JPS5875881A - Method of cutting glass substrate - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention uses a so-called glass substrate in which a copper foil layer as a conductive layer is laminated on a glass fiber layer as an insulating layer to be used as a printed wiring board prior to manufacturing the printed wiring board. The purpose of the present invention is to provide a cutting method that prevents the formation of flakes on both the copper foil and the glass fiber layer on the cut surface and allows the cut edges to be cut at right angles when cutting into the required size and shape. °There is.

When using a glass substrate as a printed wiring board, the cutting method used to cut the required shape, size, etc. is the same cutting method as for ordinary copper-clad laminates, but when the insulating layer is glass The fibers are impregnated with epoxy resin.

Due to the physical properties of this product, which is bonded under heat and pressure, the glass fibers produce burrs at the cut end, and burrs also occur on the strength steel foil layer side, making it difficult to cut the cut surface at right angles.

Therefore, printing alignment in printed wiring work is accomplished by drilling alignment holes in the glass substrate and combining them into alignment bottles.
To fit the alignment hole into the alignment bottle 1. For example, when the outer diameter of the bottle is 1 mm, the inner diameter of the hole should be 1.0 mm due to the nature of the work. Although it is required that the diameter be larger than the outer diameter of the bottle, such as ID5asψ, a deviation of 0.1 mm is allowed, but on the other hand, deviations will naturally occur in the printed pattern and resist.

As a result, printed wiring accuracy was lacking, leading to a deterioration in quality.

Therefore, the present invention can also be applied to a glass substrate instead of the alignment method using alignment bottles and alignment holes drilled in the glass substrate.

In order to be able to adopt a positioning method that utilizes the side surface of the plate, we have developed a method that prevents the formation of flakes on the silver foil and glass fiber layer at the cut surface and allows the cut surface to be aligned at right angles. This is what I did.

In other words, when a glass substrate is cut by shearing, burrs occur at the cut edges, and unless these are aligned at right angles, using the side surface of the glass substrate as an alignment surface will prevent misalignment due to burrs at the cut edges. Undeniably, in order to solve this problem, the above-mentioned alignment method using holes between the bottle and the glass substrate is adopted.

Therefore, when cutting a glass substrate, if a perpendicular cut surface can be obtained without occurrence of burr, it is possible to work on printed wiring using a glass substrate. It is clear that the above-mentioned drawbacks from the bottle and hole alignment method can also be overcome at the same time.

Therefore, in the method for cutting a glass substrate for printed wiring consisting of a glass fiber layer as an insulating layer and a copper foil layer as a conductive layer, the present invention provides a method for cutting a glass substrate for printed wiring consisting of a glass fiber layer as an insulating layer and a copper foil layer as a conductive layer. The glass fiber layer is cut through the cutting groove in the layer, and the cutting of the steel foil layer is followed in carrying out the method.

The purpose of this method is to cut the glass fiber layer through the cutting grooves in the copper foil layer, and to cut the glass fiber layer and the copper foil at right angles while preventing the generation of paris on the cut surface. It was successful.

The method of the present invention will be specifically explained below with explanatory drawings, in which a glass sheet is impregnated with engineered resin,
To cut the glass substrate, which consists of a glass fiber layer (0.8 to 2 m thick) and a copper foil layer (18 to 35 μm thick), which are bonded together by thermocompression, the copper foil layer is first cut with a grindstone cutter or a diamond cutter. At the same time, the glass fiber layer 3 is cut using a cutting drill via the cutting groove 2 of the copper foil layer 1 (see FIG. 1).

Further, the groove width of the cutting groove 2 of the # foil layer 1 is wide enough to allow cutting of the glass fiber layer 3 with a drill through the cutting groove 2. By setting the width of the glass fiber layer 3 to 8101 mm and using a drill with a diameter of 4 mm for cutting the glass fiber layer 3,
The glass fiber layer 3 can be cut through the cutting grooves 2 of the copper foil layer 1.

Furthermore, in carrying out the above method, the cutting operation of the copper foil layer 1 and the cutting operation of the glass fiber layer 3 via this cutting groove 2 can be performed separately; By simultaneously performing the cutting operation of the glass fiber layer 3 following the cutting operation, the workability of the cutting operation can be improved.

Note that 4 in FIG. 1 indicates a cutting groove in the glass fiber layer 3.

[Brief explanation of drawings]

FIG. 1.2 is an explanatory diagram showing the cutting method of the present invention. 1...Copper foil layer 2... Cutting groove 3...Glass fiber layer 4... Cutting groove Figure 1 112I! ! ! 1

Claims (6)

[Claims] (1) In the method of cutting a glass substrate for wiring (printed) consisting of a glass fiber layer as an insulating layer and a copper foil layer as a conductive layer, after cutting only the copper foil layer to the required width, A method for cutting a glass substrate, comprising cutting the glass fiber layer through cutting grooves. (2) In a method for cutting a glass substrate for printed wiring consisting of a glass fiber layer as an insulating layer and a copper foil layer as a conductive layer, only the copper foil layer is cut to a required width, and then the copper foil layer is cut. A method for cutting a glass substrate, characterized in that the glass fiber layer is cut through the grooves, and the glass fiber layer is cut through the cutting grooves in the copper foil layer so as to follow the cutting of the copper foil layer. . (3) Claim 1, characterized in that the copper foil layer is cut with a grindstone cutter or a diamond cutter.
1# The method for cutting a glass substrate according to item 11 or item 2. (4) The width of the cut grooves in the copper foil layer is wider than the width of the cut grooves in the glass fiber layer. The method for cutting a glass substrate according to item 1 or 2. (5) The glass substrate according to claim 1 or 2, wherein the width of the cut grooves in the copper foil layer is 8 m, and the width of the cut grooves in the glass fiber layer is 4 m. cutting method. (6) The method for cutting a glass substrate according to claim 1 or 2, wherein the glass fiber layer is cut with a drill having a fan-shaped cross section or the like.