JP2011527381A - 改良された銅−錫電解液及び青銅層の析出方法 - Google Patents

改良された銅−錫電解液及び青銅層の析出方法 Download PDF

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Publication number
JP2011527381A
JP2011527381A JP2011517017A JP2011517017A JP2011527381A JP 2011527381 A JP2011527381 A JP 2011527381A JP 2011517017 A JP2011517017 A JP 2011517017A JP 2011517017 A JP2011517017 A JP 2011517017A JP 2011527381 A JP2011527381 A JP 2011527381A
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Prior art keywords
acid
electrolyte
electrolyte solution
tin
electrolytic solution
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JP2011517017A
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Japanese (ja)
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JP2011527381A5 (enExample
Inventor
ブロンダー クラウス
ヴァイミュラー ベルント
オーベルスト フランク
ベルガー ザーシャ
マンツ ウーヴェ
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Umicore Galvanotechnik GmbH
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Umicore Galvanotechnik GmbH
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Application filed by Umicore Galvanotechnik GmbH filed Critical Umicore Galvanotechnik GmbH
Publication of JP2011527381A publication Critical patent/JP2011527381A/ja
Publication of JP2011527381A5 publication Critical patent/JP2011527381A5/ja
Withdrawn legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/58Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2011517017A 2008-07-10 2009-07-06 改良された銅−錫電解液及び青銅層の析出方法 Withdrawn JP2011527381A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008032398.5 2008-07-10
DE102008032398A DE102008032398A1 (de) 2008-07-10 2008-07-10 Verbesserter Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten
PCT/EP2009/004879 WO2010003621A1 (en) 2008-07-10 2009-07-06 Improved copper-tin electrolyte and process for the deposition of bronze layers

Publications (2)

Publication Number Publication Date
JP2011527381A true JP2011527381A (ja) 2011-10-27
JP2011527381A5 JP2011527381A5 (enExample) 2012-08-23

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ID=41258161

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011517017A Withdrawn JP2011527381A (ja) 2008-07-10 2009-07-06 改良された銅−錫電解液及び青銅層の析出方法

Country Status (10)

Country Link
US (1) US20110174631A1 (enExample)
EP (1) EP2310558B1 (enExample)
JP (1) JP2011527381A (enExample)
KR (1) KR20110031183A (enExample)
CN (1) CN102089466B (enExample)
AT (1) ATE549434T1 (enExample)
DE (1) DE102008032398A1 (enExample)
PL (1) PL2310558T3 (enExample)
TW (1) TW201014935A (enExample)
WO (1) WO2010003621A1 (enExample)

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DE102010044551A1 (de) * 2010-09-07 2012-03-08 Coventya Gmbh Anode sowie deren Verwendung in einem alkalischen Galvanikbad
DE102011121799B4 (de) * 2011-12-21 2013-08-29 Umicore Galvanotechnik Gmbh Elektrolyt und Verfahren zur elektrolytischen Abscheidung von Cu-Zn-Sn-Legierungsschichten und Verfahren zur Herstellung einer Dünnschichtsolarzelle
DE102012008544A1 (de) 2012-05-02 2013-11-07 Umicore Galvanotechnik Gmbh Verchromte Verbundwerkstoffe ohne Nickelschicht
AT514818B1 (de) * 2013-09-18 2015-10-15 W Garhöfer Ges M B H Ing Abscheidung von Cu, Sn, Zn-Beschichtungen auf metallischen Substraten
DE102013226297B3 (de) * 2013-12-17 2015-03-26 Umicore Galvanotechnik Gmbh Wässriger, cyanidfreier Elektrolyt für die Abscheidung von Kupfer-Zinn- und Kupfer-Zinn-Zink-Legierungen aus einem Elektrolyten und Verfahren zur elektrolytischen Abscheidung dieser Legierungen
CN103789803B (zh) * 2014-01-13 2016-04-27 孙松华 一种无氰铜锡合金电镀液及其制备方法
JP5938426B2 (ja) * 2014-02-04 2016-06-22 株式会社豊田中央研究所 電気めっきセル、及び、金属皮膜の製造方法
CN106521574B (zh) * 2016-12-05 2018-10-26 浙江工业大学 一种适用于宽pH和宽电流密度范围的无氰镀铜电镀液及其制备方法
TWI728217B (zh) * 2016-12-28 2021-05-21 德商德國艾托特克公司 錫電鍍浴液及於基板之表面上沉積錫或錫合金之方法
CN110344079B (zh) * 2019-08-16 2021-06-08 广东超华科技股份有限公司 一种降低电解铜箔电解液中铁离子浓度的装置及方法
RU2762501C1 (ru) * 2021-05-17 2021-12-21 Федеральное государственное бюджетное образовательное учреждение высшего образования "Российский химико-технологический университет имени Д.И. Менделеева" (РХТУ им. Д.И. Менделеева) Щелочной электролит для электролитического осаждения желтой оловянной бронзы
DE202021004169U1 (de) 2021-07-02 2022-12-07 Umicore Galvanotechnik Gmbh Bronzeschicht als Edelmetallersatz in Smart Cards
DE102021117095A1 (de) 2021-07-02 2023-01-05 Umicore Galvanotechnik Gmbh Bronzeschichten als Edelmetallersatz

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US4289286A (en) * 1978-10-16 1981-09-15 East/West Industries, Inc. Replaceable harness bracket assembly
US4356067A (en) * 1979-06-13 1982-10-26 Electrochemical Products, Inc. Alkaline plating baths and electroplating process
US4417956A (en) * 1980-07-17 1983-11-29 Electrochemical Products, Inc. Alkaline plating baths and electroplating process
US4389286A (en) * 1980-07-17 1983-06-21 Electrochemical Products, Inc. Alkaline plating baths and electroplating process
US4347108A (en) * 1981-05-29 1982-08-31 Rohco, Inc. Electrodeposition of copper, acidic copper electroplating baths and additives therefor
CN1004010B (zh) * 1986-07-11 1989-04-26 南京大学 无氰仿金电镀液
DE4324995C2 (de) * 1993-07-26 1995-12-21 Demetron Gmbh Cyanidisch-alkalische Bäder zur galvanischen Abscheidung von Kupfer-Zinn-Legierungsüberzügen
SG68083A1 (en) * 1997-10-30 1999-10-19 Sung Soo Moon Tin alloy plating compositions
TW577938B (en) * 1998-11-05 2004-03-01 Uyemura C & Co Ltd Tin-copper alloy electroplating bath and plating process therewith
JP2001181889A (ja) * 1999-12-22 2001-07-03 Nippon Macdermid Kk 光沢錫−銅合金電気めっき浴
JP3455712B2 (ja) 2000-04-14 2003-10-14 日本ニュークローム株式会社 銅−スズ合金めっき用ピロリン酸浴
WO2002024979A1 (de) * 2000-09-20 2002-03-28 Dr.-Ing. Max Schlötter Gmbh & Co. Kg Elektrolyt und verfahren zur abscheidung von zinn-kupfer-legierungsschichten
DE10046600C2 (de) 2000-09-20 2003-02-20 Schloetter Fa Dr Ing Max Elektrolyt und Verfahren zur Abscheidung von Zinn-Kupfer-Legierungsschichten und Verwendung des Elektrolyten
US6645364B2 (en) * 2000-10-20 2003-11-11 Shipley Company, L.L.C. Electroplating bath control
JP4249438B2 (ja) * 2002-07-05 2009-04-02 日本ニュークローム株式会社 銅―錫合金めっき用ピロリン酸浴
DE10243139A1 (de) * 2002-09-17 2004-03-25 Omg Galvanotechnik Gmbh Dunkle Schichten
ES2531163T3 (es) 2002-10-11 2015-03-11 Enthone Procedimiento y electrolito para la deposición galvánica de bronces
JP4441726B2 (ja) * 2003-01-24 2010-03-31 石原薬品株式会社 スズ又はスズ合金の脂肪族スルホン酸メッキ浴の製造方法
US7128822B2 (en) * 2003-06-04 2006-10-31 Shipley Company, L.L.C. Leveler compounds
US20050067297A1 (en) * 2003-09-26 2005-03-31 Innovative Technology Licensing, Llc Copper bath for electroplating fine circuitry on semiconductor chips
US20060231409A1 (en) * 2005-03-31 2006-10-19 Tdk Corporation Plating solution, conductive material, and surface treatment method of conductive material
EP1870495A1 (de) * 2006-06-21 2007-12-26 Atotech Deutschland Gmbh Wässriges alkalisches cyanidfreies Bad zur galvanischen Abscheidung von Zink- und Zinklegierungsüberzügen
EP1961840B1 (de) * 2007-02-14 2009-12-30 Umicore Galvanotechnik GmbH Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015174095A1 (ja) * 2014-05-15 2015-11-19 新日鐵住金株式会社 管用ねじ継手用めっき液及び管用ねじ継手の製造方法
JPWO2015174095A1 (ja) * 2014-05-15 2017-04-20 新日鐵住金株式会社 管用ねじ継手用めっき液及び管用ねじ継手の製造方法
RU2658521C2 (ru) * 2014-05-15 2018-06-21 Ниппон Стил Энд Сумитомо Метал Корпорейшн Раствор для металлизации резьбового соединения трубопроводов или труб и способ производства резьбового соединения для трубопроводов или труб
US10370770B2 (en) 2014-05-15 2019-08-06 Nippon Steel Corporation Plating solution for threaded connection for pipe or tube and producing method of threaded connection for pipe or tube

Also Published As

Publication number Publication date
KR20110031183A (ko) 2011-03-24
TW201014935A (en) 2010-04-16
EP2310558A1 (en) 2011-04-20
PL2310558T3 (pl) 2012-09-28
CN102089466A (zh) 2011-06-08
ATE549434T1 (de) 2012-03-15
DE102008032398A1 (de) 2010-01-14
CN102089466B (zh) 2012-11-07
EP2310558B1 (en) 2012-03-14
WO2010003621A1 (en) 2010-01-14
US20110174631A1 (en) 2011-07-21

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