TWI799696B - 焊料製品之製造方法、焊料、焊接部件、焊料製品、印刷線路板、印刷電路板、線材、焊接製品、可撓印刷電路板、電子部件、錫成品之製造方法、錫半成品之製造方法、錫成品、錫半成品及導電構件 - Google Patents

焊料製品之製造方法、焊料、焊接部件、焊料製品、印刷線路板、印刷電路板、線材、焊接製品、可撓印刷電路板、電子部件、錫成品之製造方法、錫半成品之製造方法、錫成品、錫半成品及導電構件 Download PDF

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Publication number
TWI799696B
TWI799696B TW109113001A TW109113001A TWI799696B TW I799696 B TWI799696 B TW I799696B TW 109113001 A TW109113001 A TW 109113001A TW 109113001 A TW109113001 A TW 109113001A TW I799696 B TWI799696 B TW I799696B
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TW
Taiwan
Prior art keywords
product
tin
solder
circuit board
manufacturing
Prior art date
Application number
TW109113001A
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English (en)
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TW202134444A (zh
Inventor
石川久雄
榧場正男
荻原明
Original Assignee
石川久雄
榧場正男
荻原明
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Priority claimed from JP2020043538A external-priority patent/JP2021142548A/ja
Priority claimed from JP2020069966A external-priority patent/JP2021164948A/ja
Priority claimed from JP2020069965A external-priority patent/JP7026907B2/ja
Application filed by 石川久雄, 榧場正男, 荻原明 filed Critical 石川久雄
Publication of TW202134444A publication Critical patent/TW202134444A/zh
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Publication of TWI799696B publication Critical patent/TWI799696B/zh

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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling
TW109113001A 2020-03-12 2020-04-17 焊料製品之製造方法、焊料、焊接部件、焊料製品、印刷線路板、印刷電路板、線材、焊接製品、可撓印刷電路板、電子部件、錫成品之製造方法、錫半成品之製造方法、錫成品、錫半成品及導電構件 TWI799696B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2020043538A JP2021142548A (ja) 2020-03-12 2020-03-12 はんだ、はんだの製造方法及びはんだ付け部品
JP2020-043538 2020-03-12
JP2020069966A JP2021164948A (ja) 2020-04-08 2020-04-08 錫成形品の製造方法、錫中間製品の製造方法、錫成形品、錫中間製品、導電部材、線材、フレキシブルプリント基板および電子部品
JP2020-069966 2020-04-08
JP2020069965A JP7026907B2 (ja) 2020-04-08 2020-04-08 はんだ製品の製造方法、プリント回路板、線材、フレキシブルプリント基板および電子部品
JP2020-069965 2020-04-08

Publications (2)

Publication Number Publication Date
TW202134444A TW202134444A (zh) 2021-09-16
TWI799696B true TWI799696B (zh) 2023-04-21

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TW109113001A TWI799696B (zh) 2020-03-12 2020-04-17 焊料製品之製造方法、焊料、焊接部件、焊料製品、印刷線路板、印刷電路板、線材、焊接製品、可撓印刷電路板、電子部件、錫成品之製造方法、錫半成品之製造方法、錫成品、錫半成品及導電構件

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009197315A (ja) * 2008-02-22 2009-09-03 Nippon Joint Kk 鉛フリーはんだ合金の製造方法及び半導体装置の製造方法
KR20150122508A (ko) * 2014-04-23 2015-11-02 덕산하이메탈(주) 주석 필터링 방법, 이를 이용한 합금 제조방법 및 솔더볼 제조방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009197315A (ja) * 2008-02-22 2009-09-03 Nippon Joint Kk 鉛フリーはんだ合金の製造方法及び半導体装置の製造方法
KR20150122508A (ko) * 2014-04-23 2015-11-02 덕산하이메탈(주) 주석 필터링 방법, 이를 이용한 합금 제조방법 및 솔더볼 제조방법

Also Published As

Publication number Publication date
TW202134444A (zh) 2021-09-16

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