JPH1051084A - Split type printed wiring board and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To punch splitting sits through the machining of one process, even when the splitting slits are long and have complex curved shapes, by providing the shapes comprising a plurality of continuous circular arcs in some portions of the constituent sides of the splitting slits. SOLUTION: In some predetermined places within outlines 11 of a rectangular board 10 having bonded copper foils to its front and rear surfaces, through holes 12 and lead-wire inserting holes 13 are bored to machine simultaneously separating perforations 14 (splitting slits 14) in some predetermined places along one-dot chain lines 11 present on right and left sides of the regions of the outlines 11 of the printed wiring board 10. Concurrently, in arbitrary places easy to generate stresses in the case of punching the board 10 which are present in some portions of the constituent sides of the splitting slits 14, shapes 15a comprising continuous circular arcs, e.g. five ones, are formed. Since the long splitting slits 14 can be substantially made short by the shapes 15a, stresses when splitting the board 10 into plural ones are eliminated to make the punching of the board 10 by the machining of one process possible, obtaining the enough portions to press down a metallic mold for the punching.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a divided printed wiring board capable of forming a plurality of printed wiring boards from one substrate, and a method of manufacturing the same.

[0002]

2. Description of the Related Art A conventional method of manufacturing a split type printed wiring board will be described with reference to FIGS. First, as shown in FIG. 4A, through holes are formed at predetermined positions within a plurality of outlines 31 of a printed wiring board, which are formed by dashed lines, on a rectangular substrate 30 having copper foils adhered to both front and back surfaces. The hole 32 and the lead insertion hole 33 are drilled by an NC drilling machine or a laser drilling device. At the same time as this drilling step, a perforated hole 34 for separation is formed at a predetermined position along the alternate long and short dash line 31. Next, after forming a wiring pattern using an etching resist by a photographic method or a screen printing method at least in the region of the printed wiring board outer line 31, an etching resist that removes the copper foil other than the wiring portion by etching and covers the wiring portion Is removed to form the wiring pattern 35 shown in FIG. Thereafter, as shown in FIG.
The solder resist 36 is coated on the surface of the substrate other than the portion to be soldered 5.

[0005] Next, a conductive paste is filled into the through holes 32 and cured to connect the front and back conductor patterns.
Thereafter, the dashed line 31 excluding the perforated hole 34 is removed.
A slit 37 for division is formed by press working along the line, thereby forming a divided printed wiring board capable of forming a plurality of printed wiring boards 38 from a single substrate 30 as shown in FIG. Can be configured.

[0004]

However, in the above-mentioned conventional method of manufacturing a split-type printed wiring board, there is no problem when the length of the split slit formed by press working is short. If the length of the slit is long, or if the external shape of the printed wiring board is complicatedly curved according to the shape of the equipment to be mounted, the slit for division can not be formed by one press working, It is necessary to press work in two or more times. This is because the press of the mold is not enough, so if you try to cut out the slit for splitting by one press work, stress will be applied to the substrate, which will cause cracking and chipping, and the cutting of slit for splitting can not be done well Because. Therefore,
A relatively long slit 37 for division as shown in FIG.
Is formed, first, a left half slit 37 for the left printed wiring board 38 is punched out, and then
It is necessary to punch out the right half slits 37 for the right printed wiring board 38. However, in this method, punching of the outer shape and the slit portion is performed in two steps, and two sets of dies are required, resulting in an increase in cost.

The present invention has been made in view of the above points, and even if the length of the dividing slit is long and the shape is complicatedly curved, the dividing slit can be processed in one step. It is an object of the present invention to provide a method for manufacturing a printed wiring board and a divided printed wiring board obtained from the method.

[0006]

According to the present invention, there is provided a divided printed wiring board characterized in that a part of a side constituting a dividing slit has a shape in which a plurality of arcs are continuous. Is provided. The present invention also provides a method for processing a plurality of printed wiring boards formed on a substrate together with through holes, lead insertion holes, and the like, and separating the perforations at predetermined locations along the outer shape of the printed wiring board. It is characterized in that the holes are processed in the same step. In the present invention, the point where the leading hole of the dividing slit is formed is an arbitrary point where stress is likely to be generated when press stamping is performed in one step. In the present invention, the leading hole of the dividing slit is formed by continuously processing a plurality of holes in a line.

In the present invention, when the dividing slit is punched along the outline of the printed wiring board, the dividing hole is previously passed through an arbitrary portion where stress is likely to be generated when the cutting is performed in one step. By forming the holes and the lead insertion holes at the time of processing, the long splitting slits are substantially shortened, and punching can be performed by one press working. Further, by forming the leading hole of the dividing slit in a place where stress is likely to occur when punching is performed in one step, cracking or chipping of the substrate due to stress can be prevented.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method for manufacturing a printed wiring board according to the present invention will be described with reference to FIGS. First, as shown in FIG. 1 (A), on a rectangular substrate 10 having copper foils adhered to the front and back surfaces, a predetermined position within an outline 11 of a printed wiring board formed by a plurality of rectangular dashed lines. The through hole 12 and the lead insertion hole 13 are drilled by an NC drilling machine or a laser drilling device. Simultaneously with this drilling step, a predetermined position along the alternate long and short dash line 11 located on the left and right of the area of the outer shape 11 of the printed wiring board. A perforation hole 14 for separation is formed at a location, and any location where stress is likely to occur when press stamping is performed in one step, for example, each printed wiring board outline 1
A plurality of divisional holes 15 for facilitating one-step punching are formed in an intermediate portion along the dashed-dotted line 11 in the longitudinal direction of one region continuously in a line by an NC drilling machine or a laser drilling device. . When processing the leading holes 15 of this continuous dividing slit, first, as shown in FIG. 3A, the leading holes 15A at both ends are processed, and then, as shown in FIG. The hole 15B is formed in the middle of the hole 15A, and finally, the hole 15C is formed between the hole 15B at the center and the hole 15A at both ends as shown in FIG. 3 (C). .

Next, at least the printed wiring board outline 1
After a wiring pattern is formed in the region 1 by an etching resist by a photographic method or a screen printing method, the copper foil other than the wiring portion is removed by etching, and the etching resist covering the remaining wiring portion is removed. The wiring pattern 16 shown in FIG. 1B is formed. afterwards,
As shown in FIG. 2A, a solder resist 17 is coated on the surface of the substrate other than the portion to be soldered to the wiring pattern 16.

Next, a conductive paste is filled into the through holes 12 by a screen printing method or a dispenser method and cured, and the conductive patterns on the front and back sides are connected with the conductive paste. Thereafter, a slit 18 for division is formed by press working along the outline 11 of the printed wiring board excluding the portion of the perforation hole 14 and the leading hole 15 of the slit for division. As shown in the drawing, a divided printed wiring board capable of forming a plurality of printed wiring boards 19 from one substrate 10 is formed. As is apparent from the drawing, the split-type printed wiring board shown in FIG. 2B has a shape 15a in which five arcs are continuous on a part of a side forming a splitting slit formed along the outline. Have. As described above, a part of the dividing slit becomes somewhat uneven, and the unevenness remains on the printed board after the division.
Since the portion is inside the extension of 1, the portion does not hinder the accommodation of the printed wiring board in a case or the like. When the slit portion is a straight line, the arc is preferably an arc shape close to a straight line, and when the slit portion is a curved line, it is preferably a smooth arc along the curve.

According to such an embodiment, when the dividing slit 18 is punched along the outer shape line 11 of the printed wiring board, the slit 18 is formed at an arbitrary position where stress is likely to be generated when the cutting is performed in one step. , Split slit tip hole 15
NC beforehand through hole 12 and lead insertion hole 13 etc.
By forming it at the time of drilling or laser drilling, the long dividing slit can be substantially shortened. Therefore, as shown in FIG. A sufficient portion for pressing the mold and the upper mold can be obtained, punching can be performed by one press working, and the cost can be reduced because only one mold is required. In addition, since the leading hole 15 of the dividing slit is formed at a location where stress is likely to occur when punching is performed in one step, cracking or chipping of the substrate due to stress can be prevented beforehand, and product yield can be reduced. Can be improved. Further, by forming the leading hole 15 of the dividing slit into a structure in which a plurality of holes are continuously formed in a line, the through hole 12 and the lead insertion hole 13 and the like can be used for NC drilling or laser drilling. The processing of the leading hole 15 of the dividing slit is facilitated.

In the above-described embodiment, the case where a rectangular printed wiring board is formed has been described. However, the present invention is not limited to this. The present invention can be similarly applied to a dividing slit having a complicatedly curved outer shape. Also, in the above embodiment, after processing the leading hole of the dividing slit,
Although a method using a conductive paste has been described as a method of performing a conductive treatment on a through hole, the present invention is not limited to this.
For example, it is also possible to use a double-sided plated through-hole forming method in which after forming the through-hole, the entire plating is performed by a panel plating method, and then patterning is performed, and then a solder resist is coated. Further, the method of processing the leading hole 15 of the dividing slit is not limited to the method described in the above embodiment, and the hole may be continuously drilled. Further, the method of the present invention is not limited to a double-sided copper-clad board, but can be similarly applied to a multilayer printed wiring board and a single-sided copper-clad board. In the case of a multilayer printed wiring board, not shown, after lapping the prepreg and the copper foil on the inner layer board,
The front holes of the dividing slits may be machined together with the perforations for separation, through-holes, and the like.

[0013]

As is apparent from the above description, according to the present invention, when the dividing slit is punched along the one-dot chain line in the printed wiring board forming area, stress is generated when trying to punch in one step. By forming the dividing tip hole in advance at an arbitrary location at the time of processing the through hole and the lead insertion hole, etc., the long dividing slit can be substantially shortened. In addition to this, the cost can be reduced because only one mold is required. In addition, since the dividing hole is formed at a location where stress is likely to be generated when punching is performed in one step, cracking or chipping of the substrate due to stress can be prevented beforehand, and product yield can be improved. Further, by forming the dividing front hole into a structure in which a plurality of holes are continuously formed in a line, it is easy to form the dividing front hole when performing NC processing or laser processing on through holes and lead insertion holes. This has the effect of Further, since the dividing front hole is formed in the same step as the processing step of the separation perforation, the through hole, and the lead insertion hole, the step can be efficiently performed without increasing the number of steps.

[Brief description of the drawings]

FIGS. 1A and 1B are explanatory views showing a procedure of a manufacturing process of a printed wiring board according to an embodiment of the present invention.

FIGS. 2A and 2B are explanatory views showing a procedure of a manufacturing process of a printed wiring board according to the embodiment of the present invention.

FIGS. 3 (A) to 3 (C) are explanatory views showing a processing step of a dividing tip hole in the embodiment of the present invention.

FIGS. 4A and 4B are explanatory views showing a conventional manufacturing process of a printed wiring board.

FIGS. 5A and 5B are explanatory views showing a conventional process for manufacturing a printed wiring board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Substrate 12 Through hole 13 Lead insertion hole 14 Perforation hole 15 Dividing tip hole 16 Wiring pattern 17 Solder resist 18 Printed wiring board

Claims (4)

[Claims] 1. A part of a side constituting a dividing slit,
A divided printed wiring board, wherein a plurality of arcs have a continuous shape. 2. A plurality of printed wiring boards are formed on a substrate together with through holes, lead insertion holes, and the like, and a dividing slit front hole is formed at a predetermined position along the outline of the printed wiring board. 2. The method according to claim 1, wherein the steps are processed in the same step. 3. The manufacturing method of a split-type printed wiring board according to claim 2, wherein a location where the leading hole of the splitting slit is formed is an arbitrary location where stress is likely to be generated when press stamping is performed in one step. Method. 4. The method for manufacturing a split-type printed wiring board according to claim 2, wherein the leading holes of the splitting slits are formed by continuously processing a plurality of holes in a line.