TW200630608A - Apparatus and method for inspecting bumps - Google Patents

Apparatus and method for inspecting bumps

Info

Publication number
TW200630608A
TW200630608A TW094142738A TW94142738A TW200630608A TW 200630608 A TW200630608 A TW 200630608A TW 094142738 A TW094142738 A TW 094142738A TW 94142738 A TW94142738 A TW 94142738A TW 200630608 A TW200630608 A TW 200630608A
Authority
TW
Taiwan
Prior art keywords
inspection
regions
images
bumps
master image
Prior art date
Application number
TW094142738A
Other languages
Chinese (zh)
Other versions
TWI274869B (en
Inventor
Yuji Akagi
Jun Onishi
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200630608A publication Critical patent/TW200630608A/en
Application granted granted Critical
Publication of TWI274869B publication Critical patent/TWI274869B/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process

Landscapes

  • Immunology (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Pathology (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)

Abstract

This invention provides an apparatus and method for inspecting bumps. The apparatus has a shape detecting unit for detecting images having a correct shape of bumps among the images of bumps contained in the images of objects obtained by a CCD camera. An inspection region setting unit sets the regions as non-inspection regions containing at least the images detected by the shape detecting unit among the regions of object images and sets the remaining regions as inspection regions. A master image memory unit stores a master image to be used as a reference for inspection. A comparison inspection unit compares the object images in the inspection regions set by the inspection region setting unit with the master image, to inspect whether or not the bumps are formed in a predetermined precision.
TW094142738A 2005-02-25 2005-12-05 Apparatus and method for inspecting bumps TWI274869B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005051393A JP4577717B2 (en) 2005-02-25 2005-02-25 Bump inspection apparatus and method

Publications (2)

Publication Number Publication Date
TW200630608A true TW200630608A (en) 2006-09-01
TWI274869B TWI274869B (en) 2007-03-01

Family

ID=36935865

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094142738A TWI274869B (en) 2005-02-25 2005-12-05 Apparatus and method for inspecting bumps

Country Status (4)

Country Link
JP (1) JP4577717B2 (en)
KR (1) KR100719712B1 (en)
CN (1) CN100470239C (en)
TW (1) TWI274869B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5346720B2 (en) * 2009-07-10 2013-11-20 東レエンジニアリング株式会社 Bonding strength measuring apparatus and bonding strength measuring method
KR101654825B1 (en) 2014-07-08 2016-09-22 (주)자비스 Method for Inspecting Compact Parts Formed on Substrate in Defect Inspection
KR20160006052A (en) 2014-07-08 2016-01-18 (주)자비스 Method for Inspecting a Electronic Board with X-ray
KR20160011222A (en) 2016-01-18 2016-01-29 (주)자비스 Method for Inspecting a Electronic Board with X-ray
KR102137186B1 (en) 2017-01-20 2020-07-23 (주)자비스 Method for Inspecting a Electronic Board with X-ray
JP2022061127A (en) * 2020-10-06 2022-04-18 東レエンジニアリング株式会社 Exterior appearance inspection device and method

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62239005A (en) * 1986-04-11 1987-10-19 Fuji Photo Film Co Ltd Surface shape inspecting instrument
JP3051279B2 (en) * 1993-05-13 2000-06-12 シャープ株式会社 Bump appearance inspection method and bump appearance inspection device
JPH07140090A (en) * 1993-11-17 1995-06-02 Nichiden Mach Ltd Item discrimination method for appearance test
JP3515199B2 (en) * 1995-01-06 2004-04-05 大日本スクリーン製造株式会社 Defect inspection equipment
JPH11218499A (en) * 1998-02-03 1999-08-10 Hitachi Denshi Ltd Visual inspection device and its image-processing method
JP2001176907A (en) * 1999-12-16 2001-06-29 Shinko Electric Ind Co Ltd Bump inspection device
JP4546607B2 (en) * 2000-04-18 2010-09-15 パナソニック株式会社 Non-defective pattern registration method and pattern inspection method
JP2002358509A (en) * 2001-06-01 2002-12-13 Dainippon Screen Mfg Co Ltd Device for inspecting hole
JP2003065970A (en) * 2001-08-27 2003-03-05 Nec Corp Foreign matter inspection method and apparatus therefor

Also Published As

Publication number Publication date
CN100470239C (en) 2009-03-18
JP4577717B2 (en) 2010-11-10
CN1825095A (en) 2006-08-30
JP2006234667A (en) 2006-09-07
KR20060094844A (en) 2006-08-30
TWI274869B (en) 2007-03-01
KR100719712B1 (en) 2007-05-17

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees