PH12014502509B1 - Surface-treated copper foil and laminate using same, copper foil, printed wiring board, electronic device, and process for producing printed wiring board - Google Patents
Surface-treated copper foil and laminate using same, copper foil, printed wiring board, electronic device, and process for producing printed wiring boardInfo
- Publication number
- PH12014502509B1 PH12014502509B1 PH12014502509A PH12014502509A PH12014502509B1 PH 12014502509 B1 PH12014502509 B1 PH 12014502509B1 PH 12014502509 A PH12014502509 A PH 12014502509A PH 12014502509 A PH12014502509 A PH 12014502509A PH 12014502509 B1 PH12014502509 B1 PH 12014502509B1
- Authority
- PH
- Philippines
- Prior art keywords
- copper foil
- wiring board
- printed wiring
- laminate
- same
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/12—Electroforming by electrophoresis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0692—Regulating the thickness of the coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/10—Moulds; Masks; Masterforms
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/12—Electroforming by electrophoresis
- C25D1/14—Electroforming by electrophoresis of inorganic material
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Molecular Biology (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
- Electroplating Methods And Accessories (AREA)
- Metal Rolling (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012122448 | 2012-05-11 | ||
JP2013003867 | 2013-01-11 | ||
JP2013008519A JP5475897B1 (ja) | 2012-05-11 | 2013-01-21 | 表面処理銅箔及びそれを用いた積層板、銅箔、プリント配線板、電子機器、並びに、プリント配線板の製造方法 |
PCT/JP2013/062658 WO2013168646A1 (ja) | 2012-05-11 | 2013-04-30 | 表面処理銅箔及びそれを用いた積層板、銅箔、プリント配線板、電子機器、並びに、プリント配線板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
PH12014502509B1 true PH12014502509B1 (en) | 2014-12-22 |
PH12014502509A1 PH12014502509A1 (en) | 2014-12-22 |
Family
ID=49550688
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PH12014502509A PH12014502509A1 (en) | 2012-05-11 | 2014-11-10 | Surface-treated copper foil and laminate using same, copper foil, printed wiring board, electronic device, and process for producing printed wiring board |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP5475897B1 (ko) |
KR (2) | KR101704892B1 (ko) |
CN (2) | CN104271813B (ko) |
MY (2) | MY171074A (ko) |
PH (1) | PH12014502509A1 (ko) |
TW (1) | TWI479036B (ko) |
WO (1) | WO2013168646A1 (ko) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5822669B2 (ja) | 2011-02-18 | 2015-11-24 | Jx日鉱日石金属株式会社 | グラフェン製造用銅箔及びそれを用いたグラフェンの製造方法 |
JP5850720B2 (ja) | 2011-06-02 | 2016-02-03 | Jx日鉱日石金属株式会社 | グラフェン製造用銅箔、及びグラフェンの製造方法 |
JP5959510B2 (ja) | 2011-06-02 | 2016-08-02 | Jx金属株式会社 | グラフェン製造用銅箔、及びグラフェンの製造方法 |
JP5721609B2 (ja) | 2011-11-15 | 2015-05-20 | Jx日鉱日石金属株式会社 | グラフェン製造用銅箔、及びグラフェンの製造方法 |
JP5885790B2 (ja) * | 2013-08-20 | 2016-03-15 | Jx金属株式会社 | 表面処理銅箔及びそれを用いた積層板、キャリア付銅箔、プリント配線板、電子機器、電子機器の製造方法、並びに、プリント配線板の製造方法 |
JP5710737B1 (ja) * | 2013-11-29 | 2015-04-30 | Jx日鉱日石金属株式会社 | 表面処理銅箔、積層板、プリント配線板、プリント回路板及び電子機器 |
JP5756547B1 (ja) * | 2014-04-28 | 2015-07-29 | 株式会社Shカッパープロダクツ | 表面処理銅箔及び積層板 |
JP6078024B2 (ja) | 2014-06-13 | 2017-02-08 | Jx金属株式会社 | 2次元六角形格子化合物製造用圧延銅箔、及び2次元六角形格子化合物の製造方法 |
TWI676405B (zh) * | 2016-07-26 | 2019-11-01 | 日商Jx金屬股份有限公司 | 印刷配線板、電子機器、導管及金屬材料 |
WO2018047933A1 (ja) * | 2016-09-12 | 2018-03-15 | 古河電気工業株式会社 | 銅箔およびこれを有する銅張積層板 |
CN108697006B (zh) * | 2017-03-31 | 2021-07-16 | Jx金属株式会社 | 表面处理铜箔、附载体铜箔、积层体、印刷配线板的制造方法及电子机器的制造方法 |
KR102349377B1 (ko) * | 2019-12-19 | 2022-01-12 | 일진머티리얼즈 주식회사 | 표면처리 동박, 이의 제조방법, 이를 포함한 동박적층판, 및 이를 포함한 프린트 배선판 |
CN112566373B (zh) * | 2020-11-13 | 2022-11-04 | 广东工业大学 | 一种基于锡模板的粗化方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2849059B2 (ja) | 1995-09-28 | 1999-01-20 | 日鉱グールド・フォイル株式会社 | 印刷回路用銅箔の処理方法 |
KR100632861B1 (ko) * | 2002-05-13 | 2006-10-13 | 미쓰이 긴조꾸 고교 가부시키가이샤 | 칩온 필름용 플렉시블 프린트배선판 |
JP2004098659A (ja) | 2002-07-19 | 2004-04-02 | Ube Ind Ltd | 銅張積層板及びその製造方法 |
US7341796B2 (en) * | 2004-02-17 | 2008-03-11 | Nippon Mining & Metals Co., Ltd | Copper foil having blackened surface or layer |
JP2005344174A (ja) * | 2004-06-03 | 2005-12-15 | Mitsui Mining & Smelting Co Ltd | 表面処理銅箔及びその表面処理銅箔を用いて製造したフレキシブル銅張積層板並びにフィルムキャリアテープ |
WO2006106956A1 (ja) * | 2005-03-31 | 2006-10-12 | Mitsui Mining & Smelting Co., Ltd | 電解銅箔及び電解銅箔の製造方法、その電解銅箔を用いて得られた表面処理電解銅箔、その表面処理電解銅箔を用いた銅張積層板及びプリント配線板 |
KR20070044774A (ko) * | 2005-10-25 | 2007-04-30 | 미쓰이 긴조꾸 고교 가부시키가이샤 | 2층 플렉시블 프린트 배선판 및 그 2층 플렉시블 프린트배선판의 제조 방법 |
TW200728515A (en) * | 2005-10-31 | 2007-08-01 | Mitsui Mining & Smelting Co | Method for manufacture of electrolytic copper foil, electrolytic copper foil manufactured by the method, surface-treated copper foil manufactured using the electrolytic copper foil, and copper-clad laminate manufactured using the electrolytic copper |
TW200738913A (en) * | 2006-03-10 | 2007-10-16 | Mitsui Mining & Smelting Co | Surface treated elctrolytic copper foil and process for producing the same |
JP2007332458A (ja) | 2006-05-18 | 2007-12-27 | Sony Corp | 蒸着装置および蒸着源ならびに表示装置の製造方法 |
JP2007332418A (ja) * | 2006-06-15 | 2007-12-27 | Fukuda Metal Foil & Powder Co Ltd | 表面処理銅箔 |
JP4240506B2 (ja) * | 2006-09-05 | 2009-03-18 | 三井金属鉱業株式会社 | 電子部品実装用フィルムキャリアテープの製造方法 |
JP5129642B2 (ja) * | 2007-04-19 | 2013-01-30 | 三井金属鉱業株式会社 | 表面処理銅箔及びその表面処理銅箔を用いて得られる銅張積層板並びにその銅張積層板を用いて得られるプリント配線板 |
US8524378B2 (en) * | 2008-11-25 | 2013-09-03 | Jx Nippon Mining & Metals Corporation | Copper foil for printed circuit |
EP2361762B1 (en) * | 2009-12-22 | 2013-11-06 | JX Nippon Mining & Metals Corporation | Method for producing laminate |
JP5242710B2 (ja) * | 2010-01-22 | 2013-07-24 | 古河電気工業株式会社 | 粗化処理銅箔、銅張積層板及びプリント配線板 |
JP5411192B2 (ja) * | 2011-03-25 | 2014-02-12 | Jx日鉱日石金属株式会社 | 圧延銅箔及びその製造方法 |
JP5261595B1 (ja) * | 2012-06-29 | 2013-08-14 | Jx日鉱日石金属株式会社 | 圧延銅箔及びその製造方法、並びに、積層板 |
-
2013
- 2013-01-21 JP JP2013008519A patent/JP5475897B1/ja active Active
- 2013-04-29 TW TW102115229A patent/TWI479036B/zh active
- 2013-04-30 MY MYPI2014703339A patent/MY171074A/en unknown
- 2013-04-30 CN CN201380024196.1A patent/CN104271813B/zh active Active
- 2013-04-30 WO PCT/JP2013/062658 patent/WO2013168646A1/ja active Application Filing
- 2013-04-30 MY MYPI2018001779A patent/MY194478A/en unknown
- 2013-04-30 CN CN201710102484.4A patent/CN107022774A/zh active Pending
- 2013-04-30 KR KR1020147034840A patent/KR101704892B1/ko active IP Right Grant
- 2013-04-30 KR KR1020167030318A patent/KR101822325B1/ko active IP Right Grant
-
2014
- 2014-11-10 PH PH12014502509A patent/PH12014502509A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
MY194478A (en) | 2022-11-30 |
CN107022774A (zh) | 2017-08-08 |
KR20160128467A (ko) | 2016-11-07 |
CN104271813B (zh) | 2018-08-28 |
KR20150008482A (ko) | 2015-01-22 |
PH12014502509A1 (en) | 2014-12-22 |
TW201402840A (zh) | 2014-01-16 |
MY171074A (en) | 2019-09-24 |
KR101704892B1 (ko) | 2017-02-08 |
TWI479036B (zh) | 2015-04-01 |
WO2013168646A1 (ja) | 2013-11-14 |
KR101822325B1 (ko) | 2018-01-25 |
JP5475897B1 (ja) | 2014-04-16 |
JP2014148691A (ja) | 2014-08-21 |
CN104271813A (zh) | 2015-01-07 |
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