PT4019652T - Liga de soldadura, pasta de soldadura, esferas de soldadura, pré-forma de soldadura, junta de soldadura, circuito electrónico de veículo, circuito electrónico de unidade de controlo electrónico, dispositivo de circuito electrónico de veículo e dispositivo de circuito electrónico de unidade de controlo electrónico - Google Patents

Liga de soldadura, pasta de soldadura, esferas de soldadura, pré-forma de soldadura, junta de soldadura, circuito electrónico de veículo, circuito electrónico de unidade de controlo electrónico, dispositivo de circuito electrónico de veículo e dispositivo de circuito electrónico de unidade de controlo electrónico

Info

Publication number
PT4019652T
PT4019652T PT218296960T PT21829696T PT4019652T PT 4019652 T PT4019652 T PT 4019652T PT 218296960 T PT218296960 T PT 218296960T PT 21829696 T PT21829696 T PT 21829696T PT 4019652 T PT4019652 T PT 4019652T
Authority
PT
Portugal
Prior art keywords
electronic circuit
solder
circuit device
ecu
soldering
Prior art date
Application number
PT218296960T
Other languages
English (en)
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of PT4019652T publication Critical patent/PT4019652T/pt

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262Sn as the principal constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/0008Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016Brazing of electronic components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244Powders, particles or spheres; Preforms made therefrom
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244Powders, particles or spheres; Preforms made therefrom
    • B23K35/025Pastes, creams, slurries
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C13/00Alloys based on tin
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C13/00Alloys based on tin
    • C22C13/02Alloys based on tin with antimony or bismuth as the next major constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
PT218296960T 2020-06-23 2021-06-22 Liga de soldadura, pasta de soldadura, esferas de soldadura, pré-forma de soldadura, junta de soldadura, circuito electrónico de veículo, circuito electrónico de unidade de controlo electrónico, dispositivo de circuito electrónico de veículo e dispositivo de circuito electrónico de unidade de controlo electrónico PT4019652T (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020107816A JP6889387B1 (ja) 2020-06-23 2020-06-23 はんだ合金、ソルダペースト、はんだボール、ソルダプリフォーム、はんだ継手、車載電子回路、ecu電子回路、車載電子回路装置、及びecu電子回路装置

Publications (1)

Publication Number Publication Date
PT4019652T true PT4019652T (pt) 2023-09-25

Family

ID=76429566

Family Applications (1)

Application Number Title Priority Date Filing Date
PT218296960T PT4019652T (pt) 2020-06-23 2021-06-22 Liga de soldadura, pasta de soldadura, esferas de soldadura, pré-forma de soldadura, junta de soldadura, circuito electrónico de veículo, circuito electrónico de unidade de controlo electrónico, dispositivo de circuito electrónico de veículo e dispositivo de circuito electrónico de unidade de controlo electrónico

Country Status (13)

Country Link
US (1) US20220355420A1 (pt)
EP (1) EP4019652B1 (pt)
JP (1) JP6889387B1 (pt)
KR (1) KR102491517B1 (pt)
CN (1) CN114746209B (pt)
BR (1) BR112022004264B1 (pt)
CA (1) CA3156067C (pt)
ES (1) ES2960421T3 (pt)
MX (1) MX2022004241A (pt)
MY (1) MY195124A (pt)
PT (1) PT4019652T (pt)
TW (1) TWI825437B (pt)
WO (1) WO2021261486A1 (pt)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023248302A1 (ja) * 2022-06-20 2023-12-28 三菱電機株式会社 はんだ接合部材、半導体装置、はんだ接合方法、および、半導体装置の製造方法
CN115446493A (zh) * 2022-08-31 2022-12-09 昆明理工大学 一种含Bi、Sb、Yb的高润湿性Sn-Ag-Cu系无铅钎料
JP7323854B1 (ja) 2023-01-12 2023-08-09 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、はんだプリフォーム、はんだ継手、車載電子回路、ecu電子回路、車載電子回路装置、およびecu電子回路装置
JP7323853B1 (ja) 2023-01-12 2023-08-09 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、はんだプリフォーム、はんだ継手、車載電子回路、ecu電子回路、車載電子回路装置、およびecu電子回路装置
JP7323855B1 (ja) 2023-01-12 2023-08-09 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、はんだプリフォーム、はんだ継手、車載電子回路、ecu電子回路、車載電子回路装置、およびecu電子回路装置
JP7376842B1 (ja) 2023-02-21 2023-11-09 千住金属工業株式会社 はんだ合金、はんだボール、はんだペースト及びはんだ継手

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6253988B1 (en) * 1999-03-29 2001-07-03 Antaya Technologies Corporation Low temperature solder
JP2002018589A (ja) * 2000-07-03 2002-01-22 Senju Metal Ind Co Ltd 鉛フリーはんだ合金
US6660226B1 (en) * 2000-08-07 2003-12-09 Murata Manufacturing Co., Ltd. Lead free solder and soldered article
GB2421030B (en) * 2004-12-01 2008-03-19 Alpha Fry Ltd Solder alloy
KR101265449B1 (ko) * 2007-07-13 2013-05-16 센주긴조쿠고교 가부시키가이샤 차재 실장용 무납 땜납과 차재 전자 회로
WO2009011392A1 (ja) * 2007-07-18 2009-01-22 Senju Metal Industry Co., Ltd. 車載電子回路用In入り鉛フリーはんだ
JP2015077601A (ja) * 2013-04-02 2015-04-23 千住金属工業株式会社 鉛フリーはんだ合金
JP6200534B2 (ja) * 2015-03-24 2017-09-20 株式会社タムラ製作所 鉛フリーはんだ合金、電子回路基板および電子制御装置
JP2016107343A (ja) * 2015-12-24 2016-06-20 千住金属工業株式会社 鉛フリーはんだ合金と車載電子回路
CN108500499B (zh) * 2016-03-22 2019-10-22 株式会社田村制作所 无铅软钎料合金、电子电路基板和电子控制装置
JP6767506B2 (ja) * 2016-05-06 2020-10-14 アルファ・アセンブリー・ソリューションズ・インコーポレイテッドAlpha Assembly Solutions Inc. 高信頼性鉛フリーはんだ合金
US20180102464A1 (en) * 2016-10-06 2018-04-12 Alpha Assembly Solutions Inc. Advanced Solder Alloys For Electronic Interconnects
JP6578393B2 (ja) * 2018-02-27 2019-09-18 株式会社タムラ製作所 鉛フリーはんだ合金、電子回路実装基板及び電子制御装置
JP6521161B1 (ja) * 2018-07-20 2019-05-29 千住金属工業株式会社 はんだ合金、はんだ粉末、はんだペースト、およびこれらを用いたはんだ継手
CN109014652A (zh) * 2018-09-26 2018-12-18 深圳市安臣焊锡制品有限公司 一种环保型焊锡材料及其制备工艺
JP2019072770A (ja) * 2018-12-05 2019-05-16 千住金属工業株式会社 鉛フリーはんだ合金と車載電子回路
JP6731037B2 (ja) * 2018-12-28 2020-07-29 株式会社タムラ製作所 鉛フリーはんだ合金、はんだ接合用材料、電子回路実装基板及び電子制御装置
JP6624322B1 (ja) * 2019-03-27 2019-12-25 千住金属工業株式会社 はんだ合金、はんだボール、はんだプリフォーム、はんだペースト及びはんだ継手

Also Published As

Publication number Publication date
WO2021261486A1 (ja) 2021-12-30
CN114746209B (zh) 2023-06-09
TW202204079A (zh) 2022-02-01
BR112022004264A2 (pt) 2022-05-31
KR102491517B1 (ko) 2023-01-26
JP6889387B1 (ja) 2021-06-18
EP4019652A4 (en) 2022-11-23
CN114746209A (zh) 2022-07-12
EP4019652B1 (en) 2023-09-06
KR20220065093A (ko) 2022-05-19
CA3156067A1 (en) 2021-12-30
ES2960421T3 (es) 2024-03-04
CA3156067C (en) 2023-03-14
JP2022002855A (ja) 2022-01-11
MY195124A (en) 2023-01-11
EP4019652A1 (en) 2022-06-29
MX2022004241A (es) 2023-05-18
TWI825437B (zh) 2023-12-11
US20220355420A1 (en) 2022-11-10
BR112022004264B1 (pt) 2022-10-18

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