TWI316139B - Method of testing non-componented large printed circuit boards using a finger tester - Google Patents

Method of testing non-componented large printed circuit boards using a finger tester

Info

Publication number
TWI316139B
TWI316139B TW095116995A TW95116995A TWI316139B TW I316139 B TWI316139 B TW I316139B TW 095116995 A TW095116995 A TW 095116995A TW 95116995 A TW95116995 A TW 95116995A TW I316139 B TWI316139 B TW I316139B
Authority
TW
Taiwan
Prior art keywords
printed circuit
circuit boards
componented
finger tester
large printed
Prior art date
Application number
TW095116995A
Other languages
English (en)
Other versions
TW200702686A (en
Inventor
Evgeny Yanenko
Uwe Rothaug
Gilbert Volpert
Original Assignee
Atg Test Systems Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atg Test Systems Gmbh filed Critical Atg Test Systems Gmbh
Publication of TW200702686A publication Critical patent/TW200702686A/zh
Application granted granted Critical
Publication of TWI316139B publication Critical patent/TWI316139B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2805—Bare printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/312—Contactless testing by capacitive methods

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measurement Of Resistance Or Impedance (AREA)
  • Auxiliary Devices For Music (AREA)
  • Electrophonic Musical Instruments (AREA)
TW095116995A 2005-06-17 2006-05-12 Method of testing non-componented large printed circuit boards using a finger tester TWI316139B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005028191A DE102005028191B4 (de) 2005-06-17 2005-06-17 Verfahren und Vorrichtung zum Testen von unbestückten, großflächigen Leiterplatten mit einem Fingertester

Publications (2)

Publication Number Publication Date
TW200702686A TW200702686A (en) 2007-01-16
TWI316139B true TWI316139B (en) 2009-10-21

Family

ID=36952558

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095116995A TWI316139B (en) 2005-06-17 2006-05-12 Method of testing non-componented large printed circuit boards using a finger tester

Country Status (8)

Country Link
EP (1) EP1920263B1 (zh)
JP (1) JP4987862B2 (zh)
KR (1) KR101035244B1 (zh)
CN (2) CN101198879A (zh)
AT (1) ATE504846T1 (zh)
DE (2) DE102005028191B4 (zh)
TW (1) TWI316139B (zh)
WO (1) WO2006133808A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT507468B1 (de) 2008-10-15 2010-10-15 Dtg Int Gmbh Ermittlung von eigenschaften einer elektrischen vorrichtung
CN106226684B (zh) * 2016-09-22 2023-09-12 合肥京东方光电科技有限公司 装配印刷电路板测试装置
IT201700004579A1 (it) * 2017-01-17 2018-07-17 Spea Spa Macchina a sonde mobili per il collaudo di schede elettroniche, e relativo metodo di collaudo
DE102017102700A1 (de) 2017-02-10 2018-09-13 Atg Luther & Maelzer Gmbh Prüfvorrichtung und Verfahren zum Prüfen von Leiterplatten
CN108169664B (zh) * 2017-12-29 2021-01-01 深圳市大族数控科技有限公司 电路板故障检测方法和装置、计算机设备和存储介质
CN109471018A (zh) * 2018-11-26 2019-03-15 梅州市志浩电子科技有限公司 一种led灯印制电路板的成品分割测试方法
CN115014427A (zh) * 2021-03-05 2022-09-06 奥特斯(中国)有限公司 基于设计数据测量部件载体的物理特性

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3975680A (en) * 1975-06-25 1976-08-17 Honeywell Information Systems, Inc. Non-contact coupling plate for circuit board tester
JPS5296358A (en) * 1976-02-06 1977-08-12 Tokyo Shibaura Electric Co Device for inspecting pattern
US4565966A (en) * 1983-03-07 1986-01-21 Kollmorgen Technologies Corporation Method and apparatus for testing of electrical interconnection networks
JPH0197878A (ja) * 1987-10-09 1989-04-17 Fujitsu Ltd 分割布線試験方式
EP0402499A1 (de) * 1989-06-13 1990-12-19 Siemens Aktiengesellschaft Verfahren zur Prüfung einer Leiterplatte mit einer Teilchensonde
JPH0348181A (ja) * 1989-07-17 1991-03-01 Hitachi Ltd プリント基板の分割導通検査方法
EP0468153B1 (de) * 1990-07-25 1995-10-11 atg test systems GmbH Kontaktierungsvorrichtung für Prüfzwecke
DE19541307C2 (de) * 1995-11-06 2001-09-27 Atg Test Systems Gmbh Verfahren zum Prüfen von elektrischen Leiteranordnungen und Vorrichtung zum Ausführen des Verfahrens
DE19821225A1 (de) * 1998-02-18 1999-08-19 Luther & Maelzer Gmbh Verfahren und Vorrichtung zum Prüfen von gedruckten Leiterplatten
JP2000214206A (ja) * 1999-01-21 2000-08-04 Hioki Ee Corp 回路基板検査方法および回路基板検査装置
DE19957286A1 (de) * 1999-11-29 2001-07-05 Atg Test Systems Gmbh Verfahren und Vorrichtung zum Testen von Leiterplatten
JP2002012314A (ja) * 2000-06-30 2002-01-15 Nidec Copal Corp 基板検査装置の基板搬送機構
DE10043726C2 (de) * 2000-09-05 2003-12-04 Atg Test Systems Gmbh Verfahren zum Prüfen von Leiterplatten mit einem Paralleltester und eine Vorrichtung zum Ausführen des Verfahrens
US20050045783A1 (en) * 2003-09-03 2005-03-03 Brumley Fred R. Adjustable stand

Also Published As

Publication number Publication date
KR101035244B1 (ko) 2011-05-18
TW200702686A (en) 2007-01-16
ATE504846T1 (de) 2011-04-15
JP2008546991A (ja) 2008-12-25
DE102005028191B4 (de) 2009-04-09
DE102005028191A1 (de) 2006-12-28
CN101198879A (zh) 2008-06-11
EP1920263A1 (de) 2008-05-14
KR20080025148A (ko) 2008-03-19
EP1920263B1 (de) 2011-04-06
CN103257311A (zh) 2013-08-21
JP4987862B2 (ja) 2012-07-25
WO2006133808A1 (de) 2006-12-21
DE502006009268D1 (de) 2011-05-19

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees