JPH07227561A - Waste coating applying device of syringe for applying resin liquid - Google Patents

Waste coating applying device of syringe for applying resin liquid

Info

Publication number
JPH07227561A
JPH07227561A JP2091094A JP2091094A JPH07227561A JP H07227561 A JPH07227561 A JP H07227561A JP 2091094 A JP2091094 A JP 2091094A JP 2091094 A JP2091094 A JP 2091094A JP H07227561 A JPH07227561 A JP H07227561A
Authority
JP
Japan
Prior art keywords
waste coating
syringe
circuit board
printed circuit
cylindrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2091094A
Other languages
Japanese (ja)
Inventor
Shigeki Kobayashi
茂樹 木林
Takao Kato
高男 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP2091094A priority Critical patent/JPH07227561A/en
Publication of JPH07227561A publication Critical patent/JPH07227561A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303Surface mounted components, e.g. affixing before soldering, aligning means, spacing means

Landscapes

  • Coating Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To realize an increase in the number of waste coating applying times by forming a waste coating applying body to a cylinder form, rotating this cylindrical waste coating applying body by a proper angle at every waste coating applying on the outer peripheral surface of the cylindrical waste coating applying body and moving the waste coating applying body by a proper size in an axial line direction. CONSTITUTION:A printed circuit board 11 is formed with plural pieces of adhesive parts 11a for electronic parts 10 on its front surface and a syringe 12 descends toward the respective adhesive parts 11a after moving in X- and Y directions along the front surface of this printed circuit board 11, thereby applying adhesives 14 for tack welding of the electronic parts to the respective adhesive parts 11a. This waste coating device is provided with the cylindrical waste coating body 15 for executing waste coating by the syringe 12. The waste coating body 15 is disposed in the section on the side of the printed circuit board 11 in such a manner that the axial line 15a of the waste coating body 15 parallels approximately with the surface of the printed circuit board 11. The waste coating body 15 is supported freely rotatably via bearings and freely slidably in an axial line direction on a machine bed at its supporting shaft 16.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、プリント基板等に対し
て、電子部品のマウント用接着剤等の樹脂液を、シリン
ジにて塗布するに際して、前記シリンジにおけるノズル
からの樹脂液の正常な吐出状態を確認するために、捨て
塗布を行うための装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a normal discharge of a resin liquid from a nozzle in the syringe when a resin liquid such as an adhesive for mounting electronic parts is applied to a printed circuit board or the like by a syringe. The present invention relates to a device for performing a waste coating to confirm the state.

【0002】[0002]

【従来の技術】一般に、プリント基板に対してトランジ
スター等の電子部品を実装するに際しては、先づ、前記
プリント基板の表面のうち電子部品の取付け箇所に接着
剤を塗布し、この接着剤にて電子部品をプリント基板に
対して仮付けしたのち、前記電子部品をプリント基板に
対して半田付けするようにしている。
2. Description of the Related Art Generally, when mounting an electronic component such as a transistor on a printed circuit board, an adhesive is first applied to a mounting position of the electronic component on the surface of the printed circuit board, and the adhesive is used for the mounting. After the electronic component is temporarily attached to the printed board, the electronic component is soldered to the printed board.

【0003】そして、プリント基板に対して接着剤を塗
布するに際しては、従来から良く知られ、且つ、図4に
示すように、接着剤を入れたシリンジ1を、プリント基
板2の表面における所定の取付け箇所に移動したのち、
次いで、シリンジ1をプリント基板2に対して接近する
ように下降動したのち、当該シリンジ1におけるノズル
3から接着剤の所定量を吐出することによって、プリン
ト基板1の所定の箇所に接着剤4を塗布するようにして
いる。
When the adhesive is applied to the printed circuit board, as shown in FIG. 4, which is well known in the art, the syringe 1 containing the adhesive is placed on the surface of the printed circuit board 2 in a predetermined manner. After moving to the mounting location,
Then, the syringe 1 is moved downward so as to approach the printed circuit board 2, and then a predetermined amount of the adhesive is discharged from the nozzle 3 of the syringe 1 so that the adhesive 4 is applied to a predetermined portion of the printed circuit board 1. I try to apply it.

【0004】ところで、この塗布に際しては、前記シリ
ンジ1におけるノズル3からの吐出量が正常である否か
のチェックを行うためとか、或いは、作業の終了時にお
いて、シリンジ1内における接着剤の全てを消費し尽く
すときとか、更には、作業の開始時において、シリンジ
1内の空気を抜くとき等のために、電子部品の取付け箇
所以外の箇所に対して捨て塗布を行うことが必要であ
る。
By the way, at the time of this application, it is necessary to check whether the discharge amount from the nozzle 3 of the syringe 1 is normal or at the end of the work, all the adhesive in the syringe 1 is removed. In order to exhaust the air in the syringe 1 at the time of consuming it, or at the time of starting the work, it is necessary to discard and apply it to a place other than the place where the electronic component is attached.

【0005】そこで、従来は、特開平3−206684
号公報に記載されているように、プリント基板における
表面のうち、電子部品の装着箇所以外の余白スペースに
対して、捨て塗布を行うようにしたり、或いは、図4に
示すように、プリント基板1の側方に、平面状の捨て塗
布板5を配設する一方、前記シリンジ1を、この捨て塗
布板5の上方まで移動したのち、当該シリンジ1におけ
るノズル3からの捨て塗布1aを、前記捨て塗布板5の
表面に対して行うようにしている。
Therefore, in the prior art, Japanese Patent Laid-Open No. 3-2066864
As described in Japanese Patent Publication No. JP-A-2003-264, the coating on the surface of the printed circuit board is performed in a blank space other than the mounting position of the electronic component, or as shown in FIG. While disposing a flat discard coating plate 5 on the side of the syringe 1, the syringe 1 is moved to a position above the discard coating plate 5, and then the discard coating 1a from the nozzle 3 of the syringe 1 is discarded. It is designed to be applied to the surface of the coating plate 5.

【0006】[0006]

【発明が解決しようとする課題】しかし、前者のよう
に、捨て塗布を、プリント基板における表面のうち余白
スペースに対して行う方法は、捨て塗布の回数に限度が
あると言う問題がある。これに対して、後者のように、
捨て塗布を、プリント基板の側方に配設した平面状の捨
て塗布板5に対して行う方法では、捨て塗布の回数を多
くすることができるものの、前記捨て塗布板5を、XY
テーブル6によって、捨て塗布ごとにX方向とY方向と
の両方に移動するようにしなければならず、広い床面積
を必要とすることに加えて、XYテーブルを必要とする
から、装置が著しく大型化するばかりか、価格の大幅な
アップを招来すると言う問題があった。
However, as in the former method, the method of performing the waste coating on the blank space of the surface of the printed circuit board has a problem that the number of times of the waste coating is limited. On the other hand, like the latter,
In the method of performing the discard coating on the flat discard coating plate 5 disposed on the side of the printed circuit board, although the number of discard coating can be increased, the discard coating plate 5 is
The table 6 has to be moved in both the X and Y directions after each waste coating, and in addition to requiring a large floor area, it requires an XY table, which makes the apparatus significantly large. There is a problem that not only the price will increase, but also the price will increase significantly.

【0007】本発明は、これらの問題を解消した捨て塗
布装置を提供することを技術的課題とするものである。
SUMMARY OF THE INVENTION The present invention has a technical object to provide a discarding coating device which solves these problems.

【0008】[0008]

【課題を解決するための手段】この技術的課題を達成す
るため本発明は、「接着剤等の樹脂液をシリンジにて塗
布するプリント基板等の被塗布体における側方の部位
に、前記シリンジによる捨て塗布を行うための捨て塗布
体を配設して成る捨て塗布装置において、前記捨て塗布
体を、軸線を前記被塗布体における樹脂塗布面と略平行
にした円筒形に形成し、この円筒形捨て塗布体を、当該
円筒形捨て塗布体の外周面に対する捨て塗布ごとに、適
宜角度ずつ回転すると共に、軸線方向に適宜寸法ずつ移
動するように構成する。」ことにした。
In order to achieve this technical object, the present invention provides a "syringe at a side portion of an object to be coated such as a printed circuit board on which a resin liquid such as an adhesive is applied by a syringe. In a waste coating device comprising a waste coating body for performing the waste coating by means of the above method, the waste coating body is formed into a cylindrical shape whose axis is substantially parallel to the resin coating surface of the object to be coated. The shape discarding applicator is configured to rotate by an appropriate angle and move by an appropriate dimension in the axial direction for each discarding application to the outer peripheral surface of the cylindrical discard applicator. ”

【0009】[0009]

【作 用】このように、捨て塗布体を、円筒形に形成
し、この円筒形捨て塗布体を、当該円筒形捨て塗布体の
外周面に対する捨て塗布ごとに、適宜角度だけ回転する
と共に、軸線方向に適宜寸法だけ移動するように構成し
たことにより、前記円筒形捨て塗布体の外周面に対する
前記シリンジによる捨て塗布を、当該円筒形捨て塗布体
における外周面をその円周方向に巡る螺旋状の軌跡に沿
って行うことができる。
[Operation] In this way, the discarding applicator is formed in a cylindrical shape, and the cylindrical discarding applicator is rotated by an appropriate angle for each discarding application to the outer peripheral surface of the cylindrical discarding applicator, and the axial line By being configured to move by an appropriate dimension in the direction, the discarding application by the syringe to the outer peripheral surface of the cylindrical discarding applicator is a spiral shape that surrounds the outer peripheral surface of the cylindrical discarding applicator in its circumferential direction. It can be done along a trajectory.

【0010】[0010]

【発明の効果】従って、本発明によると、捨て塗布体に
対して行うことのできる捨て塗布の回数を多くすること
ができるものでありながら、円筒形捨て塗布体を、適宜
角度ずつ回転すると共に、軸線方向に適宜寸法ずつ移動
するだけで良く、従来のように、平面状の捨て塗布板を
YXテーブルによって移動するものに比べて、床面積を
著しく大幅に縮小できると共に、構造を簡単化できるか
ら、装置の大幅な小型化と、低価格化とを達成できる効
果を有する。
As described above, according to the present invention, the number of times of waste coating that can be performed on the waste coating body can be increased, while the cylindrical waste coating body is rotated by an appropriate angle. , It is only necessary to move by an appropriate size in the axial direction, and the floor area can be remarkably reduced and the structure can be simplified as compared with the conventional one in which a flat waste coating plate is moved by a YX table. Therefore, there is an effect that the device can be significantly downsized and the cost can be reduced.

【0011】[0011]

【実施例】以下、本発明の実施例を、図1〜図3の図面
について説明する。この図において符号11は、被塗布
物の一つの例であるところのプリント基板を示し、この
プリント基板11の表面には、電子部品10に対する複
数個の装着部11aが形成されている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to the drawings of FIGS. In the figure, reference numeral 11 indicates a printed circuit board which is an example of the object to be coated, and a plurality of mounting portions 11a for the electronic component 10 are formed on the surface of the printed circuit board 11.

【0012】また、符号12は、樹脂液の一つの例であ
るところの接着剤をノズル13から吐出するようにした
シリンジを示し、このシリンジ12は、前記プリント基
板11の表面に沿ってX方向とY方向とに移動したの
ち、前記各装着部11aに向かって下降動することによ
って、各装着部11aに対して電子部品仮付け用の接着
剤14を塗布するものである。
Reference numeral 12 indicates a syringe in which an adhesive, which is one example of a resin liquid, is discharged from a nozzle 13, and the syringe 12 extends along the surface of the printed circuit board 11 in the X direction. After moving in the Y direction and then in the Y direction, the adhesive 14 for temporary mounting of electronic components is applied to each mounting portion 11a by descending.

【0013】符号15は、前記シリンジ12による捨て
塗布を行うための捨て塗布体を示し、この捨て塗布体1
5を、円筒形に形成し、これを、前記プリント基板11
の側方の部位に、当該捨て塗布体15における軸線15
aが前記プリント基板11の表面と略平行となるように
配設して、当該円筒形捨て塗布体15の外周面に前記シ
リンジ12による捨て塗布12aを行うように構成し、
この円筒形捨て塗布体15に対する支持軸16を、機台
17に取付けた軸受け部18にて、回転自在に、且つ、
軸線方向に摺動自在に軸支する。
Reference numeral 15 indicates a discarded coating body for performing the discarded coating by the syringe 12, and the discarded coating body 1
5 is formed into a cylindrical shape, which is formed on the printed circuit board 11
The axis 15 of the discarding applicator body 15 is located on the side of the
Arranged so that a is substantially parallel to the surface of the printed circuit board 11, and configured to perform the waste coating 12a by the syringe 12 on the outer peripheral surface of the cylindrical waste coating body 15.
A support shaft 16 for the cylindrical waste applicator 15 is rotatably supported by a bearing portion 18 attached to a machine base 17, and
The shaft is slidably supported in the axial direction.

【0014】そして、前記円筒形捨て塗布体15におけ
る支持軸16には、ねじ軸部19を設けて、このねじ軸
部19を、前記軸受け部18に固着のナット部材20に
おける雌ねじ孔20aに螺合する一方、前記支持軸16
の一端部を、長溝孔16b′を有する中空の軸継ぎ手部
16bに形成し、この軸継ぎ手部16b内に、図示しな
いモータ等にて回転駆動される駆動軸21を、この駆動
軸21に植設したピン21aが前記長溝孔16b′内に
嵌まるように摺動自在に挿入することにより、前記円筒
形捨て塗布体15を、当該円筒形捨て塗布体15の外周
面へのシリンジ12による捨て塗布12aを行うごとに
これに連動して、矢印Aの方向に適宜角度θずつ間欠的
に回転するように構成する。
A screw shaft portion 19 is provided on the support shaft 16 of the cylindrical waste applicator body 15, and the screw shaft portion 19 is screwed into the female screw hole 20a of the nut member 20 fixed to the bearing portion 18. Meanwhile, the support shaft 16
Is formed in a hollow shaft joint portion 16b having a long groove hole 16b ', and a drive shaft 21 rotationally driven by a motor or the like (not shown) is planted in the drive shaft 21 in the shaft joint portion 16b. By disposing the provided pin 21a slidably so as to fit in the slot 16b ', the cylindrical waste applicator body 15 is discarded by the syringe 12 to the outer peripheral surface of the cylindrical waste applicator body 15. Each time the coating 12a is performed, it is interlocked with the coating 12a and intermittently rotated by an angle θ in the direction of the arrow A.

【0015】この構成において、円筒形捨て塗布体15
は、当該円筒形捨て塗布体15の外周面に対する捨て塗
布後において、モータ等によって矢印方向Aに適宜角度
θだけ回転されると同時に、その支持軸16に設けたね
じ軸部19がナット部材20における雌ねじ孔20aに
螺合していることにより、矢印Bで示す軸線方向に適宜
寸法だけ移動することになる。
In this structure, the cylindrical waste coating body 15
After the waste coating on the outer peripheral surface of the cylindrical waste coating body 15, the motor is rotated by an appropriate angle θ in the arrow direction A at the same time, and at the same time, the screw shaft portion 19 provided on the support shaft 16 is fixed to the nut member 20. By being screwed into the female screw hole 20a in the above, it can be moved by an appropriate dimension in the axial direction indicated by the arrow B.

【0016】すなわち、前記円筒形捨て塗布体15は、
当該円筒形捨て塗布体15の外周面に対する捨て塗布ご
とに、適宜角度θだけ回転すると共に、軸線方向に適宜
寸法だけ移動することにより、この円筒形捨て塗布体1
5の外周面に対する前記シリンジ12による捨て塗布1
2aを、当該円筒形捨て塗布体15における外周面をそ
の円周方向に巡る螺旋状の軌跡22に沿って行うことが
できるのである。
That is, the cylindrical discarding applicator 15 is
Each time the waste coating is applied to the outer peripheral surface of the cylindrical waste coating body 15, the cylindrical waste coating body 1 is rotated by an appropriate angle θ and moved by an appropriate dimension in the axial direction.
Disposal application 1 by the syringe 12 on the outer peripheral surface of
2a can be carried out along a spiral locus 22 that goes around the outer peripheral surface of the cylindrical waste applicator 15 in the circumferential direction.

【0017】この場合、前記円筒形捨て塗布体15にお
ける外周面に対して行われた捨て塗布12aは、当該円
筒形捨て塗布体15を、その外周面にスクレーパを接触
した状態で、回転することにより、容易に除去すること
ができ、また、これに代えて、前記円筒形捨て塗布体1
5における外周面に、紙又は合成樹脂製の捨て塗布用フ
ィルム23を、着脱自在に巻付けておき、捨て塗布完了
後において、この捨て塗布用フィルム23を剥離するよ
うに構成しても良いのである。
In this case, the discarding application 12a performed on the outer peripheral surface of the cylindrical discarding applicator body 15 is such that the cylindrical discarding applicator body 15 is rotated with the scraper being in contact with the outer peripheral surface thereof. Can be easily removed, and instead of this, the cylindrical waste applicator 1
It is also possible that a paper or synthetic resin film 23 for throwing away is removably wound around the outer peripheral surface of No. 5 and the film 23 for throwing away is peeled off after the completion of the throwing away coat. is there.

【0018】そして、前記実施例のように、円筒形捨て
塗布体15における支持軸16を、軸受け部18にて、
回転自在に、且つ、軸線方向に摺動自在に軸支する一
方、この支持軸16に、前記軸受け部18に固着したナ
ット部材20に螺合するねじ軸部19を設けることによ
り、前記円筒形捨て塗布体15を矢印方向に適宜角度θ
だけ回転することで、同時に、この円筒形捨て塗布体1
5を、その軸線方向に適宜寸法だけ移動することができ
るから、その機構を著しく簡単化できる利点がある。
Then, as in the above-mentioned embodiment, the support shaft 16 of the cylindrical discarding applicator body 15 is supported by the bearing portion 18.
The support shaft 16 is rotatably supported so as to be slidable in the axial direction, and the support shaft 16 is provided with a screw shaft portion 19 screwed into a nut member 20 fixed to the bearing portion 18. The discarding applicator 15 is angled in the direction of the arrow θ
By rotating only, at the same time, this cylindrical waste coating body 1
Since 5 can be moved in the axial direction by an appropriate size, there is an advantage that the mechanism can be remarkably simplified.

【0019】また、本発明は、前記実施例のように、プ
リント基板11に対して、当該プリント基板11に電子
部品10の仮付け用接着剤14を塗布する場合に限ら
ず、その他の用途にも適用できることは言うまでもな
い。
The present invention is not limited to the case where the adhesive 14 for temporarily attaching the electronic component 10 to the printed circuit board 11 is applied to the printed circuit board 11 as in the above-described embodiment, and the present invention can be applied to other applications. It goes without saying that it is also applicable.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例を示す斜視図である。FIG. 1 is a perspective view showing an embodiment of the present invention.

【図2】本発明の実施例を示す正面図である。FIG. 2 is a front view showing an embodiment of the present invention.

【図3】図2にIII −III 視断面図である。FIG. 3 is a sectional view taken along line III-III in FIG.

【図4】従来のものを示す斜視図である。FIG. 4 is a perspective view showing a conventional one.

【符号の説明】[Explanation of symbols]

10 電子部品 11 プリント基板 12 シリンジ 13 シリンジのノズル 15 円筒形捨て塗布体 16 支持軸 17 機台 18 軸受け部 19 ねじ軸部 20 ナット部材 21 駆動軸 DESCRIPTION OF SYMBOLS 10 Electronic parts 11 Printed circuit board 12 Syringe 13 Syringe nozzle 15 Cylindrical waste application body 16 Support shaft 17 Machine stand 18 Bearing part 19 Screw shaft part 20 Nut member 21 Drive shaft

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】接着剤等の樹脂液をシリンジにて塗布する
プリント基板等の被塗布体における側方の部位に、前記
シリンジによる捨て塗布を行うための捨て塗布体を配設
して成る捨て塗布装置において、前記捨て塗布体を、軸
線を前記被塗布体における樹脂塗布面と略平行にした円
筒形に形成し、この円筒形捨て塗布体を、当該円筒形捨
て塗布体の外周面に対する捨て塗布ごとに、適宜角度ず
つ回転すると共に、軸線方向に適宜寸法ずつ移動するよ
うに構成したことを特徴とする樹脂液塗布用シリンジに
おける捨て塗布装置。
1. A throw-away application body for disposing a resin solution such as an adhesive with a syringe at a side portion of an article to be applied such as a printed circuit board. In the coating apparatus, the discarding applicator is formed into a cylindrical shape whose axis is substantially parallel to the resin coating surface of the object to be coated, and the cylindrical discarding applicator is discarded to the outer peripheral surface of the cylindrical discarding applicator. A discarding coating device for a resin liquid coating syringe, characterized in that the coating liquid is rotated by an appropriate angle for each application and moved by an appropriate dimension in the axial direction.
JP2091094A 1994-02-18 1994-02-18 Waste coating applying device of syringe for applying resin liquid Pending JPH07227561A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2091094A JPH07227561A (en) 1994-02-18 1994-02-18 Waste coating applying device of syringe for applying resin liquid

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2091094A JPH07227561A (en) 1994-02-18 1994-02-18 Waste coating applying device of syringe for applying resin liquid

Publications (1)

Publication Number Publication Date
JPH07227561A true JPH07227561A (en) 1995-08-29

Family

ID=12040385

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2091094A Pending JPH07227561A (en) 1994-02-18 1994-02-18 Waste coating applying device of syringe for applying resin liquid

Country Status (1)

Country Link
JP (1) JPH07227561A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100452946C (en) * 2004-04-20 2009-01-14 雅马哈精密科技株式会社 Method and device for manufacturing conductive patterns in a printed circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100452946C (en) * 2004-04-20 2009-01-14 雅马哈精密科技株式会社 Method and device for manufacturing conductive patterns in a printed circuit board

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