KR102550573B1 - Detection device - Google Patents

Abstract

The present invention is an inspection device in which an inspection process is performed in the order of an alignment unit, a probe unit, and a puncture unit, wherein the alignment unit inspects the alignment state of the board, the probe unit inspects the energization state of the board, and the puncture state of the board. A stamping unit may be included.

Description

Inspection device having a stamping unit {Detection device}

The present invention relates to an inspection device for inspecting nicks and the like that may occur after an energization inspection.

In general, a printed circuit board (PCB) is one of the basic and essential parts of almost all equipment such as household appliances such as washing machines and televisions, household goods including mobile phones, or automobiles and satellites.

In recent years, as the degree of integration of various electronic components constituting the printed circuit board has increased, the pattern has been considerably miniaturized and a very sophisticated pattern printing process is required. The importance of inspection is emerging, and inspecting the puncture accordingly may also be an important problem.

The present invention is a device for inspecting dents on a board, and since dents that may occur due to the inspection of the board itself, such as a energization test, can be an important factor in causing defects in the board, by performing the dent test after the energization test, the It is to provide an inspection device for producing a substrate of.

The present invention is an inspection device in which an inspection process is performed in the order of an alignment unit, a probe unit, and a puncture unit, wherein the alignment unit inspects the alignment state of the board, the probe unit inspects the energization state of the board, and the puncture state of the board. A stamping unit may be included.

A second position where the substrate waits before moving to the alignment unit is set, and a shuttle unit for transporting the substrate along a virtual straight line connecting the second position, the alignment unit, and the probe unit can be provided, thereby optimizing the inspection process. can do.

The alignment unit and the stamping unit are located at the third position between the second position and the probe unit to optimize the two-shuttle type inspection.

In the case of testing by the one-shuttle method, a fifth position where the board waits after completion of the stamping test is set, and a path from the second position to the probe unit through the alignment unit is the first path, and the probe unit If a second path is defined as a second path through the stamping unit to the fifth position, the first path and the second path may be in a forward and reverse direction of an imaginary straight line.

In the case of performing the two-shuttle inspection, the first path may be shorter than the second path.

When the alignment unit and the stamping unit are located in the same inspection area, when the shuttle unit moves along the first path or the 1-1 and 1-2 paths, only movement in the first direction is allowed and the position of the alignment unit is controlled. 3 position, and when the position of the stamping unit is the 4-2 position, the third position and the 4-2 position are the same, and the direction from the stamping unit to the probe unit is the first direction, alignment The unit and the stamping unit may be provided at positions spaced apart from each other along the first direction.

The alignment unit and the stamping unit may be provided adjacent to each other, and a process progressing direction from the alignment unit to the probe unit and a process progressing from the imaging unit to the next step may be opposite to each other.

A process progress direction from the alignment unit to the probe unit and a process progress direction from the stamping unit to the next step may be perpendicular to each other.

A plurality of shuttle units for moving the substrate through the first path and the second path are provided, the second position and the fifth position of each shuttle unit coincide with each other, and the second position and the fifth position are can match each other.

1-1 path from the second position to the alignment unit, 1-2 path from the alignment unit to the probe unit, 2-1 path from the probe unit to the stamped unit, When the 2-2 path leads to the fifth position, the 1-2 path is shorter than the 2-1 path, and the 1-1 path and the 2-2 path may coincide with each other.

Further, the 1-2 path may be shorter than the 2-1 path, and the 1-1 path may be shorter than the 2-2 path.

If the first shuttle unit moving the first substrate is positioned on the 2-2 path, the second shuttle unit moving the second substrate may be positioned on the 1-2 path or the 2-1 path. can

An index unit is provided in which the second position, the alignment unit, the probe unit, the stamping unit, and the fifth position occupy each step of the inspection process, and the substrate is inspected in order by the rotation of the index unit. The alignment unit, the probe unit, the imprinting unit, and the fifth position do not overlap each other on the index unit, and a rotation angle when the index unit advances one step may be determined according to the initially set number of steps of the index unit.

A plurality of shuttle units are provided to move the substrate in the order of the alignment unit, the probe unit, and the stamping unit, and the shuttle unit moves from the alignment unit to the probe unit, and the inspection direction is a first direction, from the probe unit to the probe unit. If the direction to be moved and inspected by the stamping unit is the second direction, the plurality of shuttle units have degrees of freedom only in the first and second directions, and movement in the first and second directions may be restricted. there is.

1 is a schematic diagram showing the configuration of an inspection device of the present invention.
Figure 2 (a) is an explanatory diagram explaining the stamping, Figure 2 (b) is an explanatory diagram showing the occurrence of defects due to stamping.
Figure 3 (a) shows the board before the dent occurs, Figure 3 (b) and (c) shows the state where the dent occurs, (b) shows a reference value for determining whether or not a defect occurs, (c) shows that defective marks exceeding the reference value of (b) have occurred.
4 is an explanatory view showing a two-shuttle system of the inspection apparatus of the present invention.
FIG. 5 is an explanatory diagram showing before merging two shuttle units of the two-shuttle system of FIG. 4;
Fig. 6 is an explanatory diagram showing a place where the stamping unit of the inspection apparatus of the present invention can be located.
7 is an explanatory view showing that the second path is modified by providing the stamping unit of the present invention.
8 shows the index unit of the present invention, and is an explanatory diagram showing the case where the index unit is composed of five stages.
Fig. 9 shows the index unit of the present invention, and is an explanatory diagram showing the case where the index unit is composed of four steps.
10 is a schematic diagram showing a loading unit and a loading unit constituting the inspection apparatus of the present invention.
11 is a schematic view showing an alignment unit included in a loading unit constituting the inspection apparatus of the present invention.
12 is a schematic diagram showing a substrate 200 inspected by the inspection apparatus of the present invention.
13 is a schematic diagram showing an inspection unit 190 constituting the inspection apparatus of the present invention.

The board 200 (Bare Board) before the circuit is printed must be tested for continuity after the manufacturing process is finished, and all electrical signals through it must be normal to be shipped. It can be important to determine whether the board 200 has a specific resistance, whether it is normal, short, or open through the conduction test, and classify the board 200 with the error and the board 200 with errors through this. .

During the essential energization test to determine such a defective substrate 200, the test is performed with a probe having a pointed end through a probe, etc., and as a result, the substrate 200 may be dented (D) due to the energization test itself. can A probe is mounted on a robot arm, etc. to contact the substrate 200 and conduct an energization test, and move to another test position by moving on the xy plane composed of x-axis (first direction) and y-axis (second direction) , When the target inspection position is reached, it goes down for inspection in the -z axis (reverse direction of the third direction), and after inspection, it rises in the +z axis (third direction) and moves the xy plane again to another inspection position. Moving can be done repeatedly.

During the operation for inspection, the same substrate 200 is repeatedly arranged on one plate or frame in a grid format in an appropriate number suitable for the facility, rather than using one substrate 200, and during inspection, a plurality of substrates 200 ) may be subjected to an energization test or a stamped (D) test in units of the entire plate or frame in which the arrays are arranged. Therefore, in order to perform inspection by holding a node for a plurality of circuits even during a single inspection, the probe must be able to quickly move in the first direction, the second direction, or the third direction. In order to prevent stamping (D), the third direction movement of the probe slows down the speed when the probe approaches the board 200 so that it adheres smoothly, but the height of the board 200 is different, and the distance and probe of the device in the circuit to be inspected are different. Since the thickness of the probe is on the order of several microns, it is easy to generate a defect error even if it is precisely controlled.

In the case where the imprint D occurs by the energization test, since a part of the imprinted board 200 is dug, an empty space may be created between the board 200 and the circuit when the circuit is printed later. The substrate 200 on which the circuit is printed may go through various processes depending on the purpose, and during this process, heating or cooling may be repeated. Therefore, due to the empty space, an error in which the circuit itself is turned off or inflated may occur as the air in the empty space contracts or expands. That is, after the energization test, puncture may occur due to the energization test itself. During the energization test, the probe of the probe unit moves up and down and can contact the target point. When the probe and the substrate come into contact, the impact of the substrate can be alleviated by slowing the elevation speed of the probe only near the vicinity.

When the circuit is mounted on the board 200 by leaving the mark D unattended and operating the facility for several hours or days, the problem of discarding the circuit itself, which is several times more expensive than the board 200, may occur, so the user It may be necessary to manage the stamping (D) periodically and frequently, such as in an hourly unit.

The controller may calculate a substrate position error of the alignment unit 170 through a camera located in the alignment unit 170 . The substrate position error stored in the control unit can be corrected by moving or rotating the table on which the substrate is placed in the probe unit 190 in the opposite direction.

The control unit may move the substrate to a position and angle correcting the substrate position error calculated by the alignment unit 170 and then control the substrate placement table of the probe unit so that the probe can contact the precise measurement point of the substrate.

When the stamping test is performed using the control unit, the controller compares the stamping of the board by the probe with a reference value, and determines that the stamping is defective when the photographing D of the image taken by the camera is equal to or greater than the reference value.

In the dent (D), there is an error due to the energization test itself in terms of structure, but defects may occur due to abrasion or bending in the probe itself, and foreign substances may be caught in the probe to cause defects. Therefore, defects due to the dent D may include defects due to defects in the probe itself or foreign substances in addition to peripheral factors that change the predetermined inspection distance between the probe and the substrate 200 . That is, since the factors of the imprint (D) are diverse, the exact shape of the imprint (D) is recognized using a camera capable of discriminating several microns at the level of a microscope, and the imprint (D) is classified by cause. ) It is possible to quickly find and cope with the cause of the stamping (D) determined by the unit 300.

An amount of the substrate etched by a probe provided in the probe unit may be photographed by a camera of the imaging unit.

The control unit may compare the stamping amount of the substrate with a reference value based on an image obtained from a camera of the photographing unit. The control unit may determine at least one of abrasion of the probe, bending of the probe, and a foreign substance caught in the probe from the comparison result.

Since a defective rate may occur in the substrate 200 due to the essential energization test itself for determining the defective rate of the substrate 200, this also needs to be regarded as one of the defective rates and classified through inspection. That is, during a series of processes in which the substrate 200 is loaded, inspected, and unloaded again, the probe unit 190 for inspecting the current of the substrate 200 is nicked (D) for inspecting the nick (D) caused by the energization. It may be a previous stage of the unit 300.

The dent (D) test may be to check the dent (D) by an energization test. Since it takes too long to check all circuit connections during the power test, the user sets the position of the board 200, which is more dense and complicated according to the pattern of the specific board 200, where defects are likely to occur. , and selective testing can be performed. In this case, by dividing sections by time and setting different positions according to each section, data on which section has a high defect rate can be collected and used for analysis. Therefore, since only the sampling position set by the user in each section can perform the energization test, the puncture (D) unit 300 refers to the location data of the energization test rather than inspecting the entire circuit to perform the energization test. can be done quickly.

Depending on the case of using the shuttle unit 150 and the case of using the index unit 400, the inspection process of the inspection device can be divided into a shuttle method and an index method, and the shuttle method includes a one-shuttle method using one shuttle and two There may be a two-shuttle method using two shuttles. In the shuttle method, the substrate 200 may be moved by the shuttle unit 150 along a virtual straight line from the standby position to the inspection position in the process of conducting the inspection, and in the index method, the index unit 400 Depending on the rotation, each unit or each part of the inspection device may be moved one step at a time and the process may be performed.

An inspection apparatus using a shuttle method will be described first.

1 is a schematic diagram showing an inspection device of the present invention. The inspection apparatus of the present invention includes a first loading unit 110, a loading unit 130, 140, a shuttle unit 150, an alignment unit 170, a probe unit 190, a second loading unit 120, a stamped ( D) may include a unit 300. Actual inspection of the inspection device may be performed on a straight line inspection path by the shuttle unit 150 of the alignment unit 170 , the probe unit 190 , and the stamping (D) unit 300 .

Inspection herein means at least one of an alignment inspection by the alignment unit 170, an energization inspection by the probe unit 190, and a puncture (D) inspection by the puncture (D) unit 300, unless specifically referred to herein. can do. The inspection sequence of the inspection device is based on the energization test of the board 200, the alignment unit 170 may be performed before the energization test, and the puncture (D) test may be performed after the energization test.

A position where the board 200 is loaded before inspection may be referred to as a first position P1 , which may be a position of the first loading unit 110 . A position at which the substrate 200 is loaded by the shuttle unit 150 before starting an operation by the shuttle unit 150 may be referred to as a second position P2 . By placing the substrate 200 at a position prior to the start of the inspection prior to the start of a full-scale inspection rather than being directly transferred from the loading unit to an inspection unit such as the alignment unit 170, the driving of the loading unit and shuttle unit in the inspection process is separated. This can result in a faster inspection. Therefore, in terms of the inspection process, the substrate 200 can be transported by the first loading unit 130, the shuttle unit, and the second loading unit 140, and all inspections can be performed while being moved by the shuttle unit. there is.

The second position P2 may be referred to as an initial position ⓘ. The substrate 200 may be moved from the first position P1 to the second position P2 by the first loading unit 130 . The initial position ⓘ may be the second position P2 or the fifth position P5 in the case of two shuttles. That is, the initial position ⓘ may be a waiting place before moving the substrate 200 before the energization test or the stamping (D) test by the first loading unit 130 to the shuttle unit 150 for inspection, and the shuttle unit ( 150), it is possible to increase the inspection efficiency of the entire inspection apparatus. For example, a direction in which the substrate 200 faces the alignment units 170, 170 and probe units 190, 190 from the initial positions (ⓘ, P2, P5) is a first direction, and the first direction is It may be in the x-axis direction of FIG. 1 . A direction perpendicular to the first direction and in which the shuttle unit 150 moves the substrate 200 after inspection along the second path may be referred to as a second direction, and the second direction may be the y-axis direction of FIG. 1 . A direction perpendicular to the first direction and the second direction and opposite to the inspection direction of the probe units 190 and 190 may be referred to as a third direction, and the third direction may be the z-axis direction of FIG. 1 .

The alignment unit 170 can check the alignment state of the substrate 200 using a camera or the like, and this position can be referred to as the third position (P3), and the substrate 200 is moved to the second position (P3) by the shuttle unit. It may be moved from P2) to the third position P3. The position at which the probe unit 190 conducts the continuity test may be referred to as the fourth position P4, and for the efficiency of the inspection operation, the second position P2, the third position P3, and the fourth position P4 are It can be arranged on a straight line (ⓐ).

The position at which the substrate 200 that has undergone the continuity test completes the movement by the shuttle unit 150 may be referred to as a fifth position P5, and the substrate 200 is moved to the fifth position by the second loading unit 140. It can be moved from (P5) to the sixth position (P6). The sixth position P6 may be the position of the second loading unit 120 . The second stacking unit 120 can be provided in plurality because it can separate the normal substrate 200 and the defective substrate 200 after inspection. A plurality of defective substrates 200 may be provided again in order to classify according to the cause of the defective substrates 200 through inspection. Among the plurality of second loading units 120 , in FIG. 1 , the position of the second loading unit 120 where the top substrate 200 is placed may be shown as a sixth position P6 .

A path from the initial position ⓘ to the probe unit 190 may be referred to as a first path, and a path up to the fifth position P5 after the energization test may be referred to as a second path. That is, the first path may be a path from the second location P2 to the fourth location P4, and the second path may be a path from the fourth location P4 to the fifth location P5. In the case of the one-shuttle method, since all inspections are performed by one shuttle, no interference problem occurs, and the first path and the second path may be the same. However, in the case of the two-shuttle method, in order to avoid an interference problem between the first shuttle unit 150a and the second shuttle unit 150b, the first path and the second path may be set differently, and the shuttle unit moves The first path may be shorter than the second path because the inspection by the inspection device takes more time than time. Therefore, the first path is arranged in a straight line that can quickly pass through the second position (P2) to the fourth position (P4), and the second path can bypass the first path by adding motion in the second direction. .

Since the stamping (D) test may be performed after the energization test, the stamping (D) unit 300 may be located between the fourth position P4 and the fifth position P5. Therefore, the fourth position (P4) can be divided into a 4-1 position (P4-1) for conducting an electricity test and a 4-2 position (P4-2) for a puncture (D) inspection.

Since the stamping (D) unit 300 can be located at any point on the second path, the 4-1 position (P4-1), the 3rd position (P3), the 5th position (P5) or the 4-1st position (P4-1) It may be located at any one of the position P4-1 and the fifth position P5.

When the 4-2 position (P4-2) is provided between the 4-1 position (P4-1) and the 5th position (P5) for the puncture (D) inspection, the first shuttle unit (150a) and Two stamping (D) units 300 by the second shuttle unit 150b may be required. In addition to twice the equipment cost of the stamped (D) unit 300, the board 200 tested by electricity is divided and inspected by two units, so when the cause of the defective board 200 is found, the stamped (D) unit 300 ) can double the risk of a bad factor.

① to ⑥ in the drawing may indicate the entire process of inspecting the substrate 200 by the inspection device in order. For example, ① indicates movement from the first loading unit 110 to the second position P2 serving as a stop by the first transfer unit, and ② indicates alignment at the second position P2 for alignment inspection. Moving to the unit 170, ③ indicates that the board 200 after alignment inspection moves to the 4-1 position (P4-1) and moves to the probe unit 190 for power inspection, ④ Indicates that the substrate 200 that has completed the energization test moves to the stamped (D) unit 300 at the 4-2 position (P4-2) for the stamped (D) test, ⑤ is the stamped (D) test The substrate 200 that has completed the step moves to the 4-2 position (P4-2) and moves to the fifth position (P5) where it prepares to move to the loading unit. It may indicate movement from the fifth position P5 (second position P2) to the sixth position P6 of the second loading unit 120.

When the puncture (D) unit 300 is provided at the 4-1 position (P4-1), the energization test and the dent (D) test may be performed at the same location. Among the test operations of the present invention, the energization test may take a longer time than consumption time at other locations. Therefore, in the case of the two-shuttle method, interference between shuttle units is likely to occur, and the time of the inspection process may be delayed.

The stamping (D) unit 300 may be provided at the fifth position P5, and the fifth position P5 may be the same as the initial position, the second position P2. Each shuttle unit may be separately provided at the fifth position P5, but in this case, a plurality of second loading units 120 for loading the normal substrate 200 may be provided, and again the plurality of loading units are loaded. Equipment to bring the substrate 200 together may be required. This complicates the process, delays time and may cause other defects. Therefore, the second position P2 and the fifth position P5 serving as a stop between the shuttle unit and the loading unit may be the same. Since the fifth position (P5) serves as a stop between the shuttle unit and the loading unit, in addition to interference between the first shuttle unit 150a and the second shuttle unit 150b, communication between the first transfer unit and the second transfer unit Interference may also be considered. That is, since the four facilities move sequentially in the automation process, the inspection design may be too complicated to perform the dent (D) inspection at the fifth position (P5).

Accordingly, the stamping (D) unit 300 may be provided at the third position (P3). That is, the third position P3 may be the same as the 4-2 position, and an alignment test and a dent (D) test may be performed.

The alignment unit 170 can check the alignment state of the board 200 by the first camera, and the stamping (D) unit 300 can check the stamping (D) of the board 200 by using the second camera. there is. The second camera may have a narrower field of view (FOV) than the first camera. This may be because the dent D is caused by an electrical test, and thus can be identified by a microscopic level of resolution.

At the third position (P3), the alignment unit 170 and the stamping (D) unit 300 may be vertically divided based on the first path, or the center of each unit may pass through the first path. In the case of being vertically divided based on the first path, the shuttle unit needs to be moved to align the center in the second direction for alignment inspection and puncture (D) inspection, which may cause defects due to position adjustment. Accordingly, the two units may be arranged at the third position P3 (the 4-2 position P4-2) so that each unit passes through the center of the first path.

According to the operation of the two shuttle units, each shuttle unit may be located at the same time at the third position (P3). When each shuttle unit is located at the third position (P3) at the same time, for example, the alignment unit 170 may be located downstream of the stamping (D) unit 300 on the second path, and the alignment unit ( The shuttle unit entering 170) enters the third position P3 earlier than the shuttle unit entering the stamped (D) unit 300, so that mutual interference can be avoided. Here, upstream and downstream may be the same as before and after the time series of the inspection process in the first path or the second path, and the shuttle unit may be in a state in which the degree of freedom of movement in the third direction (z direction) is limited. . When the shuttle unit moves without restriction in the third direction, interference between the shuttle units can be easily avoided, but the risk of control failure due to the additional degree of freedom may increase. When the shuttle unit has a degree of freedom in the third direction, the entry time of each shuttle unit to the third position (P3) can be simultaneously entered without limitation.

When the puncture (D) unit 300 is provided together with the alignment unit 170 at the third position (P3), after the puncture (D) inspection, the shuttle unit moves from the 4-2 position (P4-2) to the 5th position. When moving to (P5), it is necessary to move from the third position (P3) to the second position (P2). In this case, the shuttle unit may pass through a path that overlaps the first path in the reverse direction or a path that bypasses the first path. there is. Therefore, in this case, the first path is the path moving from the second position P2 to the third position P3 is the 1-1 path R1-1, and from the third position P3 to the 4-1 position. The path to (P4-1) may be included as the 1-2 path, and the second path is the 2-1 path (R2) from the 4-1 position (P4-1) to the 4-2 position. -1), the 2-2nd path (R2-2) may be included from the 4-2nd position (P4-2) to the 5th position (P5). That is, ⑤ in the drawing may indicate the 2-2 path (R2-2) path.

When the 2-2 route (R2-2) coincides with the 1-1 route (R1-1) in the reverse direction, the speed of the inspection process is reduced compared to the detour route, but there is a possibility of interference between each shuttle unit. may increase, and this may be referred to as the first method. If the path 2-2 (R2-2) is a detour path other than the path 1-1 (R1-1), the time of the inspection process is relatively more consumed, but the problem of interference between shuttle units can be avoided. , and this can be referred to as the second method.

In the case of the second method, for example, the time at which the first shuttle unit 150a enters the 4-2 position (P4-2) after the energization test and the time at which the second shuttle unit 150b enters the alignment unit 170 ), the interference problem between shuttle units can be easily avoided. For example, when the first shuttle unit 150a is in the first path, the second shuttle unit 150b may be in the second path, and vice versa, and the first shuttle unit 150b of each shuttle unit may be in the second path. The paths can be the same.

In the case of the first method, for example, after the puncture (D) inspection, the first shuttle unit 150a moving from the 4-2 position (P4-2) to the 5th position and the second shuttle unit 150a for alignment inspection The second shuttle units 150b moving from the position P2 to the third position P3 may interfere with each other. Therefore, when the first shuttle unit 150a is on the 2-2 path (R2-2), the second shuttle unit 150b is on the 1-2 path (R1-2), the 2-1 It is located on any one of the paths (R2-1) to avoid interference between each shuttle unit. Conversely, when the first shuttle unit 150a transfers the substrate 200 from the second position P2 to the third position P3 for alignment inspection, the second shuttle unit 150b moves the first-2 Interference between shuttle units can be avoided by being located on either the path R1-2 or the 2-1 path R2-1.

The above interference problem between the shuttle units may be a case in which the movement of the shuttle units is restricted on the x-y plane while a specific z value is fixed. If there is no restriction on the movement of each shuttle unit in the third direction, the interference problem can be avoided even if each shuttle unit is on the same path. For example, when the first shuttle unit 150a and the second shuttle unit 150b simultaneously perform alignment inspection and puncture (D) inspection at the third position P3 (the 4-2 position), or 1 The shuttle unit 150a is stamped (D) The path of moving the board 200, which has been inspected, from the third position (P3) to the fifth position (P5) through the 2-2 path (R2-2) path For alignment inspection, even when the path of the second shuttle unit 150b moves the substrate 200 from the second position P2 to the third position P3 coincides with each other, the vertical positions of the respective shuttle units are determined relative to each other. Interference can be prevented by adjusting. However, if the degree of freedom is given to the third direction of each shuttle unit in this way, since the distance to each inspection device is different for each shuttle unit during alignment inspection, energization inspection, or puncture (D) inspection, the position must be set individually In the case of vision inspection using a camera or the like, since the focal length may vary due to a difference in vertical distance, a plurality of cameras may be provided or a complexity of having to inspect a different focal length for each shuttle unit may occur. In addition, since the process through the inspection device is a very fine inspection at the level of several microns, the addition of an additional motion or process may advance the timing of the accumulated defect rate.

Therefore, the configuration of a simple inspection process in the shortest time can reduce the cost due to the increase in yield, as well as lower the cumulative defect rate of repeated processes.

The inspection device using the index method may bend a straight line path of the alignment unit 170 and the probe unit 190 in the circle shuttle method in a round circle method. The index method may be a method in which steps of each inspection process are sequentially performed by rotation on a turntable, rather than a method by a straight path by a shuttle unit.

For example, similar to the process in which the shuttle unit and the loading unit are separated in the shuttle method, an index unit 400 corresponding to the shuttle unit may be provided, and the index unit 400 and the loading unit are separated in the index method. Thus, the process can proceed. That is, by the loading units 130 and 140, the substrate 200 is transferred from or to the loading unit at the second position P2 and the fifth position P5 corresponding to the previous and subsequent positions of the inspection process. can

Each process position of the index unit 400 may be the second position (P2) to the fifth position (P5), and the inspection is performed while the one-step turntable rotates in the order of time series with the substrate 200 positioned at each position. can The role in the inspection process at the first position P1 to the sixth position may be the same as that of the shuttle method. Each position of the index unit 400 may have various polygonal shapes according to process settings. Unlike the shuttle method, each step of the inspection process may occupy one vertex of the turntable polygon, and it may be difficult to provide two or more processes at one vertex.

Accordingly, the table rotation angle may be determined according to the number of processes provided in each index unit 400, and in the case of n steps, the rotation angle per one of each process may be 360/n. For example, when included in the index unit 400 from the second position P2 to the fifth position P5, it may have a pentagonal shape, and the rotation angle of the turntable may be 72° (360/5). . When the second position P2 and the fifth position P5 are the same position, they may have a rectangular shape, and one rotation angle of the turntable may be 90° (360/4).

For understanding compared to the case where the stamping unit is provided, the case of the inspection device excluding the stamping unit may be described as follows.

The substrate 200 may be loaded on the first loading unit 110 . The substrate 200 loaded on the first loading unit 110 may be a substrate 200 subject to a puncture test, that is, an energization test or a test for dents by a probe after the energization test. At this time, the board 200 may be a printed circuit board before various components are mounted. A printed circuit board is one in which copper foil is coated on a substrate 200 made of a material such as paper phenol resin or glass epoxy resin, and various circuits are printed. The printed circuit board is formed by removing the remaining parts where circuits are not printed by an etching technique such as etching, and various electronic components are soldered and mounted on these circuits. In general, in order to test the continuity of each contact part of the printed circuit board, an electric signal is sent to each contact part of the printed circuit board by various test equipment. At this time, it is possible to determine whether or not there is an abnormality in the printed circuit board by checking the conduction state of the current.

The loading units 130 and 140 may move the substrate 200 loaded on the first loading unit 110 to an initial position ⓘ.

In some cases, a cleaning unit 180 may be disposed between the loading units. The loading unit at this time may be the first loading unit 110 on which the board is loaded before inspection.

The cleaning unit 180 may remove foreign substances from the inspection surface of the substrate 200 on which the energization test is performed by the inspection unit 190 . For example, the cleaning unit 180 may include a roller that wipes the surface of the substrate 200 . It is preferable that the part cleaned by the cleaning unit 180 includes at least a region of the substrate 200 that is inspected by the inspection unit 200 . When the cleaning unit 180 is disposed, the loading unit may move the substrate 200 that has passed through the cleaning unit 180 to an initial position ⓘ. For reference, a third loading unit may be provided to move the substrate 200 loaded in the loading unit upstream of the cleaning unit 180 .

The shuttle unit 150 may transfer the substrate 200 at the initial position ⓘ along the transfer path of the substrate 200 . The substrate 200 moved to the initial position ⓘ by the first loading unit 110 may move together with the shuttle unit 150 while being placed on the shuttle unit 150 . Alternatively, after the substrate 200 is placed on a separately prepared cradle, the cradle is transported by the shuttle unit 150, so that the substrate 200 placed on the cradle can also be transported together. In the drawing, an example in which the substrate 200 is placed on the shuttle unit 150 is disclosed.

The alignment unit 170 is located on the transfer path of the substrate 200 and can check the alignment state of the substrate 200 using a camera or the like. The alignment state of the substrate 200 whose alignment state has been confirmed may be corrected by the alignment unit 170 or may be corrected by the shuttle unit 150 . Alternatively, the alignment state of the substrate 200 may be relatively corrected by position correction of the inspection unit 190 that obtains alignment state information from the alignment unit 170 .

The inspection unit 190 is located downstream of the alignment unit 170 on the transfer path of the substrate 200 and can inspect the energized state of the substrate 200 using a probe 193 or the like. The alignment unit 170 is an element that allows reliable inspection in the inspection unit 190 to be performed by checking the alignment state of the substrate 200 . Therefore, it is preferable that the inspection unit 190 be located downstream of the alignment unit 170 . At this time, a position close to the initial position ⓘ in the direction in which the substrate 200 is transferred becomes an upstream, and a position far from the initial position becomes a downstream. Thus, downstream of the alignment unit 170 represents a position that is farther away from the initial position ⓘ compared to the distance from the initial position ⓘ to the alignment unit 170 . During the inspection process, since the substrate 200 moves in the positive direction of the x-axis from the initial position ⓘ, a position having an x-coordinate value greater than the x-coordinate value of the alignment unit 170 becomes downstream.

In the second loading unit 120 , the inspected substrate 200 may be loaded in the inspected unit. The second loading unit 120 may be configured in plurality. For example, a unit in which the substrate 200 determined to be normal in the inspection unit 190 is loaded, a unit in which the substrate 200 determined to be short is loaded, and a substrate 200 determined to be open are Can include loaded units. In this case, each unit constituting the second loading unit 120 may be positioned at a location determined according to the number of substrates 200 to be loaded. For example, it is assumed that the number of normal substrates 200 is the highest, the number of short substrates 200 is next, and the number of open substrates 200 is the lowest. At this time, the unit on which the normal substrate 200 is loaded may be disposed closest to the initial position. The unit loaded with the open substrate 200 may be disposed farthest from the initial position, and the unit loaded with the short substrate 200 may be disposed in the middle of the two units. In some cases, the two units may be disposed at the same location from the initial location. In summary, the second loading unit 120 is formed in plurality, and substrates 200 having different test results may be loaded on each second loading unit 120 . At this time, the second loading unit 120 on which a relatively large number of substrates 200 are loaded may be disposed closer to the initial position compared to the second loading unit 120 on which a relatively small number of substrates 200 are loaded. can According to this, movement of the loading unit can be minimized and power consumption of the loading unit can be reduced. In addition, it is possible to reduce the time required to load the substrates inspected by the loading unit into the second loading unit 120 . This can reduce the overall inspection time.

The inspection device of the present invention includes a first loading unit 110, loading units 130 and 140, a shuttle unit 150, an alignment unit 170, an inspection unit 190, and a second loading unit 120. The energization test of the substrate 200 can be automatically performed. In particular, the board 200 before inspection and the board 200 after inspection are separated and stacked in the first loading unit 110 and the second loading unit 120, so that the board 200 before inspection and the board 200 after inspection ) to prevent mixing.

Meanwhile, the shuttle unit 150 may transfer the substrate 200 inspected by the inspection unit 190 to an initial position. At this time, the loading unit may load the substrate 200 inspected by the inspection unit 190 and transported to the initial position by the shuttle unit 150 onto the second loading unit 120 . According to this, the substrate 200 before inspection and the substrate 200 after inspection can be stacked near each other. For example, the first loading unit 110 and the second loading unit 120 may be disposed on an imaginary vertical line ⓒ with respect to the transfer path ⓐ of the substrate 200 from the initial position to the test unit 190 . According to this configuration, since the first loading unit 110 and the second loading unit 120, which can be transported by the user, can be arranged almost nearby, work convenience can be increased. In addition, since the loading units are disposed on only one side of the x-axis, there is an advantage in that space utilization is higher compared to the case where each loading unit is disposed on both sides with the inspection unit 190 in the middle on the x-axis. In addition, the moving path of the loading unit for moving the substrate 200 in the first loading unit 110 to the initial position and transferring the substrate 200 in the initial position to the second loading unit 120 can be minimized. In addition, when there are a plurality of loading units, since each loading unit is gathered nearby, each loading unit can also be arranged near each other. Therefore, compared to the case where loading units are scattered far from each other, there is an advantage in that space utilization is high.

The inspection apparatus of the present invention inspects the energization state of the substrate 200 transferred in the x-axis direction from the (x ₁ , y ₁ ) coordinates on the xy plane, and the inspected substrate 200 is (x ₁ , y _a ) It may be loaded into coordinates (where a is a natural number other than 1).

A plurality of loading units may exist. For example, two loading units are disclosed. The first loading unit 130 may move the substrate 200 loaded on the first loading unit 110 to an initial position. The second loading unit 140 may transfer the substrate 200 inspected by the inspection unit 190 and transported to the initial position by the shuttle unit 150 to the second loading unit 120 . The first loading unit 130 moves only the 'substrate 200 before inspection' and the second loading unit 140 moves only the 'substrate 200 after inspection', thereby improving the speed of transferring the substrate 200. . In addition, since the moving path of each loading unit can be simplified, control is easy and interference problems such as collision between loading units can be easily resolved.

The movements of the first loading unit 110, the loading unit, the shuttle unit 150, the sorting unit 170, the inspection unit 190, and the second loading unit 120, that is, the degrees of freedom described above, may be as follows. . For convenience of description, a spatial coordinate system in which the transfer path of the substrate 200 from the initial position to the test unit 190 is set in the x-axis direction is shown. Of course, the spatial coordinate system may be applied in various ways. The degree of freedom at this time will be defined as a degree of freedom in a state in which each unit is driven to inspect the substrate 200 as a degree of freedom at work. On the other hand, the degree of freedom of setting represents the degree of freedom of each unit in the process of setting each unit to an initial design value before the inspection of the substrate 200 . For reference, Degrees of Freedom (DOF or Mobility) refers to the number of independent variables that can minimally represent the state of an object. In general, a two-dimensional object has a DOF value of 3. This includes the two-dimensional coordinates of the reference point and the tilted angle of the object. Similarly, a 3D object has a DOF value of 6 because it needs to express the 3D coordinates of the reference point and the angle of rotation for each axis.

According to the illustrated spatial coordinate system, the first loading unit 110 and the second unit may have a z-axis work degree of freedom when driven in the xyz space. For example, each loading unit can move up and down based on the ground.

In the xyz space, the loading unit can have x-axis, y-axis, and z-axis degrees of freedom during operation. For example, the loading unit can move up, down, and horizontally relative to the ground.

In the xyz space, the shuttle unit 150 may have x-axis and y-axis degrees of freedom during operation. For example, relative to the ground, the shuttle unit 150 may perform horizontal movement.

In the xyz space, the alignment unit 170 may be fixed during operation. That is, the alignment unit 170 may be a fixed unit.

In the xyz space, the inspection unit 190 may have a z-axis degree of freedom when driven. For example, the inspection unit 190 may perform an ascending or descending movement based on the ground.

In the process of inspecting the substrate 200, the substrate 200 needs to be positioned and introduced into the alignment unit 170 and the inspection unit 190. By the way, according to the inspection apparatus of the present invention, the alignment unit 170 is fixed, and the inspection unit 190 has a z-axis work degree of freedom. Therefore, the substrate 200 should be transferred to the positions of the alignment unit 170 and the inspection unit 190, and the positions should also be corrected. Transfer of the substrate 200 means movement in the x-axis or y-axis in the xyz plane, and the transfer of the substrate 200 is performed by the shuttle unit 150. Thus, the shuttle unit 150 has the degree of freedom of operation in the x-axis and y-axis. The inspection device of the present invention may also perform position correction of the substrate 200 by using the x-axis and y-axis degrees of freedom given to the shuttle unit 150 to transfer the substrate 200 .

According to the configuration described above, it is possible to minimize the movement of the alignment unit 170 and the inspection unit 190, which are relatively heavy compared to the shuttle unit 150. As a result, it is possible to improve the work speed and at the same time, precise inspection is possible. Also, power consumption can be reduced.

In order to improve the working speed, the transfer path of the substrate 200 by the shuttle unit 150 can be determined as follows.

The transfer path ⓐ of the substrate 200 from the initial position to the test unit 190 is defined as the first path, and the transfer path ⓑ of the substrate 200 from the test unit 190 to the initial position is defined as the second path. In this case, the length of the first path may be shorter than that of the second path. When a single shuttle unit is provided, the first path and the second path may be the same. However, when a plurality of shuttle units are provided and the first path and the second path are the same, an interference problem occurs in that each shuttle unit collides with each other. Therefore, when at least two shuttle units are provided, the first route and the second route must be different, and work efficiency may vary depending on how the different routes are configured.

In general, it takes a lot of time to check the alignment state of the substrate 200 by the alignment unit 170 and inspect by the inspection unit 190 compared to the transfer time of the shuttle unit 150 during the power test. Therefore, in order to reduce the overall test time of the substrate 200, it is advantageous to minimize the transport distance from the initial position to the alignment unit 170 and the transport distance from the alignment unit 170 to the inspection unit 190. This objective can be achieved by making the length of the first path shorter than the length of the second path.

Specifically, the initial position, the alignment unit 170 and the inspection unit 190 may be provided on a virtual straight line.

In order to improve work speed, a plurality of shuttle units 150 may be provided.

The first shuttle unit 150a and the second shuttle unit 150b may transfer the substrate 200 using different paths among the first path and the second path. For example, when the first shuttle unit 150a is operating on the first route, the second shuttle unit 150b operates on the second route, and when the first shuttle unit 150a is operating on the second route, the second shuttle unit 150b operates on the second route. The unit 150b may operate on the first path. In this case, the first path of the first shuttle unit 150a and the first path of the second shuttle unit 150b may be the same. That is, in FIG. 1 , both the first shuttle unit 150a and the second shuttle unit 150b may use path ⓐ as the first path. The second path of the second shuttle unit 150b and the second path of the second shuttle unit 150b may be formed with the first path interposed therebetween. According to this embodiment, even when a plurality of second shuttle units 150b are provided, the length of the first path may be shorter than that of the second path. For example, the first path may be formed on a straight line regardless of the number of second shuttle units 150b.

Among the substrates 200 loaded in the loading unit, a substrate located on the uppermost layer with respect to the ground (a substrate having a maximum value in the positive direction of the z-axis) is defined as an uppermost substrate.

First, an embodiment applied to the first loading unit 110 will be described.

At least when the top layer substrate is loaded by the loading unit, the height from the ground to the top layer substrate may be constant regardless of the number of substrates 200 loaded in the loading unit.

When the uppermost substrate (n-th substrate) located at a height ⓓ from the ground is moved upstream of the inspection unit 190 by the loading unit, the height ⓔ from the ground to the next uppermost substrate (n-1th substrate) is n lowered by the thickness of the substrate. According to this, in order to load the n−1 th substrate, the loading unit must descend further by the thickness of the n th substrate. Such operation of the loading unit is undesirable because it causes interference with the loading unit and complexity of control. In order to make the position where the substrate 200 is loaded by the loading unit is constant, the loading unit may raise the n−1 th substrate by the thickness of the n th substrate.

To this end, the loading unit may include a loading unit 111 in which the substrate 200 is loaded and moved along the z-axis direction or the gravity direction.

When the substrate 200 of the first height is loaded from the ground by the loading unit, the loading unit 111 may raise the substrate 200 of the second height to the first height.

However, the thickness of the substrate 200 is becoming very thin due to modern high integration and miniaturization. Therefore, it may be difficult for the loading part 111 to reliably rise as much as the thickness of the substrate 200 due to mechanical errors such as back lash. In order to reduce these mechanical errors, it is advantageous to increase the control distance.

Accordingly, the loading unit 111 may lower the substrate 200 of the second height to the first height without directly raising it to the third height and then raise the substrate 200 to the first height. In FIG. 1 , the first height may be ⓓ, the second height may be ⓔ, and the third height may be ⓕ. At this time, each height may have a relationship of ⓓ > ⓔ > ⓕ. According to this configuration, the loading unit is driven in the order of the left figure, the middle figure, and the right figure in FIG.

Next, an embodiment applied to the second loading unit 120 will be described.

At least at the time when the substrates 200 transferred from the downstream of the inspection unit 190 by the loading unit are unloaded, the height from the ground to the uppermost substrate may be constant regardless of the number of substrates 200 loaded in the loading unit.

Contrary to the previous example, this is a case where the board 200 is loaded into the loading unit after inspection. At this time, it is necessary to lower the uppermost substrate by the thickness of the substrate 200 . Even at this time, the loading part 111 may descend as much as the thickness of the substrate 200 . Alternatively, in order to improve precision, the thickness of the substrate 200 may be lowered and then appropriately raised.

That is, when the first height ⓓ > second height ⓔ > third height ⓕ has a relationship, the loading unit 111 may lower the uppermost substrate of the first height to the third height and then raise it to the second height. . According to this configuration, the loading unit 111 is driven in the order of the right picture, the middle picture, and the left picture in FIG.

The loading unit may include an arm 131 having degrees of freedom for operation in the x-axis, y-axis, and z-axis, and a suction unit 133 formed at an end of the arm 131 and adsorbing the substrate 200 . In order to minimize damage to the substrate 200 when the substrate 200 is adsorbed, the adsorption unit 133 may have a shorter z-axis degree of freedom compared to the z-axis degree of freedom of the arm 131 .

Among the loading units, the first loading unit 130 moves the substrate 200 to an initial position before testing. In this case, the substrates 200 to be loaded may be loaded in plurality in the first loading unit 110 . When the substrate 200 is thin, when the top layer substrate is loaded, the substrate 200 below it may adhere to the top layer substrate and be loaded together. When the plurality of substrates 200 are placed in the initial position, a large error may be caused in inspecting the substrate 200, so only the uppermost substrate needs to be loaded reliably. To this end, after loading the substrate 200 loaded in the loading unit, the loading unit may ascend by a first distance h ₁ and then reciprocate up and down in a second distance interval h ₂ shorter than the first distance. This action is similar to the so-called shaking off action. Only the uppermost substrate 200 can be reliably loaded into the loading unit by the removal operation of the loading unit.

Meanwhile, when the substrate 200 of the first loading unit 110 is loaded by the loading unit or the substrate 200 of the loading unit is unloaded by the second loading unit 120, the loaded substrate 200 is xy It may be distorted in a planar direction. In order to improve inspection reliability of the board 200 before inspection and to increase management convenience of the board 200 after inspection, it is preferable to align the disordered board 200 . To this end, each loading unit may include an alignment unit.

The aligning unit may load a plurality of substrates 200 in the z-axis direction in the xyz space, and align at least the uppermost substrate 200 among the stacked substrates 200 in at least one of the x-axis direction and the y-axis direction. .

In order to align the substrate 200 on a plane, the substrate 200 needs to be guided in four directions. Accordingly, two first alignment units 113 moving in the x-axis direction and two second alignment units 115 moving in the y-axis direction may be provided. In order to improve alignment reliability and simplify the configuration, the loading unit may replace one of the first alignment units 113 and one of the second alignment units 115 with a fixing unit 117 .

The fixing part 117 is formed of a fixed element such as a wall and may contact the substrate 200 in at least one of the x-axis direction and the y-axis direction. It is in contact with the substrate 200 in the x-axis direction and the y-axis direction, and accordingly, the substrate 200 is aligned in the xy plane direction with one first aligning part 113 and one second aligning part 115. can

The substrate 200 may be provided with a plurality of circuit patterns 210 and alignment marks 230 formed for each circuit pattern. Each circuit pattern 210 may be a unit mounted on a product. For example, eight circuit patterns are shown, and each circuit pattern may form a substrate of a mobile communication terminal. That is, the substrate 200 may be separated into eight circuit patterns in a post-process performed downstream of the inspection device and installed in each mobile communication terminal.

In this way, when a plurality of circuit patterns are included in one substrate 200, alignment marks may be formed for each circuit pattern in order to promote convenience in subsequent processes.

The alignment unit 170 constituting the inspection device of the present invention can check the alignment state of each circuit pattern using each alignment mark provided for each circuit pattern. That is, the alignment unit 170 of the present invention can check the alignment state of all alignment marks regardless of the inspection unit of the inspection unit 190 .

The inspection unit 190 is located downstream of the alignment unit 170 on the transfer path of the substrate 200, and can inspect the energization state of each circuit pattern by using one or more circuit patterns as an inspection unit. In this case, the inspection unit may be the number of circuit patterns that can be inspected during one-time driving of the inspection unit 190, specifically, one z-axis reciprocating motion in the xyz space.

The inspection target of the inspection unit 190 is all circuit patterns included in the board 200 . Nevertheless, the inspection unit may vary according to the probe 193 constituting the inspection unit 190 . For example, when the probe 193 capable of inspecting one circuit pattern on the substrate 200 is installed, the inspection unit becomes one circuit pattern. At this time, the inspection unit 190 goes through the z-axis reciprocating process eight times, and the shuttle unit 150 may move the substrate 200 in the x-axis direction or the y-axis direction so that an appropriate circuit pattern is inspected. When the probe 193 capable of inspecting two circuit patterns on the board 200 at once is installed, the inspection unit is two circuit patterns. At this time, the inspection unit 190 goes through the z-axis reciprocating process four times.

The shuttle unit 150 transports the substrate 200 along the transfer path, and in the section from the alignment unit 170 to the inspection unit 190, based on the inspection result of the alignment unit 170 and the inspection unit, the substrate 200 is transported. ) can be sorted.

Since the alignment unit 170 of the present invention is in a fixed state in the xyz space, if there is an abnormality in the alignment of the substrate 200 as a result of checking, a means for aligning the substrate 200 is required. A shuttle unit 150 may be used as such a means.

The shuttle unit 150 corrects the alignment error of the substrate 200 identified by the alignment unit 170 by moving the substrate 200 in the x-axis direction or the y-axis direction in the section from the alignment unit 170 to the inspection unit. can do. In other words, the shuttle unit 150 has an x-axis degree of freedom and a y-axis degree of freedom on the xy plane, and can transfer the substrate 200 along the transfer path of the substrate 200 formed on the xy plane. In addition, the x-axis alignment error and the y-axis alignment error of the substrate 200 checked by the alignment unit 170 may be corrected using the x-axis degree of freedom and the y-axis degree of freedom.

When the inspection unit 190 uses one circuit pattern as an inspection unit, there may be an alignment error in each circuit pattern. At this time, the shuttle unit 150 will match/align the next circuit pattern to be inspected with respect to the inspection unit when the inspection unit 190 inspects one circuit pattern and moves away from the board 200 in the z-axis direction. can This appearance is similarly made even when the number of inspection units is smaller than the number of circuit patterns included in the board 200 . When the inspection unit on the substrate 200 is 4 circuit patterns, the shuttle unit 150 may perform position correction on alignment marks indicating an alignment state of regions including the 4 circuit patterns. For example, when the four circuit patterns below are inspection units, the shuttle unit 150 uses the check result of the alignment unit 170 to use the second alignment mark from the bottom to the top on the left side and the first mark on the right side on the substrate ( 200) can be sorted.

In summary, the alignment unit 170 of the present invention can check the alignment state of all circuit patterns regardless of the inspection unit of the inspection unit 190 . Through this, the inspection unit of the inspection unit 190 can be set in various ways. The inspection unit may be determined by the probe 193 of the inspection unit 190, and the probe 193 is determined during initial setting. Accordingly, according to the present embodiment, inspection units may be changed upon initial setting, and the substrate 200 may be aligned with respect to various inspection units.

The inspection unit 190 may inspect the energization state of the substrate 200 through contact with the substrate 200 . In order to reliably perform the energization test, the test unit 190 may include a probe 193. The probe 193 may perform a continuity test by directly contacting the circuit pattern formed on the board 200 .

The test unit 190 may include a plurality of probes 193 , a jig 191 supporting the probes 193 , and a base plate 195 on which the jig 191 is installed. A probe 193 may be formed in a region ⓟ of the jig 191 facing the circuit pattern to be inspected. One end of the probe 193 protrudes from the region ⓟ, and the other end may be connected to an electronic circuit.

The electronic circuit may apply a test signal to the circuit pattern, receive a response signal, and perform a continuity test using the received response signal.

In the xyz space, the setting number of degrees of freedom when the test unit 190 is initially set and the number of work degrees of freedom when the test unit 190 is driven may be different from each other.

It is advantageous for the test unit 190 to have various degrees of freedom in order to reliably test energization in various environments. For this purpose, the degree of freedom of operation of the inspection unit 190 may be varied. However, control of the inspection unit 190 becomes complicated when the degree of freedom of operation of the inspection unit 190 is given in various ways. The test unit 190 may be the largest and heaviest in the test device, and moving the test unit 190 in various directions means that the work speed is reduced. In addition, it is obvious that a lot of power will be consumed.

Therefore, it is preferable that the degree of freedom of operation of the inspection unit 190 is as small as possible. For example, the inspection unit 190 may have only the z-axis degree of freedom. In addition, the remaining degrees of freedom required for a reliable continuity test can be solved by the setting degrees of freedom. That is, according to the present invention, the number of working degrees of freedom and the number of setting degrees of freedom of the inspection unit 190 may be different. Specifically, the number of working degrees of freedom may be less than the number of setting degrees of freedom.

In the xyz space, a set of degrees of freedom when the test unit 190 is initially set may have a relationship including a set of degrees of freedom when the test unit 190 is driven.

For example, the set of degrees of freedom of the inspection unit 190 may be {z} having z-axis degrees of freedom as elements. The setting degree of freedom set may be {x, y, z, r _z } including all elements of the operation degree of freedom set. In this case, y may be a y-axis degree of freedom, x may be an x-axis degree of freedom, z may be a z-axis degree of freedom, and r _z may be a rotational degree of freedom with the z-axis as a rotation axis. For reference, it should be noted that the z-axis working degree of freedom included in the working degree of freedom set and the z-axis setting degree of freedom included in the setting degree of freedom set represent only degrees of freedom and do not consider their magnitude. That is, even if they have the same degree of freedom in the xyz space, the size of the work degree of freedom and the setting degree of freedom may be different. For example, the z-axis setting freedom during initial setting is for adjusting the distance between the probe 193 and the substrate 200, and the z-axis work freedom during driving is to set the initially set probe 193 on the substrate 200. It is for contact, and the size may be different from each other.

Meanwhile, the inspection unit 190 may perform a conduction inspection on both sides of the substrate 200 . Recently, a plurality of circuit patterns may be formed on both sides of the substrate 200 due to high integration of circuit patterns. In some cases, a circuit pattern on one surface of the substrate 200 may be connected to a circuit pattern on the other surface of the substrate 200 . Therefore, for fast and reliable continuity test, the test unit 190 includes a first inspection unit 192 in contact with one surface of the substrate 200 and a second inspection unit 194 in contact with the other surface of the substrate 200. The energization state of (200) can be inspected. At this time, the first inspection unit 192 and the second inspection unit 194 may contact the substrate 200 at the same time.

A case in which the first inspection unit 192 is located above the substrate 200 and the second inspection unit 194 is located below the substrate 200 is disclosed. At this time, the substrate 200 may be placed on the shuttle in which the through hole 153 is formed and gripped by the grip portion 151 of the shuttle.

In the initial setting, the number of degrees of freedom of the first inspection unit 192 and the number of degrees of freedom of the second inspection unit 194 may be different from each other in the xyz space. The position of the first inspection unit 192 and the position of the second inspection unit 194 are relative. For example, if it is necessary to move the second inspection unit 194 in the first direction, the first inspection unit 192 may be moved in the second direction opposite to the first direction. Considering this point, it is not necessary to give the same degree of freedom to both the first inspection unit 192 and the second inspection unit 194 . Rather, giving the same degree of freedom to both the first inspection unit 192 and the second inspection unit 194 can cause user confusion and complicate the configuration. However, according to the present invention, there is no such problem because the number of degrees of freedom of the first inspection unit 192 and the number of degrees of freedom of the second inspection unit 194 are different from each other.

The inspection unit 190 may inspect the current state with the first inspection unit 192 contacting the upper surface of the substrate 200 and the second inspection unit 194 contacting the lower surface of the substrate 200 based on the direction of gravity. . In the initial setting, the number of degrees of freedom of the first inspection unit 192 in the xyz space may be less than the number of degrees of freedom of the second inspection unit 194 . The reason for doing this is that the operation of the second inspection unit 194 installed on the floor is easier than the operation of the first inspection unit 192 installed in the air. For example, in the initial setting, in the xyz space, the first inspection unit 192 has a z-axis degree of freedom and an r _z- axis degree of freedom, and the second inspection unit 194 has an x-axis degree of freedom, a y-axis degree of freedom, and a z-axis degree of freedom , r _z degrees of freedom. When the setting degrees of freedom of the first inspection unit 192 and the setting degrees of freedom of the second inspection unit 194 are combined, the inspection unit 190 has x-axis degrees of freedom, y-axis degrees of freedom, z-axis degrees of freedom, and r _z degrees of freedom.

The first loading unit 130 is loading the substrate 200 in the first loading unit 110 . At this time, the first shuttle unit 150a is located in the inspection unit 190, and the substrate 200 transferred to the inspection unit 190 by the first shuttle unit 150a is inspected by the inspection unit 190. is performing The second shuttle unit 150b is in a state of transferring the substrate 200 inspected by the inspection unit 190 to the initial position, and the second loading unit 140 is loading the substrate 200 in the initial position.

The second loading unit 140 is placed on the second shuttle unit 150b and unloads the tested substrate 200 to the second loading unit 120 on which the normal substrate 200 is loaded. The first loading unit 130 unloads the substrate 200 to be inspected onto the second shuttle (initial position) after the second loading unit 140 leaves the initial position. The first shuttle unit 150a is still in the inspection unit 190, and the corresponding substrate 200 is still under inspection.

The substrate 200 that has been inspected by the inspection unit 190 is in a state of falling into the second path by the first shuttle unit 150a. The second shuttle unit 150b on which the substrate 200 to be inspected is placed moves in the x-axis direction and moves to the alignment unit 170 . At this time, the alignment state of the substrate 200 placed on the second shuttle unit 150b is checked. When the photographing range of the alignment unit 170 is smaller than the circuit pattern, the second shuttle unit 150b may properly photograph while moving in the x-axis direction or the y-axis direction. The first loading unit 130 is in the process of moving to the first loading unit 110, and the second loading unit 140 is in a state of moving to an easily accessible position as an initial position.

The alignment state of the substrate 200 placed on the second shuttle unit 150b is confirmed and transferred to the inspection unit 190 by the second shuttle unit 150b. The first shuttle unit 150a is in a state of moving to an initial position along the x-axis along the second path. The first loading unit 130 moves to the first loading unit 110 . The second loading unit 140 maintains the position shown in FIG. 8 .

The first shuttle unit 150a completely places the inspected substrate 200 in its initial position. The second loading unit 140 moves to the initial position and loads the inspected substrate 200 . The first loading unit 130 loads the substrate 200 to be inspected from the first loading unit 110 . The substrate 200 placed on the second shuttle unit 150b is still being inspected by the inspection unit 190 .

The second loading unit 140 transfers the substrate 200 in the initial position to a unit of the second loading unit 120 on which the open substrate 200 is loaded according to the inspection result. The first loading unit 130 moves the substrate 200 of the first loading unit 110 to the initial position after the second loading unit 140 moves out of the initial position. The substrate 200 placed on the second shuttle unit 150b is still being inspected by the inspection unit 190 .

After the substrate 200 is inspected by the inspection unit 190, the second shuttle unit 150b transfers the substrate 200 along the second path. The first shuttle unit 150a on which the substrate 200 to be inspected is placed enters the alignment unit 170 along the first path, and the alignment state of the substrate 200 to be inspected is checked.

The first loading unit 130 moves from the initial position to the first loading unit 110, and the second loading unit 140 moves from the unit where the open substrate 200 is loaded to a position where it is easy to enter the initial position. do.

The second shuttle unit 150b moves to an initial position on the x-axis along the second path. The first shuttle unit 150a transfers the substrate 200 whose alignment has been confirmed in the alignment unit 170 to the inspection unit 190 along the first path. The movement of the first loading unit 130 to the first loading unit 110 is completed, and the second loading unit 140 maintains the position shown in FIG. 12 .

Two shuttle units 150, a first path, two second paths, a first loading unit 130 that moves only the substrate 200 before inspection to the initial position, and a second that moves only the substrate 200 after inspection from the initial position The loading unit 140, the alignment unit 170, which is arranged on a straight line from the initial position and has no movement on the xy plane, and the inspection unit 190 can quickly and automatically test the energization of the substrate 200 without interfering with each other. can

110 ... first loading unit 111 ... loading unit
113 ... first alignment unit 115 ... second alignment unit
117 ... fixing part 120 ... second loading unit
130 ... first loading unit 131 ... arm
133 ... adsorption unit 140 ... second loading unit
150...shuttle unit
150a... first shuttle unit 150b... second shuttle unit
151 ... grip part 153 ... through hole
170 ... alignment unit 180 ... cleaning unit
190 ... probe unit 191 ... jig
192 ... first inspection unit 193 ... probe
194 ... second inspection unit 195 ... base plate
200 ... substrate 210 ... circuit pattern
230... Align Mark 300... Imprint Unit
400... index unit
D... stamped C... circuit
R1... first path R2... second path
R1-1... 1-1 path R1-2... 1-2 path
R2-1... 2-1 path R2-2... 2-2 path
P1... 1st position P2... 2nd position
P3... 3rd position P4... 4th position
P4-1... 4-1 position P4-2... 4-2 position
P5... 5th position P6... 6th position

Claims (13)

Alignment unit inspecting the alignment state of the substrate;
a probe unit inspecting the current state of the board;
a stamping unit inspecting the stamped state of the board; including,
A first position in which the substrate is loaded before inspection is set,
A second position for waiting before the substrate is put into the alignment unit is set;
A third position between the second position and the probe unit is set;
A fourth position at which the probe unit conducts an energization test is set,
The first to fourth positions are sequentially arranged on a path along which the substrate is moved,
The alignment unit and the stamping unit are disposed at the third position between the second position and the fourth position,
A process progressing direction from the alignment unit at the third position to the probe unit at the fourth position and a process proceeding direction returning from the probe unit at the fourth position to the stamping unit at the third position are mutually exclusive. Reversing check device.
According to claim 1,
A process direction in which the substrate is passed from the second position to the alignment unit in the third position and a process direction in which the substrate is returned from the imprinting unit in the third position to the second position are opposite to each other. inspection device.
According to claim 1,
and a shuttle unit for transporting the substrate along an imaginary straight line connecting the second position, the alignment unit, and the probe unit.
delete According to claim 1,
A fifth position in which the substrate waits after the stamping test is completed is set,
If a path from the second position to the probe unit via the alignment unit is a first path, and a path from the probe unit to the fifth position via the stamped unit is a second path,
The first path is shorter than the second path.
delete delete According to claim 1,
A fifth position in which the substrate waits after the stamping test is completed is set,
If a path from the second position to the probe unit via the alignment unit is a first path, and a path from the probe unit to the fifth position via the stamped unit is a second path,
A plurality of shuttle units for moving the substrate through the first path and the second path are provided,
wherein each of the second position and each of the fifth position of each shuttle unit coincides with each other.
According to claim 1,
A fifth position in which the substrate waits after the stamping test is completed is set,
From the second position to the alignment unit, path 1-1, from the alignment unit to the probe unit, path 1-2, from the probe unit to the stamped unit, path 2-1, from the stamped unit If the fifth position is the 2-2 path,
If the first shuttle unit for moving the first substrate is located on the 2-2 path, the second shuttle unit for moving the second substrate is located on the 1-2 path or the 2-1 path inspection device.
According to claim 1,
A fifth position in which the substrate waits after the stamping test is completed is set,
An index unit is provided in which the second position, the alignment unit, the probe unit, the stamping unit, and the fifth position occupy each step of the inspection process,
An inspection device in which the inspection of the substrate is sequentially performed by the rotation of the index unit.
According to claim 1,
The probe unit includes a plurality of probes in contact with the substrate while moving up and down with respect to the substrate;
Inspection device provided with a control unit for determining a defective stamp by comparing the stamp amount of the board photographed by the stamp unit with a reference value.
According to claim 1,
A controller is provided to calculate a substrate position error of the alignment unit through a camera located in the alignment unit;
The control unit moves the substrate to a position and angle that corrects the substrate position error calculated by the alignment unit, and then controls the substrate seating table of the probe unit so that the probe can contact the precise measurement point of the substrate,
The control unit compares the stamping of the substrate by the probe with a reference value, and determines that the stamping is defective when the stamping of the image taken by the camera is equal to or greater than the reference value.
According to claim 1,
The amount of stamping of the substrate by the probe provided in the probe unit is photographed by the camera of the stamping unit,
A control unit is provided that compares the stamping amount of the board with a reference value from the image obtained from the camera of the imaging unit, and determines at least one of abrasion of the probe, bending of the probe, and foreign matter caught in the probe from the comparison result inspection device.

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