RU2465685C2 - Устройство, содержащее слоеную конструкцию, для обнаружения теплового излучения, способ его изготовления и использования - Google Patents

Устройство, содержащее слоеную конструкцию, для обнаружения теплового излучения, способ его изготовления и использования Download PDF

Info

Publication number
RU2465685C2
RU2465685C2 RU2009144002/28A RU2009144002A RU2465685C2 RU 2465685 C2 RU2465685 C2 RU 2465685C2 RU 2009144002/28 A RU2009144002/28 A RU 2009144002/28A RU 2009144002 A RU2009144002 A RU 2009144002A RU 2465685 C2 RU2465685 C2 RU 2465685C2
Authority
RU
Russia
Prior art keywords
substrate
sensor
cover
circuit
thermal radiation
Prior art date
Application number
RU2009144002/28A
Other languages
English (en)
Russian (ru)
Other versions
RU2009144002A (ru
Inventor
Карстен ГИБЕЛЕР (GB)
Карстен ГИБЕЛЕР
Матиас ШРАЙТЕР (DE)
Матиас ШРАЙТЕР
Йорг ЦАПФ (DE)
Йорг ЦАПФ
Original Assignee
Пайриос Лтд.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Пайриос Лтд. filed Critical Пайриос Лтд.
Publication of RU2009144002A publication Critical patent/RU2009144002A/ru
Application granted granted Critical
Publication of RU2465685C2 publication Critical patent/RU2465685C2/ru

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/04—Casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/04—Casings
    • G01J5/041—Mountings in enclosures or in a particular environment
    • G01J5/045—Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/34—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using capacitors, e.g. pyroelectric capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Radiation Pyrometers (AREA)
  • Measurement Of Radiation (AREA)
RU2009144002/28A 2007-05-29 2008-05-28 Устройство, содержащее слоеную конструкцию, для обнаружения теплового излучения, способ его изготовления и использования RU2465685C2 (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007024903A DE102007024903B4 (de) 2007-05-29 2007-05-29 Vorrichtung mit Sandwichstruktur zur Detektion von Wärmestrahlung, Verfahren zum Herstellen und Verwendung der Vorrichtung
DE102007024903.0 2007-05-29

Publications (2)

Publication Number Publication Date
RU2009144002A RU2009144002A (ru) 2011-07-10
RU2465685C2 true RU2465685C2 (ru) 2012-10-27

Family

ID=39627771

Family Applications (1)

Application Number Title Priority Date Filing Date
RU2009144002/28A RU2465685C2 (ru) 2007-05-29 2008-05-28 Устройство, содержащее слоеную конструкцию, для обнаружения теплового излучения, способ его изготовления и использования

Country Status (10)

Country Link
US (1) US8487257B2 (enExample)
EP (1) EP2153188B1 (enExample)
JP (1) JP5455239B2 (enExample)
KR (1) KR101496673B1 (enExample)
CN (1) CN101688811B (enExample)
AU (1) AU2008256414A1 (enExample)
BR (1) BRPI0812098B1 (enExample)
DE (1) DE102007024903B4 (enExample)
RU (1) RU2465685C2 (enExample)
WO (1) WO2008145354A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU217150U1 (ru) * 2022-09-05 2023-03-21 Олег Викторович Сохраннов Теплоотражающий кожух тепловизора

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007062688B3 (de) * 2007-12-17 2009-02-05 Pyreos Ltd. Vorrichtung mit einer abgeschirmten Sandwichstruktur zur Detektion von Wärmestrahlung und Verwendung der Vorrichtung
DE102009013336A1 (de) * 2009-03-16 2010-09-23 Perkinelmer Optoelectronics Gmbh & Co.Kg Pyroelektrisches Material, Strahlungssensor, Verfahren zur Herstellung eines Strahlungssensors und Verwendung von Lithiumtantalat und Lithiumniobat
US9118132B2 (en) * 2011-09-08 2015-08-25 Bae Systems Information And Electronic Systems Integration Vacuum compatible high-density electrical interconnect system
DE102012216618A1 (de) 2012-09-18 2014-03-20 Robert Bosch Gmbh Anordnung von mindestens zwei Wafern zum Detektieren von elektromagnetischer Strahlung und Verfahren zum Herstellen der Anordnung
DE102015208701A1 (de) * 2015-05-11 2016-11-17 Infratec Gmbh Vorrichtung zur gleichzeitigen Bestimmung mehrerer unterschiedlicher Stoffe und/oder Stoffkonzentrationen
FR3080705B1 (fr) * 2018-04-27 2020-10-30 Tn Int Emballage de transport et/ou d'entreposage de matieres radioactives permettant une fabrication facilitee ainsi qu'une amelioration de la conduction thermique

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2180098C2 (ru) * 2000-02-29 2002-02-27 Открытое акционерное общество "Ракетно-космическая корпорация "Энергия" им. С.П. Королева" Устройство определения интенсивности инфракрасного облучения
WO2002043154A1 (de) * 2000-11-27 2002-05-30 Siemens Aktiengesellschaft Pyroelektrischer bildensor und verfahren zu seiner herstellung
DE102004020685B3 (de) * 2004-04-28 2005-09-01 Robert Bosch Gmbh Infrarotsensor mit Getterschicht
WO2007000172A1 (en) * 2005-06-27 2007-01-04 Hl-Planar Technik Gmbh Device for the detection of electromagnetic waves and method for producing such a device

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0219725A (ja) * 1988-07-07 1990-01-23 Matsushita Electric Ind Co Ltd 焦電形赤外検出素子アレイ、焦電形赤外検出器およびそれらの製法
AU631734B2 (en) 1990-04-18 1992-12-03 Terumo Kabushiki Kaisha Infrared ray sensor and method of manufacturing the same
EP0566156B1 (en) 1992-04-17 1997-08-27 Terumo Kabushiki Kaisha Infrared sensor and method for production thereof
JP3181363B2 (ja) * 1992-04-17 2001-07-03 テルモ株式会社 赤外線センサおよびその製造方法
DE19525071A1 (de) 1995-07-10 1997-01-16 Siemens Ag Pyroelektrisches Bauelement und Verfahren zur Herstellung
US5729019A (en) 1995-12-29 1998-03-17 Honeywell Inc. Split field-of-view uncooled infrared sensor
US5962854A (en) * 1996-06-12 1999-10-05 Ishizuka Electronics Corporation Infrared sensor and infrared detector
JP2000298063A (ja) * 1999-04-14 2000-10-24 Tdk Corp 赤外線検出器
DE19932308C2 (de) * 1999-07-10 2001-10-25 Bosch Gmbh Robert Sensor, insbesondere Thermosensor
JP2001174324A (ja) 1999-12-17 2001-06-29 Tdk Corp 赤外線検出器および赤外線検出装置
DE10004216C2 (de) 2000-02-01 2002-09-19 Siemens Ag Vorrichtung zur Detektion von Wärmestrahlung und Verwendung der Vorrichtung
US6890834B2 (en) 2001-06-11 2005-05-10 Matsushita Electric Industrial Co., Ltd. Electronic device and method for manufacturing the same
JP3519720B2 (ja) * 2001-06-11 2004-04-19 松下電器産業株式会社 電子デバイス
AU2003255254A1 (en) * 2002-08-08 2004-02-25 Glenn J. Leedy Vertical system integration
JP4385255B2 (ja) * 2004-06-10 2009-12-16 日本電気株式会社 ボロメータ型赤外線検出器及び残像の低減方法
US7204737B2 (en) * 2004-09-23 2007-04-17 Temic Automotive Of North America, Inc. Hermetically sealed microdevice with getter shield

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2180098C2 (ru) * 2000-02-29 2002-02-27 Открытое акционерное общество "Ракетно-космическая корпорация "Энергия" им. С.П. Королева" Устройство определения интенсивности инфракрасного облучения
WO2002043154A1 (de) * 2000-11-27 2002-05-30 Siemens Aktiengesellschaft Pyroelektrischer bildensor und verfahren zu seiner herstellung
DE102004020685B3 (de) * 2004-04-28 2005-09-01 Robert Bosch Gmbh Infrarotsensor mit Getterschicht
WO2007000172A1 (en) * 2005-06-27 2007-01-04 Hl-Planar Technik Gmbh Device for the detection of electromagnetic waves and method for producing such a device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU217150U1 (ru) * 2022-09-05 2023-03-21 Олег Викторович Сохраннов Теплоотражающий кожух тепловизора

Also Published As

Publication number Publication date
EP2153188B1 (de) 2012-05-16
BRPI0812098B1 (pt) 2018-06-19
DE102007024903A1 (de) 2008-12-11
AU2008256414A1 (en) 2008-12-04
JP5455239B2 (ja) 2014-03-26
RU2009144002A (ru) 2011-07-10
BRPI0812098A2 (pt) 2014-11-25
KR101496673B1 (ko) 2015-02-27
WO2008145354A1 (de) 2008-12-04
US8487257B2 (en) 2013-07-16
EP2153188A1 (de) 2010-02-17
US20100264311A1 (en) 2010-10-21
DE102007024903B4 (de) 2009-05-07
CN101688811B (zh) 2013-10-23
CN101688811A (zh) 2010-03-31
JP2010528301A (ja) 2010-08-19
KR20100023008A (ko) 2010-03-03

Similar Documents

Publication Publication Date Title
RU2468346C2 (ru) Устройство с мембранной конструкцией для обнаружения теплового излучения, способ его изготовления и использования
RU2465685C2 (ru) Устройство, содержащее слоеную конструкцию, для обнаружения теплового излучения, способ его изготовления и использования
US9960094B2 (en) Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
JP2012008003A (ja) 赤外線センサ
TW200933761A (en) Molded sensor package and assembly method
US6528857B1 (en) Chip size image sensor bumped package
US6509560B1 (en) Chip size image sensor in wirebond package with step-up ring for electrical contact
KR101479963B1 (ko) 스크린된 샌드위치 구조를 갖는 열 방출을 감지하기 위한 장치, 및 상기 장치의 사용
US6629633B1 (en) Chip size image sensor bumped package fabrication method
KR100769587B1 (ko) 비접촉식 적외선 온도 센서
KR100502212B1 (ko) 이미지 센서 및 그 제조방법
US20160049434A1 (en) Digital radiation sensor package
TW202306057A (zh) 熱感測封裝
US6620646B1 (en) Chip size image sensor wirebond package fabrication method
KR20070090379A (ko) 비접촉식 적외선 온도 센서 및 이의 제조 방법
JP2012037394A (ja) 赤外線センサの製造方法
US20230207713A1 (en) Image sensor package
US20230026571A1 (en) Thermal sensor package
JPH06509912A (ja) 電子部品およびそのパッケージ内への装着方法
JP2011252724A (ja) 赤外線センサおよびその製造方法
TWM454052U (zh) 具一體成型透鏡模組之影像感測器結構及其透鏡模組
JPH04116959A (ja) 密着型イメージセンサ

Legal Events

Date Code Title Description
MM4A The patent is invalid due to non-payment of fees

Effective date: 20190529