JP2012008003A - 赤外線センサ - Google Patents
赤外線センサ Download PDFInfo
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- JP2012008003A JP2012008003A JP2010144176A JP2010144176A JP2012008003A JP 2012008003 A JP2012008003 A JP 2012008003A JP 2010144176 A JP2010144176 A JP 2010144176A JP 2010144176 A JP2010144176 A JP 2010144176A JP 2012008003 A JP2012008003 A JP 2012008003A
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- 229910052782 aluminium Inorganic materials 0.000 description 1
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- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
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- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
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- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/024—Arrangements for cooling, heating, ventilating or temperature compensation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/04—Casings
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/04—Casings
- G01J5/041—Mountings in enclosures or in a particular environment
- G01J5/045—Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
- G01J5/0806—Focusing or collimating elements, e.g. lenses or concave mirrors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
- G01J5/0831—Masks; Aperture plates; Spatial light modulators
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/12—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/12—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
- G01J5/14—Electrical features thereof
- G01J5/16—Arrangements with respect to the cold junction; Compensating influence of ambient temperature or other variables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
【解決手段】サーモパイル30aにより構成される感温部30を具備する複数の画素部2が半導体基板1の一表面側においてアレイ状に配置された赤外線センサチップ100と、赤外線センサチップ100の出力信号を信号処理するICチップ102とを備える。パッケージ103は、赤外線センサチップ100およびICチップ102が横並びで実装されたパッケージ本体104と、赤外線を透過するレンズ153を有しパッケージ本体104に気密的に接合されたパッケージ蓋105とを有する。パッケージ103内に、赤外線センサチップ100への赤外線を通す窓孔108を有しICチップ102の発熱に応じた各画素部2の温接点T1および冷接点T2の温度変化量を均一化するカバー部材106を設けてある。
【選択図】図1
Description
以下、本実施形態の赤外線センサについて図1〜図14を参照しながら説明する。
本実施形態の赤外線センサの基本構成は実施形態1と略同じであり、図19に示すように、カバー部材106の形状などが相違する。なお、実施形態1と同様の構成要素には同一の符号を付して説明を適宜省略する。
本実施形態の赤外線センサの基本構成は実施形態2と略同じであり、図20に示すように、カバー部材106の形状などが相違する。なお、実施形態2と同様の構成要素には同一の符号を付して説明を省略する。
本実施形態の赤外線センサの基本構成は実施形態2と略同じであり、図21に示すように、カバー160の形状が相違する。なお、実施形態2と同様の構成要素には同一の符号を付して説明を省略する。
2 画素部
30a サーモパイル
100 赤外線センサチップ
102 ICチップ
103 パッケージ
104 パッケージ本体
105 パッケージ蓋
106 カバー部材
107 前板部
108 窓孔
109 側板部
141 第1の領域
142 第2の領域
153 レンズ
T1 温接点
T2 冷接点
Claims (4)
- サーモパイルにより構成される感温部を具備する複数の画素部が半導体基板の一表面側においてアレイ状に配置された赤外線センサチップと、前記赤外線センサチップの出力信号を信号処理するICチップと、前記赤外線センサチップおよび前記ICチップが収納されたパッケージとを備え、前記パッケージが、前記赤外線センサチップおよび前記ICチップが横並びで実装されたパッケージ本体と、前記赤外線センサチップでの検知対象の赤外線を透過する機能を有し前記パッケージ本体との間に前記赤外線センサチップおよび前記ICチップを囲む形で前記パッケージ本体に気密的に接合されたパッケージ蓋とを有し、前記パッケージ内に、前記赤外線センサチップへの赤外線を通す窓孔を有し前記ICチップの発熱に応じた前記各画素部の温接点および冷接点の温度変化量を均一化するカバー部材を設けてなることを特徴とする赤外線センサ。
- 前記カバー部材は、前記赤外線センサチップの前方に位置し前記窓孔が形成された前板部と、前記前板部の外周縁から後方へ延設され前記ICチップと前記赤外線センサチップとの間で前記パッケージ本体に接合された側板部とで構成されてなることを特徴とする請求項1記載の赤外線センサ。
- 前記パッケージ本体は、前記赤外線センサチップを実装する第1の領域の表面よりも前記ICチップを実装する第2の領域の表面を後退させてあり、前記カバー部材は、前記赤外線センサチップの前方に位置し前記窓孔が形成された前板部と、前記前板部の外周縁から後方へ延設され前記赤外線センサチップと前記ICチップとの並設方向に沿った前記赤外線センサチップの両側面それぞれの側方に位置し前記パッケージ本体に接合された2つの側板部とを備え、前記前板部は、前記前板部の外周線の投影領域内に前記赤外線センサチップおよび前記ICチップが収まる大きさに形成されてなることを特徴とする請求項1記載の赤外線センサ。
- 前記カバー部材は、前記前板部の前記窓孔が矩形状であり、平面視で前記窓孔の前記ICチップ側の内周線が前記赤外線センサチップの前記ICチップ側の外周線よりも前記ICチップ側にあることを特徴とする請求項3記載の赤外線センサ。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010144176A JP5842118B2 (ja) | 2010-06-24 | 2010-06-24 | 赤外線センサ |
PCT/JP2011/064435 WO2011162346A1 (ja) | 2010-06-24 | 2011-06-23 | 赤外線センサ |
US13/806,111 US9478682B2 (en) | 2010-06-24 | 2011-06-23 | IR sensor package including a cover member and a sensor chip recessed into the package body |
CN201180027200.0A CN102933942B (zh) | 2010-06-24 | 2011-06-23 | 红外线传感器 |
EP11798227.2A EP2587234A1 (en) | 2010-06-24 | 2011-06-23 | Infrared sensor |
KR1020137001304A KR20130031342A (ko) | 2010-06-24 | 2011-06-23 | 적외선 센서 |
TW100122264A TW201214691A (en) | 2010-06-24 | 2011-06-24 | Infrared sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010144176A JP5842118B2 (ja) | 2010-06-24 | 2010-06-24 | 赤外線センサ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012008003A true JP2012008003A (ja) | 2012-01-12 |
JP5842118B2 JP5842118B2 (ja) | 2016-01-13 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010144176A Active JP5842118B2 (ja) | 2010-06-24 | 2010-06-24 | 赤外線センサ |
Country Status (7)
Country | Link |
---|---|
US (1) | US9478682B2 (ja) |
EP (1) | EP2587234A1 (ja) |
JP (1) | JP5842118B2 (ja) |
KR (1) | KR20130031342A (ja) |
CN (1) | CN102933942B (ja) |
TW (1) | TW201214691A (ja) |
WO (1) | WO2011162346A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017181130A (ja) * | 2016-03-29 | 2017-10-05 | 三菱マテリアル株式会社 | 赤外線センサ装置 |
KR20190016538A (ko) * | 2016-06-21 | 2019-02-18 | 하이만 센서 게엠베하 | 온도를 측정하거나 가스를 검출하기 위한 서모파일 적외선 개별 센서 |
US10288488B2 (en) | 2015-02-06 | 2019-05-14 | Panasonic Intellectual Property Management Co., Ltd. | Infrared detecting device |
WO2022038828A1 (ja) * | 2020-08-19 | 2022-02-24 | パナソニックIpマネジメント株式会社 | 赤外線センサ |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2011162346A1 (ja) | 2011-12-29 |
TW201214691A (en) | 2012-04-01 |
JP5842118B2 (ja) | 2016-01-13 |
US20130093037A1 (en) | 2013-04-18 |
KR20130031342A (ko) | 2013-03-28 |
CN102933942B (zh) | 2014-12-10 |
CN102933942A (zh) | 2013-02-13 |
US9478682B2 (en) | 2016-10-25 |
EP2587234A1 (en) | 2013-05-01 |
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