TW200731440A - Flip chip mounting shift inspection method and mounting apparatus - Google Patents
Flip chip mounting shift inspection method and mounting apparatusInfo
- Publication number
- TW200731440A TW200731440A TW095114659A TW95114659A TW200731440A TW 200731440 A TW200731440 A TW 200731440A TW 095114659 A TW095114659 A TW 095114659A TW 95114659 A TW95114659 A TW 95114659A TW 200731440 A TW200731440 A TW 200731440A
- Authority
- TW
- Taiwan
- Prior art keywords
- mounting
- chip
- shift
- alignment mark
- flip chip
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/5442—Marks applied to semiconductor devices or parts comprising non digital, non alphanumeric information, e.g. symbols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
- H01L2223/5448—Located on chip prior to dicing and remaining on chip after dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8112—Aligning
- H01L2224/81121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Operations Research (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
The present invention provides a mounting ship inspection method of flip chip and mounting apparatus realizing the same. In a flip chip mounting shift inspecting method, the images of an alignment mark of a chip and a first corner section of the chip viewed from a direction of recognizing the alignment mark of the chip are recognized by a first CCD camera prior to mounting. After mounting, the images of an alignment mark of a substrate and a second corner section at a position same as that of the corner section of the chip are recognized by a second CCD camera in a direction opposite to a circuit plane of the chip. The relative positional relationship between the alignment marks of the substrate and the chip is calculated, with the first and the second corner sections as references, and a mounting shift from a prescribed mounting position relationship is calculated to determine if a mounting shift conformity is good. A mounting apparatus for performing such method is also provided. In the conventional technologies, inspections are performed off-line by means of an X-ray camera apparatus or an infrared microscope, and the operation time is difficult to be shortened and the full inspection is not easily performed. The present invention enables to perform desired mounting shift inspection with a simple structure and to remarkably shorten the process.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005133475 | 2005-04-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200731440A true TW200731440A (en) | 2007-08-16 |
TWI371072B TWI371072B (en) | 2012-08-21 |
Family
ID=37307820
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095114659A TW200731440A (en) | 2005-04-28 | 2006-04-25 | Flip chip mounting shift inspection method and mounting apparatus |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4768731B2 (en) |
TW (1) | TW200731440A (en) |
WO (1) | WO2006118018A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI626704B (en) * | 2016-08-29 | 2018-06-11 | 樹德科技大學 | Automatic ic transporting system with image recognition function and transporting method thereof |
TWI671839B (en) * | 2017-07-31 | 2019-09-11 | 日商精工愛普生股份有限公司 | Electronic component conveying device and inspection device, positioning device and method, and component conveying device |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5385794B2 (en) * | 2008-01-30 | 2014-01-08 | 東レエンジニアリング株式会社 | Chip mounting method and chip mounting apparatus |
EP2284862A1 (en) | 2009-08-11 | 2011-02-16 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | System and method for picking and placement of chip dies |
JP5779386B2 (en) * | 2011-04-19 | 2015-09-16 | 富士機械製造株式会社 | Electrical component mounting machine |
JP6272676B2 (en) * | 2013-11-07 | 2018-01-31 | 東レエンジニアリング株式会社 | Bonding equipment |
JP6411823B2 (en) * | 2014-09-09 | 2018-10-24 | ボンドテック株式会社 | Chip alignment method and chip alignment apparatus |
KR102595309B1 (en) | 2016-07-20 | 2023-10-31 | 삼성전자주식회사 | method for detecting misalignment of chips, manufacturing method of fan-out panel level package using the same, and fan-out panel level package |
JP6723648B2 (en) * | 2016-07-27 | 2020-07-15 | 住友重機械工業株式会社 | Position detection device and position detection method |
JP6307730B1 (en) * | 2016-09-29 | 2018-04-11 | 株式会社新川 | Semiconductor device manufacturing method and mounting apparatus |
JP7045891B2 (en) | 2018-03-20 | 2022-04-01 | キオクシア株式会社 | Semiconductor manufacturing method, semiconductor manufacturing equipment and semiconductor equipment |
KR102590191B1 (en) * | 2020-06-30 | 2023-10-16 | 시바우라 메카트로닉스 가부시끼가이샤 | Apparatus and method for bonding |
WO2023157061A1 (en) * | 2022-02-15 | 2023-08-24 | 株式会社新川 | Inspection device, mounting device, inspection method, and program |
CN116088113A (en) * | 2023-02-15 | 2023-05-09 | 武汉光谷信息光电子创新中心有限公司 | End face coupling packaging method based on flip-chip silicon optical chip |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2585133B2 (en) * | 1990-08-24 | 1997-02-26 | ティーディーケイ株式会社 | Parts appearance sorting device |
JP3114941B2 (en) * | 1991-05-07 | 2000-12-04 | 芝浦メカトロニクス株式会社 | Component mounting equipment |
JPH0587949U (en) * | 1992-04-24 | 1993-11-26 | セイコー電子工業株式会社 | Semiconductor chip |
JPH08153995A (en) * | 1994-11-28 | 1996-06-11 | Oki Electric Ind Co Ltd | Method for aligning semiconductor device |
-
2006
- 2006-04-18 JP JP2007514594A patent/JP4768731B2/en not_active Expired - Fee Related
- 2006-04-18 WO PCT/JP2006/308089 patent/WO2006118018A1/en active Application Filing
- 2006-04-25 TW TW095114659A patent/TW200731440A/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI626704B (en) * | 2016-08-29 | 2018-06-11 | 樹德科技大學 | Automatic ic transporting system with image recognition function and transporting method thereof |
TWI671839B (en) * | 2017-07-31 | 2019-09-11 | 日商精工愛普生股份有限公司 | Electronic component conveying device and inspection device, positioning device and method, and component conveying device |
Also Published As
Publication number | Publication date |
---|---|
TWI371072B (en) | 2012-08-21 |
JPWO2006118018A1 (en) | 2008-12-18 |
JP4768731B2 (en) | 2011-09-07 |
WO2006118018A1 (en) | 2006-11-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |