WO2018166095A1 - 红外温度传感器及终端 - Google Patents

红外温度传感器及终端 Download PDF

Info

Publication number
WO2018166095A1
WO2018166095A1 PCT/CN2017/089587 CN2017089587W WO2018166095A1 WO 2018166095 A1 WO2018166095 A1 WO 2018166095A1 CN 2017089587 W CN2017089587 W CN 2017089587W WO 2018166095 A1 WO2018166095 A1 WO 2018166095A1
Authority
WO
WIPO (PCT)
Prior art keywords
temperature sensor
infrared
circuit board
package
infrared temperature
Prior art date
Application number
PCT/CN2017/089587
Other languages
English (en)
French (fr)
Inventor
李辰龙
赵辛
崔闯
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to CN201780010355.0A priority Critical patent/CN108702402B/zh
Publication of WO2018166095A1 publication Critical patent/WO2018166095A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly

Definitions

  • the embodiments of the present invention relate to the field of terminal technologies, and in particular, to an infrared temperature sensor and a terminal.
  • the existing infrared temperature sensor structure is to place a silicon infrared lens and a thermopile in the center of the package.
  • the infrared temperature sensor When applied to a mobile phone, the infrared temperature sensor is directly soldered to the mobile phone main board, and the mobile phone casing is processed with a through hole at a corresponding position, and the infrared temperature sensor is disposed in the through hole along the axial direction of the through hole.
  • the sensor is easily displaced in the through hole when it is squeezed, and in order to prevent external dust, liquid, etc. from entering the inside of the mobile phone through the gap, it is necessary to cover the through hole with a dustproof cover.
  • the installed cover plate not only requires high infrared radiation transmittance, but also requires a temperature calibration after assembly, so that increasing the production process also affects the stability of the sensor.
  • Embodiments of the present invention provide an infrared temperature sensor that does not affect efficiency of a self-contained package structure.
  • the embodiment of the invention further provides a terminal.
  • the infrared temperature sensor includes a package body and an infrared sensing element
  • the package body includes a top surface and a bottom surface opposite to the top surface, and the top surface is convexly provided with a protrusion.
  • the protrusion is provided with a sensing surface and a package surface; the package surface is disposed around the sensing surface,
  • the package surface is connected to the top surface and the sensing surface, the package is inclined toward the sensing surface, the infrared sensing element is encapsulated in the package body, and the infrared sensing element is located in the The raised position exposes the sensing surface.
  • sensing surface is parallel to the top surface and faces the same direction.
  • the package body has a symmetrical structure, and the protrusion is located at a middle position of the top surface.
  • the infrared sensing component comprises a thermopile and a silicon infrared lens covering the thermopile, the silicon infrared lens exposing the sensing surface and being flush with a plane of the sensing surface.
  • the infrared temperature sensor further includes a digitizer and a transmission module disposed in the package, the digitizer is connected to the transmission module, and the digitizer senses the infrared sensing component.
  • the temperature signal is converted into a digital signal and sent out through the transmitting module.
  • the infrared temperature sensor further includes a sensor circuit board and a connector electrically connected to one side of the sensor circuit board, and a bottom surface of the package body is connected to another side of the sensor circuit board, and the infrared temperature sensor senses The measured temperature signal is transmitted through the sensor circuit board and the connector.
  • the terminal of the embodiment of the present invention includes a housing and a circuit board encapsulated in the housing, and further includes the infrared temperature sensor, wherein the infrared temperature sensor is electrically connected to the circuit board.
  • the outer casing includes an inner surface, an outer surface, and a mounting hole penetrating the inner surface and the outer surface, the hole wall of the mounting hole including a resisting wall corresponding to the convex package surface and corresponding to the top surface Connecting wall,
  • the infrared temperature sensor is located in the mounting hole, and the protruding package surface is adhered to the resisting wall, and the top surface is in abutting connection with the connecting wall, and the sensing surface is exposed
  • the outer surface is said to be flush with the outer surface.
  • the infrared temperature sensor or the circuit board is further provided with a digitizer and a transmission module, the number The word converter converts the temperature signal sensed by the infrared sensing component into a digital signal and transmits it through the transmitting module.
  • the bottom surface of the package body is provided with a lead
  • the circuit board is provided with a clamping elastic piece
  • the pin is inserted into the clamping elastic piece to realize electrical connection between the infrared temperature sensor and the circuit board.
  • the infrared temperature sensor further includes a sensor circuit board and a connector electrically connected to one side of the sensor circuit board, a bottom surface of the package body is connected to the other side of the sensor circuit board, the connector and the connector Circuit board insertion enables electrical connection of the sensor circuit board to the circuit board.
  • the sealing wall is embedded with a sealing ring on a periphery of one side of the outer surface, and the sealing ring seals the sealing surface and the resisting wall.
  • the top surface of the package is adhered and fixed to the connecting wall.
  • the infrared temperature sensor sets the package portion provided with the infrared sensing member to be convex, and the convex package surface is inclined to form a structure with a self-contained package surface, so that the infrared temperature sensor and the mobile phone
  • the package surface for tilting can directly act as a force receiving surface to resist the outer casing, and the top surface can also be connected with the outer casing, so that the infrared temperature sensor can be prevented from being squeezed and moved after being installed. may.
  • FIG. 1 is a schematic view showing the internal side structure of an infrared temperature sensor according to an embodiment of the present invention.
  • FIG. 2 is a schematic structural view of the infrared temperature sensor shown in FIG. 1 provided with a digitizer and a transmission module.
  • FIG. 3 is a schematic diagram of a module in which the infrared temperature sensor shown in FIG. 1 is provided with a digitizer and a transmission module.
  • FIG. 4 is a partial cross-sectional view of the infrared temperature sensor of FIG. 1 provided with a sensor circuit board and a connector.
  • Fig. 5 is a perspective view showing the infrared temperature sensor shown in Fig. 1 in a plan view.
  • FIG. 6 is a schematic diagram of a terminal according to an embodiment of the present invention.
  • Figure 7 is a schematic cross-sectional view of the terminal of Figure 6 taken along the middle of the infrared temperature sensor.
  • FIG. 8 is a schematic cross-sectional view showing the middle portion of the terminal and the infrared temperature sensor of FIG.
  • Embodiments of the present invention provide an infrared temperature sensor and a terminal having the infrared temperature sensor.
  • the terminal may be a mobile phone, but is not limited to a mobile phone, and may be another terminal such as a tablet computer. Of course, it can also be other devices that use infrared temperature sensors.
  • the infrared temperature sensor 100 includes a package body 10 and an infrared sensing element 20 .
  • the package body 10 includes a top surface 11 and a bottom surface 12 opposite to the top surface 11 , and the top surface 11 is provided with a protrusion 13 .
  • the protrusion 13 is provided with a sensing surface 131 and a package surface 132 .
  • the package surface 132 is disposed around the sensing surface 131 .
  • the top surface 11 is a horizontal plane, the sensing surface 131 is parallel and oriented in the same direction; the top surface 11 may also be a curved surface or a slope or a curved surface.
  • top surface 11 When the top surface 11 is a curved surface, When combined with components such as the terminal housing, the bonding force can be increased.
  • the top surface 11 described in this embodiment is a horizontal plane.
  • the sensing surface 131 is parallel to the top surface 11 and oriented in the same direction. Therefore, when the infrared temperature sensor 100 is assembled with the terminal housing or the like, it is not necessary to provide the mounting surface shape of the housing to match the shape of the top surface 11, which is convenient for manufacturing and mounting.
  • the package surface 132 connects the top surface 11 and the sensing surface 131 , and the package surface 132 is inclined toward the sensing surface 131 .
  • the infrared sensing component 20 is encapsulated in the package body 10, and the infrared sensing component 20 is located at the position of the protrusion 13 and exposes the sensing surface 131.
  • the bottom surface 12 is provided with a pin (not shown), and the infrared temperature sensor 100 is electrically connected to a terminal such as a mobile phone through a pin.
  • the infrared sensing component 20 senses the outside temperature and transmits the signal to the terminal such as the connected mobile phone through the pin.
  • the infrared sensing element 20 is located at a middle position of the protrusion 13.
  • the infrared sensing element 20 includes a thermopile and a silicon infrared lens covering the thermopile.
  • the silicon infrared lens exposes the sensing surface 131 and is flush with the plane of the sensing surface 131, so that the infrared sensing element 2 accurately senses the outside temperature.
  • the thermopile can also be replaced by a thermocouple. The signal generated by the infrared sensing element 20 sensing the temperature can be transmitted through the pin.
  • the infrared sensing element 20 is encapsulated by the boss structure, and the protective measures such as the protection of the infrared sensing element 20 can be better realized, and the internal infrared sensing element 20 is prevented from being damaged by the effects of electrostatic discharge or water ingress.
  • the package body 10 has a substantially convex cross section.
  • the package body 10 is made of epoxy resin for bonding with a material such as a plastic case.
  • the package body 10 has a symmetrical structure, and the protrusions 13 are located at a middle position of the top surface 11. This symmetrical structure maintains the balance of the entire package 10 when the top surface 11 and the package surface 132 of the projection 13 are subjected to abutting force.
  • a heat insulation layer may be disposed directly under the connection position of the protrusion 13 and the top surface 11 for preventing heat transfer from the circuit board connected to the infrared temperature sensor 100 to the infrared sensor in the protrusion 13 20 affects the temperature detection effect.
  • the infrared temperature sensor 100 is provided with a package portion provided with the infrared sensing member 20 as a protrusion, and the convex package surface 132 is disposed obliquely, so that the infrared temperature sensor 100 is tilted when assembled with a terminal housing such as a mobile phone.
  • the package surface 132 can directly act as a force receiving surface to resist the outer casing, and the top surface 11 can also be connected to the outer casing, so that the direction of the abutting force between the top surface 11 and the outer casing after the infrared temperature sensor 100 is installed is different from the packaging surface 132.
  • the direction of the abutting force with the outer casing can avoid the possibility of movement of the outer casing or the sensor 100. At the same time, no other fixed structure is needed, which can improve the consistency of the temperature sensor.
  • the infrared temperature sensor 100 further includes a digitizer 15 and a transmission module 16 disposed in the package 10 .
  • the digitizer 15 converts the temperature signal sensed by the infrared sensor 20 into digital information (temperature value) and transmits it through the transmission module 16.
  • the transmitting module 16 is a communication interface.
  • the digitizer 15 is further connected to the transmitting module 16 with a crystal oscillator. As shown in FIG. 3, the thermopile, the digitizer 15, the transfer module 16, the crystal oscillator 17, and the power source A of the infrared sensor 20 constitute a circuit module.
  • the power source A may be a power source provided by an external circuit board, and the infrared temperature sensor 100 transmits the digital information converted into the sensed temperature by the circuit module.
  • the transfer module 16 is connected to a pin on the bottom surface 12, and the information is transmitted through the pin.
  • the infrared temperature sensor 100 itself is provided with a digitizer 15, which can directly convert the temperature signal into digital information and then send it out. The application is convenient, and it is not necessary to specially set the matched digital conversion component when using the terminal or other products. .
  • the infrared temperature sensor 100 further includes a sensor circuit board 30 and a connector 31 .
  • the connector 31 is electrically connected to one side of the sensor circuit board 30.
  • the bottom surface 12 of the package 10 enclosing the infrared sensing element 20 is connected to the other side of the sensor circuit board 30, and the pins of the bottom surface 12 are electrically connected to the circuit board.
  • the temperature data of the infrared temperature sensor 100 is transmitted through the connector 31. Specifically, when the digital converter 15 and the transmitting module 16 are disposed in the package 10, the formed circuit module passes through the pin and the The sensor circuit board 30 is electrically connected.
  • the sensor circuit board 30 provides power supply connection and electrical signal transmission to the circuit module.
  • the transmission module 16 transmits the digital signal through the sensor circuit board 30 and the connector 31.
  • the sensor circuit board 30 is electrically connected to the circuit board of a terminal through the connector 31.
  • the digitizer 15 converts the sensed temperature signal into a digital signal ( The temperature value is then transmitted to the sensor circuit board 30 via the transfer module 16 and pins, and then transmitted to the terminal by the connector 31.
  • the digitizer 15 and the transmitting module 16 are located in the terminal processor, and the temperature signal is directly converted into a temperature value by the terminal processor, that is, the infrared sensing component 20 directly contacts the
  • the sensor circuit board 30 is electrically connected, and the temperature signal sensed by the infrared sensor 20 is passed through the pin to the sensor circuit board 30, and then transmitted to the terminal via the connector 31, and then converted into a digital signal by the processor pinched by the terminal.
  • the infrared temperature sensor 100 is connected to the terminal, only the connector needs to be plugged in, and no complicated process such as soldering is required, which is convenient for assembly.
  • the performance of the infrared temperature sensor 100 in the embodiment of the present invention is improved, and the temperature measurement accuracy in different scenarios can be improved, for example, it can be used for body temperature detection, ambient temperature measurement, oil temperature measurement during cooking, and foaming. Scenes such as water temperature measurement and other conditions can be used.
  • an embodiment of the present invention further provides a terminal 200 including a housing 201 and a circuit board 202 encapsulated in the housing 201 .
  • the terminal 200 further includes the infrared temperature sensor 100, and the infrared temperature sensor 100 is electrically connected to the circuit board 202.
  • the infrared temperature sensor 100 can be directly soldered to the circuit board 202 through the pins of the bottom surface of the package 10. It is also possible to provide a metal shingle on the circuit board 202, and directly insert the pins on the bottom surface of the package 10 into the metal shrapnel, and then electrically connect after clamping to reduce the difficulty of assembly.
  • the infrared temperature sensor 100 and the circuit board 202 can also be connected through the connector 31.
  • the digital converter and the transmission module may be disposed on the terminal circuit board and integrated in the processor. After the circuit board is subjected to the temperature signal transmitted by the infrared temperature sensor 100, the infrared signal is transmitted through a digitizer in the processor. The sensed temperature signal is converted into a digital signal and sent out through the transmitting module.
  • the outer casing 201 includes an inner surface 203, an outer surface 204, and mounting holes 205 extending through the inner surface 203 and the outer surface 204.
  • the shape of the inner surface 203 matches the shape of the top surface 11 of the package 10 to ensure tight fit.
  • the hole wall of the mounting hole 205 includes a resisting wall 206 corresponding to the package surface 132 of the protrusion 13 and a connecting wall 207 corresponding to the top surface 11.
  • the infrared temperature sensor 100 is located in the mounting hole 205, and the package surface 132 of the protrusion 13 is adhered to the resisting wall 206, and the top surface 11 is connected to the connecting wall 207.
  • the top surface 11 of the package is affixed to the connecting wall 207; the sensing surface 131 exposes the outer surface 204 and is flush with the outer surface 204.
  • the overall appearance of the terminal surface is a flat, non-sag surface, the visual effect is better, and the appearance is more refined.
  • the mounting hole 205 has a cross-sectional shape substantially the same as the cross-sectional shape of the package body 10, the resisting wall 206 is located on the outer surface 204 side of the outer casing 201, and the resisting wall 206 is adjacent to the outer surface 204. A portion of one side is inclined toward the axial direction of the mounting hole 205.
  • the connecting wall 207 is connected to the abutment wall 206 and the connecting wall 207 is parallel to the outer surface 204.
  • a side wall 208 is also connected to a side of the connecting wall 207 away from the resisting wall 206.
  • the abutting wall 206, the connecting wall 207 and the side wall 208 form a hole wall of the mounting hole 204. As shown in FIG.
  • the infrared temperature sensor 100 is soldered or plugged with the circuit board 202 through the pins of the bottom surface of the package body 10, and then the mounting is loaded from the inner surface 203 direction.
  • the sealing surface 132 of the protrusion 13 is adhered to the resisting wall 206, and the top surface 11 of the periphery of the protrusion 13 is adhered to the connecting wall 207.
  • the sidewall 208 may or may not be in contact with the outer periphery of the package 10. No additional cover or the like is required at the periphery of the sensor, which reduces the cost of the terminal peripheral device and assembly.
  • the infrared sensing element 20 is located at the position of the protrusion 13 and is far away from the circuit board 202, which can reduce the influence of the heat generated by the operation of the board on the temperature sensing performance of the infrared temperature sensor 100.
  • the infrared temperature sensor 100 is fixed between the outer casing 201 and the circuit board 202.
  • the package body 10 has a resisting force toward the outer casing 201.
  • the outer casing 201 sends a reaction force to the package body 10, and the package surface 132 and the resisting wall.
  • a sealing ring can be embedded in the periphery of the resisting wall 206. When the resisting wall 206 is attached to the sealing surface 132, the sealing ring can further achieve the dustproof and waterproof effect.
  • the electrical connection between the sensor circuit board 30 and the circuit board 202 can be realized by plugging the connector 31 on the sensor circuit board 30 of the infrared temperature sensor with the circuit board 202. That is to say, the infrared temperature sensor 100 can be electrically connected to the circuit board 202 directly through the connector 31 instead of soldering the infrared temperature sensor to the circuit board, which is convenient and quick to install.
  • the digitizer and the transmission module are disposed in the package body 10 of the infrared temperature sensor 100, the transmission module is electrically connected to the sensor circuit board. The temperature signal sensed by the infrared sensing element 20 passes through the pin to the sensor circuit board 30.
  • the assembly of the outer casing 201 and the infrared temperature sensor 100 of the embodiment of the present invention cooperates with the inclined surface to avoid the mutual cooperation force of the vertical outer casing and affect the assembly stability of the infrared temperature sensor 100 when the extrusion occurs, and the inclined surface Mutual cooperation can also reduce the external impurities directly into the interior of the casing.
  • the sensing surface 131 of the infrared sensing component 20 is flush with the outer surface 204 of the outer casing, and the cover plate is not required to be disposed, which does not affect the infrared performance of the infrared temperature sensor 100, and ensures the detection accuracy of the infrared temperature sensor 100. , saving costs while ensuring the overall appearance of the outer casing.
  • the infrared sensor can be used not only to manually turn on the sensing temperature.
  • the application scenarios include, but are not limited to, a mobile phone.
  • the infrared temperature sensor can also automatically trigger temperature detection by certain scenes.
  • a general mobile phone has a motion sensor for use with the motion software, and the current sensor gesture is recognized by the motion sensor.
  • the mobile phone is horizontal or vertical, and the infrared temperature sensor is automatically triggered to detect the temperature after being recognized by the mobile phone processor.
  • the mobile software is generally turned on, and the heartbeat, the number of steps, and the like are recorded.
  • the infrared temperature sensor is automatically triggered and performed. temperature check. Most people use their mobile phones to set the morning alarm clock, and may remind the user to measure the basal body temperature in the morning. It may also need to measure the temperature of the environment.
  • the infrared temperature sensor can be automatically triggered for temperature detection. Also when the user uses the weather application software that is accessed by the mobile phone, the infrared temperature sensor can be automatically triggered to detect the temperature, providing the user with the temperature of the current environment.

Landscapes

  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Radiation Pyrometers (AREA)

Abstract

一种红外温度传感器(100)以及包括红外温度传感器(100)的终端(200)，红外温度传感器(100)包括封装体(10)及红外传感件(20)，封装体(10)包括顶面(11)及与顶面(11)相对的底面(12)，顶面(11)上凸设有凸起(13)，凸起(13)设有感测面(131)及封装面(132)；封装面(132)围绕感测面(131)设置，封装面(132)连接顶面(11)与感测面(131)，封装面(132)向感测面(131)方向倾斜，红外传感件(20)封装于封装体(10)内，红外传感件(20)位于凸起(13)位置并露出感测面(131)。

Description

红外温度传感器及终端 技术领域
本发明实施例涉及终端技术领域，尤其涉及一种红外温度传感器及终端。
背景技术
现有红外温度传感器结构是将硅红外透镜及热电堆放置于封装体中央。在应用于手机时，直接将红外温度传感器焊接在手机主板上，手机外壳在对应位置加工一通孔，红外温度传感器沿着通孔轴向设于通孔内。此种安装方式，传感器受到挤压时容易在通孔中发生位移，并且为了防止外部沙尘、液体等通过缝隙进入手机内部，需要在通孔上覆盖一块防尘的盖板。加装的盖板不仅需要红外辐射透过率高，在组装好之后还需要进行一次温度校准，因此增加生产工序同时会影响传感器的稳定性。
发明内容
本发明实施例提供一种自带封装结构的不影响效率的红外温度传感器。
本发明实施例还提供一种终端。
本发明实施例所述的红外温度传感器，包括封装体及红外传感件，
所述封装体包括顶面及与所述顶面相对的底面，所述顶面上凸设有凸起，
所述凸起设有感测面及封装面；所述封装面围绕所述感测面设置，
所述封装面连接所述顶面与所述感测面，所述封装面向所述感测面方向倾斜，所述红外传感件封装于所述封装体内，所述红外传感件位于所述凸起位置并露出所述感测面。
其中，所述感测面与所述顶面平行且朝向相同。
其中，所述封装体为对称结构，所述凸起位于所述顶面中部位置。
其中，所述红外传感件包括热电堆及覆盖热电堆的硅红外透镜，所述硅红外透镜露出所述感测面并与所述感测面所在平面平齐。
其中，所述红外温度传感器还包括设于所述封装体内的数字转换器及传送模块，所述数字转换器与所述传送模块连接，所述数字转换器将所述红外传感件感测的温度信号转换成数字信号后通过所述传送模块发送出去。
其中，所述红外温度传感器还包括传感器电路板及电连接在所述传感器电路板一侧的连接器，所述封装体的底面与所述传感器电路板另一侧连接，所述红外温度传感器感测的温度信号经所述传感器电路板和所述连接器发送出去。
本发明实施例所述的终端，包括外壳及封装于所述外壳内的电路板，还包括所述的红外温度传感器，所述红外温度传感器与所述电路板电连接，
所述外壳包括内表面、外表面及贯穿内表面及外表面的安装孔，所述安装孔的孔壁包括与所述凸起的封装面对应的抵持壁以及与所述顶面对应的连接壁，
所述红外温度传感器位于所述安装孔内，所述凸起的封装面与所述抵持壁贴合并抵持，所述顶面与所述连接壁抵持连接，所述感测面露出所述外表面并与外表面平齐。
其中，所述红外温度传感器或者所述电路板上还设有数字转换器及传送模块，所述数 字转换器将所述红外传感件感测的温度信号转换成数字信号后通过所述传送模块发送出去。
其中，所述封装体的底面设有引脚，所述电路板设有夹持弹片，所述引脚插接于所述夹持弹片内实现所述红外温度传感器与所述电路板的电连接。
其中，所述红外温度传感器还包括传感器电路板及电连接所述传感器电路板一侧的连接器，所述封装体的底面与所述传感器电路板另一侧连接，所述连接器与所述电路板插接实现所述传感器电路板与所述电路板的电连接。
其中，所述抵持壁位于所述外表面一侧的周缘嵌设有密封圈，密封圈密封所述封装面与所述抵持壁。
其中，所述封装体的顶面与所述连接壁粘贴固定。
本发明实施例所述的红外温度传感器将设有红外传感件的封装部分设置成凸起，并且凸起的封装面为倾斜设置而构成自带封装面的结构，这样在红外温度传感器与手机等终端外壳装配时，为倾斜设置的封装面可以直接作为受力面抵持外壳，而且顶面同样可以与外壳连接，这样红外温度传感器安装后受力方向不同，可以避免发生挤压而移动的可能。
附图说明
图1是本发明实施例的红外温度传感器的内部侧面结构示意图。
图2是图1所示的红外温度传感器设有数字转换器及传送模块的结构示意图。
图3是图1所示的红外温度传感器设有数字转换器及传送模块的模块示意图
图4是图1所述的红外温度传感器设有传感器电路板及连接器的部分示截面意图。
图5是图1所示的红外温度传感器俯视下的立体示意图。
图6是本发明实施例所述的终端示意图。
图7是图6所述的终端沿着红外温度传感器中部截取的截面示意图。
图8是图6所述的终端与红外温度传感器另一种安装方式中部的截面示意图。
具体实施方式
下面将结合本发明实施方式中的附图，对本发明实施方式中的技术方案进行清楚、完整地描述。
本发明实施例提供一种红外温度传感器及具有所述红外温度传感器的终端。所述终端可以为手机，但不限于手机，也可以是平板电脑等其它终端。当然也可以是应用红外温度传感器的其他设备。
请参阅图1与图5，本发明实施例中，所述红外温度传感器100包括封装体10及红外传感件20。所述封装体10包括顶面11及与所述顶面11相对的底面12，所述顶面11上设有凸起13。所述凸起13设有感测面131及封装面132；，所述封装面132围绕所述感测面131设置。当所述顶面11为水平面时所述感测面131与所述顶面11平行且朝向相同；所述顶面11也可以为弧形面或者斜面或者曲面，当顶面11为曲面时，与终端外壳等元件配合时，可以增加结合力。本实施例中所述所述顶面11为水平面。感测面131与所述顶面11平行且朝向相同，这样在红外温度传感器100与终端外壳等元件装配时，不需要设置外壳的安装表面形状来配合顶面11的形状，比较方便制作安装。
所述封装面132连接所述顶面11与所述感测面131，并且所述封装面132向所述感测面131方向倾斜。所述红外传感件20封装于所述封装体10内，所述红外传感件20位于所述凸起13位置并露出所述感测面131。一种方式中，所述底面12上设有引脚(图未示)，红外温度传感器100通过引脚与手机等终端实现电连接。红外传感件20感测外界温度后通过引脚将信号传递给连接的手机等终端。
进一步的，所述红外传感件20位于所述凸起13中部位置。所述红外传感件20包括热电堆及覆盖热电堆的硅红外透镜。所述硅红外透镜露出所述感测面131并与所述感测面131所在平面平齐，以便红外传感件2准确感测外界温度。所述热电堆也可以由热电偶代替。红外传感件20感测温度产生的信号可以通过所述引脚传递出去。采用凸台结构封装红外传感件20，可以更好的实现红外传感件20防护等保护性措施，避免内部红外传感件20受静电放电或进水等影响而损坏。
具体的，所述封装体10的截面大致为凸字型。所述封装体10材料为环氧树脂，以便与塑料外壳等材料粘贴。本实施例中，所述封装体10为对称结构，所述凸起13位于所述顶面11中部位置。这种对称结构可以在顶面11与凸起13的封装面132受到抵持力时保持整个封装体10的平衡。进一步的，位于所述凸起13与所述顶面11连接位置正下方可以设置隔热层，用于防止与红外温度传感器100连接的电路板的热量传递至凸起13内的红外传感件20而影响温度检测效果。
所述红外温度传感器100将设有红外传感件20的封装部分设置成凸起，并且凸起的封装面132为倾斜设置，这样在红外温度传感器100与手机等终端外壳装配时，为倾斜设置的封装面132可以直接作为受力面抵持外壳，而且顶面11同样可以与外壳连接，这样红外温度传感器100安装后，顶面11与外壳之间抵持力的方向，不同于封装面132与外壳之间抵持力的方向，可以避免在外壳或者传感器100发生挤压而移动的可能。同时不需要其他固定结构，可以提高温度传感器的一致性。
请参阅图2，进一步的，所述红外温度传感器100还包括设于所述封装体10内的数字转换器15及传送模块16。所述数字转换器15将所述红外传感件20感测的温度信号转换成数字信息(温度数值)后通过传送模块16发送出去。本实施例中传送模块16为通讯接口。所述数字转换器15与所述传送模块16还连接有晶振。如图3所示，所述红外传感件20的热电堆、数字转换器15、传送模块16、晶振17及电源A构成一电路模块。其中，电源A可以是外接电路板提供的电源，所述红外温度传感器100通过所述电路模块将感测的温度转换成的数字信息传递出去。本实施例中，所述传送模块16与所述底面12上的引脚连接，通过引脚将信息传递出去。所述红外温度传感器100自身设有数字转换器15，可以直接将温度信号转换成数字信息后再发送出去，应用时比较方便，无需在使用的终端或者其它产品时特意设置相匹配的数字转换元件。
请参阅图4，进一步的，所述红外温度传感器100还包括传感器电路板30及连接器31。所述连接器31电连接在所述传感器电路板30的一侧。封装所述红外传感件20的封装体10的底面12与所述传感器电路板30另一侧连接，所述底面12的引脚与电路板电连接。所述红外温度传感器100的温度数据通过连接器31传递出去。具体的，一种方式是，当所述封装体10内设置有数字转换器15及传送模块16时，形成的所述电路模块通过引脚与所 述传感器电路板30电连接，传感器电路板30为所述电路模块提供电源连接及电信号的传递，传送模块16将数字信号经过传感器电路板30和连接器31传输出去。例如，所述传感器电路板30通过连接器31与一终端的电路板的电连接，当红外传感件20感测温度后，所述数字转换器15将感测的温度信号转换成数字信号(温度数值)，然后经所述传送模块16与引脚传递至所述传感器电路板30，再由连接器31传递至终端。一种方式中，数字转换器15及传送模块16位于终端处理器内，直接由终端处理器将温度信号转换成是温度数值，也就是说所述红外传感件20通过引脚直接与所述传感器电路板30电连接，红外传感件20感测的温度信号经过引脚至传感器电路板30，再经由连接器31传递至终端，再由终端捏的处理器转换成数字信号。红外温度传感器100与终端连接时只需要插接连接器即可，无需焊接等复杂工艺，便于装配。
需要说明的是本发明实施例的红外温度传感器100整机性能有所提升，可以提升在不同场景下温度测量精度，比如可以用于体温检测、环境温度测量、烹饪过程中的油温测量、泡茶泡奶粉时水温测量等等场景均可使用。
请参阅图6与图7，本发明实施例还提供一种终端200，包括外壳201及封装于外壳201内的电路板202。所述终端200还包括所述的红外温度传感器100，所述红外温度传感器100与所述电路板202电连接。所述红外温度传感器100可以通过封装体10的底面的引脚与电路板202直接焊接。也可以在电路板202上设置夹持金属弹片，直接将封装体10底面的引脚插入金属弹片中，夹持后实现电连接，以降低装配难渡。还可以通过连接器31连接红外温度传感器100和电路板202。其中，所述有数字转换器及传送模块可以设置于终端电路板并整合于处理器内，在电路板受到红外温度传感器100传递的温度信号后通过处理器内的数字转换器将所述红外传感件感测的温度信号转换成数字信号后通过所述传送模块发送出去。
本实施例中，所述外壳201包括内表面203、外表面204及贯穿内表面203及外表面204的安装孔205。所述内表面203的形状与所述封装体10的顶面11的形状相匹配，以保证配合的紧密性。所述安装孔205的孔壁包括与所述凸起13的封装面132对应的抵持壁206以及与所述顶面11对应的连接壁207。所述红外温度传感器100位于所述安装孔205内，所述凸起13的封装面132与所述抵持壁206贴合并抵持，所述顶面11与所述连接壁207抵持连接，所述封装体的顶面11与所述连接壁207粘贴固定；所述感测面131露出所述外表面204并与外表面204平齐。如此，使终端整体外观表面是平整的无下陷面，视觉效果更好，外观更为精致。
具体的，所述安装孔205横截面与所述封装体10的横截面形状大致相同，所述抵持壁206位于所述外壳201的外表面204一侧，并且抵持壁206靠近外表面204一侧的部分向所述安装孔205的轴心方向倾斜。所述连接壁207与所述抵持壁206连接并且所述连接壁207平行于所述外表面204。所述连接壁207远离所述抵持壁206的一侧还连接有侧壁208。所述抵持壁206、连接壁207及侧壁208形成所述安装孔204的孔壁。如图8所示，一种方式中，所述红外温度传感器100通过封装体10的底面的引脚与所述电路板202焊接或者插接，然后从所述内表面203方向装入所述安装孔204内，所述凸起13的封装面132与所述抵持壁206贴合并抵持，所述凸起13周缘的顶面11与所述连接壁207贴合抵持，所述 侧壁208可以与所述封装体10的外周缘抵持或者不接触。在传感器外围不需要增加额外的盖板等，降低了终端外围器件以及组装的成本。红外传感件20位于凸起13位置，距离电路板202较远，可以减小电路板工作产生的热量对红外温度传感器100的温度感测性能的影响。红外温度传感器100固定于外壳201与电路板202之间，所述封装体10向外壳201方向有抵持力，同样外壳201给封装体10一个反作用力，而封装面132与所述抵持壁206为斜面，受到的抵持力与所述安装孔204的轴向呈夹角而不是平行，这样就可以避免由于红外温度传感器100的受力不均而沿着安装孔移动，进而保证了红外温度传感器100的性能稳定性。可以理解，在所述抵持壁206周缘可以嵌设密封圈，当抵持壁206与封装面132贴合时，密封圈可以进一步的达到防尘防水效果。
进一步的，可以通过所述红外温度传感器的传感器电路板30上的连接器31与所述电路板202插接实现所述传感器电路板30与所述电路板202的电连接。也就是说所述红外温度传感器100直接通过连接器31可以与电路板202电连接，而不是将所述红外温度传感器焊接在电路板上，安装方便快捷。当所述红外温度传感器100的所述封装体10内设置所述数字转换器及传送模块时，所述传送模块与所述传感器电路板电连接。红外传感件20感测的温度信号经过引脚至传感器电路板30。
本发明实施例所述的终端的外壳201与红外温度传感器100的装配采用倾斜面互相配合，避免相出现垂直外壳的互配合力而在出现挤压时影响红外温度传感器100装配稳定性，倾斜面互相配合也可以减少外接杂质直接进入外壳内部。同时漏出红外传感件20的感测面131与外壳的外表面204平齐，不需要而外设置盖板，不会影响红外温度传感器100的红外性能，保证了红外温度传感器100的检测准确性，节省成本同时保证了外壳整体外观。
需要说明的是，红外传感器不仅仅可以是单纯手动开启感测温度。以所述的红外温度传感器100为例说明，其应用场景包括但不限于手机。所述红外温度传感器也可以由某些场景自动触发温度检测。例如：一般的手机中都有运动传感器以配合运动软件使用，通过运动传感器识别当前手机姿态。比如在摄像头处于拍照界面时，手机呈水平或竖直状体，通过手机处理器识别后自动触发红外温度传感器进行温度检测。
再例如，手机在使用者运动过程中，一般情况下都会开启运动软件，记录心跳、步数公里数等，在打开运动软件或者识别到手机使用者处于运动状态时红外温度传感器被自动触发并进行温度检测。大多数人都会使用手机设定早晨的闹钟，同时可能会提醒用户测量早上的基础体温，那么也可能需要测量所处环境的温度，红外温度传感器可以被自动触发而进行温度检测。同样在用户使用手机查阅的天气应用软件时，红外温度传感器可以被自动触发温度检测，向用户提供当前所处环境的温度。
以上是本发明实施例的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明实施例原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也视为本发明实施例的保护范围。

Claims (12)

  1. 一种红外温度传感器，其特征在于，包括封装体(10)及红外传感件(20)，
    所述封装体包括顶面(11)及与所述顶面(11)相对的底面(12)，所述顶面(11)上凸设有凸起(13)，
    所述凸起(13)设有感测面(131)及封装面(132)；所述封装面(132)围绕所述感测面(131)设置，
    所述封装面(132)连接所述顶面(11)与所述感测面(131)，所述封装面(132)向所述感测面(131)方向倾斜，所述红外传感件(20)封装于所述封装体(10)内，所述红外传感件(20)位于所述凸起(13)位置并露出所述感测面(131)。
  2. 如权利要求1所述的红外温度传感器，其特征在于，所述感测面(131)与所述顶面(11)平行且朝向相同。
  3. 如权利要求1或2所述的红外温度传感器，其特征在于，所述封装体(110)为对称结构，所述凸起(13)位于所述顶面(11)中部位置。
  4. 如权利要求1-3任一项所述的红外温度传感器，其特征在于，所述红外传感件(20)包括热电堆及覆盖热电堆的硅红外透镜，所述硅红外透镜露出所述感测面(131)并与所述感测面(131)所在平面平齐。
  5. 如权利要求1-4任一项所述的红外温度传感器，其特征在于，所述红外温度传感器还包括设于所述封装体(10)内的数字转换器(15)及传送模块(16)，所述数字转换器(15)与所述传送模块连接，所述数字转换器(15)将所述红外传感件(20)感测的温度信号转换成数字信号后通过所述传送模块(16)发送出去。
  6. 如权利要求1-5任一项所述的红外温度传感器，其特征在于，所述红外温度传感器还包括传感器电路板(30)及电连接在所述传感器电路板(30)一侧的连接器(31)，所述封装体(10)的底面与所述传感器电路板(30)另一侧连接，所述红外温度传感器(100)感测的温度信号经所述传感器电路板(30)和所述连接器(31)发送出去。
  7. 一种终端，包括外壳(201)及封装于所述外壳(201)内的电路板(202)，其特征在于，还包括权利要求1-3任一项所述的红外温度传感器(100)，所述红外温度传感器(100)与所述电路板(201)电连接，
    所述外壳(201)包括内表面(203)、外表面(204)及贯穿内表面(203)及外表面(204)的安装孔(205)，所述安装孔(205)的孔壁包括与所述凸起(13)的封装面(132)对应的抵持壁(206)以及与所述顶面(11)对应的连接壁(207)，
    所述红外温度传感器(100)位于所述安装孔(205)内，所述凸起(13)的封装面(132)与所述抵持壁(206)贴合并抵持，所述顶面(11)与所述连接壁(207)抵持连接，所述感测面(131)露出所述外表面(204)并与外表面(204)平齐。
  8. 如权利要求7所述的终端，其特征在于，所述红外温度传感器(100)或者所述电路板(201)上还设有数字转换器(15)及传送模块(16)，所述数字转换器(15)将所述红外传感件(20)感测的温度信号转换成数字信号后通过所述传送模块(16)发送出去。
  9. 如权利要求7或8所述的终端，其特征在于，所述封装体(10)的底面(12)设有 引脚，所述电路板(202)设有夹持弹片，所述引脚插接于所述夹持弹片内实现所述红外温度传感器(100)与所述电路板(202)的电连接。
  10. 如权利要求7或8所述的终端，其特征在于，所述红外温度传感器(100)还包括传感器电路板(30)及电连接所述传感器电路板(30)一侧的连接器(31)，所述红外传感件(20)封装体(10)的底面(12)与所述传感器电路板(30)另一侧连接，所述连接器(31)与所述电路板(202)插接实现所述传感器电路板(30)与所述电路板(202)的电连接。
  11. 如权利要求7-10任一项所述的终端，其特征在于，所述抵持壁(206)位于所述外表面(204)一侧的周缘嵌设有密封圈，密封圈密封所述封装面(132)与所述抵持壁(206)。
  12. 如权利要求7-11任一项所述的终端，其特征在于，所述封装体(10)的顶面(11)与所述连接壁(207)粘贴固定。
PCT/CN2017/089587 2017-03-16 2017-06-22 红外温度传感器及终端 WO2018166095A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201780010355.0A CN108702402B (zh) 2017-03-16 2017-06-22 红外温度传感器及终端

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710157342.8 2017-03-16
CN201710157342 2017-03-16

Publications (1)

Publication Number Publication Date
WO2018166095A1 true WO2018166095A1 (zh) 2018-09-20

Family

ID=63522691

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/089587 WO2018166095A1 (zh) 2017-03-16 2017-06-22 红外温度传感器及终端

Country Status (2)

Country Link
CN (1) CN108702402B (zh)
WO (1) WO2018166095A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113447132A (zh) * 2020-03-27 2021-09-28 维沃移动通信有限公司 电子设备
CN113497839B (zh) * 2020-04-03 2024-06-07 维沃移动通信有限公司 电子设备
CN214471356U (zh) * 2021-02-05 2021-10-22 芯海科技（深圳）股份有限公司 红外温度传感器以及电子设备

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102933942A (zh) * 2010-06-24 2013-02-13 松下电器产业株式会社 红外线传感器
CN202872859U (zh) * 2012-09-19 2013-04-10 深圳天珑无线科技有限公司 一种手机及其传感器密封装置
JP2013120155A (ja) * 2011-12-08 2013-06-17 Panasonic Corp 気体成分検出装置
JP2015200558A (ja) * 2014-04-08 2015-11-12 パナソニックＩｐマネジメント株式会社 赤外線センサ
CN106331229A (zh) * 2015-07-03 2017-01-11 Lg电子株式会社 移动终端
CN206022378U (zh) * 2016-08-10 2017-03-15 菱光科技股份有限公司 红外线传感器高真空封装结构

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100769587B1 (ko) * 2006-04-25 2007-10-23 주식회사 이노칩테크놀로지 비접촉식 적외선 온도 센서
CN102394983A (zh) * 2011-11-16 2012-03-28 谢尚钗 非接触式红外线测温手机
CN205486167U (zh) * 2016-01-25 2016-08-17 广东欧珀移动通信有限公司 防水指纹传感模组及移动终端设备

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102933942A (zh) * 2010-06-24 2013-02-13 松下电器产业株式会社 红外线传感器
JP2013120155A (ja) * 2011-12-08 2013-06-17 Panasonic Corp 気体成分検出装置
CN202872859U (zh) * 2012-09-19 2013-04-10 深圳天珑无线科技有限公司 一种手机及其传感器密封装置
JP2015200558A (ja) * 2014-04-08 2015-11-12 パナソニックＩｐマネジメント株式会社 赤外線センサ
CN106331229A (zh) * 2015-07-03 2017-01-11 Lg电子株式会社 移动终端
CN206022378U (zh) * 2016-08-10 2017-03-15 菱光科技股份有限公司 红外线传感器高真空封装结构

Also Published As

Publication number Publication date
CN108702402A (zh) 2018-10-23
CN108702402B (zh) 2021-02-09

Similar Documents

Publication Publication Date Title
US10880422B2 (en) Display assembly and mobile terminal
US9540229B2 (en) Packaged sensor assembly
CN102856396B (zh) 光传感器装置
WO2018166095A1 (zh) 红外温度传感器及终端
EP3547019B1 (en) Display assembly and mobile terminal
CN210670557U (zh) 一种多功能传感器及包括其的电子设备
EP3689116B1 (en) Electronic device with waterproof structure
CN103025107A (zh) 电子设备
TWI495340B (zh) 影像感測模組及相機模組
TWI508545B (zh) 影像感測模組及相機模組
WO2022166586A1 (zh) 数字式红外温度传感器以及电子设备
WO2017201755A1 (zh) 指纹模组及电子设备
KR102165182B1 (ko) 개구부를 포함하는 전자 장치
CN110602361B (zh) 摄像头组件以及电子设备
US10274365B2 (en) Optical module package structure and method thereof
CN210006934U (zh) 充电组件及电子设备
WO2022166589A1 (zh) 红外温度传感器以及电子设备
WO2022166587A1 (zh) 红外温度传感器以及电子设备
EP4271149A1 (en) Electronic apparatus comprising waterproof structure
US20190094093A1 (en) Pressure sensor package and electronic device including the same
JP4873357B2 (ja) 基板接続コネクタの防水取付け構造
CN212158835U (zh) 红外测温装置
CN211183927U (zh) 感应按键及电子设备
KR20150046564A (ko) 온도 센서 패키지
CN213244067U (zh) 一种测温手机

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17900591

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17900591

Country of ref document: EP

Kind code of ref document: A1