JP4417858B2 - Circuit pattern inspection apparatus and method - Google Patents

Description

  The present invention relates to a circuit pattern inspection apparatus and method, for example, to a circuit pattern inspection apparatus and method that can inspect the quality of a conductive pattern formed on a glass substrate.

  As a typical method for inspecting a circuit pattern formed on a substrate, a pin contact method that has been conventionally used is, for example, as described in Japanese Patent Application Laid-Open No. H10-228707, all of the substrates to be inspected. A metallic pin probe is set up on the terminal, and an electric signal is sent to the conductive pattern via these probes. Therefore, there is an advantage that a good S / N ratio (signal-to-noise ratio) can be obtained with respect to the inspection signal, but there is a risk of damaging the inspection target product itself or its pattern.

  This pin contact type inspection is to confirm that the inspection signal supplied to the conductor pattern to be inspected has passed normally through the conductor pattern. In addition, the inspection probe is connected to the pattern adjacent to the conductor pattern to be inspected. There is also a method of determining a short-circuit state between the inspected conductor pattern and the adjacent pattern by determining whether or not a signal is detected from the other end of the adjacent pattern.

JP-A-62-269075

  For supplying and detecting inspection signals to the conductor pattern to be inspected, in addition to the pin contact method described above, the pin probe is directly contacted only on the inspection signal supply side, and on the other end side, the conductor pattern and sensor Some of them use a non-contact-contact combination method in which an inspection signal is detected in a non-contact state via capacitive coupling between them. Further, a non-contact method in which a continuity test is performed in a non-contact state on both the signal supply side and the detection side via capacitive coupling has been conventionally used.

  However, in factories where inspection systems for inspecting circuit patterns are installed, various equipment and devices are usually operating around the system. There will be many usage environments. In such an environment, common mode noise is constantly superimposed especially on the ground line. In addition, servo motors used by the inspection system itself are a source of noise.

  Conventional inspection systems, particularly those employing the non-contact method described above, handle very weak signals. For example, when conducting open detection of a conductive pattern, the quality of the pattern is judged based on a slight level difference between the detection signal level when the conductive pattern is not open and the detection signal level when there is an open location. ing. At this time, noise from the outside is not only applied to the inspection target pattern but also superimposed on the measurement signal, which adversely affects the stability and accuracy of the pattern inspection. As a result, it becomes difficult to distinguish between the sensor detection signal and noise, and a problem arises in terms of the reliability of the detection result.

  Therefore, in the conventional inspection device, since signals from adjacent conductive patterns are continuously detected, it is impossible to avoid various noises from appearing on the detection signal. Software is removed using a differential circuit.

  Thus, noise countermeasures are very important for improving the accuracy of inspection. Therefore, even if various filters are provided for the purpose of preventing external noise and preventing noise from flowing out of the apparatus, a plurality of patterns to be inspected cannot be scanned at high speed because the response speed of the filter is slow. Accordingly, since the influence on the inspection speed and inspection time is increased, a filter cannot be added.

  Furthermore, even if only the stage or sensor head on which the inspection object is placed is connected to the ground, the ground level fluctuates due to noise, which further affects the inspection.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a circuit pattern inspection apparatus and method capable of improving the quality detection accuracy of a conductive pattern even in a noisy environment. It is.

As a means for achieving this object and solving the above-mentioned problems, for example, the following configuration is provided. That is, the present invention is a circuit pattern inspection apparatus for inspecting the state of a conductive pattern arranged on a substrate, and supplies an inspection signal to the first portion of the conductive pattern to be inspected in a non-contact manner through capacitive coupling. And a first detection means for detecting, as a detection signal, a signal in which a noise signal is superimposed on the inspection signal in a non-contact manner through capacitive coupling from a second portion of the conductive pattern to be inspected. in a non-contact manner via a capacitive coupling of the same impedance as the first detection means to face the conductive pattern separated by at least 4 to 5 pattern interval only the conductive pattern or found before Symbol noise signal serving as the inspection target is propagated second detecting means and the difference hand determining said test signal obtained by subtracting the noise signal detected by said second detection means from the detection signal for detecting the noise signal When, characterized in that on the basis of a change of the test signal obtained by the differential means comprises identifying means for identifying the quality of the conductive pattern.

Further, for example, the circuit pattern inspection method of the present invention is a circuit pattern inspection method in a circuit pattern inspection apparatus for inspecting the state of a conductive pattern arranged on a substrate, and is provided on a first portion of a conductive pattern to be inspected. A step of supplying an inspection signal in a non-contact manner via capacitive coupling, and a detection signal in which a noise signal is superimposed on the inspection signal in a non-contact manner via a capacitive coupling from a second portion of the conductive pattern to be inspected. And a capacitive coupling having the same impedance as that of the first detection means facing the conductive pattern at least 4 to 5 away from which the noise signal is propagated from the conductive pattern to be inspected. A second detection step of detecting the noise signal in a non-contact manner, and the noise detected by the second detection means from the detection signal A difference calculation step of calculating the test signal obtained by subtracting the item, characterized in that it comprises an identification step of identifying the quality of the conductive pattern on the basis of changes in the test signal obtained by the difference calculation step.

Further, for example, the circuit pattern inspection apparatus of the present invention is configured to move the first of the conductive patterns while being relatively moved in a direction crossing the conductive pattern to be inspected among the plurality of conductive patterns arranged on the substrate. A signal supply means for supplying the inspection signal to the part in a non-contact manner via capacitive coupling, and the conductive pattern moved from the second part of the conductive pattern to be inspected by being moved in synchronization with the signal supply means. A first detection means for supplying a signal in which a noise signal is superimposed on the inspection signal propagating in a non-contact manner through a capacitive coupling as a test signal, and the first detection means in the moving direction at a predetermined interval From the conductive pattern to be inspected by moving in synchronization with the first detection means while maintaining the predetermined interval. Second detection means for detecting the noise signal in a non-contact manner through capacitive coupling having the same impedance as that of the first detection means, from the other conductive pattern through which only the noise signals separated by a predetermined interval are propagated. And noise signal removing means for subtracting the noise signal detected by the second detecting means from the inspection signal, and the quality of the conductive pattern is identified based on a change in the inspection signal obtained from the noise signal removing means. And an identification unit.

  ADVANTAGE OF THE INVENTION According to this invention, the quality of the conductive pattern on the board | substrate which is a test object can be detected with high precision and certainty.

  In addition, according to the present invention, the inspection speed of the conductive pattern can be increased.

  Embodiments according to the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a block diagram showing an overall configuration of a substrate inspection apparatus according to the present embodiment. The inspection target of the substrate inspection apparatus shown in FIG. 1 is, for example, a liquid crystal display panel or a touch panel. Here, the quality of a large number of conductive patterns 2a to 2h arranged in a row on a glass substrate 3 is determined. (Existence of disconnection state of conductive pattern and presence / absence of short-circuit state between patterns) are inspected. These conductive patterns are, for example, row-shaped conductive patterns before pasting in the above-described panel, and for example, chromium, silver, aluminum, ITO, or the like is used as the conductive material.

  In addition, as shown in FIG. 1, these conductive patterns 2a to 2h, which are inspection targets, have a configuration in which both ends are independent from each other and separated from adjacent conductive patterns. The conductive pattern is not limited to the configuration. For example, even if a common pattern (comb-like pattern) is connected to one end of the pattern, the quality can be inspected. Further, the pattern may be a curved pattern instead of a line.

  In the substrate inspection apparatus shown in FIG. 1, the control unit 15 is, for example, a microprocessor that controls the entire apparatus, and comprehensively controls the inspection sequence. The ROM 18 stores a control procedure including a board inspection procedure described later as a computer program. The RAM 17 is a memory used as a work area for temporarily storing control data, inspection data, and the like.

  At one end of the conductive pattern to be inspected (in the example of the substrate inspection shown in FIG. 1, the conductive pattern 2 a), a power feeding unit 12 that can supply an AC inspection signal having a predetermined frequency to the conductive pattern 2 a in a non-contact manner is positioned. At the other end of the conductive pattern 2a, an open sensor 13 is arranged for detecting whether the pattern is good or bad, that is, whether the pattern is in an open state (also referred to as a disconnected state) in a non-contact manner.

  Further, the adjacent conductive pattern (a conductive pattern 2e separated by three patterns in the example shown in FIG. 1) that is a few patterns away from the conductive pattern 2a is the same as the open sensor 13 being arranged. A noise sensor 19 is disposed on the end side. In the substrate inspection apparatus, the noise sensor 19 and the open sensor 13 have the same size, thickness, etc., and the ground resistance is also the same.

  In the board inspection apparatus shown in FIG. 1, for example, noise generated by another apparatus, mechanical servo noise of the inspection apparatus, and the like arrive at various levels as external noises 11a to 11c from various directions. These noises affect not all the specific patterns of the conductive patterns 2a to 2h but flow through the patterns as noise currents.

  Therefore, in the substrate inspection apparatus according to the present embodiment, in order to detect the noise current flowing in the pattern, in addition to the open sensor 13, a pattern and several patterns (for example, 4 to 5) in which the open sensor 13 is arranged. The noise sensor 19 is arranged in a non-contact manner at the end of the conductive pattern that is separated by (pattern interval). In the example shown in FIG. 1, the noise current of the conductive pattern 2 e is detected by the noise sensor 19.

  The weak signals detected by the open sensor 13 and the noise sensor 19 are amplified by a differential amplifier (amplifier) 20. The amplifier 20 is composed of, for example, an operational amplifier (op-amp) or the like in order to amplify a minute signal with a predetermined amplification degree. In the present embodiment, the amplifier 20 is disposed immediately after the open sensor 13 and the noise sensor 19 to eliminate the influence of external noise and the like on the detection signal itself.

  The power supply unit 12 is connected to a signal generation unit 10 that is an oscillator of a test signal. In the present embodiment, for example, a 200 kHz high-frequency signal is output to the power supply unit 12. In addition, as described above, the power supply unit 12 includes a flat plate plate for supplying an AC signal to the conductive pattern 2 in a non-contact manner. For this reason, the inspection signal is supplied to the conductive pattern through capacitive coupling between the power feeding unit 12 and the conductive pattern. The inspection signal supplied to the conductive pattern reaches the open sensor 13 through capacitive coupling between the conductive pattern and the open sensor 13.

  The drive unit 16 receives the control signal from the control unit 15 and moves the entire stage 14 on which the inspection target is placed at a predetermined speed in a predetermined direction, whereby the power supply unit 12, the open sensor 13, and the noise sensor No. 19 can sequentially scan the conductive pattern to be inspected in a non-contact state. Therefore, the drive unit 16 moves the stage 14 in a predetermined direction on the order of μm.

  That is, the power feeding unit 12, the open sensor 13, and the noise sensor 19 are arranged at one end of the conductive pattern as described above or in the vicinity thereof, for example, so as to move in the direction indicated by the arrow in FIG. Drive control is performed. In this way, the conductive patterns 2a to 2h arranged in a row on the substrate 3 are sequentially scanned, and their open states are individually inspected.

  An output signal from the amplifier 20 is sent to the signal processing unit 21. The signal processing unit 21 performs waveform processing for converting the amplified AC signal into a DC level signal, and conversion processing such as converting an analog signal into a digital signal. And the control part 15 compares the result obtained by processing with the signal processing part 21, and the preset reference value, and determines whether a process result is more than a reference value. The determination result is sent from the control unit 15 to the display unit 25.

  The display unit 25 is composed of, for example, a CRT, a liquid crystal display, or the like, and visually displays the quality of the inspection target (conductive pattern) that is the determination result sent from the control unit 15 in a format that the inspector understands. If there is a defective portion in the conductive pattern, the position of the conductive pattern on the substrate is also displayed. The display of the inspection result is not limited to the visible display, and may be output in a format such as sound. Further, visual display and sound may be mixed.

  Next, the inspection principle in the substrate inspection apparatus according to this embodiment will be described. As described above, the open sensor 13 is capacitively coupled to the conductive pattern to be inspected, and detects the inspection signal (alternating current signal) flowing through the conductive pattern as the strength of the detection signal level. For this reason, the power feeding unit 12 moves in the direction of the arrow shown in FIG. 1, and in synchronism with this, the open sensor 13 also moves by the same distance in the same direction, thereby extracting a change in the detection result for each conductive pattern. .

  When the power feeding unit 12 has been scanned to the respective conductive pattern facing positions, an inspection signal proportional to the corresponding area between the flat plate of the power feeding unit 12 and the conductive pattern can be supplied to the conductive pattern. If there is no disconnection (open state) in the conductive pattern to which the inspection signal is supplied, the inspection signal is detected by the open sensor 13, but when the power feeding unit 12 is between the conductive patterns by scanning, the conductive pattern Since the supplied inspection signal is negligible, the output of the open sensor 13 decreases. That is, the voltage level detected by the open sensor 13 decreases (for example, see FIG. 2).

  In addition, when there is an open portion in the conductive pattern to be inspected, the inspection AC signal supplied from the power supply unit 12 does not reach the open sensor 13, and the detection voltage level at the open sensor 13 decreases as will be described later. To do. For this reason, if a large drop in the output voltage level from the open sensor 13 is detected, it can be determined that there is a broken portion in the conductive pattern at that position.

  On the other hand, when attention is paid to noise coming to the inspection board from the outside, the open sensor 13 receives the inspection signal supplied from the power supply unit 12 because the noise is included in all the conductive patterns including the conductive pattern to be inspected. Both noise and noise will be detected. On the other hand, since the inspection signal does not flow through the conductive pattern immediately below, the noise sensor 19 detects only the noise on the conductive pattern.

  Therefore, in the substrate inspection apparatus according to the present embodiment, as shown in FIG. 1, the signal detected by the open sensor 13 from the inspection target pattern (this signal includes both inspection signals and noise), Each of the signals (noise only) detected by the noise sensor 19 from the conductive pattern to which the inspection signal is not supplied is input to, for example, the positive input terminal (+) and the negative input terminal (−) of the differential amplifier 20.

  Since these noises are included in all the conductive patterns including the conductive pattern to be inspected as described above, they become signals having in-phase components with respect to the positive and negative input terminals of the differential amplifier 20. Therefore, the differential amplifier 20 takes these differences and removes noise from the detection signal from the sensor 13. The principle of noise removal by a differential amplifier, an open sensor, etc. will be described later using mathematical expressions.

  Therefore, as shown in FIG. 1, the open sensor 13 is arranged, and the voltage detection value at the normal time (that is, how the continuous signal in the non-defective product changes) is measured in advance, and the voltage value different from that in the inspection process. When (signal change) is obtained, it can be determined that the conductive pattern is in an open state. Thus, the presence or absence of disconnection of the conductive pattern can be accurately detected with a simple configuration.

  FIG. 2 shows an example of an inspection result in the substrate inspection apparatus according to the present embodiment. The vertical axis represents the output voltage (mVpp) from the sensor, and the horizontal axis represents the movement distance (μm) of the sensor (or stage). 2A shows a measurement waveform when the output of the sensor (open sensor 13) is not passed through the differential amplifier, and FIG. 2B shows the differential amplifier for the detection output of the open sensor 13. This is the output voltage waveform when the noise signal is removed.

  As shown in FIG. 2 (a), it is difficult to identify a defective portion from a signal waveform with noise superimposed on it, but with reference signs A, B, C, D, and E in FIG. 2 (b). In the portion shown, a significant change in waveform (decrease in signal level) was detected. In this way, by arranging the differential amplifier 20 immediately after the open sensor 13 and the noise sensor 19 to eliminate the influence of external noise or the like on the detection signal, the normal position and open position of the conductive pattern (disconnection of the conductive pattern). The detection results are greatly different from each other). Therefore, it can be understood that the defective portion can be easily identified and recognized in the substrate inspection apparatus according to the present embodiment.

  The measurement conditions of the waveform shown in FIG. 2 are those in which the gap between the sensor and the conductive pattern is 50 μm, the moving speed of the sensor is 30 mm / second, the applied voltage is 320 V, and the distance between the sensors is 150 mm.

  Next, noise removal in the differential amplifier 20 will be described in detail using mathematical expressions. 3 equivalently shows a measurement circuit of the substrate inspection apparatus according to the present embodiment including the differential amplifier 20, and FIG. 4A shows an example of a noise signal waveform, and FIG. These show an example of a measurement signal waveform in which noise is superimposed on an inspection signal.

が成立する。 In FIG. 3, v ₁ is a noise signal, v ₂ is a measurement signal, resistance R ₁ is the resistance of the noise sensor 19, and resistance R ₂ is the resistance of the open sensor 13. Now, assuming that the voltage at the point P is v ₃ , since all the current to the negative input terminal (−) flows through the feedback resistor R _f , i ₁ = i _f , that is,

Is established.

となる。 Also, the voltage v _{s at the} point Q is

It becomes.

Since the voltage between point P and point Q is virtually 0, that is, v ₃ = v _s ,

となる。

It becomes.

が成立する。 From these equations (3) and (4),

Is established.

となる。 Therefore, if the output voltage v _out is arranged from the equation (5),

It becomes.

となり、測定信号ｖ₂からノイズ信号ｖ₁を除去することができる。つまり、差動増幅器２０の同相除去比（ＣＭＲＲ）により、測定信号からノイズ信号だけが低減されることになる。 In the above equation (6), if R ₁ = R ₂ and R _s = R _f ,

Thus, the noise signal v ₁ can be removed from the measurement signal v ₂ . That is, only the noise signal is reduced from the measurement signal by the common-mode rejection ratio (CMRR) of the differential amplifier 20.

  Next, an inspection procedure and the like in the substrate inspection apparatus according to this embodiment will be described. FIG. 5 is a flowchart showing an inspection procedure in the substrate inspection apparatus according to the present embodiment. In step S1 of FIG. 5, a glass substrate (inspection substrate) on which a conductive pattern to be inspected is formed is conveyed to a predetermined position of the substrate inspection apparatus along a conveyance path (not shown). In step S2, the inspection substrate is held and positioned by the substrate mounting stage 14 described above.

  The substrate mounting stage 14 is configured to be capable of three-dimensional position control by four-axis control of the XYZCθ angle, and positions the inspection target substrate at a reference position before measurement, which is separated from the sensor position by a certain distance. For example, the open sensor 13 is positioned so as to be in the vicinity of the right end of the conductive pattern 2a at the innermost side among the conductive patterns shown in FIG.

  After positioning the inspection board to the measurement position in this way, in step S3, for example, the signal generation unit 10 is controlled by the control unit 15, and the 200 kHz high-frequency signal (inspection signal) described above is supplied to the power supply unit 12. Like that. In step S5, the signal processing unit 21 performs the above-described waveform processing, signal conversion processing, and the like. In subsequent step S6, the control unit 15 stores these processing results in the memory (RAM 17).

  In step S7, it is determined whether processing / inspection has been completed for all conductive patterns to be inspected. This determination is made based on, for example, whether or not the moving distance of the inspection substrate matches the distance obtained by adding up the total of all the conductive pattern widths and the total of the pattern intervals. Therefore, if the result of determination in step S7 is that processing / inspection of all the conductive patterns has not been completed, the control unit 15 determines in step S8 that the conductive pattern to be inspected next is directly under the open sensor 13 or the like. The drive unit 16 is controlled so as to be positioned, and the inspection substrate is moved by a predetermined distance (specifically, the open sensor 13 or the like is relatively moved in the direction of the arrow in FIG. 2 by the distance between the centers of the adjacent row-shaped conductive patterns. Control to move to).

  Thereafter, the control unit 15 returns the process to step S5 and performs the same process as described above. As a result, the above-described waveform processing and the like are continuously performed on the conductive pattern to be inspected, and the processing results corresponding to the respective patterns are sequentially stored in the RAM 17.

  On the other hand, when the inspection for all the conductive patterns to be inspected is completed, that is, when the movement distance of the inspection substrate matches the sum of the total width of all the conductive patterns and the sum of the pattern intervals (YES in step S7). In step S9, the processing result stored in the RAM 17 is analyzed, and the quality of the inspection object is determined based on the analysis result. Specifically, the result obtained by processing the sensor output signal is compared with a reference value, and if it is equal to or greater than the reference value, it is determined that the conductive pattern is not in an open state.

  If it is determined in step S10 that all the detection signal levels at the respective conductive pattern positions are within the predetermined range, it is determined that all the conductive patterns are normal, and in step S12, the control unit 15 determines that the inspection target is a non-defective product. The display unit 25 is controlled to display the effect.

  As described above, when the inspection target is a non-defective product, the inspection substrate is lowered to the transfer position, placed on the transfer path, and transferred to the next stage. When performing continuous inspection, the process returns to step S1, and the substrate to be inspected next is transported to a predetermined position of the substrate inspection apparatus.

  However, if even one detection signal level at the conductive pattern position is not within the predetermined range, it is determined that the conductive pattern is defective, and the control unit 15 determines that the inspection target is a defective product with respect to the display unit 25 in step S13. It controls to display that it is. Then, the inspection substrate is lowered to the transport position and placed on the transport path and transported to the next stage, or processing such as removing the defective substrate from the transport path is performed.

  The arrangement of the conductive pattern to be inspected on the substrate is not limited to the example in which only the pattern shown in FIG. 1 is arranged on the substrate, and a plurality of sets of inspection patterns are arranged on the same substrate both vertically and horizontally. The inspection method of the present invention can also be applied to a thing.

  In the above-described embodiment, the presence / absence of the open state of the conductive pattern to be inspected is determined based on the detection signals from the open sensor 13 and the noise sensor 19. However, the conductive pattern between the conductive patterns is determined by the method described below. It is also possible to detect a short circuit.

  For example, in the substrate inspection apparatus shown in FIG. 1, the open sensor described above is in a non-contact manner at the end opposite to the side where the power supply unit 12 is arranged in the pattern adjacent to the conductive pattern where the power supply unit 12 is arranged. A short sensor having the same function as 13 is arranged. Even in this case, since the short sensor is capacitively coupled to the conductive pattern to be inspected, if the adjacent conductive patterns are short-circuited (short-circuited), the inspection signal from the power feeding unit 12 is short-circuited. Is supplied to that pattern.

  For this reason, the inspection signal that has flowed through the short-circuit location is detected by the short sensor as the level of the detection signal level. That is, the short sensor detects the short-circuit current as a higher level inspection signal. Then, the signal detected by the short sensor and the detection signal of the noise sensor 19 are respectively input to the positive input terminal (+) and the negative input terminal (−) of the differential amplifier (operational amplifier) and amplified. As a result, when adjacent conductive patterns are short-circuited, the intensity of the detection signal is different from that in the normal state.

  As described above, since the noise signal is in all conductive patterns, it becomes an in-phase component signal with respect to the positive and negative input terminals of the differential amplifier. Therefore, the difference between these signals is obtained by the differential amplifier. The noise is removed from the detection signal of the short sensor. Note that the short sensor may detect signals from, for example, at least two adjacent row conductive patterns of the row conductive pattern to be inspected.

  Similarly to the open sensor in the above-described embodiment, the short sensor is synchronized with the power supply unit 12 and moved in the direction of the arrow shown in FIG. 1 by the same distance as the power supply unit 12 to detect each conductive pattern. Changes in results can be extracted.

  As described above, when inspecting the quality of the conductive patterns arranged in a row on the substrate in a non-contact manner, a power feeding unit that supplies an inspection signal is arranged at one end of the conductive pattern, and the conductive pattern An open sensor for detecting the inspection signal is arranged at the other end, and a noise sensor is provided at the end on the same side where the open sensor is arranged in a conductive pattern several distances away from the conductive pattern. A signal that contains both inspection signals and noise detected by the open sensor from the pattern to be inspected, and a noise-only signal that is detected by the noise sensor and detected from the conductive pattern and that does not mix with the inspection signals input.

  In this case, since these noise signals are in-phase component signals with respect to the positive and negative input terminals of the differential amplifier, only the noise signal can be easily removed from the detection signal by taking the difference with the differential amplifier. In addition, the detection accuracy of the open state of the conductive pattern can be improved by eliminating the influence of noise.

  In addition, since the response speed is significantly faster than when noise is removed by adding a filter, multiple patterns to be inspected can be scanned at high speed, resulting in a significantly reduced test speed and inspection time. The defective part of the pattern can be reliably detected.

It is a block diagram which shows the whole structure of the board | substrate inspection apparatus which concerns on the example of embodiment of this invention. It is a figure which shows an example of the signal measurement result in the board | substrate inspection apparatus which concerns on this Example. It is a figure which shows equivalently the measurement circuit of the board | substrate inspection apparatus which concerns on the example of this Embodiment. It is a figure which shows an example of a noise signal waveform and a measurement signal waveform in which noise is superimposed on an inspection signal. It is a flowchart which shows the test | inspection procedure in the board | substrate test | inspection apparatus which concerns on this Embodiment.

Explanation of symbols

2a to 2h Conductive pattern 3 Substrate 10 Signal generation unit 12 Power supply unit 13 Open sensor 14 Stage 15 Control unit 16 Drive unit 17 RAM
18 ROM
19 Noise Sensor 20 Amplifier 21 Signal Processing Unit 25 Display Unit

Claims (14)

A circuit pattern inspection apparatus for inspecting the state of a conductive pattern arranged on a substrate,
Signal supply means for supplying an inspection signal in a non-contact manner via capacitive coupling to the first portion of the conductive pattern to be inspected;
First detection means for detecting, as a detection signal, a signal in which a noise signal is superimposed on the inspection signal in a non-contact manner through capacitive coupling from a second portion of the conductive pattern to be inspected;
In a non-contact manner via a capacitive coupling of the same impedance as the first detection means to face the conductive pattern separated by at least 4 to 5 pattern interval only the conductive pattern or found before Symbol noise signal serving as the inspection target is propagated Second detection means for detecting the noise signal;
Difference means for obtaining the inspection signal obtained by subtracting the noise signal detected by the second detection means from the detection signal;
A circuit pattern inspection apparatus comprising: identification means for identifying the quality of the conductive pattern based on a change in the inspection signal obtained by the difference means.   The circuit pattern inspection apparatus according to claim 1, wherein the identification unit identifies a disconnection state of the conductive pattern based on an inspection signal from which the noise signal is removed.   2. The apparatus according to claim 1, further comprising means for positioning and moving the signal supply means, the first detection means, and the second detection means so as to sequentially scan the conductive pattern to be inspected. The circuit pattern inspection apparatus according to claim 2.   4. The inspection signal is supplied to the conductive pattern and the inspection signal is detected from the conductive pattern in the vicinity of the tips of all the patterns at one end of the conductive pattern by the scanning. The circuit pattern inspection apparatus described.   The signal supply means includes a signal supply plate member facing the conductive pattern at a constant interval, and supplies the inspection signal in a non-contact manner through capacitive coupling between the plate member and the conductive pattern. The circuit pattern inspection apparatus according to claim 1.   Each of the first detection means and the second detection means includes a signal supply plate member that is opposed to the conductive pattern at a predetermined interval, and is not connected via capacitive coupling between the signal supply plate member and the conductive pattern. 6. The circuit pattern inspection apparatus according to claim 1, wherein a signal is detected by contact. A circuit pattern inspection method in a circuit pattern inspection apparatus for inspecting the state of a conductive pattern arranged on a substrate,
Supplying an inspection signal in a non-contact manner via capacitive coupling to the first portion of the conductive pattern to be inspected;
A first detection step of detecting, as a detection signal, a signal in which a noise signal is superimposed on the inspection signal in a non-contact manner through capacitive coupling from a second portion of the conductive pattern to be inspected;
Wherein in said test subject to conductive pattern or found before Symbol noise signal only via the capacitive coupling of the same impedance at least 4 to be opposed to the five separated conductive pattern of the first detecting means to be propagated noncontact A second detection step for detecting a noise signal;
A difference calculating step for obtaining the inspection signal obtained by subtracting the noise signal detected by the second detection means from the detection signal;
A circuit pattern inspection method comprising: an identification step for identifying quality of the conductive pattern based on a change in the inspection signal obtained in the difference calculation step.   8. The circuit pattern inspection method according to claim 7, wherein the identifying step identifies a disconnection state of the conductive pattern based on an inspection signal from which the noise signal is removed.   8. The method according to claim 7, further comprising a step of positioning and moving the signal supply means, the first detection means, and the second detection means so as to sequentially scan the conductive pattern to be inspected. The circuit pattern inspection method according to claim 8.   10. The inspection signal is supplied to the conductive pattern and the inspection signal is detected from the conductive pattern in the vicinity of the tips of all patterns at one end of the conductive pattern by the scanning. The circuit pattern inspection method described.   The signal supply means includes a signal supply plate member facing the conductive pattern at a constant interval, and supplies the inspection signal in a non-contact manner through capacitive coupling between the signal supply plate member and the conductive pattern. The circuit pattern inspection method according to any one of claims 7 to 10.   Each of the first detection means and the second detection means includes a signal detection plate member that is opposed to the conductive pattern at a predetermined interval, and is not connected via capacitive coupling between the signal detection plate member and the conductive pattern. 11. The circuit pattern inspection method according to claim 7, wherein a signal is detected by contact.   A computer-readable recording medium storing a computer program for realizing the circuit pattern inspection method according to claim 7 by computer control. While moving relatively in a direction crossing the conductive pattern to be inspected among the plurality of conductive patterns arranged on the substrate, the inspection signal is not contacted to the first part of the conductive pattern via capacitive coupling A signal supply means for supplying with
A signal that is moved in synchronism with the signal supply means and has a noise signal superimposed on the inspection signal propagating through the conductive pattern from the second portion of the conductive pattern to be inspected is passed through capacitive coupling as an inspection signal. First detecting means for non-contact supply,
The first detection unit is arranged in parallel with the first detection unit at a predetermined interval in the moving direction so as to face another conductive pattern , and is synchronized with the first detection unit while maintaining the predetermined interval. and dynamic transfer Te, than the other conductive pattern only the noise signal off the predetermined distance from the conductive pattern serving as the inspection target is propagated, via the capacitive coupling of the same impedance as the first detection means Second detection means for detecting the noise signal in a non-contact manner;
Noise signal removal means for subtracting the noise signal detected by the second detection means from the inspection signal;
Identifying means for identifying the quality of the conductive pattern based on a change in the inspection signal obtained from the noise signal removing means;
A circuit pattern inspection apparatus comprising:

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