NO834009L - Fremgangsmaate og apparatur for fremstilling av flersjikts kretskort - Google Patents
Fremgangsmaate og apparatur for fremstilling av flersjikts kretskortInfo
- Publication number
- NO834009L NO834009L NO834009A NO834009A NO834009L NO 834009 L NO834009 L NO 834009L NO 834009 A NO834009 A NO 834009A NO 834009 A NO834009 A NO 834009A NO 834009 L NO834009 L NO 834009L
- Authority
- NO
- Norway
- Prior art keywords
- conductive
- layer
- substrate
- printed circuit
- circuit pattern
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 79
- 238000004519 manufacturing process Methods 0.000 title claims description 28
- 239000004020 conductor Substances 0.000 claims description 85
- 239000000758 substrate Substances 0.000 claims description 75
- 239000011810 insulating material Substances 0.000 claims description 53
- 239000000463 material Substances 0.000 claims description 30
- 238000000576 coating method Methods 0.000 claims description 23
- 238000004070 electrodeposition Methods 0.000 claims description 22
- 239000011248 coating agent Substances 0.000 claims description 19
- 239000012212 insulator Substances 0.000 claims description 12
- 239000012774 insulation material Substances 0.000 claims description 11
- 238000005553 drilling Methods 0.000 claims description 10
- 238000003475 lamination Methods 0.000 claims description 8
- 239000012535 impurity Substances 0.000 claims description 6
- 238000000926 separation method Methods 0.000 claims description 6
- 239000002648 laminated material Substances 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims 9
- 238000000151 deposition Methods 0.000 claims 4
- 230000000873 masking effect Effects 0.000 claims 4
- 230000008021 deposition Effects 0.000 claims 2
- 108090000623 proteins and genes Proteins 0.000 claims 1
- 239000010410 layer Substances 0.000 description 86
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 25
- 229910052802 copper Inorganic materials 0.000 description 24
- 239000010949 copper Substances 0.000 description 24
- 229920002120 photoresistant polymer Polymers 0.000 description 19
- 238000005530 etching Methods 0.000 description 9
- 238000009713 electroplating Methods 0.000 description 8
- 239000004593 Epoxy Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 239000011152 fibreglass Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- 235000001674 Agaricus brunnescens Nutrition 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000010420 art technique Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000000109 continuous material Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000005297 pyrex Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Burglar Alarm Systems (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US35473682A | 1982-03-04 | 1982-03-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NO834009L true NO834009L (no) | 1983-11-03 |
Family
ID=23394704
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO834009A NO834009L (no) | 1982-03-04 | 1983-11-03 | Fremgangsmaate og apparatur for fremstilling av flersjikts kretskort |
Country Status (8)
| Country | Link |
|---|---|
| EP (1) | EP0103627A4 (da) |
| JP (1) | JPS59500341A (da) |
| CA (1) | CA1222574A (da) |
| DK (1) | DK502783D0 (da) |
| IN (1) | IN158376B (da) |
| IT (1) | IT1163136B (da) |
| NO (1) | NO834009L (da) |
| WO (1) | WO1983003065A1 (da) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60258996A (ja) * | 1984-03-09 | 1985-12-20 | アール．ダブリュ．キュー．インコ． | 多層プリント配線板の積層方法および装置 |
| GB2177851A (en) * | 1985-06-05 | 1987-01-28 | Spence Bate | Laminated low power circuitry components |
| US4927477A (en) * | 1985-08-26 | 1990-05-22 | International Business Machines Corporation | Method for making a flush surface laminate for a multilayer circuit board |
| GB2212333A (en) * | 1987-11-11 | 1989-07-19 | Gen Electric Co Plc | Method of fabricating multi-layer circuits |
| US4875966A (en) * | 1988-09-12 | 1989-10-24 | General Dynamics Corp., Pomona Div. | Pressure transfer plate assembly for a heat bonding apparatus |
| JPH03196691A (ja) * | 1989-12-26 | 1991-08-28 | Cmk Corp | プリント配線板の絶縁層の形成方法 |
| EP3197251B1 (en) * | 2014-07-18 | 2023-10-18 | Mitsubishi Gas Chemical Company, Inc. | Laminate and substrate for mounting a semiconductor device, and methods for producing the same |
| EP3007526A1 (en) * | 2014-10-08 | 2016-04-13 | T-Kingdom Co., Ltd. | Manufacturing method and structure of circuit board with very fine conductive circuit lines |
| US10332832B2 (en) | 2017-08-07 | 2019-06-25 | General Electric Company | Method of manufacturing an electronics package using device-last or device-almost last placement |
| US11664240B2 (en) | 2017-11-16 | 2023-05-30 | Mitsubishi Gas Chemical Company, Inc. | Method for producing laminate having patterned metal foil, and laminate having patterned metal foil |
| JP7153242B2 (ja) | 2017-12-14 | 2022-10-14 | 三菱瓦斯化学株式会社 | 絶縁性樹脂層付き銅箔 |
| CN112601662B (zh) | 2018-08-30 | 2023-07-07 | 三菱瓦斯化学株式会社 | 层叠体、覆金属箔层叠板、进行了图案化的带金属箔的层叠体、具有积层结构的层叠体、印刷电路板、多层无芯基板、其制造方法 |
| JP7479596B2 (ja) | 2019-03-29 | 2024-05-09 | 三菱瓦斯化学株式会社 | 絶縁性樹脂層付き銅箔、並びに、これを用いた積層体及び積層体の製造方法 |
| TW202110617A (zh) | 2019-05-31 | 2021-03-16 | 日商三菱瓦斯化學股份有限公司 | 附絕緣性樹脂層之基材、以及使用其之疊層體及疊層體之製造方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3219749A (en) * | 1961-04-21 | 1965-11-23 | Litton Systems Inc | Multilayer printed circuit board with solder access apertures |
| GB964349A (en) * | 1961-08-31 | 1964-07-22 | Rogers Corp | Improvements in printed circuit and method of making the same |
| US3350250A (en) * | 1962-03-21 | 1967-10-31 | North American Aviation Inc | Method of making printed wire circuitry |
| US3324014A (en) * | 1962-12-03 | 1967-06-06 | United Carr Inc | Method for making flush metallic patterns |
| GB1259837A (en) * | 1968-11-18 | 1972-01-12 | Boeing Co | Composite structure and method of making the same |
| US3627902A (en) * | 1970-02-02 | 1971-12-14 | Control Data Corp | Interconnections for multilayer printed circuit boards |
| US3972755A (en) * | 1972-12-14 | 1976-08-03 | The United States Of America As Represented By The Secretary Of The Navy | Dielectric circuit board bonding |
| US4159222A (en) * | 1977-01-11 | 1979-06-26 | Pactel Corporation | Method of manufacturing high density fine line printed circuitry |
| US4354895A (en) * | 1981-11-27 | 1982-10-19 | International Business Machines Corporation | Method for making laminated multilayer circuit boards |
-
1983
- 1983-03-02 CA CA000422703A patent/CA1222574A/en not_active Expired
- 1983-03-03 IT IT19877/83A patent/IT1163136B/it active
- 1983-03-04 WO PCT/US1983/000292 patent/WO1983003065A1/en not_active Application Discontinuation
- 1983-03-04 IN IN272/CAL/83A patent/IN158376B/en unknown
- 1983-03-04 JP JP58501241A patent/JPS59500341A/ja active Pending
- 1983-03-04 EP EP19830901286 patent/EP0103627A4/en not_active Ceased
- 1983-11-03 NO NO834009A patent/NO834009L/no unknown
- 1983-11-03 DK DK5027/83A patent/DK502783D0/da not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| CA1222574A (en) | 1987-06-02 |
| IN158376B (da) | 1986-11-01 |
| EP0103627A1 (en) | 1984-03-28 |
| JPS59500341A (ja) | 1984-03-01 |
| WO1983003065A1 (en) | 1983-09-15 |
| IT1163136B (it) | 1987-04-08 |
| EP0103627A4 (en) | 1985-09-18 |
| DK502783A (da) | 1983-11-03 |
| IT8319877A1 (it) | 1984-09-03 |
| IT8319877A0 (it) | 1983-03-03 |
| DK502783D0 (da) | 1983-11-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4606787A (en) | Method and apparatus for manufacturing multi layer printed circuit boards | |
| EP0843955B1 (en) | Method of forming raised metallic contacts on electrical circuits | |
| US7420127B2 (en) | Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate | |
| CN1798485B (zh) | 多层印刷电路板及其制造方法 | |
| US4889584A (en) | Method of producing conductor circuit boards | |
| NO834009L (no) | Fremgangsmaate og apparatur for fremstilling av flersjikts kretskort | |
| US6426011B1 (en) | Method of making a printed circuit board | |
| JPH0716094B2 (ja) | 配線板の製造法 | |
| US4789423A (en) | Method for manufacturing multi-layer printed circuit boards | |
| JP2013168691A (ja) | 印刷回路基板及びそのビアホールの充填方法 | |
| US7080448B2 (en) | PCB with inlaid outer-layer circuits and production methods thereof | |
| JP4488187B2 (ja) | ビアホールを有する基板の製造方法 | |
| JP5188947B2 (ja) | 多層配線基板の製造方法 | |
| JP7234049B2 (ja) | プリント配線基板 | |
| US8074352B2 (en) | Method of manufacturing printed circuit board | |
| KR100726238B1 (ko) | 다층 인쇄회로기판 제조방법 | |
| JPS59175796A (ja) | 多層印刷配線板の製造方法 | |
| CN115835491A (zh) | 一种电路板的制作方法及电路板 | |
| CA1234923A (en) | Method for manufacturing multi-layered printed circuit boards and a circuit board produced by same | |
| JP2005136282A (ja) | 多層配線基板及びその製造方法 | |
| KR100916649B1 (ko) | 인쇄회로기판의 제조방법 | |
| KR101154567B1 (ko) | 인쇄회로기판의 제조 방법 | |
| JP4160813B2 (ja) | 多層回路基板の製造法 | |
| JP2002176262A (ja) | 多層プリント配線板及びその製造方法 | |
| KR100916647B1 (ko) | 인쇄회로기판의 제조방법 |