KR100452278B1 - Backup board for punching holes of printed circuit board - Google Patents
Backup board for punching holes of printed circuit board Download PDFInfo
- Publication number
- KR100452278B1 KR100452278B1 KR10-2002-0014912A KR20020014912A KR100452278B1 KR 100452278 B1 KR100452278 B1 KR 100452278B1 KR 20020014912 A KR20020014912 A KR 20020014912A KR 100452278 B1 KR100452278 B1 KR 100452278B1
- Authority
- KR
- South Korea
- Prior art keywords
- board
- pcb
- printed circuit
- adhesive
- backup
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Laminated Bodies (AREA)
Abstract
집섬보드, 하드보드, 포맥스 중에서 선택된 어느 한가지를 코어(심재)로하여 그 양면에 스텐레스 스틸 박판(foil)을 접착제를 매개로하여 고압으로 압착하여 인쇄회로기판(PCB)의 홀가공용 백업보드를 제공하므로서, 얇고 작고 짧고 가벼운 PCB의 홀가공시에 거기에 사용되는 비트(바늘)의 마모는 적으면서 고속회전에 의한 발열 현상도 방지하여 주게되어 비트의 수명을 연장시키면서 PCB의 홀가공을 효과적이고 능률적으로 가공할 수가 있고 생산성도 더한층 높여줄 수 있는 PCB홀가공용 백업보드이다.Using any one selected from zip-sum board, hard board and Formax as core (core material), stainless steel foil is pressed on both sides by high pressure through adhesive to provide backing board for hole processing of printed circuit board (PCB). Therefore, it is possible to prevent heat generation due to high-speed rotation while reducing the wear of bits used in thin, small, short and light PCB hole processing, and to prolong the life of the bits and to effectively process PCB holes. It is a backup board for PCB hole processing which can be processed and further increase the productivity.
Description
본 발명은 전자제품에 장착되는 인쇄회로기판(PCB;Printed Circuit Board)의 제조공정에서 기판에 홀을 천공하는(드릴공정) 공정에 사용되는 백업보드(Backup Board)에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a backup board used in a process of drilling holes in a substrate (drill process) in a manufacturing process of a printed circuit board (PCB) mounted on an electronic product.
종래에는 백업보드로서, 고밀도 섬유압축판(HDF), 중밀도 섬유압축판(MDF)에 멜라민 수지를 함침 또는 코팅시킨 백업보드(이하 멜라민보드라고 함)와 페놀수지판으로된 백업보드, 또는 셀루로즈계 시트의 양면에 알루미늄 박이나 알루미늄 합금박을 폴리비닐 알콜과 같은 접착제로 접착 적층시킨 백업보드(이하 알루미늄 백업보드라고 함)가 있으나 상기 HDF, MDF, 페놀수지판 또는 알루미늄으로된 백업보드는 드릴로 홀가공(천공)시 다량의 분진이 발생하여 공해의 요인이 되었었고 홀가공용 비트(바늘)에 의한 정확한 위치의 홀가공이 어려운 단점이 있었으며 또한 멜라민보드나 알루미늄 보드는 견고성이 취약하여 홀가공시 판이 휘어지기 쉬워서 정확한 홀가공이 어려운 단점이 있으며 또 홀가공시에 발생되는 열의 분산이 잘 이루어지지 않고 따로 열을 방지하거나 제거하는 수단이 없으므로 홀천공 작업에 어려움이 많았었다. 뿐만아니라 상기 멜라민보드나 페놀보드 모두를 백업보드로 사용시에 폐기물 처리시에도 환경 오염 문제가 야기되는 결점이 있는데다가 이의 방지를 위해 별도의 비용을 부담해야 하는 결점이 있었다.Conventionally, as a backup board, a high-density fiber compression plate (HDF), a medium-density fiber compression plate (MDF) impregnated or coated with melamine resin (hereinafter referred to as melamine board) and a phenolic resin backing board, or cellulose There is a backing board (hereinafter referred to as an aluminum backing board) in which aluminum foil or aluminum alloy foil is adhesively laminated on both sides of the rose-based sheet with an adhesive such as polyvinyl alcohol, but the backing board made of HDF, MDF, phenolic resin board or aluminum When drilling with holes, a large amount of dust was generated, which contributed to pollution, and there was a disadvantage that it was difficult to drill holes with the correct position by using a hole bit (needle), and melamine board or aluminum board was weak due to its weakness. It is easy to bend the test plate, so it is difficult to make accurate hole processing. In addition, heat is not dispersed well and heat is generated separately. Since there was no means to prevent or remove, the hole drilling was difficult. In addition, when using both melamine board or phenol board as a backup board, there is a drawback of causing environmental pollution during waste treatment, and there is a drawback of having to pay a separate cost to prevent it.
또 페놀보드의 경우는 페놀 자체의 유독성으로 인하여 홀가공시 유독한 분진의 발생으로 공해요인이 되었으며 하절기에는 보드(판)가 열에 의해 유연해져서 휘는 현상이 발생하거나 동절기에는 너무 견고하여 비트(바늘)의 마모를 심하게 하는결점이 있었다. 또한 이 페놀보드 역시 홀가공시에 발생되는 열의 분산이 잘 이루어지지 않아 따로 열을 차단하거나 제거하는 수단이 없으므로 홀천공 작업에 어려움이 많았었다.In the case of phenol boards, due to the toxicity of phenol itself, it became a pollutant due to the generation of toxic dust during hole processing.In summer, boards (boards) become flexible due to heat, causing bending or being too strong in winter. There was a defect that caused severe wear. In addition, this phenol board also had difficulty in hole drilling because there is no means to block or remove heat due to poor dispersion of heat generated during hole processing.
본 발명은 종래의 페놀보드나 멜라민보드 및 알루미늄 보드등의 결점을 개량하여 백업보드가 어떠한 환경이나 가공시에도 휘거나 유독한 분진이 발생하지 않으면서 비트의 마모도 적고 또한 홀가공시에 열확산이 용이한 금속판인 스텐레스 스틸 박판을 사용하므로써 많은 열이 발생하지 않아 홀가공 환경을 상온으로 유지해주게되고 홀천공(가공)도 정확한 위치에 정밀하게 할 수 있게하는 백업보드를 제공코저하는 것으로서 이를 첨부된 도면을 참조하면서 상세히 설명하면 다음과 같다.The present invention improves the defects of conventional phenol boards, melamine boards and aluminum boards, so that the backup boards are not bent or toxic dust in any environment or processing, and less wear of the bits and easy heat diffusion during hole processing. By using the stainless steel sheet, which is a metal plate, it does not generate much heat, so it maintains the hole processing environment at room temperature, and provides a backup board for precisely drilling holes in a precise position. When described in detail with reference to as follows.
도 1 은 본 발명에 따른 제품의 종단면도1 is a longitudinal cross-sectional view of a product according to the invention
* 도면중 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings
1,1' : 스텐레스 스틸 박판(foil) 2,2' : 접착제층1,1 ': stainless steel foil 2,2': adhesive layer
4 : 코어4: core
하드보드, 집섬보드, 포맥스 중에서 선택된 어느 하나를 코어(심재)(4)로 하여 상기 코어 1.6∼2.5mm 두께의 양면에, 통상의 금속이나 목재접착용 강력 접착제중 어느 한가지나 두가지 이상의 복합 접착제층(2)(2')을 매개로 하여 20∼100미크론 두께의 스텐레스 스틸 박판(foil)(1)(1')을 적층한 다음 통상의 판넬이나 합판 제조공정에서 사용되는 핫프레스(Hot press)를 이용하여 고압으로 압착성형하는 것으로 구성된다.상기에서 복합적착제층(2)(2')에 사용되는 접착제로는 에폭시 수지계 접착제, 우레탄계 접착제, PVC계 접착제, 에틸렌 비닐아세테이트계 접착제와 같은 통상의 목재나 금속제용 접착제 중에서 선택된 한가지 또는 2가지 이상의 복합 접착제(2)(2')를 매개로하여 적층한 것이다.Any one selected from hard board, gypsum board and Formax as a core (core material) 4 on both sides of the core 1.6-2.5mm thick, any one of the usual metal or wood adhesive strong adhesive or two or more composite adhesive layer (2) A hot press used in a normal panel or plywood manufacturing process after laminating 20 to 100 micron thick stainless steel foils (1) and 1 'via (2'). The adhesive used for the composite adhesive layer (2) (2 ') above is conventional adhesives such as epoxy resin adhesives, urethane adhesives, PVC adhesives, and ethylene vinyl acetate adhesives. Laminated by one or two or more composite adhesives (2) (2 ') selected from wood or metal adhesives.
이상과같이 구성되는 본 발명 PCB 홀가공용 백업보드는 기존의 백업보드용 코어(4)의 양면에 열전도율(열흡수율)이 우수한 스텐레스 스틸 박판(1)(1')을 접착제(2)(2')로 접착한 다음 고압으로 압착하여 성형하므로서 홀가공(천공)시에 비트에서 발생되는 열을 단시간에 분산, 제거시키게되어 비트의 연속적인 가공이 가능하게되고 날로 가볍고 적으면서 짧고 얇아지고 있는 PCB를 드릴가공(홀천공)시에도 강력한 접착력에 의하여 층분열이 없이 정밀하고 미세한 가공이 가능하면서 과열 발생이나 휨현상이 없이 분당 50,000rpm내지 130,000rpm의 고속 회전으로 홀을 가공할 수 있는 장점이 있는 것이다.In the above-described PCB hole processing backup board of the present invention, the stainless steel sheet (1) (1 ') having excellent thermal conductivity (heat absorption) on both sides of the core (4) of the existing backup board is adhesive (2) (2'). By bonding to high pressure and then molding by high pressure to disperse and remove heat generated from the bit in a short time during the hole drilling (perforation) to enable continuous processing of the bit and to make the PCB thin and short and thin. Even when drilling (hole drilling), it has the advantage of being able to process holes at high speeds of 50,000rpm to 130,000rpm per minute without overheating or warping, while enabling precise and fine processing without delamination by strong adhesive force.
본 발명에 의해 제조된 PCB 홀가공용 백업보드는 홀천공(가공)시에 휨현상, 고열 발생현상이 없고 비트의 마모가 적으면서도 정밀하고 정확하면서 고속으로 단시간에 많은 양의 홀가공을 할 수 있는 효과가 있다.The PCB board backing board manufactured by the present invention has the effect of being able to perform a large amount of hole processing in a short time at high speed with precision, accuracy and low warpage, high heat generation and little bit wear during hole drilling (machining). There is.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2002-0014912A KR100452278B1 (en) | 2002-03-20 | 2002-03-20 | Backup board for punching holes of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2002-0014912A KR100452278B1 (en) | 2002-03-20 | 2002-03-20 | Backup board for punching holes of printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20020026237A KR20020026237A (en) | 2002-04-06 |
| KR100452278B1 true KR100452278B1 (en) | 2004-10-12 |
Family
ID=19719914
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-2002-0014912A KR100452278B1 (en) | 2002-03-20 | 2002-03-20 | Backup board for punching holes of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR100452278B1 (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02183597A (en) * | 1989-01-09 | 1990-07-18 | Nec Corp | Manufacture of multilayer printed circuit board |
| JPH09216198A (en) * | 1996-02-08 | 1997-08-19 | Showa Alum Corp | Entry board for small bore processing |
| US5961255A (en) * | 1996-07-30 | 1999-10-05 | Systems Division Incorporated | Entry overlay sheet and method for drilling holes |
| JPH11277499A (en) * | 1998-03-31 | 1999-10-12 | Showa Alum Corp | Backup board for printed wiring board |
| KR20020074908A (en) * | 2001-03-22 | 2002-10-04 | 디에스테크널러지(주) | The hole making method and its device on the MLB substrade in the process of hole making |
-
2002
- 2002-03-20 KR KR10-2002-0014912A patent/KR100452278B1/en not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02183597A (en) * | 1989-01-09 | 1990-07-18 | Nec Corp | Manufacture of multilayer printed circuit board |
| JPH09216198A (en) * | 1996-02-08 | 1997-08-19 | Showa Alum Corp | Entry board for small bore processing |
| US5961255A (en) * | 1996-07-30 | 1999-10-05 | Systems Division Incorporated | Entry overlay sheet and method for drilling holes |
| JPH11277499A (en) * | 1998-03-31 | 1999-10-12 | Showa Alum Corp | Backup board for printed wiring board |
| KR20020074908A (en) * | 2001-03-22 | 2002-10-04 | 디에스테크널러지(주) | The hole making method and its device on the MLB substrade in the process of hole making |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20020026237A (en) | 2002-04-06 |
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