TW200636409A - Substrate inspecting device - Google Patents

Substrate inspecting device

Info

Publication number
TW200636409A
TW200636409A TW095112092A TW95112092A TW200636409A TW 200636409 A TW200636409 A TW 200636409A TW 095112092 A TW095112092 A TW 095112092A TW 95112092 A TW95112092 A TW 95112092A TW 200636409 A TW200636409 A TW 200636409A
Authority
TW
Taiwan
Prior art keywords
substrate
inspecting
coordinate data
scan image
inspection
Prior art date
Application number
TW095112092A
Other languages
Chinese (zh)
Other versions
TWI321709B (en
Inventor
Daisuke Imai
Original Assignee
Shimadzu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shimadzu Corp filed Critical Shimadzu Corp
Publication of TW200636409A publication Critical patent/TW200636409A/en
Application granted granted Critical
Publication of TWI321709B publication Critical patent/TWI321709B/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/26—Electron or ion microscopes
    • H01J2237/282—Determination of microscope properties
    • H01J2237/2826—Calibration

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Liquid Crystal (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Thin Film Transistor (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)

Abstract

A substrate inspecting device is provided for eliminating position errors during the manufacturing processes, so as to increase position accuracy and inspection accuracy. In this manner, correct positions in inspecting area on the substrate can be obtained. The inspecting device 1 uses charged particle beams to carry out a two-dimensional scan against the substrate, and thus obtains a scan image to inspect the substrate. The device 1 further includes a device 7 for acquiring coordinate data, and the device 7 obtains coordinate data of particular positions in the inspecting area on the substrate from the scan image. During the substrate inspection, inspecting positions on the scan image can be specified based on the coordinate data obtained by the device 7. Therefore, the substrate inspection can be performed without being affected by position shift of errors.
TW95112092A 2005-04-14 2006-04-06 Substrate inspecting device TWI321709B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005117364 2005-04-14

Publications (2)

Publication Number Publication Date
TW200636409A true TW200636409A (en) 2006-10-16
TWI321709B TWI321709B (en) 2010-03-11

Family

ID=37114973

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95112092A TWI321709B (en) 2005-04-14 2006-04-06 Substrate inspecting device

Country Status (5)

Country Link
JP (2) JPWO2006112242A1 (en)
KR (1) KR20070107760A (en)
CN (1) CN101156061A (en)
TW (1) TWI321709B (en)
WO (1) WO2006112242A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104317079A (en) * 2014-10-29 2015-01-28 京东方科技集团股份有限公司 Display panel identification system, detection system, identification method and detection method
TWI694537B (en) * 2018-07-08 2020-05-21 香港商康代影像技術方案香港有限公司 System and method for misalignment compensation

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102047130B (en) * 2008-06-02 2013-09-04 株式会社岛津制作所 Liquid crystal array inspection apparatus and method for correcting imaging range
JP2010232295A (en) * 2009-03-26 2010-10-14 Hitachi High-Technologies Corp Operation processing device or acf sticking state inspection method, and display substrate module assembling line or display substrate module assembling method
JP2010251415A (en) * 2009-04-13 2010-11-04 Hitachi High-Technologies Corp Operation processor, or line or method for assembling display board module
CN102023161B (en) * 2009-09-09 2012-05-30 中芯国际集成电路制造(上海)有限公司 Method for acquiring defect image
JP5472636B2 (en) * 2010-12-17 2014-04-16 株式会社島津製作所 TFT array inspection apparatus and TFT array inspection method
JP5708164B2 (en) * 2011-04-04 2015-04-30 株式会社島津製作所 Array inspection apparatus and array inspection method
WO2013065142A1 (en) * 2011-11-02 2013-05-10 株式会社島津製作所 Liquid crystal array inspection device, and signal processing method for liquid crystal array inspection device
JP5865734B2 (en) * 2012-03-01 2016-02-17 株式会社Ｓｃｒｅｅｎホールディングス Area classification apparatus, program therefor, board inspection apparatus, and area classification method
JP2017044671A (en) * 2015-08-28 2017-03-02 三重富士通セミコンダクター株式会社 Inspection system and inspection method
JP2018054464A (en) * 2016-09-29 2018-04-05 セイコーエプソン株式会社 Electronic component conveyance device and electronic component inspection device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63122217A (en) * 1986-11-12 1988-05-26 Jeol Ltd Inspection of fine pattern
JP2910706B2 (en) * 1996-11-27 1999-06-23 日本電気株式会社 LSI image alignment method
JP4014379B2 (en) * 2001-02-21 2007-11-28 株式会社日立製作所 Defect review apparatus and method
JP4510327B2 (en) * 2001-05-29 2010-07-21 エスアイアイ・ナノテクノロジー株式会社 Layer misalignment evaluation method and apparatus based on CAD information
JP2003031629A (en) * 2001-07-17 2003-01-31 Hitachi Ltd Method and apparatus for testing pattern
JP4097255B2 (en) * 2002-12-13 2008-06-11 大日本スクリーン製造株式会社 Pattern matching apparatus, pattern matching method and program
JP2004228394A (en) * 2003-01-24 2004-08-12 Hitachi High-Technologies Corp System for evaluating shape of pattern for semiconductor wafer
US6873175B2 (en) * 2003-03-04 2005-03-29 Shimadzu Corporation Apparatus and method for testing pixels arranged in a matrix array

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104317079A (en) * 2014-10-29 2015-01-28 京东方科技集团股份有限公司 Display panel identification system, detection system, identification method and detection method
CN104317079B (en) * 2014-10-29 2017-12-01 京东方科技集团股份有限公司 A kind of display panel identifying system, detecting system, recognition methods and detection method
TWI694537B (en) * 2018-07-08 2020-05-21 香港商康代影像技術方案香港有限公司 System and method for misalignment compensation

Also Published As

Publication number Publication date
JPWO2006112242A1 (en) 2008-12-11
CN101156061A (en) 2008-04-02
KR20070107760A (en) 2007-11-07
WO2006112242A1 (en) 2006-10-26
JP2011180136A (en) 2011-09-15
TWI321709B (en) 2010-03-11

Similar Documents

Publication Publication Date Title
TW200636409A (en) Substrate inspecting device
TW200604496A (en) An inspection system
MY158021A (en) Peripheral inspection system and method
TW200942977A (en) Exposure apparatus, exposure method, and device manufacturing method
TW200741173A (en) Method and apparatus for measuring dimensional changes in transparent substrates
WO2009038838A3 (en) Methods and systems for determining a position of inspection data in design data space
WO2011085255A3 (en) Inspection guided overlay metrology
TW200725778A (en) An inspection system and a method for inspecting a diced wafer
TW200620161A (en) Method and apparatus for inspecting substrate
TW200735177A (en) Writing method and writing apparatus of charged particle beam, positional deviation measuring method, and position measuring apparatus
TW200739652A (en) Sample surface inspecting method and inspecting apparatus
WO2007021541A3 (en) Inspection system and associated method
EP2108919A3 (en) Interferometer for determining characteristics of an object surface
TW200506356A (en) Specimen inspection device and method, and method for making a semiconductor device using such specimen inspection device and method
TW200720649A (en) Methods and systems for positioning a laser beam spot relative to a semiconductor integrated circuit using a processing target as a metrology target
TW200951430A (en) Method of determining defects in a substrate and apparatus for exposing a substrate in a lithographic process
SG152147A1 (en) Alignment method and apparatus, lithographic apparatus, metrology apparatus and device manufacturing method
DE502006008604D1 (en) METHOD FOR POSITIONING A WATER
TW200642029A (en) Probing apparatus and positional deviation acquiring method
TW200628758A (en) Method and system of inspecting mura-defect and method of fabricating photomask
TW200731440A (en) Flip chip mounting shift inspection method and mounting apparatus
TW200736577A (en) Visual inspection apparatus
WO2012041457A3 (en) Projection exposure tool for microlithography and method for microlithographic imaging
TW200943006A (en) Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
GB0509727D0 (en) Method and apparatus for scale manufacture

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees