NO970383L - Lederplate og fremgangsmåte for posisjonsnöyaktig komponentanbringelse og lodding av elektroniske komponenter på lederplatens overflate - Google Patents

Lederplate og fremgangsmåte for posisjonsnöyaktig komponentanbringelse og lodding av elektroniske komponenter på lederplatens overflate

Info

Publication number
NO970383L
NO970383L NO970383A NO970383A NO970383L NO 970383 L NO970383 L NO 970383L NO 970383 A NO970383 A NO 970383A NO 970383 A NO970383 A NO 970383A NO 970383 L NO970383 L NO 970383L
Authority
NO
Norway
Prior art keywords
conductor plate
electronic components
plate
soldering
areas
Prior art date
Application number
NO970383A
Other languages
English (en)
Norwegian (no)
Other versions
NO970383D0 (no
Inventor
Ralf-Dieter Busse
Carsen Storbeck
Thomas Lade
Original Assignee
Krone Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19610586A external-priority patent/DE19610586B4/de
Priority claimed from DE1996111631 external-priority patent/DE19611631C1/de
Priority claimed from DE19620340A external-priority patent/DE19620340C1/de
Application filed by Krone Ag filed Critical Krone Ag
Publication of NO970383D0 publication Critical patent/NO970383D0/no
Publication of NO970383L publication Critical patent/NO970383L/no

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • H05K3/3442Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/0008Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016Brazing of electronic components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/182Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183Components mounted in and supported by recessed areas of the printed circuit board
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3478Applying solder preforms; Transferring prefabricated solder patterns
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/0091Housing specially adapted for small components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09036Recesses or grooves in insulating substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09063Holes or slots in insulating substrate not used for electrical connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09372Pads and lands
    • H05K2201/09427Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10583Cylindrically shaped component; Fixing means therefore
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10727Leadless chip carrier [LCC], e.g. chip-modules for cards
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Resistance Welding (AREA)
  • Thermistors And Varistors (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
  • Fuses (AREA)
NO970383A 1996-03-18 1997-01-29 Lederplate og fremgangsmåte for posisjonsnöyaktig komponentanbringelse og lodding av elektroniske komponenter på lederplatens overflate NO970383L (no)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19610586A DE19610586B4 (de) 1996-03-18 1996-03-18 Leiterplatte und lagegenauen Bestücken und Löten von elektronischen Bauelementen auf der Oberfläche der Leiterplatte
DE1996111631 DE19611631C1 (de) 1996-03-25 1996-03-25 Modul mit einem Gehäuse und einer Grundplatte
DE19620340A DE19620340C1 (de) 1996-05-21 1996-05-21 Überspannungs - Schutzstecker

Publications (2)

Publication Number Publication Date
NO970383D0 NO970383D0 (no) 1997-01-29
NO970383L true NO970383L (no) 1997-09-19

Family

ID=27216039

Family Applications (1)

Application Number Title Priority Date Filing Date
NO970383A NO970383L (no) 1996-03-18 1997-01-29 Lederplate og fremgangsmåte for posisjonsnöyaktig komponentanbringelse og lodding av elektroniske komponenter på lederplatens overflate

Country Status (29)

Country Link
US (1) US5999412A (hu)
EP (1) EP0797379B1 (hu)
JP (1) JPH104250A (hu)
KR (1) KR19990008482A (hu)
CN (1) CN1168078A (hu)
AR (1) AR006169A1 (hu)
AT (1) ATE224634T1 (hu)
AU (1) AU713077B2 (hu)
BG (1) BG62425B1 (hu)
BR (1) BR9701324A (hu)
CA (1) CA2199898A1 (hu)
CO (1) CO4560406A1 (hu)
CZ (1) CZ292485B6 (hu)
DE (1) DE59708222D1 (hu)
DK (1) DK0797379T3 (hu)
ES (1) ES2183993T3 (hu)
HU (1) HUP9700597A3 (hu)
ID (1) ID16239A (hu)
IL (1) IL120102A (hu)
NO (1) NO970383L (hu)
NZ (1) NZ314160A (hu)
PL (1) PL182659B1 (hu)
PT (1) PT797379E (hu)
SG (1) SG52925A1 (hu)
SI (1) SI0797379T1 (hu)
TR (1) TR199700165A2 (hu)
UA (1) UA42784C2 (hu)
UY (1) UY24454A1 (hu)
YU (1) YU48977B (hu)

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DE102004046394B4 (de) * 2004-08-24 2007-03-01 Dehn + Söhne Gmbh + Co. Kg Steckbare Überspannungsschutz-Anordnung
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US7522721B2 (en) * 2005-08-26 2009-04-21 Adc Telecommunications, Inc. System for broadband service delivery
US7643631B2 (en) * 2005-08-26 2010-01-05 Adc Telecommunications, Inc. Enclosure for broadband service delivery system
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CN101295570B (zh) * 2007-04-25 2011-11-23 聚鼎科技股份有限公司 保护电路板和其过电流保护元件
DE102007050590B4 (de) * 2007-10-23 2017-04-13 Tyco Electronics Services Gmbh Verteileranschlussmodul
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US8411404B2 (en) * 2008-05-27 2013-04-02 Adc Telecommunications, Inc. Overvoltage protection plug
EP2790477B1 (en) 2013-04-08 2018-06-13 Electrolux Appliances Aktiebolag A fixing device for a capacitor and a cooking oven including a cooling channel with the fixing device
DE102014103419B4 (de) 2014-03-13 2018-05-24 Epcos Ag Überspannungsableiter mit Schutz vor Erwärmung
US9763328B1 (en) * 2016-03-11 2017-09-12 Continental Automotive Systems, Inc. Electrolytic capacitor retention device
CN106231790A (zh) * 2016-07-27 2016-12-14 上海摩软通讯技术有限公司 一种印制电路板及制作方法及移动终端

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Also Published As

Publication number Publication date
DE59708222D1 (de) 2002-10-24
PT797379E (pt) 2003-02-28
ATE224634T1 (de) 2002-10-15
DK0797379T3 (da) 2003-01-06
YU9197A (sh) 2000-10-30
SI0797379T1 (en) 2003-04-30
US5999412A (en) 1999-12-07
ID16239A (id) 1997-09-11
AU713077B2 (en) 1999-11-25
IL120102A (en) 1997-04-15
TR199700165A2 (xx) 1997-10-21
AU1251397A (en) 1997-09-25
UA42784C2 (uk) 2001-11-15
HU9700597D0 (en) 1997-05-28
CA2199898A1 (en) 1997-09-18
UY24454A1 (es) 1997-03-04
NZ314160A (en) 1998-09-24
EP0797379A3 (de) 1998-01-07
KR19990008482A (ko) 1999-02-05
AR006169A1 (es) 1999-08-11
BR9701324A (pt) 1998-09-08
BG62425B1 (bg) 1999-10-29
HUP9700597A3 (en) 2000-04-28
YU48977B (sh) 2003-02-28
CZ292485B6 (cs) 2003-10-15
ES2183993T3 (es) 2003-04-01
EP0797379B1 (de) 2002-09-18
MX9701909A (es) 1997-09-30
CZ71697A3 (en) 1997-10-15
BG101319A (en) 1997-09-30
EP0797379A2 (de) 1997-09-24
PL318893A1 (en) 1997-09-29
CO4560406A1 (es) 1998-02-10
HUP9700597A1 (en) 1997-12-29
SG52925A1 (en) 1998-09-28
JPH104250A (ja) 1998-01-06
NO970383D0 (no) 1997-01-29
CN1168078A (zh) 1997-12-17
PL182659B1 (pl) 2002-02-28

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