JP2011239034A - Solid-state imaging device and camera unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a solid-state imaging device capable of suppressing transfer of heat generated when light-emitting parts including light-emitting elements are driven from the light emitting parts to other areas.SOLUTION: The solid-state imaging device comprises a printed wiring board 12 and a solid-state imaging element 101 provided on the printed wiring board 12. The printed wiring board 12 comprises: the light-emitting parts 102 including the light-emitting elements 111 provided around the solid-state imaging element 101; and hole parts 103 formed between the solid-state imaging element 101 and the light-emitting parts 102.

Description

  The present invention relates to a solid-state imaging device and a camera unit. In particular, the present invention relates to a small solid-state imaging device formed by using a solid-state imaging device such as a monitoring camera, a medical camera, a vehicle-mounted camera, and an information communication terminal camera.

In recent years, the demand for small cameras for mobile phones, in-vehicle components, etc. has been rapidly increasing. In this type of small camera, a solid-state imaging device that outputs an image input as an electrical signal by an optical system such as a lens by a solid-state imaging device is used. With the miniaturization and high performance of the solid-state imaging device, the camera is further miniaturized and used in various fields, and the market as a video input device is expanded. In a conventional image pickup apparatus using a semiconductor image pickup device, components such as an LSI on which a lens, a semiconductor image pickup device, a driving circuit thereof, a signal processing circuit, and the like are mounted are respectively formed in a housing or a structure and combined.
Along with the demand for camera miniaturization, there is an increasing demand for improving the visibility of the subject.

  As such a conventional image pickup apparatus, an apparatus that illuminates an object and picks up an image of the object from reflected light of the object is known in which the apparatus is downsized and the cost is reduced. (For example, refer to Patent Document 1). In this image pickup apparatus, a plurality of light emitting elements are arranged around an image pickup element of a circuit board on which the image pickup element is mounted to illuminate a subject.

JP 2007-249615 A

  However, in the imaging device disclosed in Patent Document 1, heat is excessively conducted in the circuit board due to the high thermal conductivity of the circuit board itself and the high electrical conductivity of the electric wiring pattern for electric signals. Therefore, the drive heat generation of the light emitting element in the imaging apparatus is transmitted to the solid-state imaging element through the circuit board. Therefore, an unnecessary temperature rise also occurs in the electrical connection part of the solid-state image sensor and the adhesive part of the translucent member, and an electrical failure of the solid-state image sensor or peeling of the translucent member occurs, resulting in a defect as an imaging device. May occur.

  The present invention has been made in view of the above circumstances, and a solid-state imaging device capable of suppressing heat generated during driving of a light-emitting unit including a light-emitting element from conducting heat from the light-emitting unit to another region, and An object is to provide a camera unit.

  A solid-state imaging device according to the present invention includes a circuit board, a solid-state imaging element disposed on the circuit board, a light-emitting unit including a light-emitting element disposed on the circuit board around the solid-state imaging element, And a thermal resistance part formed between the solid-state imaging device and the light emitting part.

  According to this configuration, since unnecessary heat can be prevented from being conducted to other regions when the light emitting unit is driven, malfunction of the solid-state imaging device can be prevented, and reliability can be improved. In addition, warpage of the circuit board due to heat can be prevented.

  In the solid-state imaging device of the present invention, the thermal resistance portion is a through hole formed between the solid-state imaging device and the light emitting portion.

  According to this configuration, since the air heat insulating portion is configured on the circuit board, heat conduction on the circuit board can be greatly suppressed. Therefore, malfunction of the solid-state imaging device can be prevented, and reliability can be improved.

  In the solid-state imaging device of the present invention, the thermal resistance portion is a constricted portion formed in a conductive wiring pattern of the circuit board between the solid-state imaging element and the light emitting portion.

  According to this configuration, the thermal conductivity can be lowered by providing a portion having a small cross-sectional area of the conductive wiring pattern having a high thermal conductivity between the solid-state imaging device and the light emitting unit. Therefore, malfunction of the solid-state imaging device can be prevented, and reliability can be improved.

  In the solid-state imaging device of the present invention, at least a part of the ground portion of the circuit board is cut off between the solid-state imaging device and the light-emitting portion.

  According to this configuration, a part of the pattern of the copper plate or copper foil having a high thermal conductivity is cut out, so that the thermal conductivity is lowered. Therefore, malfunction of the solid-state imaging device can be prevented, and reliability can be improved.

  In the solid-state imaging device of the present invention, the light emitting unit includes the light emitting element and a resistance element.

  According to this configuration, since the thermal resistance portion is formed between the light emitting element and the resistance element that generate a large amount of heat, the thermal conductivity decreases. Therefore, malfunction of the solid-state imaging device can be prevented, and reliability can be improved.

  In the solid-state imaging device of the present invention, the light emitting element is disposed between the solid-state imaging element and the resistance element.

  According to this configuration, the distance between the resistor element that generates a large amount of heat and the light emitting element is particularly long, and the amount of heat conduction from the resistor element to the solid-state imaging element is reduced. Therefore, malfunction of the solid-state imaging device can be prevented, and reliability can be improved.

  In the solid-state imaging device of the present invention, the light emitting unit includes a second thermal resistance unit disposed between the light emitting element and the resistance element.

  According to this configuration, since the air heat insulating portion is further formed on the circuit board, heat conduction on the circuit board can be greatly suppressed. Therefore, malfunction of the solid-state imaging device can be prevented, and reliability can be improved.

  The camera unit of the present invention includes a circuit board, a solid-state imaging device disposed on the circuit board, a light-emitting unit including a light-emitting element disposed on the circuit board around the solid-state imaging device, A heat resistance portion formed between the solid-state imaging device and the light emitting portion, and heat dissipation disposed on the side opposite to the surface of the circuit board on which the light emitting portion is disposed, corresponding to the light emitting portion. A sheet and a heat sink to which the circuit board is fixed.

  According to this configuration, heat generated when the light emitting unit including the light emitting element is driven is radiated by the heat resistance unit, the heat radiating sheet, and the heat radiating plate, so that heat conduction from the light emitting unit to other regions is greatly suppressed. It is possible.

  ADVANTAGE OF THE INVENTION According to this invention, it can suppress that the heat | fever generate | occur | produced at the time of the drive of the light emission part containing a light emitting element is thermally conducted from a light emission part to another area | region.

1 is an exploded perspective view of an example of a vehicle-mounted camera according to a first embodiment of the present invention. The rear view of an example of the vehicle-mounted camera of the 1st Embodiment of this invention The perspective view which shows an example of the state by which each electronic component was arrange | positioned at the printed wiring board of the 1st Embodiment of this invention. The perspective view which shows an example of the state by which each electronic component was arrange | positioned at the printed wiring board of the 1st Embodiment of this invention. The perspective view which shows an example of the state by which each electronic component was arrange | positioned at the printed wiring board of the 1st Embodiment of this invention. The figure which shows an example of the surface temperature measurement simulation result of the printed wiring board of the 1st Embodiment of this invention (when it does not have a through-hole) The figure which shows an example of the surface temperature measurement simulation result of the printed wiring board of the 1st Embodiment of this invention (when it has one through-hole) The figure which shows an example of the surface temperature measurement simulation result of the printed wiring board of the 1st Embodiment of this invention (when it has two through-holes) The figure which shows an example of the surface temperature measurement simulation result of the printed wiring board of the 1st Embodiment of this invention (when it has four through-holes) The perspective view which shows an example in the state where the imaging module of the 1st Embodiment of this invention was combined. A-A 'sectional view of the imaging module shown in FIG. The perspective view which shows an example of the state by which each electronic component was arrange | positioned by the printed wiring board of the 2nd Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(First embodiment)
FIG. 1 is an exploded perspective view of the in-vehicle camera in the present embodiment. The in-vehicle camera 100 illustrated in FIG. 1 is an example of a camera unit that includes a solid-state imaging element and a light emitting unit including a light emitting element. The in-vehicle camera is mounted, for example, on a steering column in the vehicle, and serves as a driver monitor, and is mounted so that the driver can look aside and detect a snooze driving by imaging the driver of the vehicle. . In addition, although the vehicle-mounted camera is illustrated here as a camera unit, various camera units, such as a surveillance camera, a medical camera, and a camera for information communication terminals, can be considered.

  The in-vehicle camera 100 includes an imaging module 10 as a solid-state imaging device, a first case unit 20 and a second case unit 30 that accommodate the imaging module 10, and a base unit 40 that fixes the second case unit 30. Yes.

  The imaging module 10 includes a lens unit 11, a printed wiring board 12 as a circuit board on which various electronic members such as a solid-state imaging device 101 are mounted, and a lens bracket 13 that is disposed around the center of the printed wiring board 12 and supports the lens unit 11. ,have. The solid-state imaging device 101 is disposed on the printed wiring board 12 by soldering or the like. The lens unit 11 is fixed to the metallic lens bracket 13 via a focus lock nut 14. The lens bracket 13 is fixed to the printed wiring board 12 with screws 15. A dustproof rubber 16 is provided so as to cover the solid-state imaging device 101, and the dustproof rubber 16 is accommodated between the printed wiring board 12 and the lens bracket 13. The connector 17 is disposed on the printed wiring board 12 and is connected to a cable 50 described later, and transmits a signal from the solid-state imaging device 101.

  The first case unit 20 is formed to accommodate the imaging module 10 and protects the lens unit 11, the printed wiring board 12, and various electronic components mounted on the printed wiring board 12. The first case portion 20 is a sealing packing 21 that improves the sealing performance when the imaging module 10 is attached, the first case 22 as a main body that houses the imaging module 10, and the first case 22 is opposite to the sealing packing 21. It has a panel 23 attached to the side. When the imaging module 10 is attached to the first case portion 20, the panel 23, the first case 22, the sealing packing 21, and the printed wiring board 12 are fixed by screws 24 in this order.

  The second case portion 30 is engaged with the first case portion 20 to wrap and protect the lens unit 11 and the printed wiring board 12 of the imaging module 10. The second case unit 30 includes a second case 31 as a main body that houses the imaging module 10, a connector cover 33 that protects the connector 17 on the printed wiring board 12, and a heat dissipation sheet that radiates heat from the printed wiring board 12. A cool sheet 34 is provided. The printed wiring board 12 is fixed to the second case 31 with screws 35. The connector cover 33 is fixed to the second case 31 with screws 36. Therefore, the imaging module 10 is in a state of being wrapped by the first case 20 and the second case part 30. When the in-vehicle camera 100 shown in FIG. 1 is combined, the cool sheet 34 is disposed on the side opposite to the surface of the printed wiring board 12 on which the light emitting unit 102 is disposed, corresponding to the light emitting unit 102. It will be. With such an arrangement position, it is possible to efficiently dissipate heat before the heat generated by the light emitting unit 102 is conducted. The uneven shape of the second case 31 has a function as a heat radiating fin.

  The base part 40 is provided with a flat plate-like structure that is attached to, for example, a steering column in a vehicle, and fixes the second case part 30. In the base portion 40, the camera bracket 41 is fixed to the second case 31 using screws 42. Thereby, the camera bracket 41 and the printed wiring board 12 are fixed so as to have a predetermined positional relationship. Further, the camera bracket 41 has a guide portion 43 (here, a recess) for guiding the cable 50 connected to the connector 17 on the printed wiring board 12 of the first case portion 20. The cable 50 is for transmitting various signals such as video signals and supplying power. The camera bracket 41 is made of a member having high thermal conductivity such as aluminum or SUS. Furthermore, the camera bracket 41 desirably extends longer than the length of the printed wiring board 12 in the longitudinal direction. By receiving and radiating the heat generated in the light emitting unit 102 with such a camera bracket 41, it is possible to suppress the conduction of heat to each electronic component of the in-vehicle camera 100.

FIG. 2 is a rear view of the in-vehicle camera in the embodiment of the present invention.
As shown in FIG. 2, the second case part 30 is attached to the base part 40. The connector 17 on the printed wiring board 12 is connected to the cable 50 and is covered and protected by the connector cover 33 together with a part of the cable 50. The cable 50 further includes a connector 51 on the side opposite to the connector 17 side. The connector 51 is connected to a vehicle on which the in-vehicle camera 100 is mounted.

Next, the imaging module 10 will be described in detail.
FIG. 3 is a perspective view showing an example of a state in which each electronic component is disposed on the printed wiring board 12.

  The printed wiring board 12 shown in FIG. 3 includes a solid-state imaging device 101 such as a CCD image sensor, a light emitting unit 102 that illuminates a subject, and a hole 103 as a thermal resistance unit that radiates heat from the light emitting unit 102. Are disposed.

  The printed wiring board 12 is a laminated wiring board in which a plurality of boards are laminated. In the printed wiring board 12 of this embodiment, about 6 to 8 layers of substrates are laminated, various wiring patterns are formed on the surface layer, and a ground portion is formed on the middle layer. As the ground portion, for example, a ground pattern is formed using copper foil, or a copper plate as a solid ground is inserted.

  The light emitting unit 102 is disposed around the solid-state imaging element 101 and includes a light emitting element 111 and a resistance element 112. The light emitting element 111 is, for example, an LED, and, for example, a resin-sealed one is disposed. The resistance element 112 is disposed to control the current flowing to the light emitting element 111. Since the light emitting unit 102 consumes a large amount of power, it generates a large amount of heat and occupies about half the amount of heat generated by the in-vehicle camera 100 as a whole. Therefore, the power consumption of the in-vehicle camera 100 is larger than that of the in-vehicle camera that does not have a conventional light emitting unit. Further, the heat generated in the light emitting unit 102 is conducted on the printed wiring board 12. In FIG. 2, one light emitting unit 102 is provided at each of both end portions of the solid-state imaging device 101, but the arrangement position and number are not limited thereto.

  The hole 103 has a through hole that penetrates the printed wiring board 12, and is provided between the solid-state imaging device 101 and the light emitting unit 102. The through hole is a hole that penetrates all the stacked substrates. Since this through-hole plays a role as an air insulation part of the printed wiring board 12, heat released when the light emitting part 102 is driven is conducted to the solid-state image sensor 101 and deteriorates the performance of the solid-state image sensor 101. This can be prevented. Moreover, when the printed wiring board 12 is a long board | substrate, the curvature of the printed wiring board 12 by heat conduction can be prevented. In FIG. 3, four through holes are provided on each side of the solid-state imaging device 101, but the number is not limited to this, and for example, there may be one each or two each. . Further, the four through holes may not be arranged in a straight line.

  In FIG. 3, the arrangement direction of the plurality of through holes (Y direction) and the arrangement direction of the light emitting elements 111 and the resistance elements 112 (Y direction) are the same direction, but the arrangement relationship as shown in FIG. 4 may be used. In FIG. 4, the resistance element 112, the light emitting element 111, the hole 103, and the solid-state imaging element 101 are arranged in this order from the end side of the printed wiring board 12. That is, the arrangement direction (Y direction) of the plurality of through holes and the arrangement direction (X direction) of the light emitting element 111 and the resistance element 112 are perpendicular to each other.

  In the case of the arrangement as shown in FIG. 3, the printed wiring board 12 can be reduced in size, so that the in-vehicle camera 100 can be reduced in size. On the other hand, when arranged as shown in FIG. 4, the distance between the resistance element 112 and the solid-state imaging element 101 that generate a large amount of heat when the light emitting unit 102 is driven becomes large. Thermal conduction is further suppressed, and malfunction of the solid-state imaging device 101 can be prevented.

  Further, as shown in FIG. 5, in the light emitting section 102 on the printed wiring board 12, a hole 104 as a second thermal resistance section may be provided between the light emitting element 111 and the resistance element 112. Thereby, the heat conduction on the printed wiring board 112 is further suppressed.

  Next, simulation results for the display temperature of the printed wiring board 12 will be described with reference to FIGS.

  6 to 9 are examples of simulation results when measuring the surface temperature of the printed wiring board 12 on which the electronic components are arranged. In this simulation, the heat generation level during operation of the in-vehicle camera 100 is quantified. 6 to 9, the solid-state imaging device is disposed at the center of the printed wiring board 12, and the hole portion and the light emitting portion are disposed in this order toward the end portion. FIG. 6 shows a case where the hole 103 is not provided. FIG. 7 shows a case in which the hole 103 having one through hole is provided. FIG. 8 shows a case where a hole 103 having two through holes is provided. FIG. 9 shows a case where a hole 103 having four through holes is provided. Note that α> β, for example, α = 70 ° C., for example, β = 40 ° C.

  With reference to the simulation results of FIGS. 6 to 9, it can be understood that as the area of the through hole in the printed wiring board 12 is larger, the heat conduction on the printed wiring board 12 is hindered and the temperature is lowered. The heat generation level when driving the vehicle-mounted camera 100 is reduced by about 10% compared to the heat generation level when driving the vehicle-mounted camera having no conventional hole. Thus, by providing the hole 103 and suppressing heat conduction, the thermal load on the optical filter 123 (see FIG. 10) as the translucent member and the solid-state imaging device 101 can be reduced.

  Next, a configuration in a state where the imaging module 10 is combined will be described with reference to FIGS. 10 and 11. FIG. 10 is an example of a perspective view in a state where the imaging module 10 is combined. FIG. 11 is a cross-sectional view taken along the line A-A ′ of the imaging module 10 illustrated in FIG. 10.

  As shown in FIGS. 10 and 11, a three-dimensional wiring board (MID: Molded Interconnect Devices) 121 is made of, for example, resin, and has rectangular trapezoidal leg portions 121 a. A through opening 121c that penetrates the leg 121a is formed at the center of the three-dimensional wiring board 121. Further, in the three-dimensional wiring board 121, the lens unit 11 is disposed on the opposite side to the side connected to the printed wiring board 12, although not shown in FIGS.

  In the three-dimensional wiring board 121, a wiring pattern 130 is formed on the back side of the leg 121a. The wiring pattern 130 is formed by electroless plating or the like for bare mounting of the solid-state imaging element 101. The wiring pattern 130 and the terminal portion 101a are electrically connected. The optical filter 123 is disposed on the plane of the through opening 121c on the lens unit 11 side, and the solid-state imaging device 101 is disposed on the plane of the through opening 121c opposite to the lens unit 11 side. The through opening 121c is formed in a rectangular shape, for example, corresponding to the imaging area of the solid-state imaging device 101.

  In the solid-state image sensor 101, a photoelectric conversion element 101b is arranged. Transmission of the video signal obtained by the solid-state imaging device 101 and the control signal from the outside, and power supply are performed via the wiring pattern 130 and the connection land (not shown) of the printed wiring board 12.

As for the optical filter 123 as a translucent member, IR (InfraRed) cut coat is given to the glass base material. For the IR cut coat, for example, a transparent dielectric film such as silicon dioxide (SiO ₂ ), titanium oxide (TiO ₂ ), magnesium fluoride (MgF ₂ ), zirconium oxide (ZrO ₂ ) is formed by vapor deposition. Spectral characteristics are given. In addition to IR, for example, AR coating may be applied to the glass substrate, or specification without coating may be used.

  In the three-dimensional wiring board 121, an optical filter 123 is disposed at a stepped portion 121 d that faces the lens unit 11 through the through-opening portion 121 c around the optical axis 129, and is solid so as to face the optical filter 123. An image sensor 101 is arranged.

  The solid-state imaging device 101 is connected to a terminal constituted by a wiring pattern 130 formed on the leg portion 121 a via a terminal portion 101 a formed on the surface, and is fixed to the three-dimensional wiring board 121. In addition, the terminals constituted by the wiring pattern 130 of the three-dimensional wiring board 121 are electrically connected to main boards of various devices such as a mobile phone, a personal computer, and an ECU mounted on the vehicle by using a solder paste 131 or the like. . Further, sealing resin is injected into the gap between the solid-state imaging device 101 and the three-dimensional wiring board 121 and cured.

  As shown in FIG. 11, in the imaging module 10 of the present embodiment, the lens unit 11, the optical filter 123, the three-dimensional wiring board 121, and the solid-state imaging device 101 are arranged in this order from the subject side along the optical axis.

  In the imaging module 10, a planar wiring board may be used instead of the three-dimensional wiring board 121. The planar wiring board is used when the camera unit is mounted on, for example, a mobile phone.

  According to such a camera unit of the present embodiment, the hole 103 is disposed between the solid-state imaging device 101 and the light emitting unit 102, so that heat generated when the light emitting unit 102 is driven is transferred to another region. Conduction can be suppressed, and malfunction of the solid-state imaging device 101 can be prevented.

  In this embodiment, the hole is formed, but instead of this, a part of the wiring pattern may be made of a material having high thermal resistance, or a locally thin region may be formed. By doing so, you may form a thermal resistance part.

(Second Embodiment)
In the present embodiment, a constricted portion is formed in the wiring pattern of the printed wiring board 12 between the solid-state imaging device 101 and the light emitting portion 102 as the thermal resistance portion. Since other parts are formed in the same manner as in the first embodiment, the description thereof is omitted here.

  In the constricted portion 105, as shown in FIG. 12, the cross-sectional area of the wiring pattern 106 on the printed wiring board 12 is smaller than that in other regions. However, unlike the vehicle-mounted camera 100 according to the first embodiment, the hole 103 that penetrates the printed wiring board 12 is not provided. FIG. 12 shows an example in which the wiring pattern 106 on the printed wiring board 12 is partially enlarged. When forming the constricted portion 105, only the cross-sectional area of the wiring pattern 106 on the surface layer is reduced, and the ground portion of the intermediate layer does not need to be particularly changed. The cross-sectional area may be reduced according to the pattern 106.

  By reducing the cross-sectional area of the wiring pattern 106 on the surface layer, the heat conduction from the light emitting unit 102 to the solid-state imaging device 101 can be reduced. Furthermore, if the cross-sectional area of the ground portion of the intermediate layer is also reduced, this heat conduction can be further reduced. Therefore, malfunction of the solid-state imaging device 101 when the light emitting unit 102 is driven can be prevented.

(Third embodiment)
In the present embodiment, at least a part of the ground portion of the intermediate layer of the printed wiring board 12 is cut off between the solid-state imaging device 101 and the light emitting portion 102 as the thermal resistance portion. Since other parts are formed in the same manner as in the first embodiment, the description thereof is omitted here.

  When the printed wiring board 12 is formed in a state in which at least a part of the ground part is cut off, another member (for example, part of the surface layer) enters the cut part to form a non-conductive layer. The presence of this nonconductive layer can reduce the thermal conductivity. The number of layers from which the ground portion is cut may be one or plural. However, unlike the vehicle-mounted camera of the first embodiment, the hole 103 that penetrates the printed wiring board 12 is not provided.

  Since the ground part is formed using a copper plate or the like, the thermal conductivity is increased. However, by partially cutting the ground part, heat conduction from the light emitting part 102 to the solid-state imaging device 101 is suppressed. Can do. Therefore, malfunction of the solid-state imaging device 101 when the light emitting unit 102 is driven can be prevented.

  INDUSTRIAL APPLICABILITY The present invention is useful for a solid-state imaging device, a camera unit, and the like that can suppress heat generated when a light emitting unit including a light emitting element is driven from the light emitting unit to other regions.

DESCRIPTION OF SYMBOLS 100 Car-mounted camera 10 Imaging module 11 Lens unit 12 Printed wiring board 13 Lens bracket 14 Focus lock nut 15 Screw 16 Dust-proof rubber 17 Connector 20 1st case part 21 Sealing packing 22 1st case 23 Panel 30 2nd case part 31 2nd case 33 Connector cover 34 Cool sheet 35, 36 Screw 40 Base part 41 Camera bracket 42 Screw 43 Guide part 50 Cable 51 Connector 101 Solid-state imaging device 102 Light emitting part 103, 104 Hole part 105 Constriction part 106 Wiring pattern 111 Light emitting element 112 Resistance element 121 Three-dimensional wiring board 121a Leg part 121c Through-opening part 121d Step part 123 Optical filter 129 Optical axis 130 Wiring pattern 131 Solder paste

Claims (8)

A circuit board;
A solid-state imaging device disposed on the circuit board;
A light-emitting unit including a light-emitting element disposed around the solid-state image sensor on the circuit board;
A thermal resistance section formed between the solid-state imaging device and the light emitting section;
A solid-state imaging device. The solid-state imaging device according to claim 1,
The solid-state imaging device, wherein the thermal resistance unit is a through hole formed between the solid-state imaging element and the light emitting unit. The solid-state imaging device according to claim 1,
The thermal resistance unit is a solid-state imaging device which is a constricted part formed in a conductive wiring pattern of the circuit board between the solid-state imaging element and the light emitting unit. The solid-state imaging device according to claim 1,
The thermal resistance unit is a solid-state imaging device in which at least a part of a ground part of the circuit board is cut off between the solid-state imaging element and the light emitting unit. The solid-state imaging device according to any one of claims 1 to 4,
The light emitting unit is a solid-state imaging device including the light emitting element and a resistance element. The solid-state imaging device according to claim 5,
The light-emitting element is a solid-state imaging device disposed between the solid-state imaging element and the resistance element. The solid-state imaging device according to claim 5, further comprising:
The solid-state imaging device, wherein the light emitting unit includes a second thermal resistance unit disposed between the light emitting element and the resistance element. A circuit board;
A solid-state imaging device disposed on the circuit board;
A light-emitting unit including a light-emitting element disposed around the solid-state image sensor on the circuit board;
A thermal resistance section formed between the solid-state imaging device and the light emitting section;
On the opposite side to the surface of the circuit board on which the light emitting part is disposed, a heat dissipation sheet disposed corresponding to the light emitting part,
A heat sink to which the circuit board is fixed;
A camera unit comprising: