JPH0632383B2 - Method for manufacturing multilayer printed wiring board - Google Patents
Method for manufacturing multilayer printed wiring boardInfo
- Publication number
- JPH0632383B2 JPH0632383B2 JP24523186A JP24523186A JPH0632383B2 JP H0632383 B2 JPH0632383 B2 JP H0632383B2 JP 24523186 A JP24523186 A JP 24523186A JP 24523186 A JP24523186 A JP 24523186A JP H0632383 B2 JPH0632383 B2 JP H0632383B2
- Authority
- JP
- Japan
- Prior art keywords
- inner layer
- hole
- wiring board
- printed wiring
- multilayer printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は多層プリント配線板を製造する方法に関する
ものである。TECHNICAL FIELD The present invention relates to a method for manufacturing a multilayer printed wiring board.
多層プリント配線板を製造するには、内層の表面に銅箔
からなる内層ランド等の内層配線を設け、内層と外層と
を接着したのちに、ドリルでスルーホール用孔を設ける
が、この場合にドリルで内層ランドを切削しなければな
らないので、ドリルの寿命が短くなり、また切りくずの
中に銅箔が含まれるので、スルーホール用孔の内面にえ
ぐれなどが発生するとともに、切りくずの排出性が悪く
なるので、ドリルが折損することがある。In order to manufacture a multilayer printed wiring board, inner layer wiring such as an inner layer land made of copper foil is provided on the surface of the inner layer, and after adhering the inner layer and the outer layer, a through hole is provided with a drill. Since the inner layer land has to be cut with a drill, the life of the drill is shortened, and because copper foil is contained in the chips, the inner surface of the through-hole hole may be engraved and the chips may be discharged. The drill may break due to poor performance.
このため、従来多層プリント配線板を製造するには、特
公昭57-34680号公報に記載されているように、内層に内
層ランドの中央部を通過しかつスルーホール用孔よりも
小さい穴をドリルであけたのちに、内層と外層とを接着
し、ついでドリルでスルーホール用孔を設けている。Therefore, in order to manufacture a conventional multilayer printed wiring board, as described in JP-B-57-34680, a hole that passes through the center of the inner-layer land and is smaller than the through-hole is drilled in the inner layer. After drilling, the inner layer and the outer layer are adhered, and then a hole for through hole is provided by a drill.
しかし、この多層プリント配線板の製造方法において
は、内層の穴あけ作業に多くの時間を要するとともに、
ドリルで穴あけを行なうので、その径に制限があり、し
かもドリルの折損により不良となるおそれがある。However, in this method for manufacturing a multilayer printed wiring board, it takes a lot of time to drill holes in the inner layer,
Since the holes are drilled, there is a limit to the diameter and there is a risk that the drill will break and become defective.
この発明は上述の問題点を解決するためになされたもの
で、内層ランドの切削量を減少することができかつ内層
に穴あけを行なう必要がない多層プリント配線板の製造
方法を提供することを目的とする。The present invention has been made to solve the above problems, and an object of the present invention is to provide a method for manufacturing a multilayer printed wiring board that can reduce the amount of cutting of the inner layer land and does not need to make holes in the inner layer. And
この目的を達成するため、この発明においては、多層プ
リント配線板を製造する方法において、内層の表面に設
けられた内層ランドの中央部にスルーホール用孔よりも
小さい穴を設けたのち、上記内層と外層とを接着する。In order to achieve this object, in the present invention, in a method for manufacturing a multilayer printed wiring board, a hole smaller than a through hole is provided in the central portion of an inner layer land provided on the surface of the inner layer, and then the inner layer is formed. And the outer layer.
この多層プリント配線板の製造方法においては、スルー
ホール用孔を設けるときに穴の分だけ内層ランドの切削
量が減少する。In this method of manufacturing a multilayer printed wiring board, when the through hole is provided, the amount of cutting of the inner layer land is reduced by the amount of the hole.
第１図〜第３図によりこの発明に係る多層プリント配線
板の製造方法を説明する。まず、第１図に示すように、
内層２の表面にテンティング法により銅箔からなる内層
ランド１等の内層配線を形成すると同時に、内層ランド
１の中央部にスルーホール用孔よりも小さい円形の穴３
を設ける。つぎに、第２図に示すように、内層２と外層
６との間にプリプレグ５をはさみ、積層プレスにより内
層２と外層６とを接着する。つぎに、第３図に示すよう
に、ドリルによりスルーホール用孔４を設ける。A method of manufacturing a multilayer printed wiring board according to the present invention will be described with reference to FIGS. First, as shown in FIG.
An inner layer wiring such as an inner layer land 1 made of copper foil is formed on the surface of the inner layer 2 by a tenting method, and at the same time, a circular hole 3 smaller than a through hole is formed in the center of the inner layer land 1.
To provide. Next, as shown in FIG. 2, a prepreg 5 is sandwiched between the inner layer 2 and the outer layer 6 and the inner layer 2 and the outer layer 6 are bonded by a laminating press. Next, as shown in FIG. 3, a through hole 4 is provided by a drill.
この多層プリント配線板の製造方法においては、ドリル
によりスルーホール用孔４を設ける場合に、穴３の分だ
け内層ランド１の切削量が減少するので、ドリルの寿命
を延長することができ、スルーホール用孔４の内面にえ
ぐれなどが生ずることがなく、ドリルの折損を少なくで
きる。さらに、内層ランド１を形成すると同時に穴３を
設けるので、従来方法のように内層２の穴あけ作業を行
なう必要がない。In this method for manufacturing a multilayer printed wiring board, when the through hole 4 is formed by drilling, the cutting amount of the inner layer land 1 is reduced by the amount of the hole 3, so that the life of the drill can be extended and the through hole can be extended. The inner surface of the hole 4 for the hole does not have a gouging or the like, and breakage of the drill can be reduced. Further, since the holes 3 are provided at the same time when the inner layer land 1 is formed, it is not necessary to perform the drilling operation of the inner layer 2 unlike the conventional method.
なお、上述実施例においては、内層ランド１の中央部に
円形の穴３を設けたが、多角形等の穴を設けてもよい。
また、上述実施例においては、銅箔からなる内層ランド
１を形成したが、他の導体箔からなる内層ランドを形成
してもよい。Although the circular hole 3 is provided in the central portion of the inner layer land 1 in the above embodiment, a polygonal hole or the like may be provided.
Further, in the above-mentioned embodiment, the inner layer land 1 made of the copper foil is formed, but the inner layer land made of another conductor foil may be formed.
以上説明したように、この発明に係る多層プリント配線
板の製造方法においては、ドリルの寿命を延長すること
ができ、ドリルの折損を少なくできるから、ドリルの使
用本数が減少するので、経済的であり、またスルーホー
ル用孔の内面にえぐれなどが生ずることがないから、ス
ルーホールの信頼性が向上し、さらに内層の穴あけ作業
を行なう必要がないから、製造工程を簡略化することが
できる。このように、この発明の効果は顕著である。As described above, in the method for manufacturing a multilayer printed wiring board according to the present invention, the life of the drill can be extended and the breakage of the drill can be reduced, so the number of drills used is reduced, which is economical. In addition, since the inner surface of the through hole is not carved, the reliability of the through hole is improved, and it is not necessary to perform the inner layer drilling work, so that the manufacturing process can be simplified. As described above, the effect of the present invention is remarkable.
第１図〜第３図はこの発明に係る多層プリント配線板の
製造方法の説明図である。 １……内層ランド、２……内層 ３……穴、４……スルーホール用孔1 to 3 are explanatory views of a method for manufacturing a multilayer printed wiring board according to the present invention. 1 ... Inner layer land, 2 ... Inner layer 3 ... Hole, 4 ... Through hole
Claims (1)
て、内層の表面に設けられた内層ランドの中央部にスル
ーホール用孔よりも小さい穴を設けたのち、上記内層と
外層とを接着することを特徴とする多層プリント配線板
の製造方法。1. In a method for manufacturing a multilayer printed wiring board, a hole smaller than a through hole is provided in the central portion of an inner layer land provided on the surface of the inner layer, and then the inner layer and the outer layer are bonded together. A method for manufacturing a multilayer printed wiring board, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24523186A JPH0632383B2 (en) | 1986-10-17 | 1986-10-17 | Method for manufacturing multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24523186A JPH0632383B2 (en) | 1986-10-17 | 1986-10-17 | Method for manufacturing multilayer printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63100797A JPS63100797A (en) | 1988-05-02 |
| JPH0632383B2 true JPH0632383B2 (en) | 1994-04-27 |
Family
ID=17130607
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24523186A Expired - Lifetime JPH0632383B2 (en) | 1986-10-17 | 1986-10-17 | Method for manufacturing multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0632383B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013084729A (en) * | 2011-10-07 | 2013-05-09 | Fujitsu Ltd | Multilayer wiring board, electronic apparatus, and manufacturing method of multilayer wiring board |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0316297A (en) * | 1989-06-14 | 1991-01-24 | Mitsubishi Electric Corp | Manufacture of multilayer printed wiring board |
| JP2002100850A (en) * | 2000-09-21 | 2002-04-05 | Ibiden Co Ltd | Method of manufacturing wiring board |
| JP4482613B2 (en) * | 2009-12-24 | 2010-06-16 | 新光電気工業株式会社 | Manufacturing method of multilayer wiring board |
-
1986
- 1986-10-17 JP JP24523186A patent/JPH0632383B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013084729A (en) * | 2011-10-07 | 2013-05-09 | Fujitsu Ltd | Multilayer wiring board, electronic apparatus, and manufacturing method of multilayer wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63100797A (en) | 1988-05-02 |
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