CN100452946C - Method and device for manufacturing conductive patterns in a printed circuit board - Google Patents
Method and device for manufacturing conductive patterns in a printed circuit board Download PDFInfo
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- CN100452946C CN100452946C CNB2005100657090A CN200510065709A CN100452946C CN 100452946 C CN100452946 C CN 100452946C CN B2005100657090 A CNB2005100657090 A CN B2005100657090A CN 200510065709 A CN200510065709 A CN 200510065709A CN 100452946 C CN100452946 C CN 100452946C
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- conductive pattern
- printed circuit
- circuit board
- pcb
- processing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B66—HOISTING; LIFTING; HAULING
- B66C—CRANES; LOAD-ENGAGING ELEMENTS OR DEVICES FOR CRANES, CAPSTANS, WINCHES, OR TACKLES
- B66C13/00—Other constructional features or details
- B66C13/16—Applications of indicating, registering, or weighing devices
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N7/00—Television systems
- H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
Abstract
The present invention provided the manufacturing method of a conductive pattern in a printed circuit board capable of precisely and inexpensively processing a conductive pattern formed by oppositely arranging a plurality of rows on a printed circuit board. Two or more same shape electric conductive patterns A are arranged on a printed circuit board 11, conductive patterns B of the same shape as the electric conduction patterns A are formed in the position point symmetry to each of electric conductive pattern A. Further, a lower side inspection probe 14b and an upper side inspection probe 15b are moved and brought into contact with the printed circuit board 11, and the printed circuit board 11 is rotated 180[deg.] after conducting conduction inspection to the electric conduction pattern A. Besides, the conductive inspection is conducted also to the electric conductive pattern B of the printed circuit board 11. In addition, in substitution for the lower side inspection probe 14b and the upper side inspection probe 15b, the extraction of the patterns A, B is performed by an upper side working jig and a lower side working jig in the same manner as the operation of conductive inspection.
Description
Technical field
The present invention relates in printed circuit board (PCB), to form conductive pattern, in this conductive pattern, carry out the manufacture method and the manufacturing installation of the conductive pattern in the printed circuit board (PCB) of predetermined processing.
Background technology
In the past, or conduct each conductive pattern of checking the printed circuit board (PCB) that forms a plurality of conductive patterns, or be used for cutting the stamping-out processing of each conductive pattern from printed circuit board (PCB) by having or not.Under the situation of the inspection that conductive pattern is conducted, make the inspection of testing fixture be arranged on the contact of printed circuit board (PCB) (can check the contact structure that has or not conducting) and check (for example, with reference to patent documentation 1) by the contact terminal contact is switched on probe (probe) contact.
In this inspection method, dispose each conductive pattern according to the datum mark in the printed circuit board (PCB) being become 4 rotation symmetries or twice rotational symmetric mode, the inspection that makes testing fixture also distributes according to becoming symmetrical or 2 the rotational symmetric modes of 4 rotations with the configuration consistency of conductive pattern with the configuration of probe.Therefore, when checking, even datum mark is revolved turn 90 degrees or 180 degree after state under printed circuit board (PCB) is set, also can carry out checking.
Yet, in above-mentioned inspection method in the past, in circuit substrate, produce and stretch, produce under the situation of error in the configuration of conductive pattern, be difficult to carry out the fine checking of requirement hi-Fix.In addition, at the inspection probe of the checking that is used for carrying out simultaneously a plurality of conductive patterns, exist number of probes to become many, structure complicates, simultaneously the problem that increases of cost.
Patent documentation 1: the spy opens flat 8-21867 communique.
Summary of the invention
The present invention is used to the invention that addresses the above problem just, therefore its purpose is to provide a kind of in printed circuit board (PCB), relatively configuration and on the conductive pattern that forms of multiple row can high accuracy and implement the manufacture method and the manufacturing installation of the conductive pattern in the printed circuit board (PCB) of predetermined processing at an easy rate.
In order to achieve the above object, feature on the formation of the manufacture method of the conductive pattern in the relevant printed circuit board (PCB) of the present invention is, possesses following operation, that is: conductive pattern forms operation, it arranges and forms a plurality of the 1st identical shaped conductive patterns towards certain orientation on printed circuit board (PCB), and be on the point-symmetric position at least a portion, form and the 2nd identical shaped conductive pattern of described the 1st conductive pattern described a plurality of the 1st conductive patterns; The 1st treatment process, it is at least one side's of described printed circuit board (PCB) face, and the limit is moved to handle and is used anchor clamps, and the limit contacts, thereby the 1st conductive pattern that is formed at described printed circuit board (PCB) is implemented predetermined process; Relatively rotate operation, it makes described printed circuit board (PCB) and described processing relatively rotate predetermined angular with the relation of the position between the anchor clamps; With the 2nd treatment process, for the identical face of face of in described the 1st treatment process, implementing predetermined processing in the described printed circuit board (PCB), the limit is moved to handle and is used anchor clamps, and the limit contacts, and the 2nd conductive pattern that is formed at described printed circuit board (PCB) is implemented predetermined process.
According to the manufacture method of the conductive pattern in the relevant printed circuit board (PCB) of the present invention that constitutes like that as mentioned above, on printed circuit board (PCB), dispose and form a plurality of identical shaped conductive patterns relatively.Promptly arrange and form a plurality of the 1st conductive patterns, on to the point-symmetric position of becoming of each the 1st conductive pattern, form and the 2nd identical shaped conductive pattern of the 1st conductive pattern respectively towards certain orientation.Therefore, when implementing predetermined processing in each conductive pattern, at first the limit makes processing move with anchor clamps, and predetermined process is implemented successively to the 1st conductive pattern in the limit.In this case, the limit makes to handle and moves along the arrangement of the 1st conductive pattern with anchor clamps, and handle on the limit.And, if the processing of the 1st all conductive patterns is finished, make printed circuit board (PCB) so or handle the angle of relatively rotating regulation with anchor clamps, for example 180 degree or 90 degree.
Rotation in this case by making the axle direction of rotation rotation of printed circuit board (PCB) along regulation, or makes to handle with anchor clamps and rotates and carry out along the axle direction of rotation of regulation, preferably printed circuit board (PCB) and processing is carried out under with the relative state of the opposite face between the anchor clamps.Thus, handle with anchor clamps and position relation between the 2nd conductive pattern and become and handles the 1st preceding conductive pattern and processing and use the position between the anchor clamps to concern identical.Therefore, by carrying out the processing identical, can carry out processing to the 2nd conductive pattern with the processing of the 1st conductive pattern.Thus, can handle the 1st different conductive pattern of direction and the 2nd conductive pattern with a processing with anchor clamps, installation cost reduces.In addition, can carry out high-precision processing.
Feature on another of the manufacture method of the conductive pattern in the relevant printed circuit board (PCB) of the present invention constitutes is, described processing anchor clamps are to detect to use probe, and the processing of being carried out in described the 1st treatment process and described the 2nd treatment process is the detection that conducts of described the 1st conductive pattern and described the 2nd conductive pattern.
Thus, but high accuracy and carry out the detection that conducts of conductive pattern at an easy rate.In this case, at conducting of conductive pattern detection probe used in the detection, though be difficult on it constitutes, make rotation owing to having connected many wirings, but owing to can be easy to make the printed circuit board (PCB) rotation, therefore preferably rotating the relative rotation of being carried out in the operation relatively, undertaken by making the printed circuit board (PCB) rotation.In addition, be high accuracy owing to detect the probe of usefulness, therefore preferably avoid rotation to move, but printed circuit board (PCB) is not required high accuracy, even make its rotation to the few of influence of accuracy of detection yet.Thus, rotating in the operation relatively, preferably making the printed circuit board (PCB) rotation as far as possible, rather than detect and use probe.
Feature on another of the manufacture method of the conductive pattern in the relevant printed circuit board (PCB) of the present invention constitutes is, described processing anchor clamps are clamp for machining, and the processing of being carried out in described the 1st treatment process and described the 2nd treatment process is that described the 1st conductive pattern and described the 2nd conductive pattern are processed from the stamping-out of described printed circuit board (PCB) extraction.
In addition, on the formation of the manufacturing installation of the conductive pattern in the relevant printed circuit board (PCB) of the present invention, be to arrange on the printed circuit board (PCB) and forming a plurality of in the 1st identical shaped conductive pattern of certain orientation, with the point-symmetric position of at least a portion of described a plurality of the 1st conductive patterns on, form and the 2nd identical shaped conductive pattern of described the 1st conductive pattern, and make the conductive pattern manufacturing installation of conductive pattern from this printed circuit board (PCB), it is characterized in that
Possess: supporting mechanism, it supports described printed circuit board (PCB); Handle and use anchor clamps, it moves successively to the a plurality of the 1st and the 2nd conductive pattern that is arranged in the described printed circuit board (PCB) that is supported by described supporting mechanism, carries out predetermined process; With relatively rotate mechanism, its make described printed circuit board (PCB) and described processing with anchor clamps the position relation when relative, according to and described the 1st conductive pattern and described the 2nd conductive pattern between be in point-symmetric angle, relatively rotate predetermined angular,
And, the direction of described 2nd conductive pattern of the direction of described the 1st conductive pattern when in order to make described the 1st conductive pattern being handled when described the 2nd conductive pattern is handled is identical, described the 1st conductive pattern being carried out predetermined processing and described the 2nd conductive pattern being carried out between the predetermined processing, carry out the described rotation that relatively rotates the predetermined angular of mechanism.
The processing that manufacturing installation the possessed anchor clamps of this conductive pattern constitute with probe or clamp for machining by detecting, thus high accuracy and carry out at an easy rate that conducting of conductive pattern detected or stamping-out processing.
Description of drawings
Fig. 1 is a skeleton diagram of wanting portion of representing the processing unit that adopts in one embodiment of the present invention.
Fig. 2 represents to be formed at the conductive pattern of printed circuit board (PCB), (a) is the vertical view of printed circuit board (PCB), (b) is the enlarged drawing of the part that surrounds of two chain-dotted line C in (a).
Fig. 3 is the vertical view that expression is installed on the printed circuit board (PCB) of holding device.
Fig. 4 is the skeleton diagram that expression makes the state of the workbench decline in the processing unit shown in Fig. 1.
Fig. 5 is the state of conduction detection is carried out in expression with the processing unit shown in Fig. 1 a skeleton diagram.
Fig. 6 is the skeleton diagram that expression makes the state of the workbench rising in the processing unit shown in Fig. 1.
Among the figure: the 10-processing unit; The 11-printed circuit board (PCB); The 12-workbench; The 13-holding device; 13a, 13b, 13c, 13d-maintaining part; 14-bottom moving-head; The 14b-downside detects uses probe; 15-top moving-head; The 15b-upside detects uses probe; A, B-conductive pattern; The D-point; The F-central point.
Embodiment
Below, utilize the execution mode of description of drawings about the manufacture method of printed circuit board (PCB) of the present invention.Fig. 1 is the skeleton diagram of major part of representing the processing unit 10 of the printed circuit board (PCB) that adopts in this embodiment.Whether suitably this processing unit 10 is to check the conducting as A, the B of the conductive pattern that is arranged at printed circuit board (PCB) 11 of the process object thing shown in Fig. 2 (a), the device of the conductive pattern of stamping-out processing simultaneously A, B.And this processing unit 10 possesses: be used for printed circuit board (PCB) 11 be arranged at assigned position workbench 12, keep printed circuit board (PCB) holding device 13, be arranged at the bottom moving-head 14 that the below, position is set of printed circuit board (PCB) 11 and be arranged at the top moving-head 15 that the top, position is set of printed circuit board (PCB) 11.
In addition, printed circuit board (PCB) 11, form a plurality of conductive pattern A, B and constitute every certain intervals between left and right before and after having on the flexible dimetric thin plate of flexibility, (top and bottom among Fig. 1) are arranged on a plurality of contact (not shown)s of conducting among conductive pattern A, the B on the two sides in its table.In addition, the state after in the double dot dash line C of Fig. 2 (b) expression enlarged drawing 2 (a), conductive pattern A, B forms by point symmetry so that conductive pattern B be located at a D rotated position behind the conductive pattern A as the center along face 180 degree of printed circuit board (PCB) 11 on.Also have, the relative position of conductive pattern A, B is not limited to 180 degree, can be set at various angles such as 90 degree or 45 degree.
This printed circuit board (PCB) 11 is made of two panels, makes as follows.At first, prepare on the two sides of the insulation board that constitutes by resin the substrate of crimping Copper Foil, on the assigned position of this substrate, form through hole.Then, carry out plating of non-cathode copper and electrolysis plating, on the side face of the surface of Copper Foil or through hole, form electrodeposited coating.Then, at the dry film of stickup up and down of through hole, by making etching with photoresist form the pattern that connects up.
In this case, on the surface of the Copper Foil that forms electrodeposited coating, apply photoresist, be situated between by the surface of patterned films exposure Copper Foil.And by placing developer solution to develop substrate, the place that dissolving light does not shine only forms the image of the photoresist that is made of light-struck part.At this moment, etchant resist (resist) carries out work as diaphragm, and the exposed portions serve of Copper Foil is not dissolved yet, and the part that covers etchant resist is residual as circuit.And, peel off etchant resist after, carry out the processing of the formation of protective layer or printing etc., obtain possessing the printed circuit board (PCB) of a plurality of conductive pattern A, B.
In addition, workbench 12, holding device 13, bottom moving-head 14 and top moving-head 15 are respectively by (not shown)s such as each drive units and movably be installed on the base station (not shown) under the state.Workbench 12 as shown in Figure 3, forms when overlooking the Square consisting of two isosceles right-angled triangles shape slightly littler than printed circuit board (PCB) 11, is fixed on the upper end of rotation back shaft 12a.And, when moving up and down, can rotate along the axle direction of rotation of rotation back shaft 12a by the driving of drive unit rotation back shaft 12a.
In addition, holding device 13 is made of 4 devices along the X-direction shown in Fig. 3, Y direction configuration.It is holding device 13, by the maintaining part 13a that is arranged at work gravitation initial point E, with the equidirectional configuration of maintaining part 13a along the mobile maintaining part 13b of directions X (left and right directions among Fig. 3), with maintaining part 13b relatively configuration the maintaining part 13c that can move along directions X and Y direction (fore-and-aft direction among Fig. 3), with maintaining part 13a relative to the maintaining part 13d that can move along the Y direction that disposes, these four formations.
The leading section of maintaining part 13a, 13b, 13c, 13d each bight of clamping printed circuit board 11 is respectively also fixed.In addition, maintaining part 13a etc. are according to moving the either large or small mode in mutual interval, according to its interval of width adjustment of printed circuit board (PCB) 11.Therefore, maintaining part 13a etc. by moving under the state in each bight of clamping printed circuit board 11, can apply tension force and keep on printed circuit board (PCB) 11.In addition, maintaining part 13a, 13b, 13c, 13d when loading printed circuit board (PCB) 11 and making rotation on workbench 12, can keep out of the way the position that does not hinder workbench 12 rotations.
In bottom moving-head 14, the lower position detection camera 14a of the position of side detection printed circuit board (PCB) 11 below printed circuit board (PCB) 11 and the downside inspection probe 14b that carries out the checking of conductive pattern A, B are installed.This bottom moving-head 14, by the driving of drive unit, along directions X, Y direction and Z direction (above-below direction) mobile the time, with vertical axis as center rotation θ direction.In addition, in top moving-head 15, installation is from the upper side position detection camera 15a of the position of the upper face side detection printed circuit board (PCB) 11 of printed circuit board (PCB) 11 and the upside inspection probe 15b that carries out the checking of conductive pattern A, B.And top moving-head 15 by the driving of drive unit, when moving along directions X, Y direction and Z direction, rotates the θ direction with vertical axis as the center.
Downside detects with probe 14b and upside detection and uses probe 15b, possesses the fine part that can contact on the contact of printed circuit board (PCB) 11, can carry out conduction detection by making this fine part contact at the enterprising electricity that works of contact.In addition, in this processing unit 10, except above-mentioned each device etc., also be provided with the microcomputer of control usefulness, by each device such as various control accessory drives of this microcomputer.According to this control, bottom moving-head 14, top moving-head 15 etc. moves to the position of regulation.
In this constitutes,, printed circuit board (PCB) 11 is set in the above adopting processing unit 10 to carry out at first, as shown in Figure 1, making workbench 12 move to the height of holding device 13 under the situation of checking of printed circuit board (PCB) 11.At this moment, each maintaining part 13a, 13b, 13c, the 13d of holding device 13 are moved so that lay respectively at the bight of the correspondence of printed circuit board (PCB) 11.Then, by the bight of the correspondence of clamping printed circuit boards 11 such as each maintaining part 13a, when maintaining part 13b, 13c are moved along directions X, move the state fixed printed circuit board 11 of available stretch along the Y direction by making maintaining part 13c, 13d.
Then, workbench 12 is descended, as the state of Fig. 4.And, bottom moving-head 14 is moved, detect the reference position that camera 14a detects printed circuit board (PCB) 11 with lower position, for example with the corresponding point of central point F of as shown in Figure 3 workbench 12.Then, mobile top moving-head 15 detects camera 15a with upper side position and detects the point corresponding with central point F in the printed circuit board (PCB).And, bottom moving-head 14 and top moving-head 15 are moved, carry out the conductive pattern A of conducting inspection side at first, for example carry out the conduction detection of each conductive pattern A successively near the conductive pattern the maintaining part 13a.
In this case, as shown in Figure 5, make downside detect with probe 14b below printed circuit board (PCB) 11 contact on the contact of conductive pattern A in, make upside detect with probe 15b above printed circuit board (PCB) 11 contact at the contact that is arranged on the identical conductive pattern A.And the energising downside detects with probe 14b and upside and detects with between the probe 15b, has or not conducting by detection, implements conduction detection.By detecting repeatedly successively, all conductive pattern A are carried out conduction detection.
If the conduction detection of all conducting pattern A finishes, so as shown in Figure 6, bottom moving-head 14 and top moving-head 15 are turned back to position before detecting, workbench 12 are risen, with each maintaining part 13a etc. from state liberation to the bight clamping of the correspondence of printed circuit board (PCB) 11.After this, when making printed circuit board (PCB) 11 rotation, each maintaining part 13a etc. is kept out of the way till the position that printed circuit board (PCB) 11 or workbench 12 do not disturb.Then, make workbench 12 carry out 180 degree rotations with the state shown in two chain-dotted lines among Fig. 3.Then, workbench 12 is descended up to the height of holding device 13, by the bight of the correspondence of maintaining part 13a, the 13b of holding device 13,13c, 13d clamping printed circuit board 11, with the state fixed printed circuit board 11 that stretches once more.Thus, printed circuit board (PCB) 11, relatively preceding with detection, except only having replaced the position between conductive pattern A and the conductive pattern B, become all identical states.
Then, under the state that workbench 12 is descended, the limit makes bottom moving-head 14 and top moving-head 15 move according to the mode identical with the situation of the conduction detection of above-mentioned conductive pattern A, and the conduction detection of each conductive pattern B is carried out on the limit by energising.If the conduction detection of all conductive pattern B finishes, bottom moving-head 14 turns back to top moving-head 15 and detects preceding position so, workbench 12 is risen till the lower position of printed circuit board (PCB) 11, with each maintaining part 13a etc. from the angle part of printed circuit board (PCB) 11 from.And, printed circuit board (PCB) 11 to be taken out from processing unit 10, the processing of conduction detection finishes.
In addition, the conduction detection that continues carries out extracting out under the situation of processing of each conductive pattern A, B from printed circuit board (PCB) 11, with printed circuit board (PCB) 11 place workbench 12 above, become still work by the state of holding device 13 fixed printed circuit boards 11.And, taking out downside detection probe 14b from bottom moving-head 14, when downside clamp for machining (not shown) is installed, take out upsides detection probe 15b from top moving-head 15, upside clamp for machining (not shown) is installed.This downside clamp for machining and upside clamp for machining possess the cut-out portion with the outer peripheral edges portion similar shape of conductive pattern A, B, by from clamping printed circuit board 11 up and down, can cut the outer peripheral edges portion of each conductive pattern A, B.In this case, more residual coupling parts in the outer peripheral edges portion of conductive pattern A, B, conductive pattern A, B become does not have fully the state that separates from printed circuit board (PCB) 11.
Adopt this downside clamp for machining and upside clamp for machining, identical with above-mentioned conduction detection, by each device such as bottom moving-head 14 or top moving-head 15 is driven, carry out the stamping-out processing of conductive pattern A, B.And,, each conductive pattern A, B are taken off from printed circuit board (PCB) 11 by manual manipulation if the stamping-out process finishing of all conductive pattern A, B is taken out printed circuit board (PCB) 11 from processing unit 10 so.Thus, the manufacturing of conductive pattern A, B finishes.
As mentioned above, in the manufacture method of the conductive pattern in the printed circuit board (PCB) of relevant present embodiment, on printed circuit board (PCB) 11, conductive pattern A is added up to 15 with 3 row on the formation of the state shown in Fig. 2 (a) the fore-and-aft direction 5 row left and right directions, and with the position of this each conductive pattern A symmetry on, form and the identical shaped conductive pattern B of conductive pattern A respectively.Therefore, each conductive pattern A, B are being carried out conduction detection, or carrying out stamping-out and add man-hour, at first each conductive pattern A is being implemented predetermined process,, can make conductive pattern B move to the position of the conductive pattern A before detecting by making printed circuit board (PCB) 11 Rotate 180 degree.Wherein, this rotational angle can be with conductive pattern A, B by the corresponding predetermined angular of the relative angle that disposes, for example also rotatable 90 degree or 45 degree etc.
Therefore, by the processing that repeats once more conductive pattern A is carried out, B handles to conductive pattern.Therefore, detect the respectively processing with conductive pattern B with probe 15b and the pair of lower clamp for machining conductive pattern A different with upside clamp for machining travel direction owing to detect with probe 14b and upside with pair of lower, so the reduction of processing unit 10 costs.In addition, can carry out the processing of high-precision conduction detection or stamping-out.Further, when the processing of carrying out conductive pattern B, owing to do not make bottom moving- head 14 and 15 rotations of top moving-head, and make printed circuit board (PCB) 11 rotations, therefore the precision of handling uprises.
Especially, be had better not rotate with probe 15b because downside detects with probe 14b or upside detection owing to connect many wirings, be required high-precision device simultaneously, therefore by printed circuit board (PCB) 11 is rotated, can carry out more high-precision conduction detection.But, the manufacture method of the conductive pattern in the relevant tellite of the present invention, be not limited to this, do not make printed circuit board (PCB) 11 rotation, can make yet and downside is installed is detected with probe 14b, upside and detect bottom moving- head 14 and 15 rotations of top moving-head with probe 15b and downside clamp for machining, upside anchor clamps.
In addition, the part in addition about the manufacture method of the conductive pattern in the relevant printed circuit board (PCB) of the present invention also can suitably change enforcement.For example, the shape of conductive pattern A, B is not limited to the shape of above-mentioned execution mode, so long as point-symmetric shape, forming which kind of shape so can.Also can be L shaped according to conductive pattern is formed, the pair of conductive pattern becomes roughly dimetric mode and is configured.In this case, can in little printed circuit board (PCB), efficiently form a plurality of conductive patterns.In addition, in the above-described embodiment,, also can adopt the printed circuit board (PCB) that constitutes by single sided board though constitute printed circuit board (PCB) 11 with two panels.In this case, can omit any one party of bottom moving-head 14 and top moving-head 15.
In addition, on workbench 12, be provided for adsorbing the adsorption element of printed circuit board (PCB) 11, or on printed circuit board (PCB) 11, had under the situation of at least two positions, on workbench 12, the pin that can insert this hole etc. can be set also by prepunched hole etc.Thus, can be correctly and carry out the fixing of printed circuit board (PCB) 11 definitely.In addition, in the above-described embodiment, though with printed circuit board (PCB) 11 as flexible substrate, be not limited thereto as printed circuit board (PCB), also can use tabular substrate with rigidity.Thus, also can carry out the processing of conduction detection identical or stamping-out processing etc. with above-mentioned execution mode.
Also has in the above-described embodiment the detection of the instrumentation of the circuit constant of detection or resistance, capacitor, inductance etc. though a side that will handle as conduction detection, is also insulated.In addition, in the above-described embodiment, though printed circuit board (PCB) 11 is set to level, printed circuit board (PCB) 11 is tiltable or setting vertically also.Also have, in the present embodiment, though according to handle the face relative with anchor clamps in printed circuit board (PCB) 11 is rotated mode carry out, also can be according to printed circuit board (PCB) 11 be moved to outside the position of its opposite face, and the mode that the position outside it is rotated is carried out.In addition, can suitably change enforcement about in addition part or formation of processing unit 10 etc.
Claims (4)
1, a kind of manufacture method of conductive pattern of printed circuit board (PCB) is characterized in that, possesses following operation, that is:
Conductive pattern forms operation, it arranges and forms a plurality of the 1st identical shaped conductive patterns towards certain orientation on printed circuit board (PCB), and be on the point-symmetric position at least a portion, form and the 2nd identical shaped conductive pattern of described the 1st conductive pattern described a plurality of the 1st conductive patterns;
The 1st treatment process, it is at least one side's of described printed circuit board (PCB) face, and the limit is moved to handle and is used anchor clamps, and the limit contacts, thereby the 1st conductive pattern that is formed at described printed circuit board (PCB) is implemented predetermined process;
Relatively rotate operation, it makes described printed circuit board (PCB) and described processing relatively rotate predetermined angular with the relation of the position between the anchor clamps; With
The 2nd treatment process, for the identical face of face of implementing predetermined processing in described the 1st treatment process in the described printed circuit board (PCB), the limit is moved to handle and is used anchor clamps, and the limit contacts, and the 2nd conductive pattern that is formed at described printed circuit board (PCB) is implemented predetermined process.
2, according to the manufacture method of the conductive pattern of the printed circuit board (PCB) described in the claim 1, it is characterized in that,
Described processing anchor clamps are to detect to use probe, and the processing of being carried out in described the 1st treatment process and described the 2nd treatment process is the detection that conducts of described the 1st conductive pattern and described the 2nd conductive pattern.
3, according to the manufacture method of the conductive pattern of the printed circuit board (PCB) described in the claim 1, it is characterized in that,
Described processing anchor clamps are clamp for machining, and the processing of being carried out in described the 1st treatment process and described the 2nd treatment process is that described the 1st conductive pattern and described the 2nd conductive pattern are processed from the stamping-out of described printed circuit board (PCB) extraction.
4, the manufacturing installation of the conductive pattern in a kind of printed circuit board (PCB), be to arrange on the printed circuit board (PCB) and forming a plurality of in the 1st identical shaped conductive pattern of certain orientation, with the point-symmetric position of at least a portion of described a plurality of the 1st conductive patterns on, form and the 2nd identical shaped conductive pattern of described the 1st conductive pattern, and make the conductive pattern manufacturing installation of conductive pattern from this printed circuit board (PCB), it is characterized in that
Possess:
Supporting mechanism, it supports described printed circuit board (PCB);
Handle and use anchor clamps, it moves successively to the a plurality of the 1st and the 2nd conductive pattern that is arranged in the described printed circuit board (PCB) that is supported by described supporting mechanism, carries out predetermined process; With
Relatively rotate mechanism, its make described printed circuit board (PCB) and described processing with anchor clamps the position relation when relative, according to the point-symmetric angle that is between described the 1st conductive pattern and described the 2nd conductive pattern, relatively rotate predetermined angular,
And,
The direction of described 2nd conductive pattern of the direction of described the 1st conductive pattern when in order to make described the 1st conductive pattern being handled when described the 2nd conductive pattern is handled is identical, described the 1st conductive pattern being carried out predetermined processing and described the 2nd conductive pattern being carried out between the predetermined processing, carry out the described rotation that relatively rotates the predetermined angular of mechanism.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004124132A JP4497354B2 (en) | 2004-04-20 | 2004-04-20 | Method and apparatus for producing conductive pattern on printed circuit board |
| JP2004124132 | 2004-04-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1691873A CN1691873A (en) | 2005-11-02 |
| CN100452946C true CN100452946C (en) | 2009-01-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2005200124119U Expired - Lifetime CN2819708Y (en) | 2004-04-20 | 2005-04-13 | Conductive pattern manufacturing device of printing circuit board |
| CNB2005100657090A Expired - Fee Related CN100452946C (en) | 2004-04-20 | 2005-04-13 | Method and device for manufacturing conductive patterns in a printed circuit board |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2005200124119U Expired - Lifetime CN2819708Y (en) | 2004-04-20 | 2005-04-13 | Conductive pattern manufacturing device of printing circuit board |
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| Country | Link |
|---|---|
| JP (1) | JP4497354B2 (en) |
| KR (1) | KR100750763B1 (en) |
| CN (2) | CN2819708Y (en) |
| TW (1) | TWI268748B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4497354B2 (en) * | 2004-04-20 | 2010-07-07 | ヤマハファインテック株式会社 | Method and apparatus for producing conductive pattern on printed circuit board |
| JP4986130B2 (en) * | 2007-01-16 | 2012-07-25 | 日本電産リード株式会社 | Board inspection equipment |
| JP4969330B2 (en) * | 2007-06-15 | 2012-07-04 | セイコープレシジョン株式会社 | Multilayer wiring board manufacturing apparatus and manufacturing method |
| KR20090070406A (en) * | 2007-12-27 | 2009-07-01 | 삼성전자주식회사 | Pcb strip and apparatus and method for molding thereof |
| CN102447162B (en) * | 2010-09-30 | 2014-08-27 | 汉王科技股份有限公司 | Antenna board of electromagnetic-type touch pad and manufacturing process thereof |
| CN101969747B (en) * | 2010-10-15 | 2013-07-03 | 安徽四创电子股份有限公司 | Hinge clamp positioning method for printed board processing |
| JPWO2020262198A1 (en) * | 2019-06-28 | 2020-12-30 | ||
| JP7303543B2 (en) * | 2019-08-30 | 2023-07-05 | ヤマハファインテック株式会社 | High-frequency characteristic inspection device and high-frequency characteristic inspection method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07227561A (en) * | 1994-02-18 | 1995-08-29 | Rohm Co Ltd | Waste coating applying device of syringe for applying resin liquid |
| JPH0821867A (en) * | 1994-07-06 | 1996-01-23 | Sumitomo Electric Ind Ltd | In-circuit testing method for printed wiring board |
| US5889407A (en) * | 1993-11-02 | 1999-03-30 | Circuit Line S.P.A. | Press assembly for electrically testing a printed circuit board having an exchangeable lower adapter |
| CN2819708Y (en) * | 2004-04-20 | 2006-09-20 | 雅马哈精密科技株式会社 | Conductive pattern manufacturing device of printing circuit board |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0220697A (en) * | 1988-07-06 | 1990-01-24 | Suehiro Uchiyama | Auxiliary equipment in press machine and its similar machine |
| JPH02137390A (en) * | 1988-11-18 | 1990-05-25 | Fujitsu Ltd | Manufacture of printed-wiring board unit |
| JPH0476981A (en) * | 1990-07-19 | 1992-03-11 | Taiyo Yuden Co Ltd | Integrating substrate for and hybrid integrated circuit manufacture of hybrid integrated circuit device |
| JPH04294593A (en) * | 1991-03-25 | 1992-10-19 | Hitachi Chem Co Ltd | Manufacture of wiring board and device used for manufacturing wiring board |
| JPH04123606U (en) * | 1991-04-25 | 1992-11-10 | 株式会社東芝 | ceramic wiring board |
| JP2846176B2 (en) * | 1992-03-25 | 1999-01-13 | 日本電産リード株式会社 | Printed circuit board inspection method and inspection device |
| JP3071155B2 (en) | 1997-05-16 | 2000-07-31 | ユーエイチティー株式会社 | Method and apparatus for inspecting continuity of substrate for IC package such as BGA, PGA etc. |
| JP3865185B2 (en) | 1998-04-28 | 2007-01-10 | 富士通株式会社 | Semiconductor device, test apparatus and test method thereof |
| JP4047456B2 (en) * | 1998-05-29 | 2008-02-13 | 日置電機株式会社 | Circuit board inspection equipment |
| JP2000295036A (en) * | 1999-04-09 | 2000-10-20 | Murata Mfg Co Ltd | Manufacture of voltage-controlled oscillator, and aggregate substrate for voltage-controlled oscillator |
| JP2003066085A (en) * | 2001-08-23 | 2003-03-05 | Seiko Epson Corp | Testing method of board, testing device of board, and manufacturing method of electro-optical device |
-
2004
- 2004-04-20 JP JP2004124132A patent/JP4497354B2/en not_active Expired - Fee Related
-
2005
- 2005-04-13 CN CNU2005200124119U patent/CN2819708Y/en not_active Expired - Lifetime
- 2005-04-13 CN CNB2005100657090A patent/CN100452946C/en not_active Expired - Fee Related
- 2005-04-14 KR KR1020050031017A patent/KR100750763B1/en not_active IP Right Cessation
- 2005-04-18 TW TW094112272A patent/TWI268748B/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5889407A (en) * | 1993-11-02 | 1999-03-30 | Circuit Line S.P.A. | Press assembly for electrically testing a printed circuit board having an exchangeable lower adapter |
| JPH07227561A (en) * | 1994-02-18 | 1995-08-29 | Rohm Co Ltd | Waste coating applying device of syringe for applying resin liquid |
| JPH0821867A (en) * | 1994-07-06 | 1996-01-23 | Sumitomo Electric Ind Ltd | In-circuit testing method for printed wiring board |
| CN2819708Y (en) * | 2004-04-20 | 2006-09-20 | 雅马哈精密科技株式会社 | Conductive pattern manufacturing device of printing circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI268748B (en) | 2006-12-11 |
| CN2819708Y (en) | 2006-09-20 |
| TW200607414A (en) | 2006-02-16 |
| JP2005310950A (en) | 2005-11-04 |
| KR20060045702A (en) | 2006-05-17 |
| CN1691873A (en) | 2005-11-02 |
| JP4497354B2 (en) | 2010-07-07 |
| KR100750763B1 (en) | 2007-08-20 |
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