CN101688811B - 具有用于检测热辐射的夹层结构的装置、所述装置的制造和使用方法 - Google Patents

具有用于检测热辐射的夹层结构的装置、所述装置的制造和使用方法 Download PDF

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Publication number
CN101688811B
CN101688811B CN200880024293XA CN200880024293A CN101688811B CN 101688811 B CN101688811 B CN 101688811B CN 200880024293X A CN200880024293X A CN 200880024293XA CN 200880024293 A CN200880024293 A CN 200880024293A CN 101688811 B CN101688811 B CN 101688811B
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CN
China
Prior art keywords
support
detector
cover
circuit
thermal radiation
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Expired - Fee Related
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CN200880024293XA
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English (en)
Chinese (zh)
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CN101688811A (zh
Inventor
卡斯顿·吉伯乐
马堤亚斯·史莱特
约克·查普夫
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Pyreos Ltd
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Pyreos Ltd
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/04—Casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/04—Casings
    • G01J5/041—Mountings in enclosures or in a particular environment
    • G01J5/045—Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/34—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using capacitors, e.g. pyroelectric capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Radiation Pyrometers (AREA)
  • Measurement Of Radiation (AREA)
CN200880024293XA 2007-05-29 2008-05-28 具有用于检测热辐射的夹层结构的装置、所述装置的制造和使用方法 Expired - Fee Related CN101688811B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102007024903A DE102007024903B4 (de) 2007-05-29 2007-05-29 Vorrichtung mit Sandwichstruktur zur Detektion von Wärmestrahlung, Verfahren zum Herstellen und Verwendung der Vorrichtung
DE102007024903.0 2007-05-29
PCT/EP2008/004247 WO2008145354A1 (de) 2007-05-29 2008-05-28 Vorrichtung mit sandwichtstruktur zur detektion von wärmestrahlung, verfahren zum herstellen und verwendung der vorrichtung

Publications (2)

Publication Number Publication Date
CN101688811A CN101688811A (zh) 2010-03-31
CN101688811B true CN101688811B (zh) 2013-10-23

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN200880024293XA Expired - Fee Related CN101688811B (zh) 2007-05-29 2008-05-28 具有用于检测热辐射的夹层结构的装置、所述装置的制造和使用方法

Country Status (10)

Country Link
US (1) US8487257B2 (enExample)
EP (1) EP2153188B1 (enExample)
JP (1) JP5455239B2 (enExample)
KR (1) KR101496673B1 (enExample)
CN (1) CN101688811B (enExample)
AU (1) AU2008256414A1 (enExample)
BR (1) BRPI0812098B1 (enExample)
DE (1) DE102007024903B4 (enExample)
RU (1) RU2465685C2 (enExample)
WO (1) WO2008145354A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007062688B3 (de) * 2007-12-17 2009-02-05 Pyreos Ltd. Vorrichtung mit einer abgeschirmten Sandwichstruktur zur Detektion von Wärmestrahlung und Verwendung der Vorrichtung
DE102009013336A1 (de) * 2009-03-16 2010-09-23 Perkinelmer Optoelectronics Gmbh & Co.Kg Pyroelektrisches Material, Strahlungssensor, Verfahren zur Herstellung eines Strahlungssensors und Verwendung von Lithiumtantalat und Lithiumniobat
US9118132B2 (en) * 2011-09-08 2015-08-25 Bae Systems Information And Electronic Systems Integration Vacuum compatible high-density electrical interconnect system
DE102012216618A1 (de) * 2012-09-18 2014-03-20 Robert Bosch Gmbh Anordnung von mindestens zwei Wafern zum Detektieren von elektromagnetischer Strahlung und Verfahren zum Herstellen der Anordnung
DE102015208701A1 (de) * 2015-05-11 2016-11-17 Infratec Gmbh Vorrichtung zur gleichzeitigen Bestimmung mehrerer unterschiedlicher Stoffe und/oder Stoffkonzentrationen
FR3080705B1 (fr) * 2018-04-27 2020-10-30 Tn Int Emballage de transport et/ou d'entreposage de matieres radioactives permettant une fabrication facilitee ainsi qu'une amelioration de la conduction thermique

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0453372A1 (en) * 1990-04-18 1991-10-23 Terumo Kabushiki Kaisha Infrared ray sensor
EP1640333A1 (en) * 2004-09-23 2006-03-29 Motorola, Inc. Hermetically sealed microdevice with getter shield

Family Cites Families (18)

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JPH0219725A (ja) * 1988-07-07 1990-01-23 Matsushita Electric Ind Co Ltd 焦電形赤外検出素子アレイ、焦電形赤外検出器およびそれらの製法
JP3181363B2 (ja) * 1992-04-17 2001-07-03 テルモ株式会社 赤外線センサおよびその製造方法
EP0566156B1 (en) * 1992-04-17 1997-08-27 Terumo Kabushiki Kaisha Infrared sensor and method for production thereof
DE19525071A1 (de) * 1995-07-10 1997-01-16 Siemens Ag Pyroelektrisches Bauelement und Verfahren zur Herstellung
US5729019A (en) * 1995-12-29 1998-03-17 Honeywell Inc. Split field-of-view uncooled infrared sensor
US5962854A (en) * 1996-06-12 1999-10-05 Ishizuka Electronics Corporation Infrared sensor and infrared detector
JP2000298063A (ja) * 1999-04-14 2000-10-24 Tdk Corp 赤外線検出器
DE19932308C2 (de) * 1999-07-10 2001-10-25 Bosch Gmbh Robert Sensor, insbesondere Thermosensor
JP2001174324A (ja) 1999-12-17 2001-06-29 Tdk Corp 赤外線検出器および赤外線検出装置
DE10004216C2 (de) * 2000-02-01 2002-09-19 Siemens Ag Vorrichtung zur Detektion von Wärmestrahlung und Verwendung der Vorrichtung
RU2180098C2 (ru) * 2000-02-29 2002-02-27 Открытое акционерное общество "Ракетно-космическая корпорация "Энергия" им. С.П. Королева" Устройство определения интенсивности инфракрасного облучения
DE10058861A1 (de) * 2000-11-27 2002-06-13 Siemens Ag Infrarotsensor für hochauflösende Infrarot-Detektoranordnungen und Verfahren zu seiner Herstellung
US6890834B2 (en) 2001-06-11 2005-05-10 Matsushita Electric Industrial Co., Ltd. Electronic device and method for manufacturing the same
JP3519720B2 (ja) * 2001-06-11 2004-04-19 松下電器産業株式会社 電子デバイス
WO2004015764A2 (en) * 2002-08-08 2004-02-19 Leedy Glenn J Vertical system integration
DE102004020685B3 (de) * 2004-04-28 2005-09-01 Robert Bosch Gmbh Infrarotsensor mit Getterschicht
JP4385255B2 (ja) * 2004-06-10 2009-12-16 日本電気株式会社 ボロメータ型赤外線検出器及び残像の低減方法
JP2008544263A (ja) * 2005-06-27 2008-12-04 エイチエル−プラナー・テクニク・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング 電磁波検出用装置及びそのような装置製造のための方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0453372A1 (en) * 1990-04-18 1991-10-23 Terumo Kabushiki Kaisha Infrared ray sensor
EP1640333A1 (en) * 2004-09-23 2006-03-29 Motorola, Inc. Hermetically sealed microdevice with getter shield

Also Published As

Publication number Publication date
JP5455239B2 (ja) 2014-03-26
DE102007024903A1 (de) 2008-12-11
JP2010528301A (ja) 2010-08-19
KR101496673B1 (ko) 2015-02-27
US8487257B2 (en) 2013-07-16
DE102007024903B4 (de) 2009-05-07
CN101688811A (zh) 2010-03-31
WO2008145354A1 (de) 2008-12-04
US20100264311A1 (en) 2010-10-21
RU2009144002A (ru) 2011-07-10
AU2008256414A1 (en) 2008-12-04
KR20100023008A (ko) 2010-03-03
BRPI0812098B1 (pt) 2018-06-19
BRPI0812098A2 (pt) 2014-11-25
RU2465685C2 (ru) 2012-10-27
EP2153188A1 (de) 2010-02-17
EP2153188B1 (de) 2012-05-16

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