TW200608034A - Circuit board inspecting apparatus and circuit board inspecting method - Google Patents
Circuit board inspecting apparatus and circuit board inspecting methodInfo
- Publication number
- TW200608034A TW200608034A TW094117184A TW94117184A TW200608034A TW 200608034 A TW200608034 A TW 200608034A TW 094117184 A TW094117184 A TW 094117184A TW 94117184 A TW94117184 A TW 94117184A TW 200608034 A TW200608034 A TW 200608034A
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- board
- middle holding
- inspected
- pin
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
- G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
A circuit board inspecting apparatus and a circuit board inspecting method are provided for performing highly reliable electrical inspection to an object to be inspected, or a circuit board to be inspected, even when the circuit board has a fine pitch microelectrode, and for efficiently aligning an inspection jig and the circuit board to be inspected. In a middle pin unit (31) between a circuit board side connector (21) and a tester side connector (41), a first insulating board (34) and a middle holding board (36) are fixed by a first supporting pin (33), a second insulating board (35) and a middle holding board (36) are fixed by a second supporting pin (37), and a first abutting and supporting position of the first supporting pin (33) to the middle holding board (36) and a second abutting and supporting position of the second supporting pin (37) to the middle holding board (36) are arranged at different positions on a middle holding board projection plane projected in a thickness direction of the middle holding board (36). Then, in the middle pin unit (31), an image pickup device, such as a CCD camera (91), is arranged and the inspection jig (11) and the circuit board (1) to be tested are aligned.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004159686 | 2004-05-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200608034A true TW200608034A (en) | 2006-03-01 |
Family
ID=35451003
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094117184A TW200608034A (en) | 2004-05-28 | 2005-05-25 | Circuit board inspecting apparatus and circuit board inspecting method |
Country Status (2)
Country | Link |
---|---|
TW (1) | TW200608034A (en) |
WO (1) | WO2005116670A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9703623B2 (en) | 2014-11-11 | 2017-07-11 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Adjusting the use of a chip/socket having a damaged pin |
JP2018136195A (en) * | 2017-02-22 | 2018-08-30 | 日置電機株式会社 | Probe device and measurement system |
TWI730828B (en) * | 2020-06-29 | 2021-06-11 | 群翊工業股份有限公司 | Plate frame width adjustment equipment and control method thereof |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3094779B2 (en) * | 1994-03-10 | 2000-10-03 | ジェイエスアール株式会社 | Circuit board inspection apparatus and inspection method |
JP2000266799A (en) * | 1999-03-15 | 2000-09-29 | Taiyo Kogyo Kk | Printed circuit board inspection device |
JP2002005980A (en) * | 2000-06-16 | 2002-01-09 | Toppan Printing Co Ltd | Printed wiring board inspection jig, inspection device, and positioning method between printed wiring board and upper/lower inspection jig |
-
2005
- 2005-05-25 TW TW094117184A patent/TW200608034A/en unknown
- 2005-05-25 WO PCT/JP2005/009571 patent/WO2005116670A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2005116670A1 (en) | 2005-12-08 |
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