SG126025A1 - Method and apparatus for a twisting fixture probe for probing test access point structures - Google Patents

Method and apparatus for a twisting fixture probe for probing test access point structures

Info

Publication number
SG126025A1
SG126025A1 SG200600414A SG200600414A SG126025A1 SG 126025 A1 SG126025 A1 SG 126025A1 SG 200600414 A SG200600414 A SG 200600414A SG 200600414 A SG200600414 A SG 200600414A SG 126025 A1 SG126025 A1 SG 126025A1
Authority
SG
Singapore
Prior art keywords
access point
test access
probing test
point structures
twisting fixture
Prior art date
Application number
SG200600414A
Inventor
Kenneth P Parker
Chris R Jacobsen
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of SG126025A1 publication Critical patent/SG126025A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2805—Bare printed circuit boards

Abstract

A twisting fixture probe for cleaning oxides, residues or other contaminants from the surface of a solder bead probe and probing a solder bead probe on a printed circuit board during in-circuit testing.
SG200600414A 2005-03-14 2006-01-20 Method and apparatus for a twisting fixture probe for probing test access point structures SG126025A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/079,702 US7259576B2 (en) 2005-03-14 2005-03-14 Method and apparatus for a twisting fixture probe for probing test access point structures

Publications (1)

Publication Number Publication Date
SG126025A1 true SG126025A1 (en) 2006-10-30

Family

ID=36970138

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200600414A SG126025A1 (en) 2005-03-14 2006-01-20 Method and apparatus for a twisting fixture probe for probing test access point structures

Country Status (4)

Country Link
US (1) US7259576B2 (en)
CN (1) CN1834679A (en)
SG (1) SG126025A1 (en)
TW (1) TW200632326A (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060103397A1 (en) * 2004-10-29 2006-05-18 Parker Kenneth P Method and apparatus for a twisting fixture probe for probing test access point structures
US7338292B2 (en) * 2006-01-26 2008-03-04 Agilent Technologies, Inc. Board-to-board electronic interface using hemi-ellipsoidal surface features
US20090179657A1 (en) * 2008-01-11 2009-07-16 Eddie Lee Williamson Printed circuit board for coupling probes to a tester, and apparatus and test system using same
CN101677486A (en) * 2008-09-19 2010-03-24 鸿富锦精密工业（深圳）有限公司 Printed circuit board and manufacturing method thereof
US8310256B2 (en) 2009-12-22 2012-11-13 Teradyne, Inc. Capacitive opens testing in low signal environments
US8760185B2 (en) * 2009-12-22 2014-06-24 Anthony J. Suto Low capacitance probe for testing circuit assembly
WO2013006209A2 (en) * 2011-07-03 2013-01-10 Eoplex Limited Lead carrier with thermally fused package components
KR101241969B1 (en) * 2012-08-28 2013-04-03 (주)메리테크 Bump test glass panel type block structure of the probe
JP6047756B2 (en) * 2012-10-12 2016-12-21 株式会社タニタ Cigar springs, connectors, electrodes and electrometers
US10359447B2 (en) 2012-10-31 2019-07-23 Formfactor, Inc. Probes with spring mechanisms for impeding unwanted movement in guide holes
US10001507B2 (en) * 2016-09-14 2018-06-19 International Business Machines Corporation ICT probe contact improvement
JP6881354B2 (en) * 2018-03-07 2021-06-02 オムロン株式会社 Inspection unit and inspection equipment
CN109378282A (en) * 2018-11-28 2019-02-22 中国华能集团有限公司 A kind of probe contact type test device
CN113394580B (en) * 2020-03-12 2023-05-16 富联精密电子(天津)有限公司 Electronic device
TWI786625B (en) * 2021-05-07 2022-12-11 范劉文玲 Transmission probe

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4307928A (en) * 1979-08-17 1981-12-29 Petlock Jr William Bellows-type electrical test contact
US4397519A (en) * 1981-05-12 1983-08-09 Pylon Company, Inc. Electrical contact construction
US4885533B1 (en) * 1988-09-09 1998-11-03 Qa Technology Co Inc Electrical circuit test probe having an elongate cylindrical retaining and sliding bearing region
US5032787A (en) * 1989-11-03 1991-07-16 Everett/Charles Contact Products, Inc. Electrical test probe having rotational control of the probe shaft
US5157325A (en) * 1991-02-15 1992-10-20 Compaq Computer Corporation Compact, wireless apparatus for electrically testing printed circuit boards
US5850147A (en) * 1992-03-10 1998-12-15 Virginia Panel Corporation Coaxial double-headed spring contact probe assembly and coaxial surface contact for engagement therewith
US5357192A (en) * 1993-02-01 1994-10-18 Motorola, Inc. Method of contacting a semiconductor die with probes
US6051982A (en) * 1996-08-02 2000-04-18 International Business Machines Corporation Electronic component test apparatus with rotational probe and conductive spaced apart means
US5804984A (en) * 1996-08-02 1998-09-08 International Business Machines Corporation Electronic component test apparatus with rotational probe
US6605954B1 (en) * 2002-01-23 2003-08-12 Lsi Logic Corporation Reducing probe card substrate warpage
US6552430B1 (en) * 2002-01-30 2003-04-22 Texas Instruments Incorporated Ball grid array substrate with improved traces formed from copper based metal
KR100546361B1 (en) * 2003-08-08 2006-01-26 삼성전자주식회사 Test tool of semiconductor device and operation method of the test tool

Also Published As

Publication number Publication date
CN1834679A (en) 2006-09-20
TW200632326A (en) 2006-09-16
US7259576B2 (en) 2007-08-21
US20060202675A1 (en) 2006-09-14

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