PL2310558T3 - Ulepszony elektrolit miedziowo-cynowy i sposób osadzania warstw cyny i brązu - Google Patents

Ulepszony elektrolit miedziowo-cynowy i sposób osadzania warstw cyny i brązu

Info

Publication number
PL2310558T3
PL2310558T3 PL09776985T PL09776985T PL2310558T3 PL 2310558 T3 PL2310558 T3 PL 2310558T3 PL 09776985 T PL09776985 T PL 09776985T PL 09776985 T PL09776985 T PL 09776985T PL 2310558 T3 PL2310558 T3 PL 2310558T3
Authority
PL
Poland
Prior art keywords
bronze layers
tin
layers
bronze
decorative
Prior art date
Application number
PL09776985T
Other languages
English (en)
Polish (pl)
Inventor
Klaus Bronder
Bernd Weyhmueller
Frank Oberst
Sascha Berger
Uwe Manz
Original Assignee
Umicore Galvanotechnik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Umicore Galvanotechnik Gmbh filed Critical Umicore Galvanotechnik Gmbh
Publication of PL2310558T3 publication Critical patent/PL2310558T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroplating Methods And Accessories (AREA)
PL09776985T 2008-07-10 2009-07-06 Ulepszony elektrolit miedziowo-cynowy i sposób osadzania warstw cyny i brązu PL2310558T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008032398A DE102008032398A1 (de) 2008-07-10 2008-07-10 Verbesserter Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten
PCT/EP2009/004879 WO2010003621A1 (en) 2008-07-10 2009-07-06 Improved copper-tin electrolyte and process for the deposition of bronze layers
EP09776985A EP2310558B1 (en) 2008-07-10 2009-07-06 Improved copper-tin electrolyte and process for the deposition of tin-bronze layers

Publications (1)

Publication Number Publication Date
PL2310558T3 true PL2310558T3 (pl) 2012-09-28

Family

ID=41258161

Family Applications (1)

Application Number Title Priority Date Filing Date
PL09776985T PL2310558T3 (pl) 2008-07-10 2009-07-06 Ulepszony elektrolit miedziowo-cynowy i sposób osadzania warstw cyny i brązu

Country Status (10)

Country Link
US (1) US20110174631A1 (enExample)
EP (1) EP2310558B1 (enExample)
JP (1) JP2011527381A (enExample)
KR (1) KR20110031183A (enExample)
CN (1) CN102089466B (enExample)
AT (1) ATE549434T1 (enExample)
DE (1) DE102008032398A1 (enExample)
PL (1) PL2310558T3 (enExample)
TW (1) TW201014935A (enExample)
WO (1) WO2010003621A1 (enExample)

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DE102012008544A1 (de) 2012-05-02 2013-11-07 Umicore Galvanotechnik Gmbh Verchromte Verbundwerkstoffe ohne Nickelschicht
AT514818B1 (de) * 2013-09-18 2015-10-15 W Garhöfer Ges M B H Ing Abscheidung von Cu, Sn, Zn-Beschichtungen auf metallischen Substraten
DE102013226297B3 (de) * 2013-12-17 2015-03-26 Umicore Galvanotechnik Gmbh Wässriger, cyanidfreier Elektrolyt für die Abscheidung von Kupfer-Zinn- und Kupfer-Zinn-Zink-Legierungen aus einem Elektrolyten und Verfahren zur elektrolytischen Abscheidung dieser Legierungen
CN103789803B (zh) * 2014-01-13 2016-04-27 孙松华 一种无氰铜锡合金电镀液及其制备方法
JP5938426B2 (ja) * 2014-02-04 2016-06-22 株式会社豊田中央研究所 電気めっきセル、及び、金属皮膜の製造方法
AR100422A1 (es) * 2014-05-15 2016-10-05 Nippon Steel & Sumitomo Metal Corp Solución para deposición para conexión roscada para un caño o tubo y método de producción de la conexión roscada para un caño o tubo
CN106521574B (zh) * 2016-12-05 2018-10-26 浙江工业大学 一种适用于宽pH和宽电流密度范围的无氰镀铜电镀液及其制备方法
TWI728217B (zh) * 2016-12-28 2021-05-21 德商德國艾托特克公司 錫電鍍浴液及於基板之表面上沉積錫或錫合金之方法
CN110344079B (zh) * 2019-08-16 2021-06-08 广东超华科技股份有限公司 一种降低电解铜箔电解液中铁离子浓度的装置及方法
RU2762501C1 (ru) * 2021-05-17 2021-12-21 Федеральное государственное бюджетное образовательное учреждение высшего образования "Российский химико-технологический университет имени Д.И. Менделеева" (РХТУ им. Д.И. Менделеева) Щелочной электролит для электролитического осаждения желтой оловянной бронзы
DE202021004169U1 (de) 2021-07-02 2022-12-07 Umicore Galvanotechnik Gmbh Bronzeschicht als Edelmetallersatz in Smart Cards
DE102021117095A1 (de) 2021-07-02 2023-01-05 Umicore Galvanotechnik Gmbh Bronzeschichten als Edelmetallersatz

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Also Published As

Publication number Publication date
KR20110031183A (ko) 2011-03-24
TW201014935A (en) 2010-04-16
EP2310558A1 (en) 2011-04-20
CN102089466A (zh) 2011-06-08
ATE549434T1 (de) 2012-03-15
DE102008032398A1 (de) 2010-01-14
JP2011527381A (ja) 2011-10-27
CN102089466B (zh) 2012-11-07
EP2310558B1 (en) 2012-03-14
WO2010003621A1 (en) 2010-01-14
US20110174631A1 (en) 2011-07-21

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