PL3633729T3 - Panel wyświetlający z mikro-diodami elektroluminescencyjnymi oraz sposób jego wytwarzania - Google Patents
Panel wyświetlający z mikro-diodami elektroluminescencyjnymi oraz sposób jego wytwarzaniaInfo
- Publication number
- PL3633729T3 PL3633729T3 PL17911299.0T PL17911299T PL3633729T3 PL 3633729 T3 PL3633729 T3 PL 3633729T3 PL 17911299 T PL17911299 T PL 17911299T PL 3633729 T3 PL3633729 T3 PL 3633729T3
- Authority
- PL
- Poland
- Prior art keywords
- micro
- manufacturing
- display panel
- electroluminescent diodes
- electroluminescent
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
- H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/814—Bodies having reflecting means, e.g. semiconductor Bragg reflectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
-
- H10W90/00—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/018—Bonding of wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710370731.9A CN106941108B (zh) | 2017-05-23 | 2017-05-23 | 微发光二极管显示面板及其制作方法 |
| PCT/CN2017/089253 WO2018214200A1 (zh) | 2017-05-23 | 2017-06-20 | 微发光二极管显示面板及其制作方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL3633729T3 true PL3633729T3 (pl) | 2022-09-19 |
Family
ID=59465082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL17911299.0T PL3633729T3 (pl) | 2017-05-23 | 2017-06-20 | Panel wyświetlający z mikro-diodami elektroluminescencyjnymi oraz sposób jego wytwarzania |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US10263138B2 (pl) |
| EP (1) | EP3633729B1 (pl) |
| JP (1) | JP6838247B2 (pl) |
| KR (1) | KR102319307B1 (pl) |
| CN (1) | CN106941108B (pl) |
| PL (1) | PL3633729T3 (pl) |
| WO (1) | WO2018214200A1 (pl) |
Families Citing this family (60)
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| US12464822B2 (en) | 2016-11-25 | 2025-11-04 | Vuereal Inc. | Integration of microdevices into system substrate |
| US20240266330A1 (en) * | 2016-11-25 | 2024-08-08 | Vuereal Inc. | Integration of microdevices into system substrate |
| KR102587215B1 (ko) | 2016-12-21 | 2023-10-12 | 삼성디스플레이 주식회사 | 발광 장치 및 이를 구비한 표시 장치 |
| CN107170773B (zh) * | 2017-05-23 | 2019-09-17 | 深圳市华星光电技术有限公司 | 微发光二极管显示面板及其制作方法 |
| CN107393940B (zh) * | 2017-09-06 | 2020-02-21 | 严光能 | Led显示设备及其制造方法 |
| CN107742636B (zh) * | 2017-10-25 | 2020-04-03 | 上海天马微电子有限公司 | 一种显示面板和显示装置 |
| CN109786307B (zh) * | 2017-11-15 | 2021-02-05 | 鸿富锦精密工业(深圳)有限公司 | 微型led显示面板的制备方法 |
| KR102422091B1 (ko) * | 2017-12-07 | 2022-07-18 | 엘지디스플레이 주식회사 | 발광 소자 및 이를 이용한 표시 장치 |
| CN108231968B (zh) | 2017-12-11 | 2020-02-11 | 厦门市三安光电科技有限公司 | 微发光二极管及其转移方法 |
| US12446363B2 (en) | 2017-12-11 | 2025-10-14 | Hubei San'an Optoelectronics Co., Ltd. | Light-emitting structure and light-emitting device including the same |
| CN108364971B (zh) * | 2018-03-20 | 2021-03-30 | 厦门市三安光电科技有限公司 | 微发光元件、微发光二极管及其转印方法 |
| TWI721435B (zh) * | 2018-05-28 | 2021-03-11 | 鴻海精密工業股份有限公司 | 微型發光二極體顯示面板 |
| CN108807556B (zh) | 2018-06-11 | 2021-01-29 | 京东方科技集团股份有限公司 | 一种光学传感器件及其制作方法、显示器件、显示设备 |
| CN110828500A (zh) * | 2018-08-07 | 2020-02-21 | 深圳Tcl新技术有限公司 | 一种led显示屏及其制作方法 |
| CN109148506B (zh) * | 2018-08-24 | 2021-04-13 | 上海天马微电子有限公司 | Micro LED转移方法及显示面板、显示装置 |
| CN109300931B (zh) | 2018-09-30 | 2021-02-26 | 上海天马微电子有限公司 | 一种Micro LED显示面板及制作方法、显示装置 |
| WO2020132882A1 (zh) * | 2018-12-25 | 2020-07-02 | 深圳市柔宇科技有限公司 | 发光装置及其制造方法、显示面板及显示装置 |
| CN109599037B (zh) * | 2018-12-29 | 2020-07-10 | 武汉华星光电技术有限公司 | 显示面板及其制备方法 |
| CN109585488A (zh) * | 2019-01-02 | 2019-04-05 | 京东方科技集团股份有限公司 | Led显示基板及其制作方法、显示装置 |
| KR102810550B1 (ko) * | 2019-02-13 | 2025-05-22 | 엘지전자 주식회사 | 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조 방법 |
| KR102702650B1 (ko) | 2019-02-28 | 2024-09-06 | 삼성디스플레이 주식회사 | 전자 장치, 전자 장치 제조 방법, 및 발광 소자 전이 방법 |
| DE102019112733A1 (de) | 2019-05-15 | 2020-11-19 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Lichtemittierendes Bauelement und Anzeigevorrichtung |
| CN110164322A (zh) * | 2019-05-22 | 2019-08-23 | 深圳市华星光电半导体显示技术有限公司 | 一种显示面板及电子装置 |
| CN112018227A (zh) * | 2019-05-31 | 2020-12-01 | 云谷(固安)科技有限公司 | 显示面板及显示装置 |
| CN110289279B (zh) * | 2019-06-04 | 2021-09-24 | 上海天马微电子有限公司 | 一种转移方法、阵列基板、其制作方法及显示装置 |
| CN110189628B (zh) * | 2019-06-28 | 2023-01-10 | 京东方科技集团股份有限公司 | 一种背光模组及显示装置 |
| TWI750488B (zh) * | 2019-07-17 | 2021-12-21 | 錼創顯示科技股份有限公司 | 半導體結構與微型半導體顯示裝置 |
| KR102850607B1 (ko) * | 2019-07-25 | 2025-08-27 | 삼성전자주식회사 | Led 패키지를 구비한 디스플레이 모듈 및 그 제조 방법 |
| CN112310115B (zh) * | 2019-07-26 | 2023-06-06 | 京东方科技集团股份有限公司 | 一种驱动背板、显示面板及显示装置 |
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| CN111128942B (zh) * | 2019-12-04 | 2021-07-23 | 深圳市华星光电半导体显示技术有限公司 | 一种微发光二极管显示基板及其制备方法 |
| GB2593699B (en) | 2020-03-30 | 2022-10-26 | Plessey Semiconductors Ltd | Monolithic LED pixel |
| CN111211213B (zh) * | 2020-04-21 | 2020-09-04 | 南京中电熊猫平板显示科技有限公司 | 一种显示背板及其制造方法 |
| CN111509015A (zh) * | 2020-04-27 | 2020-08-07 | 武汉华星光电半导体显示技术有限公司 | 显示面板及显示装置 |
| CN113451494B (zh) * | 2020-05-09 | 2022-09-27 | 重庆康佳光电技术研究院有限公司 | 一种led背板 |
| CN111584507B (zh) * | 2020-05-13 | 2023-05-02 | 深圳市华星光电半导体显示技术有限公司 | 显示面板及其制作方法、显示终端 |
| CN113707788B (zh) * | 2020-05-22 | 2022-07-22 | 重庆康佳光电技术研究院有限公司 | 背板结构及其制作方法、巨量转移方法、显示设备 |
| KR102903911B1 (ko) | 2020-05-29 | 2025-12-24 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
| CN114093902B (zh) * | 2020-08-25 | 2025-09-02 | 京东方科技集团股份有限公司 | 一种显示面板及其制作方法 |
| CN112582519B (zh) * | 2020-12-02 | 2022-03-11 | 苏州芯聚半导体有限公司 | 微发光二极管的转移方法及转移设备 |
| KR20220083935A (ko) * | 2020-12-11 | 2022-06-21 | 삼성디스플레이 주식회사 | 표시 장치 |
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| TWI765631B (zh) * | 2021-03-31 | 2022-05-21 | 錼創顯示科技股份有限公司 | 微型發光元件結構及顯示裝置 |
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| JP7502658B2 (ja) | 2021-12-10 | 2024-06-19 | 日亜化学工業株式会社 | 発光素子の製造方法 |
| US12424599B2 (en) | 2022-02-28 | 2025-09-23 | The Hong Kong University Of Science And Technology | Full-color light-emitting diode micro-display and the fabrication method thereof |
| CN115425120B (zh) * | 2022-08-09 | 2023-10-20 | 惠科股份有限公司 | 显示面板的制备方法 |
| JP7701319B2 (ja) | 2022-08-10 | 2025-07-01 | 信越半導体株式会社 | マイクロled用接合型ウェーハの製造方法 |
| CN115295706B (zh) | 2022-09-29 | 2022-12-06 | 惠科股份有限公司 | Led芯片转移方法及显示面板 |
| JP7750198B2 (ja) | 2022-09-29 | 2025-10-07 | 信越半導体株式会社 | マイクロled特性評価用ウェーハ及びマイクロled特性評価方法 |
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-
2017
- 2017-05-23 CN CN201710370731.9A patent/CN106941108B/zh active Active
- 2017-06-20 EP EP17911299.0A patent/EP3633729B1/en active Active
- 2017-06-20 WO PCT/CN2017/089253 patent/WO2018214200A1/zh not_active Ceased
- 2017-06-20 JP JP2019565231A patent/JP6838247B2/ja active Active
- 2017-06-20 US US15/548,104 patent/US10263138B2/en active Active
- 2017-06-20 PL PL17911299.0T patent/PL3633729T3/pl unknown
- 2017-06-20 KR KR1020197037980A patent/KR102319307B1/ko active Active
-
2019
- 2019-02-18 US US16/278,688 patent/US10505084B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20180342691A1 (en) | 2018-11-29 |
| WO2018214200A1 (zh) | 2018-11-29 |
| KR102319307B1 (ko) | 2021-11-03 |
| EP3633729A4 (en) | 2021-02-17 |
| KR20200004893A (ko) | 2020-01-14 |
| US20190181295A1 (en) | 2019-06-13 |
| EP3633729B1 (en) | 2022-05-18 |
| US10263138B2 (en) | 2019-04-16 |
| JP6838247B2 (ja) | 2021-03-03 |
| US10505084B2 (en) | 2019-12-10 |
| JP2020521181A (ja) | 2020-07-16 |
| CN106941108B (zh) | 2019-09-17 |
| CN106941108A (zh) | 2017-07-11 |
| EP3633729A1 (en) | 2020-04-08 |
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