GB1259837A - Composite structure and method of making the same - Google Patents

Composite structure and method of making the same

Info

Publication number
GB1259837A
GB1259837A GB5462668A GB5462668A GB1259837A GB 1259837 A GB1259837 A GB 1259837A GB 5462668 A GB5462668 A GB 5462668A GB 5462668 A GB5462668 A GB 5462668A GB 1259837 A GB1259837 A GB 1259837A
Authority
GB
United Kingdom
Prior art keywords
pads
holes
core
sandwich
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5462668A
Inventor
Walter Weglin
Charles Walter Wildebour
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Boeing Co
Original Assignee
Boeing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Boeing Co filed Critical Boeing Co
Priority to GB5462668A priority Critical patent/GB1259837A/en
Publication of GB1259837A publication Critical patent/GB1259837A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

1,259,837. Printed circuit boards. BOEING CO. 18 Nov., 1968, No. 54626/68. Heading B5N. [Also in Divisions B6 and H1] Printed circuit boards (see Divisions B6 and H1) are incorporated into a sandwich construction. As shown in Fig. 14 the sandwich consists of a printed core 34 of kraft pulp material, an overlay 36 having holes 38 registering with the pads 40 in the printed circuitry and another overlay 42 which has smaller holes 44 that align with the pads 40 and the holes 38. The smaller holes 44 provide access for the component leads and the larger holes 38 for soldering to the pads 40. In assembling the layers, core 34 is compressed and inserted between two paper, wax or plastics sheets suitably punched and each coated on one side with adhesive 46. The sandwich is then bonded together in a press and subjected to a further punch operation in which punch holes 44 are extended through core 34 and pads 40. Two or more of the sandwiches may be interconnected in a multilayer assembly (Fig. 17, not shown) using solder tubelets which provide a capillary guide in each hole 44 for a pressed solder pin. In another modification two or more core layers are bonded between a layer of outer protective layers with component lead openings of differing diameters to expose circular portions of the pads from one core layer to the next.
GB5462668A 1968-11-18 1968-11-18 Composite structure and method of making the same Expired GB1259837A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB5462668A GB1259837A (en) 1968-11-18 1968-11-18 Composite structure and method of making the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB5462668A GB1259837A (en) 1968-11-18 1968-11-18 Composite structure and method of making the same

Publications (1)

Publication Number Publication Date
GB1259837A true GB1259837A (en) 1972-01-12

Family

ID=10471608

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5462668A Expired GB1259837A (en) 1968-11-18 1968-11-18 Composite structure and method of making the same

Country Status (1)

Country Link
GB (1) GB1259837A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0103627A1 (en) * 1982-03-04 1984-03-28 Ecolab Inc. A method and apparatus for manufacturing multi-layer circuit boards
EP0285900A2 (en) * 1987-04-04 1988-10-12 Bayer Ag Process for making printed circuits
US4920019A (en) * 1989-03-24 1990-04-24 Eveready Battery Company, Inc. Battery pack assembly having a circuit board
EP0478320A2 (en) * 1990-09-28 1992-04-01 Kabushiki Kaisha Toshiba Method for manufacturing printed circuit board

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0103627A1 (en) * 1982-03-04 1984-03-28 Ecolab Inc. A method and apparatus for manufacturing multi-layer circuit boards
EP0103627A4 (en) * 1982-03-04 1985-09-18 Economics Lab A method and apparatus for manufacturing multi-layer circuit boards.
EP0285900A2 (en) * 1987-04-04 1988-10-12 Bayer Ag Process for making printed circuits
EP0285900A3 (en) * 1987-04-04 1989-03-15 Bayer Ag Process for making printed circuits
US4859263A (en) * 1987-04-04 1989-08-22 Bayer Aktiengesellschaft Ag Process for the manufacture of printed circuits
US4920019A (en) * 1989-03-24 1990-04-24 Eveready Battery Company, Inc. Battery pack assembly having a circuit board
EP0478320A2 (en) * 1990-09-28 1992-04-01 Kabushiki Kaisha Toshiba Method for manufacturing printed circuit board
EP0478320A3 (en) * 1990-09-28 1993-06-30 Kabushiki Kaisha Toshiba Method for manufacturing printed circuit board
US5325583A (en) * 1990-09-28 1994-07-05 Kabushiki Kaisha Toshiba Method for manufacturing printed circuit board

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee