 48
- 230000017525 heat dissipation Effects 0.000 claims description 27
- 238000010276 construction Methods 0.000 claims description 13
- 239000004020 conductor Substances 0.000 claims description 12
- 238000009828 non-uniform distribution Methods 0.000 claims description 3
- 230000000903 blocking effect Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 47
- 239000010410 layer Substances 0.000 description 38
- 239000002184 metal Substances 0.000 description 33
- 229910052751 metal Inorganic materials 0.000 description 33
- 238000000034 method Methods 0.000 description 23
- 230000008569 process Effects 0.000 description 17
- 239000000463 material Substances 0.000 description 15
- 229920002120 photoresistant polymer Polymers 0.000 description 14
- 230000004888 barrier function Effects 0.000 description 10
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- 238000005516 engineering process Methods 0.000 description 9
- 238000002161 passivation Methods 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 7
- 238000000151 deposition Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000008021 deposition Effects 0.000 description 6
- 239000011229 interlayer Substances 0.000 description 6
- 230000005855 radiation Effects 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 238000001465 metallisation Methods 0.000 description 4
- 238000001259 photo etching Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000013459 approach Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000005764 inhibitory process Effects 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
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- 206010034960 Photophobia Diseases 0.000 description 1
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- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 208000013469 light sensitivity Diseases 0.000 description 1
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- 229910052759 nickel Inorganic materials 0.000 description 1
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- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (11)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010606435.2A CN102543917B (zh) | 2010-12-24 | 集成电路散热装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010606435.2A CN102543917B (zh) | 2010-12-24 | 集成电路散热装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102543917A true CN102543917A (zh) | 2012-07-04 |
CN102543917B CN102543917B (zh) | 2016-12-14 |
Family
ID=
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104867890A (zh) * | 2015-05-07 | 2015-08-26 | 上海交通大学 | 一种用于3d芯片的相变冷却结构 |
CN108766897A (zh) * | 2018-06-12 | 2018-11-06 | 厦门大学 | 实现大功率GaN器件层散热的三维异质结构的封装方法 |
WO2020248905A1 (zh) * | 2019-06-12 | 2020-12-17 | 上海先方半导体有限公司 | 一种晶圆级三维堆叠微流道散热结构及其制造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050211418A1 (en) * | 2002-11-01 | 2005-09-29 | Cooligy, Inc. | Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device |
CN1728365A (zh) * | 2004-07-01 | 2006-02-01 | 国际商业机器公司 | 用于半导体集成电路封装的微通道冷却的设备和方法 |
CN1819165A (zh) * | 2004-11-24 | 2006-08-16 | 朗迅科技公司 | 微通道冷却技术 |
CN101005753A (zh) * | 2006-01-17 | 2007-07-25 | 德尔菲技术公司 | 微通道散热装置 |
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050211418A1 (en) * | 2002-11-01 | 2005-09-29 | Cooligy, Inc. | Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device |
CN1728365A (zh) * | 2004-07-01 | 2006-02-01 | 国际商业机器公司 | 用于半导体集成电路封装的微通道冷却的设备和方法 |
CN1819165A (zh) * | 2004-11-24 | 2006-08-16 | 朗迅科技公司 | 微通道冷却技术 |
CN101005753A (zh) * | 2006-01-17 | 2007-07-25 | 德尔菲技术公司 | 微通道散热装置 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104867890A (zh) * | 2015-05-07 | 2015-08-26 | 上海交通大学 | 一种用于3d芯片的相变冷却结构 |
CN108766897A (zh) * | 2018-06-12 | 2018-11-06 | 厦门大学 | 实现大功率GaN器件层散热的三维异质结构的封装方法 |
WO2020248905A1 (zh) * | 2019-06-12 | 2020-12-17 | 上海先方半导体有限公司 | 一种晶圆级三维堆叠微流道散热结构及其制造方法 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: NATIONAL CENTER FOR ADVANCED PACKAGING Free format text: FORMER OWNER: INST OF MICROELECTRONICS, C. A. S Effective date: 20150227 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 100029 CHAOYANG, BEIJING TO: 214135 WUXI, JIANGSU PROVINCE |
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TA01 | Transfer of patent application right |
Effective date of registration: 20150227 Address after: Taihu international science and Technology Park in Jiangsu province Wuxi City Linghu road 214135 Wuxi national hi tech Industrial Development Zone No. 200 Chinese Sensor Network International Innovation Park building D1 Applicant after: National Center for Advanced Packaging Co., Ltd. Address before: 100029 Beijing city Chaoyang District Beitucheng West Road No. 3 Institute of Microelectronics Applicant before: Institute of Microelectronics, Chinese Academy of Sciences |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170816 Address after: 200331 room 155-2, ginkgo Road, Shanghai, Putuo District, China, 4 Patentee after: Shanghai State Intellectual Property Services Co., Ltd. Address before: Taihu international science and Technology Park in Jiangsu province Wuxi City Linghu road 214135 Wuxi national hi tech Industrial Development Zone No. 200 Chinese Sensor Network International Innovation Park building D1 Patentee before: National Center for Advanced Packaging Co., Ltd. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20191202 Address after: 214028 Jiangsu New District of Wuxi City Linghu Road No. 200 Chinese Sensor Network International Innovation Park building D1 Patentee after: National Center for Advanced Packaging Co., Ltd. Address before: 200331 room 155-2, ginkgo Road, Shanghai, Putuo District, China, 4 Patentee before: Shanghai State Intellectual Property Services Co., Ltd. |