JP2846759B2 - Multilayer printed wiring board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer printed wiring board having a plurality of inner layers and a power supply layer and a ground layer as a plurality of inner layers, and to produce manufacturing information of the multilayer printed wiring board. The present invention relates to a manufacturing information creating apparatus and a wiring pattern cutting method for cutting a wiring pattern of the multilayer printed wiring board.

[0002]

2. Description of the Related Art Conventionally, when a logical change or the like occurs in a multilayer printed wiring board after being manufactured and it becomes necessary to cut a wiring pattern, the cutting is performed by either an outer layer pattern cutting or an inner layer pattern cutting. I have.

In the outer layer pattern cutting, a target pattern is cut by searching for a portion where the pattern to be cut is drawn out to the outer layer, and shaving the portion with a cutting jig such as a cutter. Also, in the inner layer pattern cut, when there is no place where the pattern to be cut is drawn out to the outer layer and the pattern wired in the inner layer must be cut, a through via hole connected to the pattern to be cut is searched for, drill etc. The pattern cutting is performed by cutting the electrical connection of the via hole by making a through hole with a hole making jig (hereinafter, this method is referred to as via hole destruction). At this time, as shown in FIGS. 8 and 9,
If a through via hole that can be used for pattern cutting is not found, the printed wiring board is cut in order from the outer layer 14a with a drilling jig such as a drill to cut the target pattern 17 (hereinafter, this cutting method will be referred to as a cutting method). Call it boring). In addition, as for the method of cutting the wiring, refer to
2696, JP-A-62-293380 and JP-A-62-247664.

[0004]

However, in such a conventional technique, when the inner layer pattern is cut,
When the power supply layer 15 or the earth layer 16 is cut between the outer layer 14a and the layer having the pattern 17 to be cut by a drill or the like when there is no penetrating via hole capable of breaking the via hole and the outer layer 14a and the layer having the pattern 17 to be cut. However, there is a problem that chips of the conductive material may be diffused into the through-hole formed by the drill, causing a short circuit and causing a burnout accident.

The present invention has been made in view of such a conventional problem. When cutting an inner wiring pattern, a conductive layer for forming a power supply layer or an earth layer even when there is no through via hole. A multilayer printed wiring board that does not cause a short circuit due to cutting of a material and does not cause a burnout accident, a manufacturing information creating device that creates manufacturing information of the multilayer printed wiring board, and a wiring pattern that cuts a wiring pattern of the multilayer printed wiring board. It is intended to provide a cutting method.

[0006]

To achieve the above object, a multilayer printed wiring board comprises a power supply layer and an earth layer.
A conductive material is not provided in a portion of at least one layer on an extension of the non-penetrating via hole, and a clearance land having a diameter larger than the diameter of the non-penetrating via hole is provided. It is.

Another multi-layer printed wiring board for achieving the above object is a power supply layer and an earth layer, at least one of which is arranged in a layer thickness direction from a predetermined position of a wiring pattern formed in an inner layer. A conductive land is not provided in a portion having the imaginary line on the opposite side , and a clearance land having a diameter larger than the width of the wiring pattern is provided ;
On an imaginary line extending in the thickness direction from the center of the strand,
The center position of the clearance land
It is characterized in that a stamp is formed .

Here, it is preferable that the clearance land is provided in both the power supply layer and the ground layer .

[0009]

[Function] If there is no place where the pattern to be cut is pulled out to the outer layer and the pattern wired in the inner layer must be cut, the worker who cuts the wiring pattern needs to set the position of the clearance land for cutting the wiring pattern. Make a hole. At this time, if a mark indicating the center position of the clearance land is formed on the multilayer printed wiring board at a position visible from the outside on an imaginary line extending in the layer thickness direction from the center of the clearance land, the position of this mark is set. Drill holes in the layer thickness direction.

When a clearance land is formed on only one of the power supply layer and the earth layer, the hole is formed so that the hole is not formed on the other layer. Further, when clearance lands are formed on both the power supply layer and the earth layer, the holes are formed without taking care not to make holes in the other layer. That is, when clearance lands are formed in both layers, drilling can be performed without considering the position of a drilling jig such as a drill in the layer thickness direction. Therefore, in this case, a through-hole may be formed at a corresponding position of the clearance land so as to facilitate drilling.

Since the clearance lands are formed on the imaginary line extending in the thickness direction from the predetermined position of the pattern to be cut in the inner layer, the power supply layer and the ground can be formed even if the above-described perforation is performed. The conductive material forming the layer does not become chips. Therefore, even when there is no through via hole when cutting the wiring pattern of the inner layer, it is possible to prevent the occurrence of a short circuit due to the cutting of the conductive material forming the power supply layer or the ground layer.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment according to the present invention will be described below with reference to FIGS. First, a manufacturing information creation device for a power supply layer and an earth layer of a multilayer printed wiring board according to an embodiment of the present invention will be described with reference to FIGS.

As shown in FIG. 6, the manufacturing information creating apparatus of this embodiment stores an input device 1 for inputting basic information for creating manufacturing information of a power supply layer and an earth layer, and stores the input basic information and the like. The storage device 4 includes a computing device 2 that creates manufacturing information based on the input basic information, and an output device 3 that outputs the created manufacturing information. The input device 1 for inputting the basic information may be a keyboard, but here, it is assumed that the input device 1 is an external storage device such as a floppy disk device in which the basic information is stored.

FIG. 7 shows a functional configuration of the information creating apparatus main body 5 composed of the arithmetic unit 2 and the storage unit 4.
It will be described based on. The information generating apparatus main body 5 includes a non-penetrating via-hole position information input unit 102 for acquiring the non-penetrating via-hole position information 101, a non-penetrating via-hole position information storage unit 103 for storing this information, a power supply layer / earth layer area. A power / ground region information input unit 105 for acquiring information 104; a power layer / ground region information storage unit 106 for storing this information; an inner layer pattern position information input unit 108 for acquiring inner layer position information 107; The position of the clearance land to be formed on the power supply layer and / or the earth layer is determined based on the inner layer pattern position information storage unit 109 storing the position information, the non-penetrating via hole position information 101, and the power supply layer / earth layer area information 104. , The power layer / earth layer region information 104 and the inner layer pattern position information 107 And / or a second determining unit 111 that determines the position of the clearance land to be formed on the ground layer, and creates power / ground layer manufacturing information based on the determined clearance land information, and outputs this to the output device 3. A power supply layer / earth layer manufacturing information output unit 112;

Next, creation of power supply layer / earth layer manufacturing information of a printed wiring board will be described. First, the non-penetrating via hole position information 101, the power supply layer / earth region information 104, and the inner layer pattern position information 107, which are basic information, are called from the input device 1 which is an external storage device, and are input to the information generating device main body 5. .

Here, the basic information to be input will be described. The non-penetrating via hole position information 101 includes the position of the layer where the non-penetrating via hole is formed, the position of the non-penetrating via hole on this layer, and the like. The position of the non-penetrating via hole on the layer is given by, for example, XY coordinates. In addition, power supply layer / earth layer area information 10
Reference numeral 4 denotes the position of the power supply layer and the earth layer in the thickness direction of the printed wiring board, the position of the area where the conductive material is actually applied in these layers, the position of the thermal pad, and the like. Also, the inner layer pattern position information 107
Is composed of the starting position and the ending position of the wiring pattern, the pattern width, and the like. The inner layer pattern position information 107 is provided for each inner layer on which a wiring pattern is formed.

The information 101, 104, and 107 input from the input device 1 to the information generating device main body 5 are acquired by the corresponding input units 102, 105, and 108, and stored in the storage units 103, 106, and 109, respectively. You.

The first determination unit 110 determines the non-penetrating via hole position information 101 and the power supply layer / earth layer area information 104.
Thus, the position of the clearance land formed on the power supply layer and / or the ground layer is determined. Here, the determination of the position of the clearance land by the first determination unit 110 will be specifically described with reference to FIGS. 1 and 2. In addition,
In FIG. 1, the printed wiring board is drawn by omitting an insulating portion of each layer so that the structure inside the printed wiring board becomes clear.

For example, as shown in FIGS. 1 and 2, when it is desired to cut the wiring pattern 17 connecting the pin 11 of the component 10 and the pin 13 of the component 12, there is no through via hole crossing the wiring pattern 17. , If there is a non-penetrating via hole 19,
The center coordinates of the clearance lands 22 and 23 are determined by using the portions of the power supply layer 15 and the earth layer 16 on the extension lines of the clearance lands 22 and 23 as clearance lands 22 and 23.

In the power supply layer / earth layer manufacturing information output unit 112, the center coordinates of the determined clearance lands 22, 23 and the predetermined clearance lands 22, 23 are determined.
Clearance lands 22, 23 based on the diameter of
Is determined, and the positions and sizes of the clearance lands 22, 23 are output to the output device 3. The size of the predetermined clearance lands 22 and 23 is determined to be larger than the diameter of the non-penetrating via hole 19. From the power supply layer / ground layer manufacturing information output unit 112, the position of the power supply layer and the ground layer in the thickness direction of the printed wiring board, which is the power supply layer / ground layer information 104 input from the input device 1, and the thermal pad Are output.

On the other hand, in the second determining unit 111, the power supply layer
Earth layer area information 104 and inner layer pattern position information 107
Thus, the position of the clearance land formed on the power supply layer and / or the ground layer is determined. This position determination will be specifically described with reference to FIGS. 3 and 4 in the same manner as described above. For example, when it is desired to cut the wiring pattern 17 connecting the pin 11 of the component 10 and the pin 13 of the component 12, If there are no through-holes or non-through-holes crossing the wiring pattern 17, the power supply layer 15 and the ground layer 16 in the thickness direction of the printed wiring board are separated from the arbitrary points on the wiring pattern 17 by the clearance lands 22. , 23 as clearance land 22,
23 are determined.

In the power supply layer / earth layer manufacturing information output unit 112, the determined clearance lands 22,
The size of the clearance lands 22 and 23 is determined based on the center coordinates of the clearance lands 23 and the predetermined sizes of the clearance lands 22 and 23, and the clearance lands 2 and 23 are determined.
The positions and the sizes of 2, 23 are output to the output device 3.
The predetermined clearance lands 22 and 2
The size of 3 is set to a diameter larger than the width of the wiring pattern 17 to be cut.

FIGS. 1 and 2, FIGS. 3 and 4 are based on the power / ground layer manufacturing information thus created.
In the case where the printed wiring boards as shown in FIG. For example,
A printed wiring board as shown in FIGS. 1 and 2 is prepared,
When it is desired to cut the wiring pattern 17 formed on the inner layers 14 and 14 due to a logical change or the like, a through hole is drilled at the position of the clearance land 22 and the wiring pattern 17 is cut. At this time, the conductive materials of the power supply layer 15 and the ground layer 16 have clearance lands 22 and 23 at the drill penetration positions and are not cut by the drill. , Never short.

Also, when a printed wiring board as shown in FIGS. 3 and 4 is prepared and the wiring pattern 17 formed on the inner layer 14 is to be cut, the position of the clearance land 22 is drilled in the same manner as described above. Drill through holes,
The wiring pattern 17 is cut. Also at this time, as described above, since the conductive material of the power supply layer 15 and the ground layer 16 is not cut by the drill, there is no short circuit due to chips of the conductive material of the power supply layer 15 and the ground layer 16.

In the above-described embodiment, it is difficult to accurately grasp a position where a hole is to be drilled in order to cut the wiring pattern 17. Therefore, for example, as shown in FIG. 5, at the center of the clearance lands 22, 23,
By printing the mark 31 indicating the center such as “+”, the clearance land 2 can be formed when drilling.
The drill can be correctly positioned at the center positions of 2, 23, and the wiring pattern 17 can be cut without the power supply layer 15 and the ground layer 16 being short-circuited.
In this case, since the outer layer 14a is transparent, the clearance lands 22 and 23 themselves have symbols 31 indicating their centers.
Is printed, but if the outer layer is opaque,
It is necessary to print the center symbol on the outer layer.

In the above embodiment, the wiring pattern 1
At the time of cutting, the clearance lands 22 and 23 are provided on the power supply layer 15 and the earth layer 16 in consideration of forming a through hole by a drill.
In the case where a hole is drilled from the outer layer 14a side on which the 12 is mounted to the inner layer 14, there is no need to provide the clearance land 23 of the earth layer 16 since the hole is unnecessary. However, in such a case, it is necessary to accurately control the position of the drill in the thickness direction of the printed wiring board.
Clearance lands 22, 2 on both the ground layer 16
Preferably, 3 is provided.

[0027]

According to the present invention, it is necessary to cut the wiring pattern of the inner layer due to a logical change in the multi-layer printed wiring board after manufacture, and in this case, even if there is no through via hole, the power supply layer or There is no short circuit caused by cutting the conductive material forming the ground layer, and it is possible to prevent the multilayer printed wiring board from being burned.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing a structure of a multilayer printed wiring board according to a first embodiment of the present invention.

FIG. 2 is a sectional view taken along line II-II in FIG.

FIG. 3 is an explanatory diagram showing a structure of a multilayer printed wiring board according to a second embodiment of the present invention.

FIG. 4 is a sectional view taken along line IV-IV in FIG. 3;

FIG. 5 is a perspective view of a power supply layer and an earth layer according to an embodiment of the present invention.

FIG. 6 is a block diagram of an apparatus for creating manufacturing information of a power supply layer and an earth layer of a multilayer printed wiring board according to one embodiment of the present invention.

FIG. 7 is a functional block diagram of a main body of a manufacturing information creating apparatus for a power supply layer and an earth layer of a multilayer printed wiring board according to one embodiment of the present invention.

FIG. 8 is an explanatory diagram showing a structure of a conventional multilayer printed wiring board.

FIG. 9 is an explanatory view showing the structure of another conventional multilayer printed wiring board.

[Description of Signs] 1 ... input device, 2 ... arithmetic device, 3 ... output device, 4 ... storage device, 5 ... power supply layer / ground layer manufacturing information production device body, 1
0, 12: printed wiring board mounted parts, 11, 13: pins of printed wiring board mounted parts, 14: inner layer, 15: power supply layer, 16: ground layer, 17: wiring pattern, 19: non-penetrating via hole, 22, 23 ... clearance land, 3
1 ... mark.

──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Hideyuki Tanahashi 216 Totsuka-cho, Totsuka-ku, Yokohama-shi, Kanagawa Pref. JP-A-2-222196 (JP, A) JP-A-52-53270 (JP, A) JP-A-5-67884 (JP, A) JP-A-63-108679 (JP, U) (58) Fields investigated (Int) .Cl. ⁶ , DB name) H05K 3/46

Claims (5)

(57) [Claims] A plurality of inner layers, a power supply layer and a ground layer as the plurality of inner layers, and a wiring pattern of one of the plurality of inner layers and a wiring pattern of another inner layer are different from each other. In a multilayer printed wiring board electrically connected via a non-penetrating via hole, a portion of at least one of the power supply layer and the ground layer on an extension of the non-penetrating via hole is electrically conductive. A multilayer printed wiring board, wherein no material is provided and a clearance land having a diameter larger than the diameter of the non-penetrating via hole is provided. 2. A multilayer printed wiring board having a plurality of inner layers and a power supply layer and a ground layer as the plurality of inner layers, wherein at least one of the power supply layer and the ground layer is provided. In a portion of the wiring pattern formed in the inner layer on a virtual line extending in a layer thickness direction from a predetermined position, no conductive material is provided, and a clearance land having a diameter larger than the width of the wiring pattern is provided. Having a virtual direction from the center of the clearance land in the thickness direction.
Place the clearance land on the line at a position visible from the outside.
A multi-layer printed wiring board , wherein a mark indicating the center position of the multi-layer printed wiring board is formed . 3. The multilayer printed wiring board according to claim 1, wherein the clearance lands are provided on both the power supply layer and the ground layer. In 4. virtual line toward the thickness direction from the center of the clearance lands, in a position visible from the outside, according to claim 1, wherein a mark indicating the center position of the clearance lands are formed Multilayer printed wiring board. 5. A multi-layer printed wiring board manufacturing information creating device having a plurality of inner layers and a power supply layer and an earth layer as the plurality of inner layers, wherein: power supply area information of the power supply layer; Acquiring means for acquiring layer ground area information, non-penetrating via hole position information, and wiring pattern information of the inner layer; position information of the non-penetrating via hole, power source area information of the power supply layer, ground of the ground layer Based on the region information, at least one of the power supply layer and the ground layer on the extension of the non-penetrating via hole is provided with no conductive material, and has a diameter larger than the diameter of the non-penetrating via hole. To create area information of clearance land with large size
Clearance land information creating means, based on the power supply area information of the power supply layer, the ground area information of the ground layer, and the wiring pattern information of the inner layer, at least one of the power supply layer and the ground layer. , the portion having the virtual line toward the layer thickness direction from the predetermined position of the wiring patterns formed on the inner layer, the conductive material is set Kerarezu and area information clearance lands of greater diameter than the width of the wiring pattern, And a second clearance land information creating means for creating a multi-layer printed circuit board manufacturing information creating apparatus.