PL3131989T3 - Układ rozpuszczalników o niskiej toksyczności do powłok z żywicy poliamidoimidowej i poliamidowo-amidowej - Google Patents
Układ rozpuszczalników o niskiej toksyczności do powłok z żywicy poliamidoimidowej i poliamidowo-amidowejInfo
- Publication number
- PL3131989T3 PL3131989T3 PL15779758.0T PL15779758T PL3131989T3 PL 3131989 T3 PL3131989 T3 PL 3131989T3 PL 15779758 T PL15779758 T PL 15779758T PL 3131989 T3 PL3131989 T3 PL 3131989T3
- Authority
- PL
- Poland
- Prior art keywords
- polyamideimide
- resin coating
- solvent system
- acid resin
- low toxicity
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/34—Carboxylic acids; Esters thereof with monohydroxyl compounds
- C08G18/343—Polycarboxylic acids having at least three carboxylic acid groups
- C08G18/345—Polycarboxylic acids having at least three carboxylic acid groups having three carboxylic acid groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
- C08G18/7657—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
- C08G18/7664—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
- C08G18/7671—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups containing only one alkylene bisphenyl group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1035—Preparatory processes from tetracarboxylic acids or derivatives and diisocyanates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/14—Polyamide-imides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/20—Diluents or solvents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/101—Esters; Ether-esters of monocarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/20—Carboxylic acid amides
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Paints Or Removers (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201461981155P | 2014-04-17 | 2014-04-17 | |
US14/687,771 US9725617B2 (en) | 2014-04-17 | 2015-04-15 | Low toxicity solvent system for polyamideimide and polyamide amic acid resin coating |
PCT/US2015/026255 WO2015161131A1 (en) | 2014-04-17 | 2015-04-16 | Low toxicity solvent system for polyamideimide and polyamide amic acid resin coating |
Publications (1)
Publication Number | Publication Date |
---|---|
PL3131989T3 true PL3131989T3 (pl) | 2023-03-27 |
Family
ID=54321458
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL15779758.0T PL3131989T3 (pl) | 2014-04-17 | 2015-04-16 | Układ rozpuszczalników o niskiej toksyczności do powłok z żywicy poliamidoimidowej i poliamidowo-amidowej |
Country Status (9)
Country | Link |
---|---|
US (1) | US9725617B2 (pl) |
EP (1) | EP3131989B1 (pl) |
JP (1) | JP6704352B2 (pl) |
CN (1) | CN106687540A (pl) |
AU (1) | AU2015247468B2 (pl) |
ES (1) | ES2937264T3 (pl) |
PL (1) | PL3131989T3 (pl) |
SG (1) | SG11201608548VA (pl) |
WO (1) | WO2015161131A1 (pl) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI535768B (zh) * | 2014-07-18 | 2016-06-01 | 長興材料工業股份有限公司 | 含溶劑之乾膜及其用途 |
JP6822416B2 (ja) * | 2015-12-14 | 2021-01-27 | 昭和電工マテリアルズ株式会社 | ポリアミドイミド樹脂及び塗料 |
US10301506B2 (en) * | 2016-06-06 | 2019-05-28 | Cymer-Dayton, Llc | Full scale process for preparing polymer powders |
JP6953685B2 (ja) * | 2016-06-29 | 2021-10-27 | 昭和電工マテリアルズ株式会社 | ポリアミドイミド樹脂組成物及び塗料 |
EP3590992A4 (en) * | 2017-03-01 | 2020-10-28 | Hitachi Chemical Company, Ltd. | POLYAMIDIMIDE RESIN AND USE THEREOF |
GB2564425A (en) * | 2017-07-07 | 2019-01-16 | Wuhan Xinqu Chuangrou Optoelectronics Tech Co Ltd | Formulation and layer |
CN109181392A (zh) * | 2018-06-25 | 2019-01-11 | 武汉船用电力推进装置研究所(中国船舶重工集团公司第七二研究所) | 一种环保型高溶解力清漆稀释剂 |
KR102289812B1 (ko) * | 2018-08-20 | 2021-08-13 | 주식회사 엘지화학 | 폴리이미드 전구체 조성물, 이를 이용하여 제조된 폴리이미드 필름 및 플렉서블 디바이스 |
KR102264423B1 (ko) * | 2018-08-20 | 2021-06-14 | 주식회사 엘지화학 | 폴리이미드 전구체 조성물, 그 제조 방법 및 이를 이용한 폴리이미드 필름 |
WO2020040495A1 (ko) * | 2018-08-20 | 2020-02-27 | 주식회사 엘지화학 | 폴리이미드 전구체 조성물, 그 제조 방법 및 이를 이용한 폴리이미드 필름 |
EP3973018A1 (en) * | 2019-05-22 | 2022-03-30 | AdvanSix Resins & Chemicals LLC | Polymer compositions for forming an enamel coating on a wire |
CN112480731A (zh) * | 2019-09-12 | 2021-03-12 | 中国石油天然气股份有限公司 | 耐高温涂料成膜剂、其制备方法及应用 |
CN111621225B (zh) * | 2020-05-27 | 2021-10-26 | 苏州东特绝缘科技有限公司 | 黑色聚酰胺酰亚胺涂料的制备方法及其涂料、漆包线 |
JP7071669B2 (ja) * | 2020-07-09 | 2022-05-19 | ダイキン工業株式会社 | 塗料組成物、塗膜及び塗装物品 |
KR20230052939A (ko) * | 2020-09-22 | 2023-04-20 | 엘란타스 유럽 에스.알.엘. | 폴리아미드이미드를 포함하는 와이어 에나멜 조성물 |
EP4392478A1 (en) | 2021-08-26 | 2024-07-03 | Solvay | Reduced viscosity compositions containing polyamideimide polymers |
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JPS4831842B1 (pl) | 1968-07-04 | 1973-10-02 | ||
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US9029441B2 (en) * | 2011-12-15 | 2015-05-12 | Fujifilm Hunt Chemicals Us, Inc. | Low toxicity solvent system for polyamideimide and polyamide amic acid resins and coating solutions thereof |
RU2014132892A (ru) * | 2012-01-09 | 2016-02-27 | Е.И.Дю Пон Де Немур Энд Компани | Связывающие растворы |
BE1020269A5 (nl) * | 2012-01-17 | 2013-07-02 | Taminco | Gebruik van vervangende oplosmiddelen voor n-methylpyrrolidon (nmp). |
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JP5477729B2 (ja) * | 2012-08-30 | 2014-04-23 | 東洋紡株式会社 | 潤滑塗料用ポリアミドイミド樹脂組成物 |
US9815941B2 (en) * | 2014-04-17 | 2017-11-14 | Cymer-Dayton, Llc | Low toxicity solvent system for polyamdieimide and polyamide amic acid resin manufacture |
-
2015
- 2015-04-15 US US14/687,771 patent/US9725617B2/en not_active Expired - Fee Related
- 2015-04-16 ES ES15779758T patent/ES2937264T3/es active Active
- 2015-04-16 WO PCT/US2015/026255 patent/WO2015161131A1/en active Application Filing
- 2015-04-16 SG SG11201608548VA patent/SG11201608548VA/en unknown
- 2015-04-16 EP EP15779758.0A patent/EP3131989B1/en active Active
- 2015-04-16 JP JP2016562750A patent/JP6704352B2/ja not_active Expired - Fee Related
- 2015-04-16 PL PL15779758.0T patent/PL3131989T3/pl unknown
- 2015-04-16 CN CN201580020156.9A patent/CN106687540A/zh active Pending
- 2015-04-16 AU AU2015247468A patent/AU2015247468B2/en not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
AU2015247468A1 (en) | 2016-12-01 |
ES2937264T3 (es) | 2023-03-27 |
US20150299513A1 (en) | 2015-10-22 |
CN106687540A (zh) | 2017-05-17 |
JP6704352B2 (ja) | 2020-06-03 |
AU2015247468B2 (en) | 2019-02-14 |
EP3131989A1 (en) | 2017-02-22 |
EP3131989A4 (en) | 2017-12-13 |
US9725617B2 (en) | 2017-08-08 |
WO2015161131A1 (en) | 2015-10-22 |
JP2017516886A (ja) | 2017-06-22 |
SG11201608548VA (en) | 2016-11-29 |
EP3131989B1 (en) | 2022-11-09 |
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