NO20020323L - Inspeksjonsanordning for komponenter - Google Patents

Inspeksjonsanordning for komponenter

Info

Publication number
NO20020323L
NO20020323L NO20020323A NO20020323A NO20020323L NO 20020323 L NO20020323 L NO 20020323L NO 20020323 A NO20020323 A NO 20020323A NO 20020323 A NO20020323 A NO 20020323A NO 20020323 L NO20020323 L NO 20020323L
Authority
NO
Norway
Prior art keywords
inspection device
video camera
component inspection
component
different
Prior art date
Application number
NO20020323A
Other languages
English (en)
Other versions
NO20020323D0 (no
Inventor
Peter Bollinger
Original Assignee
Merten Kg Pulsotronic
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Merten Kg Pulsotronic filed Critical Merten Kg Pulsotronic
Publication of NO20020323D0 publication Critical patent/NO20020323D0/no
Publication of NO20020323L publication Critical patent/NO20020323L/no

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Adjustment And Processing Of Grains (AREA)
  • Beans For Foods Or Fodder (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Transplanting Machines (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
  • Closed-Circuit Television Systems (AREA)
  • Studio Devices (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
  • Ceramic Capacitors (AREA)
  • Sorting Of Articles (AREA)

Abstract

Komponentene (11) som skal undersøkes, blir holdt ved hjelp av undertrykk i en bæreanordning (10) og blir undersøkt ved hjelp av et videokamera. Arbeidsstykket blir registrert fra to forskjellige sider via forskjellige strålebaner (25, 26) ved å benytte det samme videokamera, hvor to bilder av det samme objekt blir reprodusert fra forskjellige retninger og evaluert ved hjelp av bildebehandling. Det kan således bestemmes om komponenten (11) er intakt, og spesielt om dens ben (13) er til stede og på riktig plass.
NO20020323A 1999-07-23 2002-01-21 Inspeksjonsanordning for komponenter NO20020323L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19934619A DE19934619A1 (de) 1999-07-23 1999-07-23 Inspektionsvorrichtung für Bauteile
PCT/EP2000/006117 WO2001008461A1 (de) 1999-07-23 2000-06-30 Inspektionsvorrichtung für bauteile

Publications (2)

Publication Number Publication Date
NO20020323D0 NO20020323D0 (no) 2002-01-21
NO20020323L true NO20020323L (no) 2002-03-19

Family

ID=7915831

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20020323A NO20020323L (no) 1999-07-23 2002-01-21 Inspeksjonsanordning for komponenter

Country Status (17)

Country Link
US (1) US7019771B1 (no)
EP (1) EP1198979B1 (no)
JP (1) JP4415155B2 (no)
KR (1) KR20020024308A (no)
CN (1) CN1364403A (no)
AT (1) ATE233988T1 (no)
AU (1) AU5535800A (no)
CA (1) CA2380276A1 (no)
CZ (1) CZ2002256A3 (no)
DE (2) DE19934619A1 (no)
HK (1) HK1048044B (no)
IL (2) IL147678A0 (no)
MY (1) MY122774A (no)
NO (1) NO20020323L (no)
SK (1) SK842002A3 (no)
TW (1) TW508984B (no)
WO (1) WO2001008461A1 (no)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004008082A1 (de) * 2004-02-19 2005-09-08 Marconi Communications Gmbh Verfahren zum Bestücken eines Schaltungsträgers
JP4652883B2 (ja) * 2005-04-28 2011-03-16 日本発條株式会社 測定装置及び測定方法
US20080141795A1 (en) * 2006-12-13 2008-06-19 Gagnon Daniel F Micro-surface inspection tool
JP5094428B2 (ja) * 2008-01-09 2012-12-12 ヤマハ発動機株式会社 部品認識装置および実装機
JP5094534B2 (ja) * 2008-04-30 2012-12-12 富士機械製造株式会社 電子部品の実装装置
JP4897076B2 (ja) * 2010-08-19 2012-03-14 日本発條株式会社 測定装置及び測定方法
JP2012042436A (ja) * 2010-08-23 2012-03-01 Hitachi High-Technologies Corp Ｆｐｄモジュールの位置決めマーク認識装置及びｆｐｄモジュールの組立装置
DE102010053912B4 (de) * 2010-12-09 2013-01-31 Mühlbauer Ag Optische Untersuchungseinrichtung und optisches Untersuchungsverfahren
JP5963500B2 (ja) * 2012-03-29 2016-08-03 ヤマハ発動機株式会社 電子部品装着装置
JP5954757B2 (ja) * 2015-01-09 2016-07-20 上野精機株式会社 外観検査装置
JP6786593B2 (ja) * 2015-08-26 2020-11-18 アーベーベー・シュバイツ・アーゲーＡＢＢ Ｓｃｈｗｅｉｚ ＡＧ 多視点による対象検査装置及び方法
CH711570B1 (de) 2015-09-28 2019-02-15 Besi Switzerland Ag Vorrichtung für die Montage von Bauelementen auf einem Substrat.

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4914513A (en) * 1988-08-02 1990-04-03 Srtechnologies, Inc. Multi-vision component alignment system
JPH03203399A (ja) * 1989-12-29 1991-09-05 Matsushita Electric Ind Co Ltd 部品装着装置
US4959898A (en) * 1990-05-22 1990-10-02 Emhart Industries, Inc. Surface mount machine with lead coplanarity verifier
NL9100215A (nl) * 1991-02-07 1992-09-01 Asm Lithography Bv Inrichting voor het repeterend afbeelden van een maskerpatroon op een substraat.
SE515418C2 (sv) * 1994-10-12 2001-07-30 Mydata Automation Ab Metod och anordning att avbilda i en rad fasthållna komponenter för automatisk utvärdering av komponenternas lägen samt användning av en sådan anordning
JP3647146B2 (ja) * 1996-06-20 2005-05-11 松下電器産業株式会社 電子部品実装装置および電子部品実装方法
JPH10313197A (ja) * 1997-05-13 1998-11-24 Kiyoshi Matsumoto 表面実装用電子部品位置決め装置
AU8472898A (en) * 1997-06-30 1999-01-19 Semiconductor Technologies & Instruments, Inc. Method and apparatus for inspecting a workpiece
US6072898A (en) * 1998-01-16 2000-06-06 Beaty; Elwin M. Method and apparatus for three dimensional inspection of electronic components
DE19821800A1 (de) * 1998-05-15 1999-12-02 Foerderung Angewandter Informa Verfahren und Vorrichtung zum Prüfen von Seitensichten und Draufsicht von Objekten aus einer Sichtposition
US6410872B2 (en) * 1999-03-26 2002-06-25 Key Technology, Inc. Agricultural article inspection apparatus and method employing spectral manipulation to enhance detection contrast ratio
US6879390B1 (en) * 2000-08-10 2005-04-12 Kla-Tencor Technologies Corporation Multiple beam inspection apparatus and method
JP2003130808A (ja) * 2001-10-29 2003-05-08 Hitachi Ltd 欠陥検査方法及びその装置
US6813016B2 (en) * 2002-03-15 2004-11-02 Ppt Vision, Inc. Co-planarity and top-down examination method and optical module for electronic leaded components

Also Published As

Publication number Publication date
IL147678A (en) 2006-07-05
US7019771B1 (en) 2006-03-28
DE19934619A1 (de) 2001-01-25
CZ2002256A3 (cs) 2002-06-12
SK842002A3 (en) 2002-10-08
EP1198979A1 (de) 2002-04-24
ATE233988T1 (de) 2003-03-15
DE50001407D1 (de) 2003-04-10
NO20020323D0 (no) 2002-01-21
WO2001008461A1 (de) 2001-02-01
AU5535800A (en) 2001-02-13
KR20020024308A (ko) 2002-03-29
HK1048044A1 (en) 2003-03-14
JP4415155B2 (ja) 2010-02-17
IL147678A0 (en) 2002-08-14
HK1048044B (zh) 2003-07-18
EP1198979B1 (de) 2003-03-05
TW508984B (en) 2002-11-01
CA2380276A1 (en) 2001-02-01
JP2003517723A (ja) 2003-05-27
CN1364403A (zh) 2002-08-14
MY122774A (en) 2006-05-31

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Legal Events

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FC2A Withdrawal, rejection or dismissal of laid open patent application