WO2006067028A3 - Leiterplatte mit wenigstens eine metallisierte seitliche öffnung in der stirnseite und anordnung mindestens zwei solcher leiterplatten - Google Patents

Leiterplatte mit wenigstens eine metallisierte seitliche öffnung in der stirnseite und anordnung mindestens zwei solcher leiterplatten Download PDF

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Publication number
WO2006067028A3
WO2006067028A3 PCT/EP2005/056330 EP2005056330W WO2006067028A3 WO 2006067028 A3 WO2006067028 A3 WO 2006067028A3 EP 2005056330 W EP2005056330 W EP 2005056330W WO 2006067028 A3 WO2006067028 A3 WO 2006067028A3
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
components
strip conductors
fitted
electrical
Prior art date
Application number
PCT/EP2005/056330
Other languages
English (en)
French (fr)
Other versions
WO2006067028A2 (de
Inventor
Dietmar Birgel
Karl-Peter Hauptvogel
Juergen Krueger
Paul Burger
Original Assignee
Endress & Hauser Gmbh & Co Kg
Dietmar Birgel
Karl-Peter Hauptvogel
Juergen Krueger
Paul Burger
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Endress & Hauser Gmbh & Co Kg, Dietmar Birgel, Karl-Peter Hauptvogel, Juergen Krueger, Paul Burger filed Critical Endress & Hauser Gmbh & Co Kg
Publication of WO2006067028A2 publication Critical patent/WO2006067028A2/de
Publication of WO2006067028A3 publication Critical patent/WO2006067028A3/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/027—Soldered or welded connections comprising means for positioning or holding the parts to be soldered or welded
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09163—Slotted edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10363—Jumpers, i.e. non-printed cross-over connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

Die Erfindung betrifft Leiterplatten, die untereinander durch flexible Leiterbahnen oder Jumper verbunden werden. Es ist wünschenswert, die Jumper in einem dem Lötprozess und in einem Schritt zusammen mit anderen SMD- und sonstigen Bauteilen auf den Leiterplatten in einem Reflow-Lötofen zu löten. Dazu sind bei der erfindungsgemäßen Leiterplatte (10), die üblicherweise mehrere Innenlagen (11) sowie innere Leiterbahnen (12) und äußere Leiterbahnen (13) aufweist, in der Stirnseite (18) seitliche Öffnungen (17) angebracht, die vorzugsweise metallisiert sind. Nach Ein- bzw. Aufbringen von Lotpaste können dort hineingesteckte Anschlußpins bzw. Anschlußdrähte (16) eines Jumpers (15) zusammen mit anderen Bauteilen auf der Leiterplatte (10) in einem Reflow-Lötofen verlötet werden.
PCT/EP2005/056330 2004-12-22 2005-11-29 Leiterplatte mit wenigstens eine metallisierte seitliche öffnung in der stirnseite und anordnung mindestens zwei solcher leiterplatten WO2006067028A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004063135.2 2004-12-22
DE200410063135 DE102004063135A1 (de) 2004-12-22 2004-12-22 Leiterplatte zur Bestückung mit elektrischen und/oder elektronischen Bauteilen

Publications (2)

Publication Number Publication Date
WO2006067028A2 WO2006067028A2 (de) 2006-06-29
WO2006067028A3 true WO2006067028A3 (de) 2006-08-31

Family

ID=36570960

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2005/056330 WO2006067028A2 (de) 2004-12-22 2005-11-29 Leiterplatte mit wenigstens eine metallisierte seitliche öffnung in der stirnseite und anordnung mindestens zwei solcher leiterplatten

Country Status (2)

Country Link
DE (1) DE102004063135A1 (de)
WO (1) WO2006067028A2 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106717135A (zh) * 2014-09-24 2017-05-24 皇家飞利浦有限公司 印刷电路板和印刷电路板布置
CN109301511B (zh) * 2017-07-25 2021-08-06 迈恩德电子有限公司 终端连接和用于终端连接的板装置和制造终端连接的方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007008109B4 (de) * 2007-02-19 2022-10-27 Osram Gmbh Trägerplattenanordnung
DE102008056826A1 (de) 2008-11-11 2010-05-12 Neuschäfer Elektronik GmbH Leiterplatte zur Bestückung mit oberflächenmontierbaren und drahtgebundenen Bauteilen und Verfahren zur Herstellung einer Leiterplatte
DE102014105530A1 (de) 2014-04-17 2015-10-22 Endress+Hauser Flowtec Ag Leiterplatte und Anordnung aus einer Leiterplatte und einem Koaxialkabel
US20210066827A1 (en) * 2019-08-26 2021-03-04 Lockheed Martin Corporation Pin side edge mount connector and systems and methods thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3281627A (en) * 1964-04-08 1966-10-25 Gen Electric Circuit board connecting and mounting arrangement
US5949657A (en) * 1997-12-01 1999-09-07 Karabatsos; Chris Bottom or top jumpered foldable electronic assembly
JP2004335550A (ja) * 2003-04-30 2004-11-25 Jst Mfg Co Ltd 多層プリント配線板の接続構造
JP2004335547A (ja) * 2003-04-30 2004-11-25 Jst Mfg Co Ltd 多層プリント配線板の接続構造

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1416437B2 (de) * 1961-09-21 1970-06-11 Telefunken Patentverwertungsgesellschaft Mbh, 7900 Ulm Trägerplatte für mikrominiaturisierte Schaltelemente und Verfahren zu ihrer Herstellung
US3280378A (en) * 1964-07-01 1966-10-18 Cts Corp Means for anchoring and connecting lead wires in an electrical component
GB1241234A (en) * 1968-03-11 1971-08-04 Beckman Instruments Inc Electrical terminal and mounting thereof on base member
DD247546A1 (de) * 1986-04-01 1987-07-08 Zeiss Jena Veb Carl Anschlusskontaktierte leiterplatte
JPH08195556A (ja) * 1995-01-13 1996-07-30 Fujitsu Ten Ltd 回路基板間の接続方法
DE19822794C1 (de) * 1998-05-20 2000-03-09 Siemens Matsushita Components Mehrfachnutzen für elektronische Bauelemente, insbesondere akustische Oberflächenwellen-Bauelemente

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3281627A (en) * 1964-04-08 1966-10-25 Gen Electric Circuit board connecting and mounting arrangement
US5949657A (en) * 1997-12-01 1999-09-07 Karabatsos; Chris Bottom or top jumpered foldable electronic assembly
JP2004335550A (ja) * 2003-04-30 2004-11-25 Jst Mfg Co Ltd 多層プリント配線板の接続構造
JP2004335547A (ja) * 2003-04-30 2004-11-25 Jst Mfg Co Ltd 多層プリント配線板の接続構造

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 2003, no. 12 5 December 2003 (2003-12-05) *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106717135A (zh) * 2014-09-24 2017-05-24 皇家飞利浦有限公司 印刷电路板和印刷电路板布置
CN106717135B (zh) * 2014-09-24 2019-09-27 皇家飞利浦有限公司 印刷电路板和印刷电路板布置
CN109301511B (zh) * 2017-07-25 2021-08-06 迈恩德电子有限公司 终端连接和用于终端连接的板装置和制造终端连接的方法

Also Published As

Publication number Publication date
DE102004063135A1 (de) 2006-07-13
WO2006067028A2 (de) 2006-06-29

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