TW200608034A - Circuit board inspecting apparatus and circuit board inspecting method - Google Patents

Circuit board inspecting apparatus and circuit board inspecting method

Info

Publication number
TW200608034A
TW200608034A TW094117184A TW94117184A TW200608034A TW 200608034 A TW200608034 A TW 200608034A TW 094117184 A TW094117184 A TW 094117184A TW 94117184 A TW94117184 A TW 94117184A TW 200608034 A TW200608034 A TW 200608034A
Authority
TW
Taiwan
Prior art keywords
circuit board
board
middle holding
inspected
pin
Prior art date
Application number
TW094117184A
Other languages
Chinese (zh)
Inventor
Kiyoshi Kimura
Sugiro Shimoda
Satoshi Suzuki
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200608034A publication Critical patent/TW200608034A/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

A circuit board inspecting apparatus and a circuit board inspecting method are provided for performing highly reliable electrical inspection to an object to be inspected, or a circuit board to be inspected, even when the circuit board has a fine pitch microelectrode, and for efficiently aligning an inspection jig and the circuit board to be inspected. In a middle pin unit (31) between a circuit board side connector (21) and a tester side connector (41), a first insulating board (34) and a middle holding board (36) are fixed by a first supporting pin (33), a second insulating board (35) and a middle holding board (36) are fixed by a second supporting pin (37), and a first abutting and supporting position of the first supporting pin (33) to the middle holding board (36) and a second abutting and supporting position of the second supporting pin (37) to the middle holding board (36) are arranged at different positions on a middle holding board projection plane projected in a thickness direction of the middle holding board (36). Then, in the middle pin unit (31), an image pickup device, such as a CCD camera (91), is arranged and the inspection jig (11) and the circuit board (1) to be tested are aligned.
TW094117184A 2004-05-28 2005-05-25 Circuit board inspecting apparatus and circuit board inspecting method TW200608034A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004159686 2004-05-28

Publications (1)

Publication Number Publication Date
TW200608034A true TW200608034A (en) 2006-03-01

Family

ID=35451003

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094117184A TW200608034A (en) 2004-05-28 2005-05-25 Circuit board inspecting apparatus and circuit board inspecting method

Country Status (2)

Country Link
TW (1) TW200608034A (en)
WO (1) WO2005116670A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9703623B2 (en) 2014-11-11 2017-07-11 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Adjusting the use of a chip/socket having a damaged pin
JP2018136195A (en) * 2017-02-22 2018-08-30 日置電機株式会社 Probe device and measurement system
TWI730828B (en) * 2020-06-29 2021-06-11 群翊工業股份有限公司 Plate frame width adjustment equipment and control method thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3094779B2 (en) * 1994-03-10 2000-10-03 ジェイエスアール株式会社 Circuit board inspection apparatus and inspection method
JP2000266799A (en) * 1999-03-15 2000-09-29 Taiyo Kogyo Kk Printed circuit board inspection device
JP2002005980A (en) * 2000-06-16 2002-01-09 Toppan Printing Co Ltd Printed wiring board inspection jig, inspection device, and positioning method between printed wiring board and upper/lower inspection jig

Also Published As

Publication number Publication date
WO2005116670A1 (en) 2005-12-08

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