MY169616A - Methods for examining a bonding structure of a substrate and bonding structure inspection devices - Google Patents

Methods for examining a bonding structure of a substrate and bonding structure inspection devices

Info

Publication number
MY169616A
MY169616A MYPI2011003674A MYPI2011003674A MY169616A MY 169616 A MY169616 A MY 169616A MY PI2011003674 A MYPI2011003674 A MY PI2011003674A MY PI2011003674 A MYPI2011003674 A MY PI2011003674A MY 169616 A MY169616 A MY 169616A
Authority
MY
Malaysia
Prior art keywords
bonding structure
substrate
interests
examining
methods
Prior art date
Application number
MYPI2011003674A
Inventor
Kum Pang Chung
Chew Junn Lam
Jian Xu
Tong Liu
Zai Xin Tang
Albertus Zakaria
Original Assignee
Agency Science Tech & Res
Component Tech Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency Science Tech & Res, Component Tech Pte Ltd filed Critical Agency Science Tech & Res
Publication of MY169616A publication Critical patent/MY169616A/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
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  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

In an embodiment, a method for examining a bonding structure (174) of a substrate may be provided. The method may include: providing a substrate including a bonding structure (174) to be examined; determining one or more stereoscopic images including one or a plurality of predefined regions of interests of portions of the bonding structure (174) to be examined, the predefined regions of interests corresponding to reference regions of interests in a stored predetermined reference model of a reference bonding structure (174) of a reference substrate; determining one or more two-dimensional feature parameters and one or more three-dimensional feature parameters of the bonding structure (174) to be examined from one or more of a plurality of the predefined regions of interests; and determining as to whether the determined feature parameters fulfill at least one predefined quality criterion with respect to the reference model. FIG. 15
MYPI2011003674A 2009-02-06 2010-02-08 Methods for examining a bonding structure of a substrate and bonding structure inspection devices MY169616A (en)

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