DK502783A - Fremgangsmaade og apparat til fremstilling af flerlags kredsloebsplader - Google Patents
Fremgangsmaade og apparat til fremstilling af flerlags kredsloebsplader Download PDFInfo
- Publication number
- DK502783A DK502783A DK502783A DK502783A DK502783A DK 502783 A DK502783 A DK 502783A DK 502783 A DK502783 A DK 502783A DK 502783 A DK502783 A DK 502783A DK 502783 A DK502783 A DK 502783A
- Authority
- DK
- Denmark
- Prior art keywords
- circuit boards
- multiple circuit
- manufacturing multiple
- manufacturing
- boards
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Burglar Alarm Systems (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US35473682A | 1982-03-04 | 1982-03-04 | |
PCT/US1983/000292 WO1983003065A1 (en) | 1982-03-04 | 1983-03-04 | A method and apparatus for manufacturing multi-layer circuit boards |
Publications (2)
Publication Number | Publication Date |
---|---|
DK502783A true DK502783A (da) | 1983-11-03 |
DK502783D0 DK502783D0 (da) | 1983-11-03 |
Family
ID=23394704
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK5027/83A DK502783D0 (da) | 1982-03-04 | 1983-11-03 | Fremgangsmade og apparat til fremstilling af flerlags kredsloebsplader |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP0103627A4 (da) |
JP (1) | JPS59500341A (da) |
CA (1) | CA1222574A (da) |
DK (1) | DK502783D0 (da) |
IN (1) | IN158376B (da) |
IT (1) | IT1163136B (da) |
NO (1) | NO834009L (da) |
WO (1) | WO1983003065A1 (da) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0154564A3 (en) * | 1984-03-09 | 1986-08-20 | Cirtel Inc. | Method and apparatus for laminating multilayer printed circuit boards having both rigid and flexible portions |
GB2177851A (en) * | 1985-06-05 | 1987-01-28 | Spence Bate | Laminated low power circuitry components |
US4927477A (en) * | 1985-08-26 | 1990-05-22 | International Business Machines Corporation | Method for making a flush surface laminate for a multilayer circuit board |
GB2212333A (en) * | 1987-11-11 | 1989-07-19 | Gen Electric Co Plc | Method of fabricating multi-layer circuits |
US4875966A (en) * | 1988-09-12 | 1989-10-24 | General Dynamics Corp., Pomona Div. | Pressure transfer plate assembly for a heat bonding apparatus |
JPH03196691A (ja) * | 1989-12-26 | 1991-08-28 | Cmk Corp | プリント配線板の絶縁層の形成方法 |
JP6493404B2 (ja) * | 2014-07-18 | 2019-04-03 | 三菱瓦斯化学株式会社 | 積層体の製造方法及び半導体素子搭載用基板の製造方法 |
EP3007526A1 (en) * | 2014-10-08 | 2016-04-13 | T-Kingdom Co., Ltd. | Manufacturing method and structure of circuit board with very fine conductive circuit lines |
US10332832B2 (en) | 2017-08-07 | 2019-06-25 | General Electric Company | Method of manufacturing an electronics package using device-last or device-almost last placement |
KR20200087137A (ko) | 2017-11-16 | 2020-07-20 | 미츠비시 가스 가가쿠 가부시키가이샤 | 패터닝된 금속박 부착 적층체의 제조 방법 및 패터닝된 금속박 부착 적층체 |
CN111465496B (zh) | 2017-12-14 | 2022-03-01 | 三菱瓦斯化学株式会社 | 带绝缘性树脂层的铜箔 |
CN112601662B (zh) | 2018-08-30 | 2023-07-07 | 三菱瓦斯化学株式会社 | 层叠体、覆金属箔层叠板、进行了图案化的带金属箔的层叠体、具有积层结构的层叠体、印刷电路板、多层无芯基板、其制造方法 |
CN113573887A (zh) | 2019-03-29 | 2021-10-29 | 三菱瓦斯化学株式会社 | 带绝缘性树脂层的铜箔、以及使用其的层叠体和层叠体的制造方法 |
WO2020241899A1 (ja) | 2019-05-31 | 2020-12-03 | 三菱瓦斯化学株式会社 | 絶縁性樹脂層付き基材、並びに、これを用いた積層体及び積層体の製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3219749A (en) * | 1961-04-21 | 1965-11-23 | Litton Systems Inc | Multilayer printed circuit board with solder access apertures |
GB964349A (en) * | 1961-08-31 | 1964-07-22 | Rogers Corp | Improvements in printed circuit and method of making the same |
US3350250A (en) * | 1962-03-21 | 1967-10-31 | North American Aviation Inc | Method of making printed wire circuitry |
US3324014A (en) * | 1962-12-03 | 1967-06-06 | United Carr Inc | Method for making flush metallic patterns |
GB1259837A (en) * | 1968-11-18 | 1972-01-12 | Boeing Co | Composite structure and method of making the same |
US3627902A (en) * | 1970-02-02 | 1971-12-14 | Control Data Corp | Interconnections for multilayer printed circuit boards |
US3972755A (en) * | 1972-12-14 | 1976-08-03 | The United States Of America As Represented By The Secretary Of The Navy | Dielectric circuit board bonding |
US4159222A (en) * | 1977-01-11 | 1979-06-26 | Pactel Corporation | Method of manufacturing high density fine line printed circuitry |
US4354895A (en) * | 1981-11-27 | 1982-10-19 | International Business Machines Corporation | Method for making laminated multilayer circuit boards |
-
1983
- 1983-03-02 CA CA000422703A patent/CA1222574A/en not_active Expired
- 1983-03-03 IT IT19877/83A patent/IT1163136B/it active
- 1983-03-04 WO PCT/US1983/000292 patent/WO1983003065A1/en not_active Application Discontinuation
- 1983-03-04 EP EP19830901286 patent/EP0103627A4/en not_active Ceased
- 1983-03-04 IN IN272/CAL/83A patent/IN158376B/en unknown
- 1983-03-04 JP JP58501241A patent/JPS59500341A/ja active Pending
- 1983-11-03 NO NO834009A patent/NO834009L/no unknown
- 1983-11-03 DK DK5027/83A patent/DK502783D0/da not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
IT1163136B (it) | 1987-04-08 |
WO1983003065A1 (en) | 1983-09-15 |
IT8319877A1 (it) | 1984-09-03 |
CA1222574A (en) | 1987-06-02 |
EP0103627A1 (en) | 1984-03-28 |
NO834009L (no) | 1983-11-03 |
IN158376B (da) | 1986-11-01 |
IT8319877A0 (it) | 1983-03-03 |
JPS59500341A (ja) | 1984-03-01 |
EP0103627A4 (en) | 1985-09-18 |
DK502783D0 (da) | 1983-11-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AHS | Application shelved for other reasons than non-payment |