AU2008256414A1 - Device having a sandwich structure for detecting thermal radiation, method of production and use of the device - Google Patents

Device having a sandwich structure for detecting thermal radiation, method of production and use of the device Download PDF

Info

Publication number
AU2008256414A1
AU2008256414A1 AU2008256414A AU2008256414A AU2008256414A1 AU 2008256414 A1 AU2008256414 A1 AU 2008256414A1 AU 2008256414 A AU2008256414 A AU 2008256414A AU 2008256414 A AU2008256414 A AU 2008256414A AU 2008256414 A1 AU2008256414 A1 AU 2008256414A1
Authority
AU
Australia
Prior art keywords
support
detector
cover
circuit
stack
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2008256414A
Other languages
English (en)
Inventor
Carsten Giebeler
Matthias Schreiter
Jorg Zapf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pyreos Ltd
Original Assignee
Pyreos Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pyreos Ltd filed Critical Pyreos Ltd
Publication of AU2008256414A1 publication Critical patent/AU2008256414A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/04—Casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/04—Casings
    • G01J5/041—Mountings in enclosures or in a particular environment
    • G01J5/045—Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/34—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using capacitors, e.g. pyroelectric capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Radiation Pyrometers (AREA)
  • Measurement Of Radiation (AREA)
AU2008256414A 2007-05-29 2008-05-28 Device having a sandwich structure for detecting thermal radiation, method of production and use of the device Abandoned AU2008256414A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102007024903A DE102007024903B4 (de) 2007-05-29 2007-05-29 Vorrichtung mit Sandwichstruktur zur Detektion von Wärmestrahlung, Verfahren zum Herstellen und Verwendung der Vorrichtung
DE102007024903.0 2007-05-29
PCT/EP2008/004247 WO2008145354A1 (de) 2007-05-29 2008-05-28 Vorrichtung mit sandwichtstruktur zur detektion von wärmestrahlung, verfahren zum herstellen und verwendung der vorrichtung

Publications (1)

Publication Number Publication Date
AU2008256414A1 true AU2008256414A1 (en) 2008-12-04

Family

ID=39627771

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2008256414A Abandoned AU2008256414A1 (en) 2007-05-29 2008-05-28 Device having a sandwich structure for detecting thermal radiation, method of production and use of the device

Country Status (10)

Country Link
US (1) US8487257B2 (enExample)
EP (1) EP2153188B1 (enExample)
JP (1) JP5455239B2 (enExample)
KR (1) KR101496673B1 (enExample)
CN (1) CN101688811B (enExample)
AU (1) AU2008256414A1 (enExample)
BR (1) BRPI0812098B1 (enExample)
DE (1) DE102007024903B4 (enExample)
RU (1) RU2465685C2 (enExample)
WO (1) WO2008145354A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007062688B3 (de) * 2007-12-17 2009-02-05 Pyreos Ltd. Vorrichtung mit einer abgeschirmten Sandwichstruktur zur Detektion von Wärmestrahlung und Verwendung der Vorrichtung
DE102009013336A1 (de) * 2009-03-16 2010-09-23 Perkinelmer Optoelectronics Gmbh & Co.Kg Pyroelektrisches Material, Strahlungssensor, Verfahren zur Herstellung eines Strahlungssensors und Verwendung von Lithiumtantalat und Lithiumniobat
US9118132B2 (en) * 2011-09-08 2015-08-25 Bae Systems Information And Electronic Systems Integration Vacuum compatible high-density electrical interconnect system
DE102012216618A1 (de) * 2012-09-18 2014-03-20 Robert Bosch Gmbh Anordnung von mindestens zwei Wafern zum Detektieren von elektromagnetischer Strahlung und Verfahren zum Herstellen der Anordnung
DE102015208701A1 (de) * 2015-05-11 2016-11-17 Infratec Gmbh Vorrichtung zur gleichzeitigen Bestimmung mehrerer unterschiedlicher Stoffe und/oder Stoffkonzentrationen
FR3080705B1 (fr) * 2018-04-27 2020-10-30 Tn Int Emballage de transport et/ou d'entreposage de matieres radioactives permettant une fabrication facilitee ainsi qu'une amelioration de la conduction thermique

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0219725A (ja) * 1988-07-07 1990-01-23 Matsushita Electric Ind Co Ltd 焦電形赤外検出素子アレイ、焦電形赤外検出器およびそれらの製法
AU631734B2 (en) * 1990-04-18 1992-12-03 Terumo Kabushiki Kaisha Infrared ray sensor and method of manufacturing the same
US5397897A (en) * 1992-04-17 1995-03-14 Terumo Kabushiki Kaisha Infrared sensor and method for production thereof
JP3181363B2 (ja) * 1992-04-17 2001-07-03 テルモ株式会社 赤外線センサおよびその製造方法
DE19525071A1 (de) * 1995-07-10 1997-01-16 Siemens Ag Pyroelektrisches Bauelement und Verfahren zur Herstellung
US5729019A (en) * 1995-12-29 1998-03-17 Honeywell Inc. Split field-of-view uncooled infrared sensor
US5962854A (en) * 1996-06-12 1999-10-05 Ishizuka Electronics Corporation Infrared sensor and infrared detector
JP2000298063A (ja) * 1999-04-14 2000-10-24 Tdk Corp 赤外線検出器
DE19932308C2 (de) * 1999-07-10 2001-10-25 Bosch Gmbh Robert Sensor, insbesondere Thermosensor
JP2001174324A (ja) * 1999-12-17 2001-06-29 Tdk Corp 赤外線検出器および赤外線検出装置
DE10004216C2 (de) * 2000-02-01 2002-09-19 Siemens Ag Vorrichtung zur Detektion von Wärmestrahlung und Verwendung der Vorrichtung
RU2180098C2 (ru) * 2000-02-29 2002-02-27 Открытое акционерное общество "Ракетно-космическая корпорация "Энергия" им. С.П. Королева" Устройство определения интенсивности инфракрасного облучения
DE10058861A1 (de) * 2000-11-27 2002-06-13 Siemens Ag Infrarotsensor für hochauflösende Infrarot-Detektoranordnungen und Verfahren zu seiner Herstellung
US6890834B2 (en) 2001-06-11 2005-05-10 Matsushita Electric Industrial Co., Ltd. Electronic device and method for manufacturing the same
JP3519720B2 (ja) * 2001-06-11 2004-04-19 松下電器産業株式会社 電子デバイス
US7402897B2 (en) * 2002-08-08 2008-07-22 Elm Technology Corporation Vertical system integration
DE102004020685B3 (de) * 2004-04-28 2005-09-01 Robert Bosch Gmbh Infrarotsensor mit Getterschicht
JP4385255B2 (ja) * 2004-06-10 2009-12-16 日本電気株式会社 ボロメータ型赤外線検出器及び残像の低減方法
US7204737B2 (en) * 2004-09-23 2007-04-17 Temic Automotive Of North America, Inc. Hermetically sealed microdevice with getter shield
CN101213429B (zh) * 2005-06-27 2012-02-08 Hl-平面技术有限公司 用于检测电磁波的器件以及生产这样的器件的方法

Also Published As

Publication number Publication date
DE102007024903A1 (de) 2008-12-11
BRPI0812098A2 (pt) 2014-11-25
WO2008145354A1 (de) 2008-12-04
RU2465685C2 (ru) 2012-10-27
CN101688811B (zh) 2013-10-23
EP2153188A1 (de) 2010-02-17
US8487257B2 (en) 2013-07-16
EP2153188B1 (de) 2012-05-16
KR101496673B1 (ko) 2015-02-27
JP2010528301A (ja) 2010-08-19
RU2009144002A (ru) 2011-07-10
KR20100023008A (ko) 2010-03-03
BRPI0812098B1 (pt) 2018-06-19
DE102007024903B4 (de) 2009-05-07
JP5455239B2 (ja) 2014-03-26
CN101688811A (zh) 2010-03-31
US20100264311A1 (en) 2010-10-21

Similar Documents

Publication Publication Date Title
JP7045430B2 (ja) ウェハレベルパッケージ内の熱赤外線センサアレイ
US9279730B2 (en) Device having a membrane structure for detecting thermal radiation, and method for production thereof
US20130119492A1 (en) Miniaturized Electrical Component Comprising an MEMS and an ASIC and Production Method
US20090134481A1 (en) Molded Sensor Package and Assembly Method
US8487257B2 (en) Device with a sandwich structure for detecting thermal radiation, and method for the production thereof
KR100591390B1 (ko) 멤브레인을 갖는 센서 및 그 제조 방법
KR101479963B1 (ko) 스크린된 샌드위치 구조를 갖는 열 방출을 감지하기 위한 장치, 및 상기 장치의 사용
JP2004193600A (ja) 半導体装置及びその製造方法、半導体装置用カバー並びに電子機器
WO2011142059A1 (ja) 半導体装置及びその製造方法
JP2011252724A (ja) 赤外線センサおよびその製造方法

Legal Events

Date Code Title Description
MK5 Application lapsed section 142(2)(e) - patent request and compl. specification not accepted