PT1362132E - Regeneracao de um alvo de pulverizacao de tantalo - Google Patents
Regeneracao de um alvo de pulverizacao de tantaloInfo
- Publication number
- PT1362132E PT1362132E PT02718966T PT02718966T PT1362132E PT 1362132 E PT1362132 E PT 1362132E PT 02718966 T PT02718966 T PT 02718966T PT 02718966 T PT02718966 T PT 02718966T PT 1362132 E PT1362132 E PT 1362132E
- Authority
- PT
- Portugal
- Prior art keywords
- plate
- refractory
- powder
- metal products
- refractory metal
- Prior art date
Links
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 title abstract 3
- 230000008929 regeneration Effects 0.000 title 1
- 238000011069 regeneration method Methods 0.000 title 1
- 239000007921 spray Substances 0.000 title 1
- 229910052751 metal Inorganic materials 0.000 abstract 3
- 239000002184 metal Substances 0.000 abstract 3
- 239000000843 powder Substances 0.000 abstract 3
- 239000003870 refractory metal Substances 0.000 abstract 3
- 238000000034 method Methods 0.000 abstract 2
- 230000003716 rejuvenation Effects 0.000 abstract 2
- 229910052715 tantalum Inorganic materials 0.000 abstract 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 abstract 1
- 229910052799 carbon Inorganic materials 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 230000003628 erosive effect Effects 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 229910052750 molybdenum Inorganic materials 0.000 abstract 1
- 239000011733 molybdenum Substances 0.000 abstract 1
- 238000000926 separation method Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
- H01J37/3491—Manufacturing of targets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
- B22F2007/068—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts repairing articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Composite Materials (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Furnace Housings, Linings, Walls, And Ceilings (AREA)
- Electrodes Of Semiconductors (AREA)
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
- Catalysts (AREA)
- Arc-Extinguishing Devices That Are Switches (AREA)
- Inorganic Insulating Materials (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Compositions Of Oxide Ceramics (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US26874201P | 2001-02-14 | 2001-02-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PT1362132E true PT1362132E (pt) | 2006-09-29 |
Family
ID=23024267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PT02718966T PT1362132E (pt) | 2001-02-14 | 2002-02-14 | Regeneracao de um alvo de pulverizacao de tantalo |
Country Status (24)
| Country | Link |
|---|---|
| US (1) | US20020112955A1 (enExample) |
| EP (1) | EP1362132B1 (enExample) |
| JP (1) | JP2004523653A (enExample) |
| CN (1) | CN1221684C (enExample) |
| AT (1) | ATE325906T1 (enExample) |
| AU (1) | AU2002250075B2 (enExample) |
| BG (1) | BG64959B1 (enExample) |
| BR (1) | BR0207202A (enExample) |
| CA (1) | CA2437713A1 (enExample) |
| CZ (1) | CZ20032186A3 (enExample) |
| DE (1) | DE60211309T2 (enExample) |
| DK (1) | DK1362132T3 (enExample) |
| ES (1) | ES2261656T3 (enExample) |
| HU (1) | HUP0400730A2 (enExample) |
| IS (1) | IS6911A (enExample) |
| MX (1) | MXPA03007293A (enExample) |
| NO (1) | NO20033567L (enExample) |
| NZ (1) | NZ527503A (enExample) |
| PL (1) | PL363521A1 (enExample) |
| PT (1) | PT1362132E (enExample) |
| RU (1) | RU2304633C2 (enExample) |
| SK (1) | SK10062003A3 (enExample) |
| WO (1) | WO2002064287A2 (enExample) |
| ZA (1) | ZA200306259B (enExample) |
Families Citing this family (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7175802B2 (en) * | 2001-09-17 | 2007-02-13 | Heraeus, Inc. | Refurbishing spent sputtering targets |
| NZ534237A (en) * | 2002-01-24 | 2006-01-27 | Starck H C Inc | Refractory metal and alloy refining by laser forming and melting |
| US20040016635A1 (en) * | 2002-07-19 | 2004-01-29 | Ford Robert B. | Monolithic sputtering target assembly |
| US20040065546A1 (en) * | 2002-10-04 | 2004-04-08 | Michaluk Christopher A. | Method to recover spent components of a sputter target |
| US7504008B2 (en) * | 2004-03-12 | 2009-03-17 | Applied Materials, Inc. | Refurbishment of sputtering targets |
| US20060021870A1 (en) * | 2004-07-27 | 2006-02-02 | Applied Materials, Inc. | Profile detection and refurbishment of deposition targets |
| US20060081459A1 (en) * | 2004-10-18 | 2006-04-20 | Applied Materials, Inc. | In-situ monitoring of target erosion |
| US8802191B2 (en) | 2005-05-05 | 2014-08-12 | H. C. Starck Gmbh | Method for coating a substrate surface and coated product |
| AU2006243448B2 (en) | 2005-05-05 | 2011-09-01 | H.C. Starck Inc. | Coating process for manufacture or reprocessing of sputter targets and X-ray anodes |
| US9127362B2 (en) | 2005-10-31 | 2015-09-08 | Applied Materials, Inc. | Process kit and target for substrate processing chamber |
| JPWO2007052743A1 (ja) * | 2005-11-07 | 2009-04-30 | 株式会社東芝 | スパッタリングターゲットおよびその製造方法 |
| DE102005055255A1 (de) * | 2005-11-19 | 2007-05-31 | Applied Materials Gmbh & Co. Kg | Verfahren zum Herstellen eines Targets |
| US8647484B2 (en) | 2005-11-25 | 2014-02-11 | Applied Materials, Inc. | Target for sputtering chamber |
| US20080078268A1 (en) | 2006-10-03 | 2008-04-03 | H.C. Starck Inc. | Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof |
| US20080145688A1 (en) | 2006-12-13 | 2008-06-19 | H.C. Starck Inc. | Method of joining tantalum clade steel structures |
| US8197894B2 (en) * | 2007-05-04 | 2012-06-12 | H.C. Starck Gmbh | Methods of forming sputtering targets |
| US8968536B2 (en) | 2007-06-18 | 2015-03-03 | Applied Materials, Inc. | Sputtering target having increased life and sputtering uniformity |
| CN101779266A (zh) * | 2007-08-08 | 2010-07-14 | 皇家飞利浦电子股份有限公司 | 用于将材料涂抹到x射线源的阳极表面的方法和装置、阳极以及x射线源 |
| US8699667B2 (en) * | 2007-10-02 | 2014-04-15 | General Electric Company | Apparatus for x-ray generation and method of making same |
| US7901552B2 (en) | 2007-10-05 | 2011-03-08 | Applied Materials, Inc. | Sputtering target with grooves and intersecting channels |
| US8246903B2 (en) | 2008-09-09 | 2012-08-21 | H.C. Starck Inc. | Dynamic dehydriding of refractory metal powders |
| US8043655B2 (en) * | 2008-10-06 | 2011-10-25 | H.C. Starck, Inc. | Low-energy method of manufacturing bulk metallic structures with submicron grain sizes |
| FR2953747B1 (fr) * | 2009-12-14 | 2012-03-23 | Snecma | Procede de reparation d'une aube en titane par rechargement laser et compression hip moderee |
| DE102010004241A1 (de) * | 2010-01-08 | 2011-07-14 | H.C. Starck GmbH, 38642 | Verfahren zur Herstellung von Funktionsschichten auf der Oberfläche von Werkstücken, eine so hergestellte Funktionsschicht und ein Werkstück |
| WO2013049274A2 (en) | 2011-09-29 | 2013-04-04 | H.C. Starck, Inc. | Large-area sputtering targets and methods of manufacturing large-area sputtering targets |
| JP6532219B2 (ja) * | 2013-11-25 | 2019-06-19 | 株式会社フルヤ金属 | スパッタリングターゲットの再生方法及び再生スパッタリングターゲット |
| AT14301U1 (de) * | 2014-07-09 | 2015-07-15 | Plansee Se | Verfahren zur Herstellung eines Bauteils |
| CN104439239B (zh) * | 2014-11-06 | 2017-05-03 | 金堆城钼业股份有限公司 | 一种重复利用中频感应烧结炉钨钼废发热体的方法 |
| DE102015008921A1 (de) * | 2015-07-15 | 2017-01-19 | Evobeam GmbH | Verfahren zur additiven Herstellung von Bauteilen |
| CN107614744B (zh) * | 2015-12-28 | 2020-04-24 | Ｊｘ金属株式会社 | 溅射靶的制造方法 |
| CN105618753A (zh) * | 2016-03-03 | 2016-06-01 | 中研智能装备有限公司 | 一种轧辊等离子3d打印再制造设备及再制造方法 |
| DE102016121951A1 (de) * | 2016-11-15 | 2018-05-17 | Cl Schutzrechtsverwaltungs Gmbh | Vorrichtung zur additiven Herstellung dreidimensionaler Objekte |
| JP6650141B1 (ja) * | 2019-01-10 | 2020-02-19 | 株式会社ティー・オール | 使用済み成膜用ターゲットの充填式再生方法 |
| CA3130828A1 (en) * | 2019-02-22 | 2020-08-27 | Oerlikon Surface Solutions Ag, Pfaffikon | Method for producing targets for physical vapor deposition (pvd) |
| CN110523987B (zh) * | 2019-09-27 | 2021-02-05 | 华中科技大学 | 一种用于致密材料制备的激光烧结同步压制增材制造系统 |
| CN111940745B (zh) * | 2019-12-30 | 2024-01-19 | 宁夏东方钽业股份有限公司 | 大松装冶金级钽粉的制造方法 |
| CN112522698B (zh) * | 2020-11-26 | 2023-04-25 | 江苏科技大学 | 一种超声振动辅助激光熔覆钨钽铌合金装置及方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU1494559A1 (ru) * | 1986-05-28 | 1996-03-10 | Ярославское научно-производственное объединение ЭЛЕКТРОНПРИБОР" | Способ изготовления мишени для распыления в вакууме |
| US5643472A (en) * | 1988-07-08 | 1997-07-01 | Cauldron Limited Partnership | Selective removal of material by irradiation |
| WO1996036746A1 (fr) * | 1995-05-18 | 1996-11-21 | Asahi Glass Company Ltd. | Procede de production d'une cible de pulverisation |
| DE19626732B4 (de) * | 1996-07-03 | 2009-01-29 | W.C. Heraeus Gmbh | Vorrichtung und Verfahren zum Herstellen und Recyclen von Sputtertargets |
| US6348113B1 (en) * | 1998-11-25 | 2002-02-19 | Cabot Corporation | High purity tantalum, products containing the same, and methods of making the same |
| DE19925330A1 (de) * | 1999-06-02 | 2000-12-07 | Leybold Materials Gmbh | Verfahren zur Herstellung oder zum Recyceln von Sputtertargets |
-
2002
- 2002-02-14 BR BR0207202-5A patent/BR0207202A/pt not_active IP Right Cessation
- 2002-02-14 US US10/075,709 patent/US20020112955A1/en not_active Abandoned
- 2002-02-14 CN CNB028048210A patent/CN1221684C/zh not_active Expired - Fee Related
- 2002-02-14 JP JP2002564069A patent/JP2004523653A/ja active Pending
- 2002-02-14 MX MXPA03007293A patent/MXPA03007293A/es active IP Right Grant
- 2002-02-14 ES ES02718966T patent/ES2261656T3/es not_active Expired - Lifetime
- 2002-02-14 HU HU0400730A patent/HUP0400730A2/hu unknown
- 2002-02-14 DK DK02718966T patent/DK1362132T3/da active
- 2002-02-14 PT PT02718966T patent/PT1362132E/pt unknown
- 2002-02-14 NZ NZ527503A patent/NZ527503A/en unknown
- 2002-02-14 RU RU2003127947/02A patent/RU2304633C2/ru not_active IP Right Cessation
- 2002-02-14 WO PCT/US2002/004306 patent/WO2002064287A2/en not_active Ceased
- 2002-02-14 CZ CZ20032186A patent/CZ20032186A3/cs unknown
- 2002-02-14 AU AU2002250075A patent/AU2002250075B2/en not_active Ceased
- 2002-02-14 AT AT02718966T patent/ATE325906T1/de not_active IP Right Cessation
- 2002-02-14 DE DE60211309T patent/DE60211309T2/de not_active Expired - Lifetime
- 2002-02-14 PL PL02363521A patent/PL363521A1/xx not_active Application Discontinuation
- 2002-02-14 EP EP02718966A patent/EP1362132B1/en not_active Expired - Lifetime
- 2002-02-14 SK SK1006-2003A patent/SK10062003A3/sk not_active Application Discontinuation
- 2002-02-14 CA CA002437713A patent/CA2437713A1/en not_active Abandoned
-
2003
- 2003-08-04 BG BG108059A patent/BG64959B1/bg unknown
- 2003-08-12 NO NO20033567A patent/NO20033567L/no not_active Application Discontinuation
- 2003-08-13 IS IS6911A patent/IS6911A/is unknown
- 2003-08-13 ZA ZA200306259A patent/ZA200306259B/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CA2437713A1 (en) | 2002-08-22 |
| HUP0400730A2 (en) | 2004-08-30 |
| DE60211309D1 (de) | 2006-06-14 |
| EP1362132A2 (en) | 2003-11-19 |
| WO2002064287A2 (en) | 2002-08-22 |
| US20020112955A1 (en) | 2002-08-22 |
| NO20033567D0 (no) | 2003-08-12 |
| CZ20032186A3 (cs) | 2004-02-18 |
| DE60211309T2 (de) | 2007-05-24 |
| BR0207202A (pt) | 2004-01-27 |
| BG64959B1 (bg) | 2006-10-31 |
| MXPA03007293A (es) | 2005-09-08 |
| RU2304633C2 (ru) | 2007-08-20 |
| AU2002250075B2 (en) | 2007-03-29 |
| HK1062902A1 (en) | 2004-12-03 |
| BG108059A (en) | 2005-04-30 |
| ES2261656T3 (es) | 2006-11-16 |
| ATE325906T1 (de) | 2006-06-15 |
| CN1221684C (zh) | 2005-10-05 |
| WO2002064287A3 (en) | 2002-10-10 |
| EP1362132A4 (en) | 2004-07-28 |
| RU2003127947A (ru) | 2005-04-10 |
| IS6911A (is) | 2003-08-13 |
| EP1362132B1 (en) | 2006-05-10 |
| PL363521A1 (en) | 2004-11-29 |
| DK1362132T3 (da) | 2006-09-11 |
| CN1491294A (zh) | 2004-04-21 |
| NO20033567L (no) | 2003-08-12 |
| ZA200306259B (en) | 2004-08-13 |
| JP2004523653A (ja) | 2004-08-05 |
| NZ527503A (en) | 2004-07-30 |
| SK10062003A3 (sk) | 2004-03-02 |
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