KR20220116711A - Detection device - Google Patents

Abstract

The present invention relates to an inspection device in which an inspection process is performed in the order of an alignment unit, a probe unit, and a puncture unit. The inspection device may include: an alignment unit for inspecting the alignment state of a board, a probe unit for inspecting the electrical state of the board, and the puncture state of the board.

Description

Inspection device with imprinting unit {Detection device}

The present invention relates to an inspection apparatus for inspecting possible dents after energization inspection.

In general, a printed circuit board (PCB: Printed Circuit Board) is one of the basic essential parts in almost all equipment such as household appliances such as washing machines and televisions, household goods including mobile phones, automobiles, satellites, and the like.

In recent years, as the degree of integration of various electronic components constituting the printed circuit board increases, the pattern is considerably refined, and a printing process of a very sophisticated pattern is required. The importance of inspection is being emphasized, and inspection of the resulting imprint may also be an important issue.

The present invention is an apparatus for inspecting a dent on a substrate, and since dents that may occur due to the inspection itself such as an energization inspection can also be an important factor in causing a defect in the substrate, by performing engraving inspection after energization inspection, better quality It is to provide an inspection apparatus for producing a substrate of

The present invention is an inspection device in which the inspection process is performed in the order of an alignment unit, a probe unit, and an engraving unit. It may include an engraving unit.

A second position at which the substrate waits before moving to the alignment unit is set, and a shuttle unit for transferring the substrate along an imaginary straight line connecting the second position, the alignment unit, and the probe unit may be provided to optimize the inspection process can do.

The alignment unit and the stamping unit are positioned at a third position, which is a position for the inspection step between the second position and the probe unit, so that the two-shuttle inspection can be optimized.

In the case of the one-shuttle inspection, a fifth position waiting after completion of the inspection of the substrate is set, and the path from the second position through the alignment unit to the probe unit is a first path, and from the probe unit to the probe unit. Assuming that the second path through the imprinting unit to the fifth position, the first path and the second path may be in the forward and reverse directions of an imaginary straight line.

When the two-shuttle test is performed, the first path may be shorter than the second path.

When the alignment unit and the stamping unit are located in the same inspection area, when the shuttle unit moves the first path or the 1-1 and 1-2 paths, only movement in the first direction is allowed, and the position of the alignment unit is corrected. If the 3rd position and the position of the imprinting unit is the 4-2 position, the 3rd position and the 4-2 position are the same, and if the direction from the imprinting unit to the probe unit is the 1st direction, alignment The unit and the imprinting unit may be provided at positions spaced apart from each other in the first direction.

The alignment unit and the imprinting unit may be provided adjacent to each other, and the process progress direction from the alignment unit to the probe unit and the process progress direction from the imprint unit to the next step may be opposite to each other.

A process progress direction from the alignment unit to the probe unit and a process progress direction from the stamp unit to the next step may be perpendicular to each other.

A plurality of shuttle units for moving the substrate through the first path and the second path are provided, wherein the respective second and fifth positions of each shuttle unit coincide with each other, and the second position and the fifth position are can match each other.

A 1-1 path is from the second position to the alignment unit, a 1-2 path is from the alignment unit to the probe unit, a 2-1 path is from the probe unit to the imprinting unit, and the imprinting unit to the imprinting unit is a 2-1 path. When the path to the fifth position is the 2-2 path, the 1-2 path may be shorter than the 2-1 path, and the 1-1 path and the 2-2 path may coincide with each other.

In addition, the 1-2 th path may be shorter than the 2-1 path, and the 1-1 path may be shorter than the 2-2 path.

When the first shuttle unit for moving the first substrate is located on the 2-2 path, the second shuttle unit for moving the second substrate may be located on the 1-2 path or the 2-1 path. can

The second position, the alignment unit, the probe unit, the imprinting unit, and the fifth position are provided with an index unit occupying each step of the inspection process, and the inspection of the substrate is performed in order by the rotation of the index unit, the second position, The alignment unit, the probe unit, the imprinting unit, and the fifth position do not overlap each other on the index unit, and the rotation angle during one step of the index unit may be determined according to the number of initially set steps of the index unit.

A plurality of shuttle units for moving the substrate in the order of the alignment unit, the probe unit, and the imprinting unit are provided, wherein the shuttle unit moves from the alignment unit to the probe unit and the inspection direction is a first direction, from the probe unit to the If the direction to be inspected while moving to the imprinting unit is referred to as a second direction, the plurality of shuttle units have degrees of freedom only in the first and second directions, and movement in the first and second directions may be restricted. have.

BRIEF DESCRIPTION OF THE DRAWINGS It is the schematic which showed the structure of the inspection apparatus of this invention.
Fig. 2 (a) is an explanatory diagram illustrating the dent, and Fig. 2 (b) is an explanatory diagram showing the occurrence of defects due to the dent.
Figure 3 (a) shows the substrate before the dent occurs, (b) and (c) of Figure 3 (b) and (c) show the state in which the dent occurs, (b) is a reference value for judging whether there is a defect, (c) shows the occurrence of a defect that exceeds the reference value of (b).
4 is an explanatory view showing a two-shuttle method of the inspection apparatus of the present invention.
5 is an explanatory view showing the two shuttle units of FIG. 4 before merging the two shuttle units.
6 is an explanatory view showing a place where the imprinting unit of the inspection device of the present invention can be located.
Figure 7 is an explanatory view showing that the second path is corrected by providing the stamping unit of the present invention.
8 is a diagram illustrating an index unit according to the present invention, and is an explanatory diagram illustrating a case in which the index unit consists of five steps.
9 is a diagram illustrating an index unit according to the present invention, and is an explanatory diagram illustrating a case in which the index unit consists of four steps.
10 is a schematic view showing a loading unit and a loading unit constituting the inspection apparatus of the present invention.
11 is a schematic view showing an alignment unit included in the loading unit constituting the inspection apparatus of the present invention.
12 is a schematic diagram showing a substrate 200 to be inspected by the inspection apparatus of the present invention.
13 is a schematic diagram showing an inspection unit 190 constituting the inspection apparatus of the present invention.

The board 200 (Bare Board) before the circuit is printed needs to complete the energization test after the manufacturing process is completed, and shipment may be possible only when all electrical signals through this are not abnormal. It may be important to determine normal, short, or open having a specific resistance of the substrate 200 through the energization test, and to classify the normal substrate 200 and the erroneous substrate 200 through this. .

During the energization inspection necessary to determine such a defective substrate 200, the inspection is performed with a probe having a pointed tip through a probe, etc. can A probe is mounted on a robot arm, etc. to contact the substrate 200 and conduct a energization test, and it moves to another inspection position by moving on the xy plane consisting of the x-axis (first direction) and y-axis (second direction). , when the target inspection position is reached, it descends for inspection in the -z-axis (reverse direction of the third direction), and after inspection, it rises to the +z-axis (the third direction) and moves the xy plane again to another inspection position. Moving can be performed repeatedly.

In the operation for inspection, the same substrate 200 is repeatedly arranged on one plate or frame in a grid format in an appropriate number for the equipment rather than one substrate 200, and during inspection, a plurality of substrates 200 ) may be conducted for the entire plate or frame on which the energization test or the dent (D) test is carried out. Accordingly, in order to hold a node for a plurality of circuits and perform an inspection even during a single inspection, the probe must be able to move rapidly in the first direction, the second direction, or the third direction. In order to prevent stamping (D), the third direction movement of the probe slows the speed when the probe approaches the substrate 200 so that it is in close contact with the substrate 200, but the height of the substrate 200 is different, and the distance and probe Since the thickness of the probe is on the order of several microns, it is easy to cause a defect error even if it is precisely controlled.

When the dent (D) is generated by the energization test, since a part of the engraved substrate 200 is dented, an empty space may be created between the substrate 200 and the circuit when the circuit is printed later. The circuit printed circuit board 200 may undergo various processes depending on the purpose, and heating or cooling may be repeated in this process. Accordingly, due to the empty space, an error in which the circuit itself is turned off or inflated may occur as air in the empty space contracts or expands. That is, dents may occur due to the energization test itself after the energization test. During the energization test, the probe of the probe unit can be raised and lowered to contact the target point. When the probe and the substrate are in contact, the impact of the substrate can be alleviated by slowly adjusting the elevating speed of the probe only in the vicinity of the probe.

If the circuit is mounted on the substrate 200 by leaving the dent (D) and operating the equipment for several hours or several days, the user may have a problem of discarding the circuit itself, which is several times more expensive than the substrate 200. It may be necessary to periodically and frequently manage the stamping (D) in units of one hour.

The controller may calculate a substrate position error of the alignment unit 170 through a camera located in the alignment unit 170 . The substrate position error stored in the controller may be corrected by moving or rotating the table on which the substrate is seated in the probe unit 190 in the opposite direction.

The controller may move the substrate to a position and angle that corrects the substrate position error calculated by the alignment unit 170 , and then control the substrate seating table of the probe unit so that the probe can contact the accurate measurement point of the substrate.

In the case of performing an imprint inspection using the control unit, the control unit compares the imprint of the substrate by the probe with a reference value, and when the imprint (D) of the image photographed by the camera is equal to or greater than the reference value, it may be determined as a bad imprint.

Although there are errors due to the energization test itself in the structure of the dent (D), defects may occur due to wear or bending in the probe itself, and foreign substances may be caught in the probe. Therefore, in the occurrence of a defect due to the dent D, there may be a defect due to a defect of the probe itself or a foreign substance in addition to a peripheral factor that changes the predetermined inspection distance between the probe and the substrate 200 . That is, since the factors of the dent (D) are various, the exact shape of the dent (D) is recognized using a camera capable of discriminating a number of microns at the microscopic level, and the dent (D) is classified by cause (D). ) The cause of the dent (D) determined by the unit 300 can be quickly found and dealt with.

The amount of imprinting of the substrate by the probe provided in the probe unit may be captured by the camera of the imprinting unit.

The control unit may compare the amount of imprinting of the substrate with a reference value from the image obtained from the camera of the imprinting unit. The controller may determine at least one of abrasion of the probe, bending of the probe, and foreign matter caught in the probe from the comparison result.

Due to the energized inspection itself, which is essential for determining the defect rate of the substrate 200 , the defect rate may rather occur in the substrate 200 , so it is also necessary to consider it as one of the defect rates and classify it through inspection. That is, during a series of processes in which the substrate 200 is loaded, inspected and unloaded again, the probe unit 190 for inspecting the energization of the substrate 200 is engraved (D) for inspecting engraving (D) due to energization It may be a previous stage of the unit 300 .

Imprint (D) inspection may be to confirm the dent (D) by the energized inspection. Since it takes too long to check all the circuit connections during the energization test, the user sets the position of the board 200 that is more dense and complicated depending on the pattern according to the specific board 200 and is prone to defects. can be identified and selective testing can be performed. In this case, by dividing sections by time and setting different positions for each section, data indicating which section has a high defect rate can be collected and used for analysis. Therefore, since only the sampling position set in each section by the user can perform the energization inspection, the engraving (D) unit 300 refers to the location data of the energization inspection rather than inspecting the entire circuit for the engraving (D) inspection. can be done quickly.

According to the case of using the shuttle unit 150 and the case of using the index unit 400, the inspection process of the inspection apparatus can be divided into a shuttle method and an index method. The shuttle method includes a one-shuttle method using one shuttle and two There may be a two-shuttle method using a dog shuttle. In the shuttle method, the substrate 200 may be moved by the shuttle unit 150 on a virtual straight line from the standby position to the inspection position during the inspection process, and the index method is the index unit 400 . According to the rotation, each unit or each part of the inspection apparatus may be moved one step at a time to proceed with the process.

The inspection apparatus by a shuttle system is demonstrated first.

1 is a schematic diagram showing an inspection apparatus of the present invention. The inspection device of the present invention includes a first loading unit 110, loading units 130, 140, a shuttle unit 150, an alignment unit 170, a probe unit 190, a second loading unit 120, a stamp ( D) may include a unit 300 . Substantial inspection of the inspection apparatus may be performed on a straight inspection path of the alignment unit 170 , the probe unit 190 , and the engraving (D) unit 300 by the shuttle unit 150 .

Here, the inspection means at least any one of an alignment inspection by the alignment unit 170 , an energization inspection by the probe unit 190 , and an engraving (D) inspection by the dent (D) unit 300, unless it is precisely referred to herein. can do. The inspection order of the inspection apparatus is based on the energization inspection of the substrate 200, the alignment unit 170 may be made before the energization inspection, and the dent (D) inspection may be performed after the energization inspection.

A position at which the substrate 200 is loaded before the inspection may be referred to as a first position P1 , which may be a position of the first loading unit 110 . A position at which the substrate 200 is loaded by the shuttle unit 150 before starting the operation by the shuttle unit 150 may be referred to as a second position P2 . By locating the substrate 200 at the position before the start of the inspection before the start of the full-scale inspection, rather than when the loading unit is directly transferred to the inspection unit such as the alignment unit 170, the driving of the loading unit and the shuttle unit in the inspection process is separated. This will allow for a faster inspection. Therefore, in a broad view of the inspection process, the substrate 200 may be transported by the first loading unit 130 , the shuttle unit, and the second loading unit 140 , and all inspections may be performed while being moved by the shuttle unit. have.

The second position P2 may be referred to as an initial position ⓘ. The substrate 200 may be moved from the first position P1 to the second position P2 by the first loading unit 130 . The initial position ⓘ may be the second position P2 or the fifth position P5 in the case of two shuttles. That is, the initial position ⓘ may be a place where the first loading unit 130 waits before moving the substrate 200 before the energization inspection or the dent (D) inspection to the shuttle unit 150 for inspection, and the shuttle unit ( 150), it is possible to increase the inspection efficiency of the entire inspection apparatus by minimizing the movement direction. For example, a direction in which the substrate 200 is directed from the initial positions (ⓘ, P2, P5) toward the alignment units 170 and 170 and the probe units 190 and 190 is the first direction, and the first direction is It may be in the x-axis direction of FIG. 1 . A direction perpendicular to the first direction and in which the shuttle unit 150 moves the substrate 200 after inspection along a second path may be referred to as a second direction, and the second direction may be the y-axis direction of FIG. 1 . . A direction perpendicular to the first direction and the second direction and opposite to the inspection direction of the probe units 190 and 190 may be referred to as a third direction, and the third direction may be the z-axis direction of FIG. 1 .

The alignment unit 170 may check the alignment state of the substrate 200 using a camera or the like, and this position may be referred to as a third position P3, and the substrate 200 is moved to the second position ( It may be moved from P2) to the third position P3. The position at which the probe unit 190 conducts the energization test may be referred to as a fourth position P4, and for the efficiency of the inspection operation, the second position P2, the third position P3, and the fourth position P4 are It may be arranged on a straight line (ⓐ).

A position at which the substrate 200, which has completed the energization test, completes movement by the shuttle unit 150 may be referred to as a fifth position P5, and the substrate 200 is moved to the fifth position by the second loading unit 140 It may be moved from (P5) to a sixth position (P6). The sixth position P6 may be a position of the second loading unit 120 . Since the second loading unit 120 can separate the normal substrate 200 and the defective substrate 200 after inspection, a plurality of second loading units may be provided. The defective substrate 200 may be provided in plurality again for classification according to the cause of the defective substrate 200 by inspection. Among the plurality of second loading units 120 , in FIG. 1 , the position of the second loading unit 120 on which the top substrate 200 is placed may be illustrated as the sixth position P6 .

A path from the initial position ⓘ to the probe unit 190 may be referred to as a first path, and a path from the initial position ⓘ to the fifth position P5 after the energization test may be referred to as a second path. That is, the first path may be a path from the second position P2 to the fourth position P4 , and the second path may be a path from the fourth position P4 to the fifth position P5 . In the case of the one-shuttle method, since all inspections are performed by one shuttle, no interference problem occurs, so that the first path and the second path may be the same. However, in the case of the two-shuttle method, in order to avoid the problem of interference between the first shuttle unit 150a and the second shuttle unit 150b, the first route and the second route may be set differently, and the shuttle unit moves The first path may be shorter than the second path because the inspection by the inspection device requires more time than time. Accordingly, the first path is arranged in a straight line that can quickly pass through the second position P2 to the fourth position P4, and the second path can bypass the first path by adding movement in the second direction. .

Since the dent (D) inspection may be performed after the energization inspection, the dent (D) unit 300 may be located between the fourth position (P4) and the fifth position (P5). Accordingly, the fourth position (P4) can be divided into a 4-1 position (P4-1) for conducting an energization inspection, and a 4-2 position (P4-2) for performing a dent (D) inspection.

Since the stamping (D) unit 300 may be located at any point on the second path, the 4-1 position (P4-1), the third position (P3), the fifth position (P5), or the 4-1th position It may be located in any one of the position P4-1 and the fifth position P5.

When the 4-2th position P4-2 for the dent (D) inspection is provided between the 4-1 position P4-1 and the 5th position P5, the first shuttle unit 150a and Two stamping (D) units 300 by the second shuttle unit 150b may be required. This is because, in addition to the double the equipment value of the dent (D) unit 300, the energized substrate 200 is divided into two units and inspected, so that when the cause of the defective substrate 200 is found, the dent (D) unit 300 ) may double the risk of defective factors.

In the drawings, ① to ⑥ may indicate the entire process in which the substrate 200 is inspected by the inspection device in order. For example, ① indicates moving from the first loading unit 110 to the second position P2 serving as a stop by the first transfer unit, and ② is aligned for alignment check at the second position P2. indicates moving to the unit 170, ③ indicates that the substrate 200 that has completed the alignment inspection moves to the 4-1 position (P4-1) and moves to the probe unit 190 for energization inspection, ④ indicates that the substrate 200, which has completed the energization test, moves to the dent (D) unit 300 at the 4-2 position (P4-2) for engraving (D) inspection, and ⑤ indicates dent (D) inspection indicates that the board 200, which has completed It may indicate movement from the fifth position P5 (the second position P2 ) to the sixth position P6 of the second loading unit 120 .

When the dent (D) unit 300 is provided at the 4-1 position (P4-1), the energization test and the dent (D) inspection may be performed at the same position. The energization test during the test operation of the present invention may take longer than the time spent in other locations. Therefore, in the case of the two-shuttle system, interference between the shuttle units is likely to occur, and the time of the inspection process may be delayed.

The imprinting (D) unit 300 may be provided at the fifth position P5 , and the fifth position P5 may be the same as the initial position of the second position P2 . Each shuttle unit may be provided separately at the fifth position P5, but in this case, a plurality of second loading units 120 for loading the normal substrate 200 may be provided, and again loaded on the plurality of loading units. A facility for assembling the substrate 200 may be required. This complicates the process, delays time, and may cause other defects. Accordingly, the second position P2 and the fifth position P5 serving as a stop between the shuttle unit and the loading unit may be the same. Since the fifth position P5 serves as a stop between the shuttle unit and the loading unit, in addition to the interference between the first shuttle unit 150a and the second shuttle unit 150b, the first transfer unit and the second transfer unit Interference may also be considered. That is, since the four facilities move sequentially in the automation process, the inspection design may be too complicated to perform the dent (D) inspection at the fifth position (P5).

Accordingly, the engraving (D) unit 300 may be provided at the third position (P3). That is, the third position P3 may be the same as the 4-2 position, and the alignment inspection and the stamping (D) inspection may be performed.

The alignment unit 170 can check the alignment state of the substrate 200 by the first camera, and the stamping (D) unit 300 can check the stamping (D) of the substrate 200 using the second camera. have. The second camera may have a narrower field of view (FOV) than the first camera. This may be because the dent (D) may be confirmed by a microscopic level of resolution since it is generated by a energization test.

At the third position P3, the alignment unit 170 and the stamping (D) unit 300 may be vertically divided based on the first path or the center of each unit may pass through the first path. In the case of being vertically divided based on the first path, it is necessary to move the shuttle unit in order to align the center in the second direction for the alignment inspection and the dent (D) inspection, which may cause a defect according to the position adjustment. Accordingly, two units may be arranged at the third position P3 (the 4-2 position P4-2) so that each unit passes through the center on the first path.

According to the operation of the two shuttle units, each shuttle unit may be located at the third position P3 at the same time. When each shuttle unit is located at the third position P3 at the same time, for example, the alignment unit 170 may be located downstream on the second path than the stamp (D) unit 300, and the alignment unit ( The shuttle unit entering 170 can avoid interference with each other by entering the third position P3 before the shuttle unit entering the stamping (D) unit 300 . Here, the upstream and downstream may be the same as the line and the back according to the time series of the inspection process in the first path or the second path, and the shuttle unit may have a limited degree of freedom in moving in the third direction (z direction). . When the shuttle units move without restriction in the third direction, interference between the respective shuttle units can be easily avoided, but the risk of control failure due to the addition of degrees of freedom may increase. When the shuttle units have freedom in the third direction, the time for each shuttle unit to enter the third position P3 is unlimited and may simultaneously enter.

When the stamp (D) unit 300 is provided at the third position (P3) together with the alignment unit 170, after the inspection (D), the shuttle unit moves from the 4-2 position (P4-2) to the fifth position When moving to (P5), it must move from the third position (P3) to the second position (P2). In this case, the shuttle unit may pass a path that overlaps the first path in the reverse direction or a path that bypasses the first path. have. Accordingly, in this case, the first path moves from the second position P2 to the third position P3, the 1-1 path R1-1, and the third position P3 to the 4-1 position A path moving to (P4-1) may be included as a 1-2 path, and the second path is a 2-1 path (R2) from a 4-1 position (P4-1) to a 4-2 position. -1), a 2-2 path R2-2 path may be included from the 4-2 position P4-2 to the fifth position P5. That is, in the drawing, ⑤ may indicate the second-second path (R2-2) path.

When the 2-2 path (R2-2) path coincides in the reverse direction of the 1-1 path (R1-1), the speed of the inspection process is shortened compared to the detour path, but there is a possibility that an interference problem between each shuttle unit may occur. may be increased, and this may be referred to as the first method. When the 2-2 path (R2-2) path is a bypass path other than the 1-1 path (R1-1), the time of the inspection process is relatively longer, but the problem of interference between each shuttle unit can be avoided. and this may be referred to as the second method.

In the case of the second method, for example, the time at which the first shuttle unit 150a enters the 4-2 position P4-2 after the energization test and the second shuttle unit 150b are adjusted to the alignment unit 170 ), if you set different entry times, you can easily avoid the problem of interference between shuttle units. For example, if the first shuttle unit 150a is in the first path, the second shuttle unit 150b may be in the second path, and vice versa, and the first shuttle unit 150b may be in the first path. The paths may be the same.

In the case of the first method, for example, after the dent (D) inspection, the first shuttle unit 150a moves from the 4-2 position (P4-2) to the fifth position and the second for alignment inspection. The second shuttle units 150b moving from the position P2 to the third position P3 may interfere with each other. Accordingly, when the first shuttle unit 150a is on the path 2-2 path R2-2, the second shuttle unit 150b moves on the path 1-2 path R1-2 and 2-1 Interference between each shuttle unit can be avoided by being located in any one of the paths R2-1. Conversely, when the first shuttle unit 150a transfers the substrate 200 from the second position P2 to the third position P3 for the alignment inspection, the second shuttle unit 150b performs the steps 1-2 Interference between each shuttle unit can be avoided by being located in either the path R1-2 or the 2-1 path R2-1.

The interference problem between the shuttle units may be a case in which the movement of the shuttle unit is restricted in the x-y plane while being fixed for a specific z value. If there is no restriction on the movement of each shuttle unit in the third direction, the interference problem can be avoided even when each shuttle unit is on the same path. For example, when the first shuttle unit 150a and the second shuttle unit 150b simultaneously perform the alignment inspection and the dent (D) inspection at the third position P3 (position 4-2), or 1 The shuttle unit 150a is stamped (D), the inspection is completed, the substrate 200 through the 2-2 path (R2-2) path through the path from the third position (P3) to the fifth position (P5) and For the alignment check, even when the path of the second shuttle unit 150b moving the substrate 200 from the second position P2 to the third position P3 coincides, the vertical positions of each shuttle unit are mutually Interference can be prevented by adjusting. However, if the degree of freedom is given to the third direction of each shuttle unit in this way, the distance from each inspection device is different for each shuttle unit during alignment inspection, energization inspection, or dent (D) inspection, so the position must be set individually. In the case of performing vision inspection with a , camera, etc., since focal lengths may vary due to differences in vertical distances, complexity may arise in that it is necessary to provide a plurality of cameras or to inspect different focal lengths for each shuttle unit. In addition, since the process through the inspection device is a very fine inspection of the level of several microns, an additional movement or addition of a process may advance the time of the accumulated defect rate.

Therefore, the configuration of a simple inspection process in the shortest time can not only reduce the cost due to an increase in yield, but also reduce the cumulative defect rate of the repeated process.

The inspection apparatus using the index method may be to bend a straight path between the alignment unit 170 and the probe unit 190 in a one-shuttle method in a round circle method. The index method may be a method in which steps of each inspection process are performed one by one by rotation on a turntable in order, not by a linear path by a shuttle unit.

For example, in the shuttle method, the index unit 400 corresponding to the shuttle unit may be provided, similarly to the process in which the shuttle unit and the loading unit are separated and the loading unit is separated, and in the index method, the index unit 400 and the loading unit are separated Thus, the process can proceed. That is, by the loading units 130 and 140, the substrate 200 is transferred from or to the loading unit at the second position P2 and the fifth position P5 corresponding to the position before and after the inspection process. can

Each process position of the index unit 400 may be a second position (P2) to a fifth position (P5), and the inspection is performed while the one-step turntable rotates in a time series sequence with the substrate 200 positioned at each position. can A role in the inspection process at the first position P1 to the sixth position may be the same as that of the shuttle method. Each position of the index unit 400 may have various polygonal shapes according to process settings. Unlike the shuttle method, each step of the inspection process may occupy one vertex of the turntable polygon, and it may be difficult to provide two or more processes at one vertex.

Accordingly, the angle of table rotation may be determined according to the number of processes provided in each index unit 400 , and in the case of n steps, the rotation angle per one rotation of each process may be 360/n. For example, when included in the index unit 400 from the second position P2 to the fifth position P5, it may have a pentagonal shape, and the one rotation angle of the turntable may be 72° (360/5). . When the second position P2 and the fifth position P5 are the same position, they may have a rectangular shape, and a rotation angle of the turntable may be 90° (360/4).

In comparison with the case in which the imprinting unit is provided, the case of the inspection device in which the imprinting unit is excluded will be described for better understanding.

The substrate 200 may be loaded on the first loading unit 110 . The substrate 200 loaded on the first loading unit 110 may be a substrate 200 to be subjected to an immersion inspection for inspection of energized state, that is, energized inspection or engraving by a probe after energized inspection. At this time, the board 200 may be a printed circuit board before various components are mounted. A printed circuit board is one in which copper foil is coated on a board 200 made of a material such as paper phnol resin or glass epoxy resin and various circuits are printed. The printed circuit board is constructed by removing the remaining portion on which the circuit is not printed by etching techniques such as etching, and various electronic components are soldered and mounted on these circuits. In general, in order to conduct an energization test for each contact portion of the printed circuit board, an electric signal is transmitted to each contact portion of the printed circuit board by various test equipment. At this time, it is possible to determine whether there is an abnormality in the printed circuit board by checking the current state.

The loading units 130 and 140 may move the substrate 200 loaded on the first loading unit 110 to the initial position ⓘ.

In some cases, the cleaning unit 180 may be disposed between the loading unit and the loading unit. The loading unit at this time may be the first loading unit 110 on which the substrate is loaded before the inspection.

The cleaning unit 180 may remove foreign substances from the inspection surface of the substrate 200 on which the energization inspection is performed by the inspection unit 190 . For example, the cleaning unit 180 may include a roller for wiping the surface of the substrate 200 . It is preferable that the portion to be cleaned by the cleaning unit 180 includes at least an area of the substrate 200 to be inspected by the inspection unit 200 . When the cleaning unit 180 is disposed, the loading unit may move the substrate 200 that has passed through the cleaning unit 180 to the initial position ⓘ. For reference, a third loading unit for moving the substrate 200 loaded on the loading unit upstream of the cleaning unit 180 may be provided.

The shuttle unit 150 may transfer the substrate 200 at the initial position ⓘ along the transfer path of the substrate 200 . The substrate 200 moved to the initial position ⓘ by the first loading unit 110 may move together with the shuttle unit 150 while being placed on the shuttle unit 150 . Alternatively, after the substrate 200 is placed on a separately provided cradle, the cradle is transported by the shuttle unit 150 so that the substrate 200 placed on the cradle may also be transported together. In the drawing, an example in which the substrate 200 is placed on the shuttle unit 150 is disclosed.

The alignment unit 170 is located on the transfer path of the substrate 200 and may check the alignment state of the substrate 200 using a camera or the like. The alignment state of the substrate 200 whose alignment has been confirmed may be corrected by the alignment unit 170 or the alignment state may be corrected by the shuttle unit 150 . Alternatively, the alignment state of the substrate 200 may be relatively corrected by correcting the position of the inspection unit 190 , which has acquired the alignment state information from the alignment unit 170 .

The inspection unit 190 is located downstream of the alignment unit 170 on the transfer path of the substrate 200 , and may inspect the energization state of the substrate 200 using the probe 193 . The alignment unit 170 is an element that enables reliable inspection in the inspection unit 190 by checking the alignment state of the substrate 200 . Accordingly, the inspection unit 190 is preferably located downstream of the alignment unit 170 . At this time, in the direction in which the substrate 200 is transferred, a position close to the initial position ⓘ becomes upstream, and a position far from the initial position becomes downstream. Accordingly, the downstream of the alignment unit 170 represents a position where the distance from the initial position ⓘ is greater than the distance from the initial position ⓘ to the alignment unit 170 . Since the substrate 200 moves in the positive direction of the x-axis from the initial position ⓘ in the inspection process, a position having an x-coordinate value greater than the x-coordinate value of the alignment unit 170 becomes a downstream position.

In the second loading unit 120 , the substrate 200 tested in the tested unit may be loaded. The second loading unit 120 may be configured in plurality. For example, the unit in which the substrate 200 determined as normal in the inspection unit 190 is loaded, the unit in which the substrate 200 determined as short is loaded, and the substrate 200 determined to be open. It may contain units to be loaded. In this case, the arrangement position of each unit constituting the second loading unit 120 may be determined according to the quantity of the substrate 200 to be loaded. For example, it is assumed that the number of normal substrates 200 is the largest, the number of short substrates 200 is next, and the number of open substrates 200 is the smallest. In this case, the unit on which the normal substrate 200 is loaded may be disposed closest to the initial position. The unit on which the open substrate 200 is loaded may be disposed furthest from the initial position, and the unit on which the short substrate 200 is loaded may be disposed between the two units. In some cases, the two units may be disposed at the same position from the initial position. In summary, a plurality of second loading units 120 may be formed, and substrates 200 having different inspection results may be loaded on each second loading unit 120 . At this time, the second loading unit 120 on which a relatively large number of substrates 200 are loaded is to be disposed closer to the initial position compared to the second loading unit 120 on which a relatively small number of substrates 200 are loaded. can Accordingly, the movement of the loading unit can be minimized, and power consumption of the loading unit can be reduced. In addition, it is possible to reduce the time for the substrate, which has been inspected by the loading unit, to be loaded onto the second loading unit 120 . This can reduce the overall inspection time.

The inspection apparatus of the present invention includes a first loading unit 110 , loading units 130 , 140 , a shuttle unit 150 , an alignment unit 170 , an inspection unit 190 , and a second loading unit 120 . The energization test of the substrate 200 may be automatically performed. In particular, the substrate 200 before the inspection and the substrate 200 after the inspection are separated and loaded in the first loading unit 110 and the second loading unit 120, so that the substrate 200 before the inspection and the substrate 200 after the inspection ) to prevent mixing.

Meanwhile, the shuttle unit 150 may transfer the substrate 200 inspected by the inspection unit 190 to an initial position. In this case, the loading unit may load the substrate 200 inspected by the inspection unit 190 and transferred to the initial position by the shuttle unit 150 on the second loading unit 120 . Accordingly, the substrate 200 before the inspection and the substrate 200 after the inspection may be stacked near each other. For example, the first loading unit 110 and the second loading unit 120 may be arranged on a virtual vertical line ⓒ with respect to the transfer path ⓐ of the substrate 200 from the initial position to the inspection unit 190 . According to this configuration, since the first loading unit 110 and the second loading unit 120 that can be transported by the user can be arranged almost nearby, work convenience can be increased. In addition, since the loading units are arranged only on one side of the x-axis, there is an advantage of high space utilization compared to the case where each loading unit is arranged on both sides with the inspection unit 190 in the center on the x-axis. In addition, it is possible to minimize the movement path of the loading unit by moving the substrate 200 of the first loading unit 110 to the initial position and moving the substrate 200 in the initial position to the second loading unit 120 . In addition, when there are a plurality of loading units, each loading unit can also be arranged adjacent to each other since each loading unit is gathered nearby. Therefore, there is an advantage of high space utilization compared to the case in which the loading units are scattered in distant places.

The inspection apparatus of the present invention inspects the energization state of the substrate 200 transferred from the (x ₁ , y ₁ ) coordinate in the xy plane in the x-axis direction, and (x ₁ , y _a ) the inspected substrate 200 It may be to load the coordinates (here, a is a natural number not 1).

A plurality of loading units may exist. For example, two loading units are disclosed. The first loading unit 130 may move the substrate 200 loaded on the first loading unit 110 to an initial position. The second loading unit 140 may transfer the substrate 200 inspected by the inspection unit 190 and transferred to the initial position by the shuttle unit 150 to the second loading unit 120 . The first loading unit 130 moves only the 'substrate 200 before inspection', and the second loading unit 140 moves only the 'substrate 200 after inspection', thereby improving the speed of moving the substrate 200 . . In addition, since the movement path of each loading unit can be simplified, control is easy, and interference problems such as collision between the loading units can be easily solved.

The movement of the first loading unit 110 , the loading unit, the shuttle unit 150 , the alignment unit 170 , the inspection unit 190 , and the second loading unit 120 , that is, the degree of freedom, as described above may be as follows. . For convenience of explanation, a spatial coordinate system in which the transfer path of the substrate 200 from the initial position to the inspection unit 190 is set in the x-axis direction is shown. Of course, the spatial coordinate system may be applied in various ways. In this case, the degree of freedom is defined as the degree of freedom of operation in a state in which each unit is driven in order to inspect the substrate 200 . Meanwhile, the setting degree of freedom represents the degree of freedom of each unit in the process of setting each unit to an initial design value before the inspection operation of the substrate 200 . For reference, Degrees of Freedom (DOF or Mobility) refers to the number of independent variables that can represent the state of an object as a minimum. In general, a two-dimensional object has a DOF value of 3. This includes the two-dimensional coordinates of the reference point and the angle at which the object is tilted. Similarly, a three-dimensional object has a DOF value of 6, because the three-dimensional coordinates of the reference point and the rotation angle for each axis must be expressed.

According to the illustrated spatial coordinate system, the first loading unit 110 and the second unit in the xyz space may have a z-axis working freedom when driving. For example, with respect to the ground, each loading unit can move up and down.

In the xyz space, the loading unit may have x-axis, y-axis, and z-axis operation degrees of freedom when driven. For example, the loading unit can move up, down, and horizontally relative to the ground.

In the xyz space, the shuttle unit 150 may have x-axis and y-axis operation degrees of freedom when driven. For example, the shuttle unit 150 may perform a horizontal motion with respect to the ground.

In the xyz space, the alignment unit 170 may be fixed during operation. That is, the alignment unit 170 may be a fixed unit.

In the xyz space, the test unit 190 may have a z-axis degree of freedom when driven. For example, the inspection unit 190 may perform upward and downward movements with respect to the ground.

In the inspection process of the substrate 200 , the position of the substrate 200 needs to be corrected, and it needs to be introduced into the alignment unit 170 and the inspection unit 190 . However, according to the inspection apparatus of the present invention, the alignment unit 170 is fixed, and the inspection unit 190 has a z-axis operation degree of freedom. Accordingly, the substrate 200 must be transferred to the positions of the alignment unit 170 and the inspection unit 190 , and the position must be corrected. The transfer of the substrate 200 means movement in the x-axis or the y-axis in the xyz plane, and the transfer of the substrate 200 is performed by the shuttle unit 150 . Accordingly, the shuttle unit 150 has x-axis and y-axis working degrees of freedom. The inspection apparatus of the present invention may also perform position correction of the substrate 200 by using the x-axis and y-axis operation degrees of freedom provided to the shuttle unit 150 for transferring the substrate 200 .

According to the above configuration, it is possible to minimize the movements of the alignment unit 170 and the inspection unit 190, which are relatively heavy compared to the shuttle unit 150 . As a result, it is possible to improve the working speed and at the same time make precise inspections possible. In addition, power consumption can be reduced.

In order to improve the working speed, the transfer path of the substrate 200 by the shuttle unit 150 may be determined as follows.

A transport path ⓐ of the substrate 200 from the initial position to the inspection unit 190 is defined as a first path, and a transport path ⓑ of the substrate 200 from the inspection unit 190 to the initial position is defined as a second path. In this case, the length of the first path may be shorter than the length of the second path. When the shuttle unit is provided in a single number, the first path and the second path may be the same. However, when a plurality of shuttle units are provided, if the first path and the second path are the same, an interference problem occurs in that each shuttle unit collides. Accordingly, when at least two shuttle units are provided, the first route and the second route should be different, and work efficiency may vary depending on how the different routes are configured.

In general, compared with the transfer time of the shuttle unit 150 , it takes a lot of time to check the alignment state of the substrate 200 by the alignment unit 170 and to inspect the substrate 200 by the inspection unit 190 during the energization inspection. Therefore, it is advantageous to minimize the transport distance from the initial position to the alignment unit 170 and the transport distance from the alignment unit 170 to the inspection unit 190 in order to reduce the overall power-on inspection time of the substrate 200 . This object can be achieved by making the length of the first path shorter than the length of the second path.

Specifically, the initial position, the alignment unit 170 and the inspection unit 190 may be provided on a virtual straight line.

In order to improve working speed, a plurality of shuttle units 150 may be provided.

The first shuttle unit 150a and the second shuttle unit 150b may transfer the substrate 200 using different paths among the first path and the second path. For example, when the first shuttle unit 150a is operating on the first route, the second shuttle unit 150b operates on the second route, and when the first shuttle unit 150a is running on the second route, the second shuttle The unit 150b may travel in the first path. In this case, the first path of the first shuttle unit 150a and the first path of the second shuttle unit 150b may be the same. That is, both the first shuttle unit 150a and the second shuttle unit 150b in FIG. 1 may use the path ⓐ as the first path. The second path of the second shuttle unit 150b and the second path of the second shuttle unit 150b may be formed with the first path interposed therebetween. According to this embodiment, even when a plurality of second shuttle units 150b are provided, the length of the first path may be shorter than the length of the second path. For example, the first path may be formed on a straight line regardless of the number of the second shuttle units 150b.

Among the substrates 200 loaded in the loading unit, a substrate located at the uppermost layer with respect to the ground (a substrate having a maximum value in the positive direction of the z-axis) is defined as the uppermost substrate.

First, look at the embodiment applied to the first loading unit (110).

At least when the uppermost substrate is loaded by the loading unit, the height from the ground to the uppermost substrate may be constant regardless of the number of substrates 200 loaded in the loading unit.

When the uppermost substrate (nth substrate) located at a height ⓓ from the ground is moved upstream of the inspection unit 190 by a loading unit, the height ⓔ from the ground to the next uppermost substrate (n-1 substrate) is nth as low as the thickness of the substrate. According to this, in order to load the n-1 th substrate, the loading unit has to descend further by the thickness of the n th substrate. This operation of the loading unit is not preferable because it causes interference with the loading unit and complexity of control. The loading unit may raise the n-1 th substrate by the thickness of the n th substrate in order to keep the position at which the loading of the substrate 200 is made constant by the loading unit.

To this end, the loading unit may include a loading unit 111 on which the substrate 200 is loaded and moving along the z-axis direction or the gravity direction.

When the substrate 200 of the first height is loaded from the ground by the loading unit 111 , the loading unit 111 may raise the substrate 200 of the second height to the first height.

However, the thickness of the substrate 200 is becoming very thin due to modern high integration and miniaturization. Therefore, it may be difficult for the loading part 111 to reliably rise as much as the thickness of the substrate 200 due to a mechanical error such as back lash. It is advantageous to lengthen the control distance in order to reduce such mechanical error.

Accordingly, the loading unit 111 may lower the substrate 200 of the second height to the first height without directly raising the substrate 200 to the first height, and then lower it to the third height. 1 , the first height may be ⓓ, the second height may be ⓔ, and the third height may be ⓕ. In this case, each height may have a relationship of ⓓ > ⓔ > ⓕ. According to this configuration, the loading unit is driven in the order of the left figure, the middle figure, and the right figure in FIG. 2 .

Next, an embodiment applied to the second loading unit 120 will be described.

At least the height from the ground to the uppermost substrate at the time when the substrate 200 moved from the downstream of the inspection unit 190 by the loading unit is unloaded may be constant regardless of the number of substrates 200 loaded in the loading unit.

Contrary to the previous example, it is a case in which the substrate 200 is loaded into the loading unit after the inspection. In this case, it is necessary to lower the uppermost substrate by the thickness of the substrate 200 . Also at this time, the loading part 111 may be lowered by the thickness of the substrate 200 . Alternatively, after descending further than the thickness of the substrate 200 to improve precision, it may rise appropriately.

That is, when the first height ⓓ > second height ⓔ > third height ⓕ has a relationship, the loading unit 111 may lower the uppermost substrate of the first height to the third height and then raise it to the second height. . According to this configuration, the loading unit 111 is driven in the order of the right picture, the middle picture, and the left picture in FIG. 2 .

The loading unit may include an arm 131 having x-axis, y-axis, and z-axis operation degrees of freedom, and an adsorption unit 133 formed at an end of the arm 131 and adsorbing the substrate 200 . In order to minimize damage to the substrate 200 when the substrate 200 is adsorbed, the adsorption unit 133 may have a z-axis working freedom of a shorter distance compared to the z-axis working freedom of the arm 131 .

Among the loading units, the first loading unit 130 moves the substrate 200 to the initial position before the inspection. At this time, the loading target substrate 200 may be in a state of being loaded in a plurality of the first loading unit (110). When the substrate 200 is thin, when the uppermost substrate is loaded, the lower substrate 200 may be attached to the uppermost substrate and loaded together. When the plurality of substrates 200 are placed in the initial positions, a large error may be caused in the inspection of the substrates 200 , so that only the uppermost substrate needs to be reliably loaded. To this end, the loading unit may reciprocate up and down in a second distance section h ₂ shorter than the first distance after loading the substrate 200 loaded on the loading unit and rising by a first distance h ₁ . This action is similar to the so-called action of brushing something off. Only the uppermost substrate 200 can be reliably loaded into the loading unit by the operation of the loading unit.

On the other hand, when the substrate 200 of the first loading unit 110 is loaded by the loading unit, or the substrate 200 of the loading unit is unloaded by the second loading unit 120, the loaded substrate 200 is xy It can be disturbed in a flat direction. In order to improve the inspection reliability of the substrate 200 before inspection, and to increase the management convenience of the substrate 200 after inspection, it is preferable to align the disordered substrate 200 . For this purpose, each loading unit may include an alignment unit.

The alignment unit may align the plurality of substrates 200 in the z-axis direction in the xyz space, and align the substrate 200 of at least the uppermost layer among the loaded substrates 200 in at least one of the x-axis direction and the y-axis direction. .

In order to align the substrate 200 on a plane, it is necessary to guide the substrate 200 in four directions. Accordingly, two first alignment units 113 moving in the x-axis direction and two second alignment units 115 moving in the y-axis direction may be provided. In order to improve the reliability of alignment and simplify the configuration, the loading unit may replace one of the first alignment units 113 and one of the second alignment units 115 with the fixing unit 117 .

The fixing part 117 is made of a fixed element such as a wall and may be in contact with the substrate 200 in at least one of the x-axis direction and the y-axis direction. It is in contact with the substrate 200 in the x-axis direction and the y-axis direction, and accordingly, one first alignment part 113 and one second alignment part 115 are used to align the substrate 200 in the xy plane direction. can

The substrate 200 may be provided with a plurality of circuit patterns 210 and alignment marks 230 formed for each circuit pattern. Each circuit pattern 210 may be a unit mounted on a product. For example, eight circuit patterns are shown, and each circuit pattern may form a substrate of a mobile communication terminal. That is, the substrate 200 may be separated into eight circuit patterns in a post process performed downstream of the inspection device and installed in each mobile communication terminal.

When a plurality of circuit patterns are included in one substrate 200 as described above, alignment marks may be formed for each circuit pattern in order to facilitate post-processing.

The alignment unit 170 constituting the inspection apparatus of the present invention may check the alignment state of each circuit pattern by using each alignment mark provided for each circuit pattern. That is, the alignment unit 170 of the present invention can check the alignment state of all alignment marks regardless of the inspection unit of the inspection unit 190 .

The inspection unit 190 is located downstream of the alignment unit 170 on the transfer path of the substrate 200 , and may inspect the energization state of each circuit pattern by using one or more circuit patterns as an inspection unit. In this case, the inspection unit may be the number of circuit patterns that can be inspected during one driving of the inspection unit 190 , specifically, one z-axis reciprocating motion in the xyz space.

An inspection target of the inspection unit 190 is all circuit patterns included in the substrate 200 . Nevertheless, the test unit may vary according to the probes 193 constituting the test unit 190 . For example, when the probe 193 capable of inspecting one circuit pattern on the substrate 200 is installed, the inspection unit becomes one circuit pattern. At this time, the inspection unit 190 may go through the z-axis reciprocating motion process eight times, and the shuttle unit 150 may move the substrate 200 in the x-axis direction or the y-axis direction so that an appropriate circuit pattern is inspected. When the probe 193 capable of inspecting two circuit patterns at once is installed on the substrate 200, the inspection unit is two circuit patterns. At this time, the inspection unit 190 undergoes a z-axis reciprocating motion process four times.

The shuttle unit 150 transports the substrate 200 along the transport path, and in the section from the alignment unit 170 to the inspection unit 190 , the substrate 200 is based on the inspection result and the inspection unit of the alignment unit 170 . ) can be sorted.

Since the alignment unit 170 of the present invention is in a fixed state in the xyz space, if there is an abnormality in the alignment state of the substrate 200 as a result of checking, a means for aligning the substrate 200 is required. As such a means, the shuttle unit 150 may be used.

The shuttle unit 150 corrects the alignment error of the substrate 200 confirmed by the alignment unit 170 by moving the substrate 200 in the x-axis direction or the y-axis direction in the section from the alignment unit 170 to the inspection unit. can do. In other words, the shuttle unit 150 has an x-axis degree of freedom and a y-axis degree of freedom on the xy plane, and can transport the substrate 200 along a transport path of the substrate 200 formed on the xy plane. In addition, the x-axis alignment error and the y-axis alignment error of the substrate 200 confirmed by the alignment unit 170 may be corrected using the x-axis degree of freedom and the y-axis degree of freedom.

When the inspection unit 190 uses one circuit pattern as an inspection unit, there may be an alignment error in each circuit pattern. At this time, when the inspection unit 190 inspects one circuit pattern and moves away from the substrate 200 in the z-axis direction, the shuttle unit 150 matches/aligns the circuit pattern to be the next inspection object with respect to the inspection unit. can This shape is similarly made when the inspection unit is smaller than the number of circuit patterns included in the substrate 200 . When the inspection unit is four circuit patterns with respect to the substrate 200 , the shuttle unit 150 may perform position correction on an alignment mark indicating an alignment state of an area including the four circuit patterns. For example, when the four circuit patterns below are inspection units, the shuttle unit 150 uses the second alignment mark from the bottom left to the top using the confirmation result of the alignment unit 170 and the first mark from the bottom right to the substrate ( 200) can be sorted.

In summary, the alignment unit 170 of the present invention can check the alignment state of all circuit patterns regardless of the inspection unit of the inspection unit 190 . Through this, the inspection unit of the inspection unit 190 may be set in various ways. The test unit may be determined by the probe 193 of the test unit 190 , and the probe 193 is determined during initial setting. Accordingly, according to the present embodiment, the inspection unit may be changed during initial setting, and the substrate 200 may be aligned with respect to various inspection units.

The inspection unit 190 may inspect the energization state of the substrate 200 through contact with the substrate 200 . In order to reliably perform the energization test, the test unit 190 may include a probe 193 . The probe 193 may directly contact the circuit pattern formed on the substrate 200 to perform the energization test.

The test unit 190 may include a plurality of probes 193 , a jig 191 supporting the probes 193 , and a base plate 195 on which the jig 191 is installed. The probe 193 may be formed in the area ⓟ facing the circuit pattern to be inspected in the jig 191 . One end of the probe 193 may protrude in the region ⓟ, and the other end may be connected to an electronic circuit.

The electronic circuit may apply a test signal to the circuit pattern, receive a response signal, and perform an energization test with the received response signal.

In the xyz space, the number of setting degrees of freedom when the inspection unit 190 is initially set and the number of working degrees of freedom when the inspection unit 190 is driven may be different from each other.

It is advantageous for the inspection unit 190 to have various degrees of freedom in order to reliably conduct energization tests in various environments. To this end, the degree of freedom of operation of the inspection unit 190 may be varied. However, when various degrees of work freedom of the inspection unit 190 are given, the control of the inspection unit 190 becomes complicated. The inspection unit 190 may be the largest and heaviest in the inspection apparatus, and moving the inspection unit 190 in various directions means that the working speed is lowered. Also, it is obvious that a lot of power will be consumed.

Therefore, it is preferable that the working freedom of the inspection unit 190 is as small as possible. For example, the inspection unit 190 may have only a z-axis working degree of freedom. In addition, the remaining degrees of freedom required for a reliable energization test can be solved with a degree of freedom of setting. That is, according to the present invention, the number of working degrees of freedom and the number of setting degrees of freedom of the inspection unit 190 may be different. Specifically, the number of working degrees of freedom may be less than the number of setting degrees of freedom.

In the xyz space, the setting degree of freedom set at the time of initial setting of the test unit 190 may have a relationship including the set of working degrees of freedom when the test unit 190 is driven.

For example, the set of working degrees of freedom of the inspection unit 190 may be {z} having a z-axis degree of freedom as an element. The setting degree of freedom set may be {x, y, z, r _z } including all elements of the working degree of freedom set. In this case, y may be a y-axis degree of freedom, x may be an x-axis degree of freedom, z is a z-axis degree of freedom, and r _z may be a rotational degree of freedom using the z-axis as a rotation axis. For reference, it is reminded that the z-axis working freedom included in the working degree of freedom set and the z-axis setting degree of freedom included in the setting degree of freedom set represent only the degrees of freedom and do not consider the size. That is, even if they have the same degree of freedom in the xyz space, the size of the working degree of freedom and the setting degree of freedom may be different. For example, the degree of freedom in setting the z-axis at the time of initial setting is for adjusting the distance between the probe 193 and the substrate 200, and the degree of freedom in the operation of the z-axis at the time of driving is to attach the initially set probe 193 to the substrate 200. It is intended to be in contact and the size may be different from each other.

Meanwhile, the test unit 190 may perform a energization test on both surfaces of the substrate 200 . Due to the recent high integration of circuit patterns, a plurality of circuit patterns may be formed on both surfaces of the substrate 200 . In some cases, the circuit pattern on one surface of the substrate 200 may be connected to the circuit pattern on the other surface of the substrate 200 . Therefore, for quick and reliable energization inspection, the inspection unit 190 includes a first inspection unit 192 in contact with one surface of the substrate 200 and a second inspection unit 194 in contact with the other surface of the substrate 200 . It is possible to check the energization state of (200). In this case, the first inspection unit 192 and the second inspection unit 194 may be in contact with the substrate 200 at the same time.

A case in which the first inspection unit 192 is located above the substrate 200 and the second inspection unit 194 is located below the substrate 200 is disclosed. At this time, the substrate 200 may be placed on the shuttle in which the through hole 153 is formed and gripped by the grip part 151 of the shuttle.

In the initial setting, the number of degrees of freedom of the first inspection unit 192 and the number of degrees of freedom of the second inspection unit 194 may be different from each other in the xyz space. The position of the first inspection unit 192 and the position of the second inspection unit 194 are relative. For example, when it is necessary to move the second inspection unit 194 in the first direction, the first inspection unit 192 may be moved in a second direction opposite to the first direction. In consideration of this point, it is not necessary to provide the same degree of freedom to both the first inspection unit 192 and the second inspection unit 194 . Rather, if the same degree of freedom is given to both the first inspecting unit 192 and the second inspecting unit 194, users may be confused and the configuration may be complicated. However, according to the present invention, since the number of degrees of freedom of the first inspection unit 192 and the number of degrees of freedom of the second inspection unit 194 are configured differently from each other, there is no such problem.

The inspection unit 190 may inspect the energization state with the first inspection unit 192 in contact with the upper surface of the substrate 200 and the second inspection unit 194 in contact with the lower surface of the substrate 200 based on the direction of gravity. . In the initial setting, the number of degrees of freedom of the first inspection unit 192 in the xyz space may be less than the number of degrees of freedom of the second inspection unit 194 . The reason for doing this is that the operation of the second inspection unit 194 installed on the floor is easier than the operation of the so-called first inspection unit 192 installed in the air. For example, in the initial setting, in the xyz space, the first inspection unit 192 has z-axis degrees of freedom and r- _z degrees of freedom, and the second inspection part 194 has x-axis degrees of freedom, y-axis degrees of freedom, and z-axis degrees of freedom. , r and _z degrees of freedom. When the setting freedom of the first inspection unit 192 and the setting freedom of the second inspection unit 194 are combined, the inspection unit 190 has x-axis degrees of freedom, y-axis degrees of freedom, z-axis degrees of freedom, and r- _z degrees of freedom.

The first loading unit 130 is loading the substrate 200 in the first loading unit 110 . At this time, the first shuttle unit 150a is located in the inspection unit 190 , and the substrate 200 transferred to the inspection unit 190 by the first shuttle unit 150a is energized by the inspection unit 190 . is being carried out The second shuttle unit 150b is in a state in which the substrate 200 that has been inspected by the inspection unit 190 is transferred to the initial position, and the second loading unit 140 is loading the substrate 200 in the initial position.

The second loading unit 140 is placed on the second shuttle unit 150b and the substrate 200 on which the inspection has been completed is unloaded from among the second loading units 120 on which the normal substrate 200 is loaded. The first loading unit 130 is unloading the substrate 200 to be inspected to the second shuttle (initial position) after the second loading unit 140 is out of the initial position. The first shuttle unit 150a is still in the inspection unit 190 , and the substrate 200 is still being inspected.

The substrate 200, which has been inspected by the inspection unit 190, is in a state of being pulled into the second path by the first shuttle unit 150a. The second shuttle unit 150b on which the substrate 200 to be inspected is placed moves in the x-axis direction and moves to the alignment unit 170 . At this time, the alignment state of the substrate 200 placed on the second shuttle unit 150b is checked. When the photographing range of the alignment unit 170 is smaller than the circuit pattern, the second shuttle unit 150b may appropriately move in the x-axis direction or the y-axis direction to allow proper photographing. The first loading unit 130 is being moved to the first loading unit 110 , and the second loading unit 140 is in a state where it is easy to access the initial position.

The alignment state of the substrate 200 placed on the second shuttle unit 150b is checked and transferred to the inspection unit 190 by the second shuttle unit 150b. The first shuttle unit 150a is moved to an initial position along the x-axis along the second path. The first loading unit 130 moves to the first loading unit 110 . The second loading unit 140 maintains the position of FIG. 8 .

The first shuttle unit 150a completely positions the inspected substrate 200 at the initial position. The second loading unit 140 moves to the initial position to load the inspected substrate 200 . The first loading unit 130 loads the substrate 200 to be inspected from the first loading unit 110 . The substrate 200 placed on the second shuttle unit 150b is still being inspected in the inspection unit 190 .

The second loading unit 140 transfers the substrate 200 at the initial position to the unit on which the open substrate 200 is loaded among the second loading units 120 according to the inspection result. The first loading unit 130 moves the substrate 200 of the first loading unit 110 to the initial position after the second loading unit 140 deviates from the initial position. The substrate 200 placed on the second shuttle unit 150b is still being inspected in the inspection unit 190 .

After the inspection of the substrate 200 by the inspection unit 190 is completed, the second shuttle unit 150b transfers the substrate 200 through the second path. The first shuttle unit 150a on which the substrate 200 to be inspected is placed enters the alignment unit 170 along the first path, and the alignment state of the substrate 200 to be inspected is checked.

The first loading unit 130 moves from the initial position to the first loading unit 110 , and the second loading unit 140 moves from the unit on which the open substrate 200 is loaded to a position where it is easy to enter the initial position. do.

The second shuttle unit 150b moves to an initial position on the x-axis along the second path. The first shuttle unit 150a transfers the substrate 200 on which the alignment check in the alignment unit 170 has been completed to the inspection unit 190 along a first path. The first loading unit 130 is in a state where the movement to the first loading unit 110 is completed, and the second loading unit 140 maintains the position of FIG. 12 .

Two shuttle units 150 , a first path, two second paths, a first loading unit 130 for moving only the substrate 200 before inspection to an initial position, a second loading unit 130 for moving only the substrate 200 after inspection from the initial position The loading unit 140, the alignment unit 170, which are arranged on a straight line from the initial position, and there is no movement in the xy plane, and the inspection unit 190 can perform the energization inspection of the substrate 200 quickly and automatically without interfering with each other. can

110...First loading unit 111...Loading unit
113...first alignment unit 115...second alignment unit
117...Fixed part 120...Second loading unit
130...first loading unit 131...arm
133...Suction unit 140...Second loading unit
150...shuttle unit
150a... 1st shuttle unit 150b... 2nd shuttle unit
151...Grip part 153...Through hole
170...alignment unit 180...cleaning unit
190...probe unit 191...jig
192...First inspection unit 193...Probe
194...Second inspection unit 195...Base plate
200...substrate 210...circuit pattern
230...align mark 300...imprint unit
400... index unit
D... Imprinted C... Circuit
R1... first path R2... second path
R1-1... Path 1-1 R1-2... Path 1-2
R2-1... 2-1 route R2-2... 2-2 route
P1... 1st position P2... 2nd position
P3... 3rd position P4... 4th position
P4-1... Position 4-1 P4-2... Position 4-2
P5... 5th position P6... 6th position

Claims (13)

an alignment unit for inspecting the alignment state of the substrate;
a probe unit for inspecting the energization state of the substrate;
an imprinting unit for inspecting the imprinting state of the substrate; inspection device comprising a.
The method of claim 1,
An inspection device in which the inspection process is performed in the order of the alignment unit, the probe unit, and the stamping unit.
The method of claim 1,
a second position in which the substrate waits before moving to the alignment unit is set;
and a shuttle unit for transferring the substrate along an imaginary straight line connecting the second position, the alignment unit, and the probe unit.
The method of claim 1,
a second position in which the substrate waits before moving to the alignment unit is set;
The alignment unit and the stamping unit are positioned at a third position that is a position for the inspection step between the second position and the probe unit.
The method of claim 1,
A second position in which the substrate waits before moving to the alignment unit and a fifth position in which the substrate waits after completion of the stamping inspection are set,
Assuming that a path from the second position to the probe unit through the alignment unit is a first path, and a path from the probe unit to the fifth position through the stamping unit is referred to as a second path,
The first path is shorter than the second path.
The method of claim 1,
When the position of the alignment unit is referred to as the third position, and the position of the stamping unit is the position 4-2,
The third position and the 4-2 position are the same,
If the direction from the imprinting unit to the probe unit is a first direction,
The alignment unit and the stamping unit are provided at positions spaced apart from each other in the first direction.
The method of claim 1,
The alignment unit and the stamping unit are provided adjacent to each other,
An inspection apparatus in which a process progress direction from the alignment unit to the probe unit and a process progress direction from the stamp unit to the next step are opposite to each other.
The method of claim 1,
A second position in which the substrate waits before moving to the alignment unit and a fifth position in which the substrate waits after completion of the stamping inspection are set,
Assuming that the path from the second position to the probe unit through the alignment unit is referred to as a first path, and the path from the probe unit to the fifth position through the stamping unit is referred to as a second path,
A plurality of shuttle units for moving the substrate through the first path and the second path are provided,
each second position and each fifth position of each shuttle unit coincide with each other;
The second position and the fifth position coincide with each other.
The method of claim 1,
A second position in which the substrate waits before moving to the alignment unit and a fifth position in which the substrate waits after completion of the stamping inspection are set,
A 1-1 path is from the second position to the alignment unit, a 1-2 path is from the alignment unit to the probe unit, a 2-1 path is from the probe unit to the imprinting unit, and in the imprinting unit If the 5th location is the 2-2 route,
When the first shuttle unit for moving the first substrate is located on the 2-2 path, the second shuttle unit for moving the second substrate is located on the 1-2 path or the 2-1 path inspection device.
The method of claim 1,
A second position in which the substrate waits before moving to the alignment unit and a fifth position in which the substrate waits after completion of the stamping inspection are set,
The second position, the alignment unit, the probe unit, the imprinting unit, and the fifth position are provided with an index unit occupying each step of the inspection process,
An inspection apparatus in which inspection of the substrate is sequentially performed by rotation of the index unit.
The method of claim 1,
The probe unit includes a plurality of probes in contact with the substrate while lifting with respect to the substrate,
Inspection apparatus provided with a control unit for determining a defect by comparing the amount of the imprint of the substrate photographed by the imprinting unit with a reference value.
The method of claim 1,
The control unit calculates the substrate position error of the alignment unit through the camera located in the alignment unit,
The control unit moves the substrate to a position and angle that corrects the substrate position error calculated by the alignment unit, and then controls the substrate seating table of the probe unit so that the probe can contact the accurate measurement point of the substrate,
The control unit compares the imprinting of the substrate by the probe with a reference value, and determines that the imprinting of the image captured by the camera is greater than or equal to the reference value as a defect in imprinting.
The method of claim 1,
The amount of imprinting of the substrate by the probe provided in the probe unit is photographed by the camera of the imprinting unit,
A control unit is provided that compares the amount of imprinting of the substrate with a reference value from the image obtained from the camera of the imprinting unit, and determines at least one of abrasion of the probe, bending of the probe, and foreign matter caught in the probe from the comparison result inspection device.

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