TW200723427A - Method for inspecting semiconductor device - Google Patents

Method for inspecting semiconductor device

Info

Publication number
TW200723427A
TW200723427A TW095120264A TW95120264A TW200723427A TW 200723427 A TW200723427 A TW 200723427A TW 095120264 A TW095120264 A TW 095120264A TW 95120264 A TW95120264 A TW 95120264A TW 200723427 A TW200723427 A TW 200723427A
Authority
TW
Taiwan
Prior art keywords
semiconductor device
image information
image
ball
acquiring
Prior art date
Application number
TW095120264A
Other languages
Chinese (zh)
Other versions
TWI318431B (en
Inventor
Sang-Yoon Lee
Min-Gu Kang
Il-Nam Kim
Hyun-Min Lee
Ssang-Gun Lim
Original Assignee
Intekplus Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intekplus Co Ltd filed Critical Intekplus Co Ltd
Publication of TW200723427A publication Critical patent/TW200723427A/en
Application granted granted Critical
Publication of TWI318431B publication Critical patent/TWI318431B/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

A method for inspecting a semiconductor device is disclosed, which increases the accuracy of an external-defect inspection capable of determining whether balls or PCBs (Printed Circuit Boards) of the semiconductor device have external defects. The method for inspecting the semiconductor device to determine whether a defect occurs in a ball grid array contained in a PCB via an image captured by a camera includes the steps of: (a) capturing an image of the semiconductor device to allow a circumference of each ball contained in the semiconductor device to be displayed in white, and acquiring falling-illumination image information from the captured image; (b) capturing an image of the semiconductor device to allow a center part of each ball contained in the semiconductor device to be displayed in white, and acquiring coaxial image information from the captured image; (c) subtracting the coaxial image information from the falling-illumination image information, and acquiring ring-shaped image information; and (d) comparing the ring-shaped image information with reference image information, and determining whether the ball is defective according to the comparison result.
TW095120264A 2005-06-07 2006-06-07 Method for inspecting semiconductor device TWI318431B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050048576A KR100705643B1 (en) 2005-06-07 2005-06-07 Method for Inspecting Of Semiconductor device

Publications (2)

Publication Number Publication Date
TW200723427A true TW200723427A (en) 2007-06-16
TWI318431B TWI318431B (en) 2009-12-11

Family

ID=37498651

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095120264A TWI318431B (en) 2005-06-07 2006-06-07 Method for inspecting semiconductor device

Country Status (3)

Country Link
KR (1) KR100705643B1 (en)
TW (1) TWI318431B (en)
WO (1) WO2006132485A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8699784B2 (en) * 2010-08-10 2014-04-15 Camtek Ltd. Inspection recipe generation and inspection based on an inspection recipe
KR101410890B1 (en) * 2011-08-29 2014-06-23 포아텍 주식회사 Monitoring for edge of wafer and its monitoring method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3566470B2 (en) * 1996-09-17 2004-09-15 株式会社日立製作所 Pattern inspection method and apparatus
KR20020046636A (en) * 2000-12-15 2002-06-21 송재인 Visual system and method for soldering inspection of PCB

Also Published As

Publication number Publication date
TWI318431B (en) 2009-12-11
KR20060127529A (en) 2006-12-13
KR100705643B1 (en) 2007-04-09
WO2006132485A1 (en) 2006-12-14

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