TW200632351A - A circuit pattern inspection device and inspection method thereof - Google Patents

A circuit pattern inspection device and inspection method thereof

Info

Publication number
TW200632351A
TW200632351A TW095102033A TW95102033A TW200632351A TW 200632351 A TW200632351 A TW 200632351A TW 095102033 A TW095102033 A TW 095102033A TW 95102033 A TW95102033 A TW 95102033A TW 200632351 A TW200632351 A TW 200632351A
Authority
TW
Taiwan
Prior art keywords
inspection
noise
conductive pattern
signal
contact way
Prior art date
Application number
TW095102033A
Other languages
Chinese (zh)
Inventor
Hiroshi Hamori
Shuji Yamaoka
Shogo Ishioka
Original Assignee
Oht Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oht Inc filed Critical Oht Inc
Publication of TW200632351A publication Critical patent/TW200632351A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/52—Testing for short-circuits, leakage current or ground faults
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/54—Testing for continuity

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)

Abstract

There are provided a circuit pattern inspection device and inspection method thereof capable of detecting the open state of a conductive pattern on a substrate. A power supply unit (12) for supplying an inspection signal in a non-contact way is arranged at one end of the conductive pattern and an open sensor (13) for detecting the inspection signal in a non-contact way is arranged at the other end of the conductive pattern. Furthermore, a noise sensor (19) is arranged in a non-contact way on a conductive pattern located at a distance of several patterns from the aforementioned conductive pattern and at the end of the same side as the open sensor (13). A signal containing the inspection signal and a noise detected by the open sensor (13) and a signal containing only noise not mixed with the inspection signal detected by a noise sensor are inputted to a differential amplifier (20), where the noise as a signal of the same phase component is removed. Thus, it is possible to surely inspect the conductive patterns arranged on a string shape on the substrate in a non-contact way.
TW095102033A 2005-01-19 2006-01-19 A circuit pattern inspection device and inspection method thereof TW200632351A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005012006A JP4417858B2 (en) 2005-01-19 2005-01-19 Circuit pattern inspection apparatus and method

Publications (1)

Publication Number Publication Date
TW200632351A true TW200632351A (en) 2006-09-16

Family

ID=36692414

Family Applications (2)

Application Number Title Priority Date Filing Date
TW095102033A TW200632351A (en) 2005-01-19 2006-01-19 A circuit pattern inspection device and inspection method thereof
TW102105827A TWI407126B (en) 2005-01-19 2006-01-19 Circuit pattern checking device and method thereof

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW102105827A TWI407126B (en) 2005-01-19 2006-01-19 Circuit pattern checking device and method thereof

Country Status (5)

Country Link
JP (1) JP4417858B2 (en)
KR (1) KR101175384B1 (en)
CN (1) CN101107535A (en)
TW (2) TW200632351A (en)
WO (1) WO2006078045A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008249522A (en) * 2007-03-30 2008-10-16 Aisin Seiki Co Ltd Glass breakage detection apparatus
JP5391819B2 (en) * 2009-05-14 2014-01-15 日本電産リード株式会社 Touch panel inspection device
JP4644745B2 (en) * 2009-08-04 2011-03-02 オー・エイチ・ティー株式会社 Circuit pattern inspection device
JP5580247B2 (en) * 2011-04-27 2014-08-27 株式会社ユニオンアロー・テクノロジー Pattern inspection device
JP5432213B2 (en) * 2011-05-20 2014-03-05 株式会社ユニオンアロー・テクノロジー Pattern inspection device
US9121884B2 (en) * 2013-06-07 2015-09-01 Infineon Technologies Ag Capacitive test method, apparatus and system for semiconductor packages
CN110672948B (en) * 2019-09-29 2021-04-20 云谷（固安）科技有限公司 Touch panel detection equipment and system

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06187088A (en) * 1992-12-18 1994-07-08 Seiko Epson Corp Tablet
JP3527726B2 (en) * 2002-05-21 2004-05-17 ウインテスト株式会社 Inspection method and inspection device for active matrix substrate
JP4246987B2 (en) 2002-11-27 2009-04-02 日本電産リード株式会社 Substrate inspection apparatus and substrate inspection method
WO2004051290A1 (en) * 2002-11-30 2004-06-17 Oht Inc. Circuit pattern inspection device and circuit pattern inspection method
JP2004264272A (en) * 2003-02-28 2004-09-24 Oht Inc Electric conductor inspecting device and electric conductor inspection method

Also Published As

Publication number Publication date
KR20070097113A (en) 2007-10-02
JP2006200992A (en) 2006-08-03
TW201323901A (en) 2013-06-16
JP4417858B2 (en) 2010-02-17
WO2006078045A1 (en) 2006-07-27
CN101107535A (en) 2008-01-16
TWI407126B (en) 2013-09-01
KR101175384B1 (en) 2012-08-20

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