TWI316139B - Method of testing non-componented large printed circuit boards using a finger tester - Google Patents

Method of testing non-componented large printed circuit boards using a finger tester

Info

Publication number
TWI316139B
TWI316139B TW095116995A TW95116995A TWI316139B TW I316139 B TWI316139 B TW I316139B TW 095116995 A TW095116995 A TW 095116995A TW 95116995 A TW95116995 A TW 95116995A TW I316139 B TWI316139 B TW I316139B
Authority
TW
Taiwan
Prior art keywords
printed circuit
circuit boards
componented
finger tester
large printed
Prior art date
Application number
TW095116995A
Other languages
Chinese (zh)
Other versions
TW200702686A (en
Inventor
Evgeny Yanenko
Uwe Rothaug
Gilbert Volpert
Original Assignee
Atg Test Systems Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atg Test Systems Gmbh filed Critical Atg Test Systems Gmbh
Publication of TW200702686A publication Critical patent/TW200702686A/en
Application granted granted Critical
Publication of TWI316139B publication Critical patent/TWI316139B/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2805—Bare printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/312—Contactless testing by capacitive methods

Abstract

The invention relates to a method of testing unloaded, large-area printed circuit boards having conductor tracks with a finger tester. According to the method according to the invention, the printed circuit boards (3) are tested when subdivided into a number of segments (I, II, III), conductor tracks (2) that extend beyond one segment being tested by means of capacitive measurement of the end points located in the respective segment, an interruption of the conductor track being established if one measured value of the capacitive measured values belonging to one conductor track differs significantly from other measured values.
TW095116995A 2005-06-17 2006-05-12 Method of testing non-componented large printed circuit boards using a finger tester TWI316139B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005028191A DE102005028191B4 (en) 2005-06-17 2005-06-17 Method and device for testing unpopulated, large-area circuit boards with a finger tester

Publications (2)

Publication Number Publication Date
TW200702686A TW200702686A (en) 2007-01-16
TWI316139B true TWI316139B (en) 2009-10-21

Family

ID=36952558

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095116995A TWI316139B (en) 2005-06-17 2006-05-12 Method of testing non-componented large printed circuit boards using a finger tester

Country Status (8)

Country Link
EP (1) EP1920263B1 (en)
JP (1) JP4987862B2 (en)
KR (1) KR101035244B1 (en)
CN (2) CN101198879A (en)
AT (1) ATE504846T1 (en)
DE (2) DE102005028191B4 (en)
TW (1) TWI316139B (en)
WO (1) WO2006133808A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT507468B1 (en) * 2008-10-15 2010-10-15 Dtg Int Gmbh DETERMINATION OF CHARACTERISTICS OF AN ELECTRICAL DEVICE
CN106226684B (en) * 2016-09-22 2023-09-12 合肥京东方光电科技有限公司 Testing device for assembling printed circuit board
IT201700004579A1 (en) 2017-01-17 2018-07-17 Spea Spa MOVING PROBE MACHINE FOR THE TESTING OF ELECTRONIC CARDS, AND RELATIVE TESTING METHOD
DE102017102700A1 (en) 2017-02-10 2018-09-13 Atg Luther & Maelzer Gmbh Test apparatus and method for testing printed circuit boards
CN108169664B (en) * 2017-12-29 2021-01-01 深圳市大族数控科技有限公司 Circuit board fault detection method and device, computer equipment and storage medium
CN109471018A (en) * 2018-11-26 2019-03-15 梅州市志浩电子科技有限公司 A kind of finished product segmentation test method of LED light printed circuit board
CN115014427A (en) * 2021-03-05 2022-09-06 奥特斯(中国)有限公司 Measuring physical properties of component carriers based on design data

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3975680A (en) * 1975-06-25 1976-08-17 Honeywell Information Systems, Inc. Non-contact coupling plate for circuit board tester
JPS5296358A (en) * 1976-02-06 1977-08-12 Tokyo Shibaura Electric Co Device for inspecting pattern
US4565966A (en) * 1983-03-07 1986-01-21 Kollmorgen Technologies Corporation Method and apparatus for testing of electrical interconnection networks
JPH0197878A (en) * 1987-10-09 1989-04-17 Fujitsu Ltd Testing method of divided wirings
EP0402499A1 (en) * 1989-06-13 1990-12-19 Siemens Aktiengesellschaft Process for testing a circuit board with a particle beam
JPH0348181A (en) * 1989-07-17 1991-03-01 Hitachi Ltd Divided continuity inspection for printed circuit board
EP0468153B1 (en) * 1990-07-25 1995-10-11 atg test systems GmbH Device for contacting elements for testing
DE19541307C2 (en) * 1995-11-06 2001-09-27 Atg Test Systems Gmbh Method for testing electrical conductor arrangements and device for carrying out the method
DE19821225A1 (en) * 1998-02-18 1999-08-19 Luther & Maelzer Gmbh Method for testing printed circuit cards
JP2000214206A (en) * 1999-01-21 2000-08-04 Hioki Ee Corp Circuit substrate inspecting method and circuit substrate inspecting apparatus
DE19957286A1 (en) * 1999-11-29 2001-07-05 Atg Test Systems Gmbh Method and device for testing printed circuit boards
JP2002012314A (en) * 2000-06-30 2002-01-15 Nidec Copal Corp Board conveying mechanism for board inspection device
DE10043726C2 (en) * 2000-09-05 2003-12-04 Atg Test Systems Gmbh Method for testing circuit boards with a parallel tester and apparatus for carrying out the method
US20050045783A1 (en) * 2003-09-03 2005-03-03 Brumley Fred R. Adjustable stand

Also Published As

Publication number Publication date
CN103257311A (en) 2013-08-21
DE102005028191B4 (en) 2009-04-09
EP1920263A1 (en) 2008-05-14
DE102005028191A1 (en) 2006-12-28
TW200702686A (en) 2007-01-16
DE502006009268D1 (en) 2011-05-19
JP4987862B2 (en) 2012-07-25
KR20080025148A (en) 2008-03-19
WO2006133808A1 (en) 2006-12-21
CN101198879A (en) 2008-06-11
ATE504846T1 (en) 2011-04-15
KR101035244B1 (en) 2011-05-18
JP2008546991A (en) 2008-12-25
EP1920263B1 (en) 2011-04-06

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees