TWI268748B - Method for producing conductive patterns on printed circuit boards - Google Patents

Method for producing conductive patterns on printed circuit boards

Info

Publication number
TWI268748B
TWI268748B TW094112272A TW94112272A TWI268748B TW I268748 B TWI268748 B TW I268748B TW 094112272 A TW094112272 A TW 094112272A TW 94112272 A TW94112272 A TW 94112272A TW I268748 B TWI268748 B TW I268748B
Authority
TW
Taiwan
Prior art keywords
conductive patterns
printed circuit
circuit boards
producing conductive
circuit board
Prior art date
Application number
TW094112272A
Other languages
Chinese (zh)
Other versions
TW200607414A (en
Inventor
Toru Ishii
Tomokazu Kato
Kengo Tsuchida
Original Assignee
Yamaha Fine Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Fine Technologies Co Ltd filed Critical Yamaha Fine Technologies Co Ltd
Publication of TW200607414A publication Critical patent/TW200607414A/en
Application granted granted Critical
Publication of TWI268748B publication Critical patent/TWI268748B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B66—HOISTING; LIFTING; HAULING
    • B66C—CRANES; LOAD-ENGAGING ELEMENTS OR DEVICES FOR CRANES, CAPSTANS, WINCHES, OR TACKLES
    • B66C13/00—Other constructional features or details
    • B66C13/16—Applications of indicating, registering, or weighing devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00—Television systems
    • H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

On a printed circuit board, a number of conductive patterns A having the same shape are formed. Other conductive patterns B are formed in a point-symmetric manner. A lower inspection probe and an upper inspection probe are moved while contacting the printed circuit board, in order to inspect conductivity of the conductive patterns A. Then, the printed circuit board is rotated in a 180-degree arc. Then, the conductive patterns B are inspected by the lower inspection probe.
TW094112272A 2004-04-20 2005-04-18 Method for producing conductive patterns on printed circuit boards TWI268748B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004124132A JP4497354B2 (en) 2004-04-20 2004-04-20 Method and apparatus for producing conductive pattern on printed circuit board

Publications (2)

Publication Number Publication Date
TW200607414A TW200607414A (en) 2006-02-16
TWI268748B true TWI268748B (en) 2006-12-11

Family

ID=35346900

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094112272A TWI268748B (en) 2004-04-20 2005-04-18 Method for producing conductive patterns on printed circuit boards

Country Status (4)

Country Link
JP (1) JP4497354B2 (en)
KR (1) KR100750763B1 (en)
CN (2) CN100452946C (en)
TW (1) TWI268748B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4497354B2 (en) * 2004-04-20 2010-07-07 ヤマハファインテック株式会社 Method and apparatus for producing conductive pattern on printed circuit board
JP4986130B2 (en) * 2007-01-16 2012-07-25 日本電産リード株式会社 Board inspection equipment
JP4969330B2 (en) * 2007-06-15 2012-07-04 セイコープレシジョン株式会社 Multilayer wiring board manufacturing apparatus and manufacturing method
KR20090070406A (en) * 2007-12-27 2009-07-01 삼성전자주식회사 Pcb strip and apparatus and method for molding thereof
CN102447162B (en) * 2010-09-30 2014-08-27 汉王科技股份有限公司 Antenna board of electromagnetic-type touch pad and manufacturing process thereof
CN101969747B (en) * 2010-10-15 2013-07-03 安徽四创电子股份有限公司 Printed board processing hinge clamp positioning method
WO2020262198A1 (en) * 2019-06-28 2020-12-30 デンカ株式会社 Ceramic substrate and method for manufacture thereof, composite substrate, circuit substrate and method for manufacture thereof, and method for inspection of circuit substrate
JP7303543B2 (en) * 2019-08-30 2023-07-05 ヤマハファインテック株式会社 High-frequency characteristic inspection device and high-frequency characteristic inspection method

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0220697A (en) * 1988-07-06 1990-01-24 Suehiro Uchiyama Auxiliary equipment in press machine and its similar machine
JPH02137390A (en) * 1988-11-18 1990-05-25 Fujitsu Ltd Manufacture of printed-wiring board unit
JPH0476981A (en) * 1990-07-19 1992-03-11 Taiyo Yuden Co Ltd Integrating substrate for and hybrid integrated circuit manufacture of hybrid integrated circuit device
JPH04294593A (en) * 1991-03-25 1992-10-19 Hitachi Chem Co Ltd Manufacture of wiring board and device used for manufacturing wiring board
JPH04123606U (en) * 1991-04-25 1992-11-10 株式会社東芝 ceramic wiring board
JP2846176B2 (en) * 1992-03-25 1999-01-13 日本電産リード株式会社 Printed circuit board inspection method and inspection device
IT1266653B1 (en) * 1993-11-02 1997-01-09 Circuit Line Spa MACHINE TO PERFORM THE SIMULTANEOUS ELECTRICAL TEST, ON THE TWO SIDES OF A PLATE WITH PRINTED CIRCUITS
JPH07227561A (en) * 1994-02-18 1995-08-29 Rohm Co Ltd Waste coating applying device of syringe for applying resin liquid
JPH0821867A (en) * 1994-07-06 1996-01-23 Sumitomo Electric Ind Ltd In-circuit testing method for printed wiring board
JP3071155B2 (en) 1997-05-16 2000-07-31 ユーエイチティー株式会社 Method and apparatus for inspecting continuity of substrate for IC package such as BGA, PGA etc.
JP3865185B2 (en) 1998-04-28 2007-01-10 富士通株式会社 Semiconductor device, test apparatus and test method thereof
JP4047456B2 (en) * 1998-05-29 2008-02-13 日置電機株式会社 Circuit board inspection equipment
JP2000295036A (en) * 1999-04-09 2000-10-20 Murata Mfg Co Ltd Manufacture of voltage-controlled oscillator, and aggregate substrate for voltage-controlled oscillator
JP2003066085A (en) * 2001-08-23 2003-03-05 Seiko Epson Corp Testing method of board, testing device of board, and manufacturing method of electro-optical device
JP4497354B2 (en) * 2004-04-20 2010-07-07 ヤマハファインテック株式会社 Method and apparatus for producing conductive pattern on printed circuit board

Also Published As

Publication number Publication date
CN2819708Y (en) 2006-09-20
JP4497354B2 (en) 2010-07-07
CN1691873A (en) 2005-11-02
KR20060045702A (en) 2006-05-17
JP2005310950A (en) 2005-11-04
CN100452946C (en) 2009-01-14
TW200607414A (en) 2006-02-16
KR100750763B1 (en) 2007-08-20

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees