US9118132B2 - Vacuum compatible high-density electrical interconnect system - Google Patents
Vacuum compatible high-density electrical interconnect system Download PDFInfo
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- US9118132B2 US9118132B2 US13/603,447 US201213603447A US9118132B2 US 9118132 B2 US9118132 B2 US 9118132B2 US 201213603447 A US201213603447 A US 201213603447A US 9118132 B2 US9118132 B2 US 9118132B2
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- 239000000463 material Substances 0.000 claims description 7
- 238000001931 thermography Methods 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000003384 imaging method Methods 0.000 description 9
- 230000003287 optical effect Effects 0.000 description 4
- BQENMISTWGTJIJ-UHFFFAOYSA-N 2,3,3',4,5-pentachlorobiphenyl Chemical compound ClC1=CC=CC(C=2C(=C(Cl)C(Cl)=C(Cl)C=2)Cl)=C1 BQENMISTWGTJIJ-UHFFFAOYSA-N 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000013481 data capture Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/04—Casings
- G01J5/041—Mountings in enclosures or in a particular environment
- G01J5/045—Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
- H01R12/718—Contact members provided on the PCB without an insulating housing
Definitions
- the present invention relates to electrical connections and more specifically to high-density electrical connections in a vacuum environment.
- the high resolution imaging equipment typically comprises a large number of coordinated optical sensors, such as focal plane arrays, operating in a small area. Each of these optical sensors necessitates a plurality of electrical connections to supply power and transmit input and output data.
- PCB printed circuit board
- the imaging systems commonly require that the aforementioned optical sensors and other circuitry be easily changed or replaced through interconnect systems.
- these interconnect systems are required in order to segregate modular portions of the imaging systems during assembly and manufacturing processes.
- Traditional interconnect systems use interposer connectors.
- these interconnect systems are most commonly made from plastics or other organics-containing materials, such as flame retardant 4 (FR4). In normal non-cryogenic operating conditions, typically, it is not difficult to provide any needed thermal cooling to these imaging systems.
- FR4 flame retardant 4
- the vacuum compatible high-density electrical interconnect system for use in a vacuum environment includes a vacuum compatible base plate, at least one vacuum compatible printed wiring board (PWB) disposed on the vacuum compatible base plate and at least one vacuum compatible interposer module disposed in the vacuum compatible base plate. Further, the at least one vacuum compatible PWB includes a plurality of components on a front side of the at least one vacuum compatible PWB and a plurality of associated pads on a back side of the at least one vacuum compatible PWB.
- PWB vacuum compatible printed wiring board
- the at least one vacuum compatible interposer module is disposed in the vacuum compatible base plate such that it operatively connects to the plurality of associated pads on the back side of the at least one vacuum compatible PWB and further operatively connects to a plurality of pads of an external device that is disposed outside the vacuum environment.
- a thermal imaging camera includes a vacuum chamber, a vacuum compatible window disposed in the vacuum chamber and configured to receive infrared (IR) light, the vacuum compatible base plate disposed in the vacuum chamber, the at least one vacuum compatible PWB disposed on the vacuum compatible base plate and the at least one vacuum compatible interposer module disposed in the vacuum compatible base plate. Further, the at least one vacuum compatible PWB includes the plurality of components on the front side of the at least one vacuum compatible PWB and the plurality of associated pads on the back side of the at least one vacuum compatible PWB.
- IR infrared
- the at least one vacuum compatible interposer module is disposed in the vacuum compatible base plate such that it operatively connects to the plurality of associated pads on the back side of the at least one vacuum compatible PWB and further operatively connects to the plurality of pads of the external device that is disposed outside the vacuum environment.
- FIG. 1 is a cross sectional view of a vacuum compatible high-density electrical interconnect system, according to an embodiment of the present subject matter.
- FIG. 2 is a cross sectional isometric view of the vacuum compatible high-density electrical interconnect system for a thermal imaging camera, such as shown in FIG. 1 , according to an embodiment of the present subject matter.
- PCB printed circuit board
- PWB printed wiring board
- FIG. 1 is a cross sectional view 100 of a vacuum compatible high-density electrical interconnect system, according to an embodiment of the present subject matter.
- the vacuum compatible high-density electrical interconnect system includes a hermetically sealed chamber 102 .
- the hermetically sealed chamber 102 includes a vacuum compatible base plate 104 , a vacuum compatible PWB 106 disposed on the vacuum compatible base plate 104 , a vacuum compatible interposer module 108 disposed in the vacuum compatible base plate 104 and a vacuum compatible feed through module 110 disposed in the vacuum compatible base plate 104 .
- the vacuum compatible base plate 104 , the vacuum compatible PWB 106 , the vacuum compatible interposer module 108 and the vacuum compatible feed through module 110 are made of materials, such as metal, glass, ceramic and the like.
- the vacuum compatible PWB 106 includes a plurality of components 112 A-N on a front side of the vacuum compatible PWB 106 and a plurality of associated pads 114 A-N on a back side of the vacuum compatible PWB 106 .
- the vacuum compatible interposer module 108 includes a first plurality of spring connectors 116 A-N on a first side of the vacuum compatible interposer module 108 and a second plurality of spring connectors 118 A-N on a second side of the vacuum compatible interposer module 108 .
- the vacuum compatible feed through module 110 includes a first plurality of pins 120 A-N on a first side of the vacuum compatible feed through module 110 and a second plurality of pins 122 A-N on a second side of the vacuum compatible feed through module 110 .
- the first side of the vacuum compatible feed through module 110 is disposed directly across from the second side of the vacuum compatible feed through module 110 .
- the vacuum compatible interposer module 108 is disposed in the vacuum compatible base plate 104 such that it operatively connects to the plurality of associated pads 114 A-N on the back side of the vacuum compatible PWB 106 and further operatively connects to the plurality of pads of an external device that is disposed outside the vacuum environment.
- the first plurality of spring connectors 116 A-N are operatively connected to the plurality of associated pads 114 A-N on the back side of the vacuum compatible PWB 106 and the second plurality of spring connectors 118 A-N are configured to operatively connect to the plurality of pads of the external device.
- the vacuum compatible feed through module 110 is disposed in the vacuum compatible base plate 104 such that it operatively connects the second plurality of spring connectors 118 A-N with the first plurality of pins 120 A-N and further configured to operatively connect the second plurality of pins 122 A-N to the plurality of pads of the external device.
- use of the first plurality of springs connectors 116 A-N to interface with the vacuum compatible interposer module 108 and the plurality of associated pads 114 A-N on the back side of the vacuum compatible PWB 106 allows for a space efficient method of directly connecting a large number of high-density electrical elements, rather than relying on space inefficient traditional connections.
- electronic devices such as focal plane arrays would be connected to the vacuum compatible PCB 106 opposite to the plurality of associated pads 114 A-N.
- the plurality of associated pads 114 A-N interface with the first plurality of spring connectors 116 A-N which then directly interface with the vacuum compatible interposer module 108 .
- connection density is further maximized by sandwiching each vacuum compatible interposer module between two vacuum compatible PCBs so that the vacuum compatible interposer module can connect to two sets of electronic devices at the same time with a single connector.
- FIG. 2 is another cross sectional isometric view 200 that illustrates the vacuum compatible high-density electrical interconnect system for a thermal imaging camera, such as shown in FIG. 1 , according to an embodiment of the present subject matter. As shown in FIG. 2
- the thermal imaging camera includes a vacuum chamber 202 , a vacuum compatible window 204 disposed in the vacuum chamber 202 and configured to receive infrared (IR) light, a vacuum compatible base plate 206 disposed in the vacuum chamber 202 , a vacuum compatible PWB 208 disposed on the vacuum compatible base plate 206 , a vacuum compatible interposer module 210 disposed in the vacuum compatible base plate 206 , a vacuum compatible feed through module 212 disposed in the vacuum compatible base plate 206 and a focal plane array 218 disposed in the vacuum chamber 202 .
- IR infrared
- the vacuum compatible base plate 206 , the vacuum compatible PWB 208 , the vacuum compatible interposer module 210 and the vacuum compatible feed through module 212 are made of materials, such as metal, glass, ceramic and the like.
- the vacuum compatible interposer module 210 includes a plurality of spring connectors 214 A-N on a side of the vacuum compatible interposer module 210 .
- the vacuum compatible feed through module 212 includes a plurality of pins 216 A-N on a second side of the vacuum compatible feed through module 212 .
- the vacuum compatible interposer module 210 is disposed in the vacuum compatible base plate 206 such that it operatively connects to the vacuum compatible PWB 208 and further operatively connects to the plurality of pads of the external device that is disposed outside the vacuum environment.
- the plurality of spring connectors 214 A-N are configured to operatively connect to the plurality of pads of the external device.
- the vacuum compatible feed through module 212 is disposed in the vacuum compatible base plate 206 such that it operatively connects the plurality of spring connectors 214 A-N with the plurality of pins 216 A-N and further configured to operatively connect to the plurality of pads of the external device.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
Abstract
A vacuum compatible high-density electrical interconnect system for use in a vacuum environment is disclosed. In one embodiment, the vacuum compatible high-density electrical interconnect system includes a vacuum compatible base plate, a vacuum compatible printed wiring board (PWB) disposed on the vacuum compatible base plate and a vacuum compatible interposer module disposed in the vacuum compatible base plate. Further, the vacuum compatible PWB includes a plurality of components on a front side of the vacuum compatible PWB and a plurality of associated pads on a back side of the vacuum compatible PWB. In one exemplary embodiment, the vacuum compatible interposer module is disposed in the vacuum compatible base plate such that it operatively connects to the plurality of associated pads on the back side of the vacuum compatible PWB and further operatively connects to a plurality of pads of an external device that is disposed outside the vacuum environment.
Description
This Application claims rights under 35 USC §119(e) from U.S. application Ser. No. 61/532,272 filed Sep. 8, 2011, the contents of which are incorporated herein by reference.
1. Field of the Invention
The present invention relates to electrical connections and more specifically to high-density electrical connections in a vacuum environment.
2. Brief Description of Related Art
One of the most difficult challenges posed by a high resolution imaging equipment is management of very high-density electrical connections required to operate many optical sensors used for such applications. The high resolution imaging equipment typically comprises a large number of coordinated optical sensors, such as focal plane arrays, operating in a small area. Each of these optical sensors necessitates a plurality of electrical connections to supply power and transmit input and output data.
Traditional electrical connections require lengths of wire or other conductive materials, which run along a printed circuit board (PCB) and occupy valuable space. This inefficient usage of available space severely limits the number of electrical connections per area and consequently limits the performance of high resolution imaging systems.
Further, due to high equipment cost and changing data capture requirements, the imaging systems commonly require that the aforementioned optical sensors and other circuitry be easily changed or replaced through interconnect systems. Furthermore, these interconnect systems are required in order to segregate modular portions of the imaging systems during assembly and manufacturing processes. Traditional interconnect systems use interposer connectors. Unfortunately, these interconnect systems are most commonly made from plastics or other organics-containing materials, such as flame retardant 4 (FR4). In normal non-cryogenic operating conditions, typically, it is not difficult to provide any needed thermal cooling to these imaging systems. However, when these imaging systems are housed in a cryogenic operating condition, it becomes difficult to provide the needed thermal cooling, as the plastics and other organics used in the interconnect systems may absorb moisture and can outgas and are therefore, not suitable for use in the vacuum environment required for many imaging applications, such as infrared (IR) imaging.
A vacuum compatible high-density electrical interconnect system is disclosed. According to one aspect of the present subject matter, the vacuum compatible high-density electrical interconnect system for use in a vacuum environment includes a vacuum compatible base plate, at least one vacuum compatible printed wiring board (PWB) disposed on the vacuum compatible base plate and at least one vacuum compatible interposer module disposed in the vacuum compatible base plate. Further, the at least one vacuum compatible PWB includes a plurality of components on a front side of the at least one vacuum compatible PWB and a plurality of associated pads on a back side of the at least one vacuum compatible PWB. In one embodiment, the at least one vacuum compatible interposer module is disposed in the vacuum compatible base plate such that it operatively connects to the plurality of associated pads on the back side of the at least one vacuum compatible PWB and further operatively connects to a plurality of pads of an external device that is disposed outside the vacuum environment.
According to another aspect of the present subject matter, a thermal imaging camera includes a vacuum chamber, a vacuum compatible window disposed in the vacuum chamber and configured to receive infrared (IR) light, the vacuum compatible base plate disposed in the vacuum chamber, the at least one vacuum compatible PWB disposed on the vacuum compatible base plate and the at least one vacuum compatible interposer module disposed in the vacuum compatible base plate. Further, the at least one vacuum compatible PWB includes the plurality of components on the front side of the at least one vacuum compatible PWB and the plurality of associated pads on the back side of the at least one vacuum compatible PWB. In one embodiment, the at least one vacuum compatible interposer module is disposed in the vacuum compatible base plate such that it operatively connects to the plurality of associated pads on the back side of the at least one vacuum compatible PWB and further operatively connects to the plurality of pads of the external device that is disposed outside the vacuum environment.
The advantages and features of the present disclosure will become better understood with reference to the following detailed description and claims taken in conjunction with the accompanying drawings, wherein like elements are identified with like symbols, and in which:
The exemplary embodiments described herein in detail for illustrative purposes are subject to many variations in structure and design.
The terms “printed circuit board (PCB)” and “printed wiring board (PWB)” are used interchangeably throughout the document.
Further, the vacuum compatible PWB 106 includes a plurality of components 112A-N on a front side of the vacuum compatible PWB 106 and a plurality of associated pads 114A-N on a back side of the vacuum compatible PWB 106. Furthermore, the vacuum compatible interposer module 108 includes a first plurality of spring connectors 116A-N on a first side of the vacuum compatible interposer module 108 and a second plurality of spring connectors 118A-N on a second side of the vacuum compatible interposer module 108. In addition, the vacuum compatible feed through module 110 includes a first plurality of pins 120A-N on a first side of the vacuum compatible feed through module 110 and a second plurality of pins 122A-N on a second side of the vacuum compatible feed through module 110. For example, the first side of the vacuum compatible feed through module 110 is disposed directly across from the second side of the vacuum compatible feed through module 110.
In one embodiment, the vacuum compatible interposer module 108 is disposed in the vacuum compatible base plate 104 such that it operatively connects to the plurality of associated pads 114A-N on the back side of the vacuum compatible PWB 106 and further operatively connects to the plurality of pads of an external device that is disposed outside the vacuum environment. Particularly, the first plurality of spring connectors 116A-N are operatively connected to the plurality of associated pads 114A-N on the back side of the vacuum compatible PWB 106 and the second plurality of spring connectors 118A-N are configured to operatively connect to the plurality of pads of the external device. In one exemplary implementation, the vacuum compatible feed through module 110 is disposed in the vacuum compatible base plate 104 such that it operatively connects the second plurality of spring connectors 118A-N with the first plurality of pins 120A-N and further configured to operatively connect the second plurality of pins 122A-N to the plurality of pads of the external device.
In this embodiment, use of the first plurality of springs connectors 116A-N to interface with the vacuum compatible interposer module 108 and the plurality of associated pads 114A-N on the back side of the vacuum compatible PWB 106 allows for a space efficient method of directly connecting a large number of high-density electrical elements, rather than relying on space inefficient traditional connections. In an exemplary embodiment, it is contemplated that electronic devices, such as focal plane arrays would be connected to the vacuum compatible PCB 106 opposite to the plurality of associated pads 114A-N. The plurality of associated pads 114A-N interface with the first plurality of spring connectors 116A-N which then directly interface with the vacuum compatible interposer module 108. This compact, direct path to the vacuum compatible interposer module 108 maximizes the number of available connections over a predetermined area of the vacuum compatible PCB 106. In an exemplary embodiment, connection density is further maximized by sandwiching each vacuum compatible interposer module between two vacuum compatible PCBs so that the vacuum compatible interposer module can connect to two sets of electronic devices at the same time with a single connector.
Referring now to FIG. 2 , which is another cross sectional isometric view 200 that illustrates the vacuum compatible high-density electrical interconnect system for a thermal imaging camera, such as shown in FIG. 1 , according to an embodiment of the present subject matter. As shown in FIG. 2 , the thermal imaging camera includes a vacuum chamber 202, a vacuum compatible window 204 disposed in the vacuum chamber 202 and configured to receive infrared (IR) light, a vacuum compatible base plate 206 disposed in the vacuum chamber 202, a vacuum compatible PWB 208 disposed on the vacuum compatible base plate 206, a vacuum compatible interposer module 210 disposed in the vacuum compatible base plate 206, a vacuum compatible feed through module 212 disposed in the vacuum compatible base plate 206 and a focal plane array 218 disposed in the vacuum chamber 202. For example, the vacuum compatible base plate 206, the vacuum compatible PWB 208, the vacuum compatible interposer module 210 and the vacuum compatible feed through module 212 are made of materials, such as metal, glass, ceramic and the like. Further, the vacuum compatible interposer module 210 includes a plurality of spring connectors 214A-N on a side of the vacuum compatible interposer module 210. Furthermore, the vacuum compatible feed through module 212 includes a plurality of pins 216A-N on a second side of the vacuum compatible feed through module 212.
In one embodiment, the vacuum compatible interposer module 210 is disposed in the vacuum compatible base plate 206 such that it operatively connects to the vacuum compatible PWB 208 and further operatively connects to the plurality of pads of the external device that is disposed outside the vacuum environment. Particularly, the plurality of spring connectors 214A-N are configured to operatively connect to the plurality of pads of the external device. In one exemplary implementation, the vacuum compatible feed through module 212 is disposed in the vacuum compatible base plate 206 such that it operatively connects the plurality of spring connectors 214A-N with the plurality of pins 216A-N and further configured to operatively connect to the plurality of pads of the external device.
The foregoing descriptions of specific embodiments of the present disclosure have been presented for purposes of illustration and description. They are not intended to be exhaustive or to limit the present disclosure to the precise forms disclosed, and obviously many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the present disclosure and its practical application, to thereby enable others skilled in the art to best utilize the present disclosure and various embodiments with various modifications as are suited to the particular use contemplated. It is understood that various omission and substitutions of equivalents are contemplated as circumstance may suggest or render expedient, but such are intended to cover the application or implementation without departing from the spirit or scope of the claims of the present disclosure.
Claims (10)
1. A vacuum compatible high-density electrical interconnect system for use in a vacuum environment, comprising:
a vacuum compatible base plate;
at least one vacuum compatible printed wiring board (PWB) disposed on the vacuum compatible base plate, wherein the at least one vacuum compatible PWB includes a plurality of components on a front side of the at least one vacuum compatible PWB and a plurality of associated pads on a back side of the at least one vacuum compatible PWB; and
at least one vacuum compatible interposer module disposed in the vacuum compatible base plate such that it operatively connects to the plurality of associated pads on the back side of the at least one vacuum compatible PWB and further operatively connects to a plurality of pads of an external device that is disposed outside the vacuum environment.
2. The system of claim 1 , wherein the at least one vacuum compatible interposer module comprises a first plurality of spring connectors on a first side of the at least one vacuum compatible interposer module and a second plurality of spring connectors on a second side of the at least one vacuum compatible interposer module, wherein the first plurality of spring connectors are operatively connected to the plurality of associated pads on the back side of the at least one vacuum compatible PWB and wherein the second plurality of spring connectors are configured to operatively connect to the plurality of pads of the external device.
3. The system of claim 2 , further comprising:
a vacuum compatible feed through module having a first plurality of pins on a first side of the vacuum compatible feed through module and a second plurality of pins on a second side of the vacuum compatible feed through module, wherein the first side of the vacuum compatible feed through module is disposed directly across from the second side of the vacuum compatible feed through module and wherein the vacuum compatible feed through module is disposed in the vacuum compatible base plate such that it operatively connects the second plurality of spring connectors with the first plurality of pins and further configured to operatively connect the second plurality of pins to the plurality of pads of the external device.
4. The system of claim 3 , wherein the vacuum compatible feed through module is made of materials selected from the group consisting of metal, glass or ceramic.
5. The system of claim 1 , wherein the at least one vacuum compatible PWB is made of materials selected from the group consisting of metal, glass or ceramic.
6. The system of claim 1 , wherein the vacuum compatible base plate is made of materials selected from the group consisting of metal, glass or ceramic.
7. The system of claim 1 , wherein the at least one vacuum compatible interposer module is made of materials selected from the group consisting of metal, glass or ceramic.
8. A thermal imaging camera, comprising:
a vacuum chamber;
a vacuum compatible window disposed in the vacuum chamber and configured to receive infrared (IR) light;
a vacuum compatible base plate disposed in the vacuum chamber;
at least one vacuum compatible printed wiring board (PWB) disposed on the vacuum compatible base plate, wherein the at least one vacuum compatible PWB includes a plurality of components on a front side of the at least one vacuum compatible PWB and a plurality of associated pads on a back side of the at least one vacuum compatible PWB; and
at least one vacuum compatible interposer module disposed in the vacuum compatible base plate such that it operatively connects to the plurality of associated pads on the back side of the at least one vacuum compatible PWB and further operatively connects to a plurality of pads of an external device.
9. The thermal imaging camera of claim 8 , wherein the at least one vacuum compatible interposer module comprises a first plurality of spring connectors on a first side of the at least one vacuum compatible interposer module and a second plurality of spring connectors on a second side of the at least one vacuum compatible interposer module, wherein the first plurality of spring connectors are operatively connected to the plurality of associated pads on the back side of the at least one vacuum compatible PWB and wherein the second plurality of spring connectors are configured to operatively connect to the plurality of pads of the external device.
10. The thermal imaging camera of claim 9 , further comprising:
a vacuum compatible feed through module having a first plurality of pins on a first side of the vacuum compatible feed through module and a second plurality of pins on a second side of the vacuum compatible feed through module, wherein the first side of the vacuum compatible feed through module is disposed directly across from the second side of the vacuum compatible feed through module and wherein the vacuum compatible feed through module is disposed in the vacuum compatible base plate such that it operatively connects the second plurality of spring connectors with the first plurality of pins and further configured to operatively connect the second plurality of pins to the plurality of pads of the external device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/603,447 US9118132B2 (en) | 2011-09-08 | 2012-09-05 | Vacuum compatible high-density electrical interconnect system |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161532272P | 2011-09-08 | 2011-09-08 | |
| US13/603,447 US9118132B2 (en) | 2011-09-08 | 2012-09-05 | Vacuum compatible high-density electrical interconnect system |
Publications (2)
| Publication Number | Publication Date |
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| US20130063603A1 US20130063603A1 (en) | 2013-03-14 |
| US9118132B2 true US9118132B2 (en) | 2015-08-25 |
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| US13/603,447 Active 2034-05-08 US9118132B2 (en) | 2011-09-08 | 2012-09-05 | Vacuum compatible high-density electrical interconnect system |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7771114B2 (en) * | 2005-06-23 | 2010-08-10 | Abb Research Ltd | Electrical installation with a cooling element and method for operating said installation |
| US8487257B2 (en) * | 2007-05-29 | 2013-07-16 | Pyreos Ltd. | Device with a sandwich structure for detecting thermal radiation, and method for the production thereof |
| US8575550B2 (en) * | 2007-12-17 | 2013-11-05 | Pyreos Ltd. | Apparatus having a screened structure for detecting thermal radiation |
| US8822256B1 (en) * | 2013-04-04 | 2014-09-02 | Bae Systems Information And Electronic Systems Integration Inc. | Method for fabricating infrared sensors |
-
2012
- 2012-09-05 US US13/603,447 patent/US9118132B2/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7771114B2 (en) * | 2005-06-23 | 2010-08-10 | Abb Research Ltd | Electrical installation with a cooling element and method for operating said installation |
| US8487257B2 (en) * | 2007-05-29 | 2013-07-16 | Pyreos Ltd. | Device with a sandwich structure for detecting thermal radiation, and method for the production thereof |
| US8575550B2 (en) * | 2007-12-17 | 2013-11-05 | Pyreos Ltd. | Apparatus having a screened structure for detecting thermal radiation |
| US8822256B1 (en) * | 2013-04-04 | 2014-09-02 | Bae Systems Information And Electronic Systems Integration Inc. | Method for fabricating infrared sensors |
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| US20130063603A1 (en) | 2013-03-14 |
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