TWI407126B - Circuit pattern checking device and method thereof - Google Patents

Abstract

There are provided a circuit pattern inspection device and method thereof capable of detecting the open state of a conductive pattern on a substrate. A power supply unit (12) for supplying an inspection signal in a non-contact way is arranged at one end of the conductive pattern and an open sensor (13) for detecting the inspection signal in a non-contact way is arranged at the other end of the conductive pattern. Furthermore, a noise sensor (19) is arranged in a non-contact way on a conductive pattern located at a distance of several patterns from the aforementioned conductive pattern and at the end of the same side as the open sensor (13). A signal containing the inspection signal and a noise detected by the open sensor (13) and a signal containing only noise not mixed with the inspection signal detected by a noise sensor are inputted to a differential amplifier (20), where the noise as a signal of the same phase component is removed. Thus, it is possible to surely inspect the conductive patterns arranged on a string shape on the substrate in a non-contact way.

Description

Circuit pattern inspection device and method thereof

The present invention relates to a circuit pattern inspection apparatus and a method thereof, and, for example, to a circuit pattern inspection apparatus and a method thereof capable of inspecting whether a conductive pattern formed on a glass substrate is good.

A representative method of the circuit pattern formed on the substrate, the tip contact method used in the prior art is, for example, described in Patent Document 1, and a metal tip probe is set at all the terminals of the substrate to be inspected. An electrical signal is sent to the conductive pattern via the probes. Therefore, it is an advantage that a good S/N ratio (signal noise ratio) can be obtained for the inspection signal, but conversely, there is a problem that the inspection object product itself or its pattern is injured.

According to the inspection of the tip contact method, an inspection signal is supplied to the inspected conductive pattern, and it is confirmed that the inspection pattern is normally passed through the conductive pattern. Further, the inspection probe is placed adjacent to the pattern of the inspection conductive pattern, and it is determined whether or not the other end of the adjacent pattern is A signal is detected for determining a short state of the inspected conductive pattern and the adjacent pattern.

[Patent Document 1] Japanese Patent Laid-Open Publication No. SHO 62-269075

In order to supply and detect the inspection signal to the conductive pattern to be inspected, in addition to the above-described tip contact method, a non-contact one-contact method may be used, and the tip probe may be directly contacted only on the supply side of the inspection signal. On the other end side, the inspection signal is detected in a non-contact state via capacitive coupling between the conductive pattern and the sensor. In addition, the prior art also uses non-contact parties. In the formula, the conduction check is performed in a non-contact state on both the supply side and the detection side of the signal via capacitive coupling.

However, in a factory or the like where an inspection system for inspecting a circuit pattern is provided, generally, since various devices or devices operate around the system, these become sources of noise, and the inspection system is in a lot of external noise. Use the environment. In this environment, especially the ground line often overlaps with common mode noise. In addition, the servo motor used in the inspection system itself has also become a source of noise.

Prior art inspection systems, particularly those employing the non-contact methods described above, deal with very weak signals. For example, in the case of performing the open circuit detection of the conductive pattern, the pattern is used according to the level of the detection signal when the conductive pattern is not in an open state, and the level of the detection signal at the time of the open portion is used to perform a good pattern. The judgment. At this time, the noise from the outside is not only attached to the inspection target pattern, but also overlaps the measurement signal, which adversely affects the stability and accuracy of the pattern inspection. As a result, the difference between the sensor detection signal and the noise becomes difficult, and the reliability of the detection result also causes problems.

Therefore, in the inspection apparatus of the prior art, since the signals from the adjacent conductive patterns are continuously detected, various noises are inevitably attached to the detection signals, and the noises can be soft-formed using, for example, a differential circuit. Remove.

In this way, when it is necessary to improve the accuracy of the inspection, it is very important to prevent noise. Even if various filters are provided for the purpose of preventing external noise and preventing noise from flowing out of the device, since the response speed of the filter is slow, it is not possible to scan a plurality of inspection object patterns at high speed. Therefore, there is a large influence on the inspection speed or the inspection time, so the filter cannot be attached.

In addition, even if only the loading table or sensor head to which the inspection object is loaded is grounded, because of the respective places The line level will change due to noise, so it will have a greater impact on the inspection.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object thereof is to provide a circuit pattern inspection apparatus and a method thereof, which can improve the detection accuracy of a conductive pattern even in a large amount of noise.

One means for solving the above problems for achieving the above object is, for example, the following configuration. That is, the present invention is a circuit pattern inspection device for inspecting a state of a conductive pattern disposed on a substrate, and is characterized by comprising: a signal supply portion for supplying a first portion of a conductive pattern to be inspected a first detection unit that can detect a first signal by using a second portion that is a conductive pattern to be inspected, and a second detection unit that has a conductive pattern that is separated from four to five patterns from a conductive pattern to be inspected. The second signal can be detected; the difference unit is configured to obtain a difference between the first signal and the second signal; and the recognition unit is configured to identify whether the conductive pattern is good or not based on a change in the difference signal obtained by the difference unit.

Further, the present invention provides a circuit pattern inspection device for inspecting a state of a conductive pattern disposed on a substrate, and is characterized by comprising: a signal supply portion for supplying an inspection signal to a first portion of a conductive pattern to be inspected The first detecting unit can detect the first signal by using the second portion of the conductive pattern to be inspected, and the second detecting unit can detect the second signal by using the conductive pattern that leaves the predetermined interval from the circuit pattern to be inspected. The difference unit is configured to obtain a difference between the first signal and the second signal, and the recognition unit is configured to identify whether the conductive pattern is good or not based on a change in the differential signal obtained by the difference unit.

For example, the difference unit removes the second signal that is the noise signal from the first signal in which the noise signal is superimposed on the inspection signal. Further, the identification unit is configured to recognize the disconnection of the conductive pattern based on the signal from which the noise signal is removed. status.

For example, it is characterized in that the signal supply unit, the first detecting unit, and the second detecting unit are positioned and moved to sequentially scan the conductive pattern to be inspected.

For example, it is characterized in that the inspection signal is supplied to the conductive pattern near the front end of all the patterns of one end portion of the conductive pattern by the scanning, and the inspection signal is detected by the conductive pattern.

Further, for example, the signal supply unit includes a plate member facing the conductive pattern at a predetermined interval, and the inspection signal is supplied in a non-contact manner via capacitive coupling between the plate member and the conductive pattern.

For example, each of the first detecting unit and the second detecting unit includes a plate member facing the conductive pattern at a predetermined interval, and is capacitively coupled via the plate member and the conductive pattern. The signal is detected by the way of contact.

Further, another means for solving the above problems has, for example, the following configuration. That is, the present invention is a circuit pattern inspection method for inspecting a state of a conductive pattern disposed on a substrate by a circuit pattern inspection device, characterized in that the step included includes: a conductive pattern to be an inspection target The first portion is supplied with the inspection signal, and the first detection step detects the first signal by the second portion of the conductive pattern to be inspected, and the second detection step uses four to five pattern intervals from the conductive pattern to be the inspection target. a conductive pattern for detecting a second signal; a difference calculating step for determining a difference between the first signal and the second signal; and an identifying step of identifying whether the conductive pattern is changed based on a change in a differential signal obtained by the difference calculating step good.

Further, the present invention is a circuit pattern inspection method for inspecting a state of a conductive pattern disposed on a substrate by a circuit pattern inspection device, characterized in that the step includes: first, a conductive pattern to be inspected The first detection step detects the first signal by the second portion of the conductive pattern to be inspected, and the second detection step uses the conductive pattern separated from the predetermined pattern by the conductive pattern to be the inspection target. The second signal is detected; the difference calculation step is for determining a difference between the first signal and the second signal; and the identifying step is to identify whether the conductive pattern is good or not based on a change in the difference signal obtained by the difference calculation step.

For example, in the difference calculation step, the first signal that is the noise signal is removed from the first signal in which the noise signal is superimposed on the inspection signal. Further, for example, it is characterized in that the disconnection state of the conductive pattern is recognized in the above-described identification step based on the signal from which the noise signal is removed.

For example, it is characterized in that the signal supply unit, the first detecting unit, and the second detecting unit are positioned and moved to sequentially scan the conductive pattern to be inspected.

For example, it is characterized in that the inspection signal is supplied to the conductive pattern near the front end of all the patterns of one end portion of the conductive pattern by the scanning, and the inspection signal is detected by the conductive pattern.

For example, the signal supply unit includes a plate member facing the conductive pattern at a predetermined interval, and the inspection signal is supplied in a non-contact manner via capacitive coupling between the plate member and the conductive pattern.

Further, for example, each of the first detecting unit and the second detecting unit includes The plate member facing the conductive pattern at a predetermined interval is coupled to the signal through the capacitive coupling between the plate member and the conductive pattern to detect the signal in a non-contact manner.

2a~2h‧‧‧ conductive pattern

3‧‧‧Substrate

5‧‧‧ unit

10‧‧‧Signal Generation Department

11a~11c‧‧‧External noise

12‧‧‧Power Supply Department

13‧‧‧Open circuit sensor

14‧‧‧Loading station

15‧‧‧Control Department

16‧‧‧ Drive Department

17‧‧‧RAM

18‧‧‧ROM

19‧‧‧ Noise Sensor

20‧‧‧Differential Amplifier

21‧‧‧Signal Processing Department

25‧‧‧Display Department

Fig. 1 is a block diagram showing the entire structure of a substrate inspecting apparatus according to an embodiment of the present invention.

2(a) and 2(b) show an example of signal measurement results of the substrate inspecting apparatus of the embodiment.

Fig. 3 equivalently shows a measurement circuit of the substrate inspecting apparatus of the embodiment.

4(a) and 4(b) show an example of a noise signal waveform and a waveform of a measurement signal in which noise is superimposed on the inspection signal.

Fig. 5 is a flow chart showing the inspection procedure of the substrate inspecting apparatus of the embodiment.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the invention will be described in detail with reference to the accompanying drawings. Fig. 1 is a block diagram showing the entire structure of a substrate inspecting apparatus of the embodiment. The object to be inspected by the substrate inspection apparatus shown in FIG. 1 is, for example, a liquid crystal display panel or a touch panel, and is used to check whether the plurality of conductive patterns 2a to 2h which are arranged in a row on the glass substrate 3 are good. (There is no disconnection state of the conductive pattern or short-circuit between the patterns). The conductive pattern is, for example, a row-shaped conductive pattern before bonding of the above-described panel, and the conductive material is, for example, chromium, silver, aluminum, ITO or the like.

Further, as shown in FIG. 1, the conductive patterns 2a to 2h to be inspected are constructed such that both ends thereof are independent of each other and are separated from the adjacent conductive patterns, but the inspection target is not limited to the conductive patterns of such a configuration. For example, even if a pattern (comb-like pattern) in which one end of the pattern is connected to each other can be checked whether it is good or not. In addition, the pattern may not be in a line shape, but may be a curved diagram. case.

In the substrate inspection apparatus shown in Fig. 1, the control unit 15 is used to control the entire apparatus, for example, using a microprocessor for collectively controlling the inspection program. The control step including the substrate inspection step described later is stored in the ROM 18 to become a computer program. In addition, the RAM 17 uses a memory as a work area for temporarily storing control data, checking data, and the like.

At one end of the conductive pattern of the inspection object (the conductive pattern 2a in the example of the substrate inspection shown in FIG. 1), the power supply portion 12 is positioned to supply the conductive pattern 2a with an AC detection signal of a predetermined frequency in a non-contact manner. The other end of the pattern 2a is provided with an open circuit sensor 13 for detecting whether the pattern is good in a non-contact manner, that is, detecting whether the pattern has an open state (also referred to as a disconnected state).

Further, in the adjacent conductive pattern (the conductive pattern 2e which is separated from the four pattern portions in the example shown in FIG. 1) leaving the conductive pattern 2a at a predetermined interval (several patterns), the open circuit sensor 13 is disposed. On the same end side, a noise sensor 19 is disposed. Further, in the present substrate inspection device, the noise sensor 19 and the open circuit sensor 13 have the same size, thickness, and the same, and the ground resistance is also the same.

In the substrate inspection apparatus shown in FIG. 1, for example, the noise or the mechanical noise of the inspection device, which is a source of the other device, becomes the external noises 11a to 11c, and arrives at various levels from a predetermined direction. In addition, the noise does not only affect the specific pattern of the conductive patterns 2a to 2h, but also affects any pattern, and becomes a noise current flowing through the conductive pattern.

In the substrate inspection apparatus according to the embodiment, in order to detect the noise current flowing in the pattern, the pattern of the open sensor 13 is separated from the open sensor 13 at a predetermined interval (for example, 4~). The end of the conductive pattern of the five pattern spaces), the noise sensor is arranged in a non-contact manner 19. In the example shown in FIG. 1, the noise current of the conductive pattern 2e is detected by the noise sensor 19.

In addition, the interval between the noise sensor 19 and the open circuit sensor 13 is set to eliminate the external noise and the like by using the differential amplifier 20 disposed behind the open circuit sensor 13 and the noise sensor 19. The impact. Specifically, the pattern interval, the pattern width, the material, and the like of the conductive pattern of the inspection object are changed according to the size of the substrate inspection device itself, and the optimum interval between the noise sensor 19 and the open circuit sensor 13 is changed, so that it is, for example, an initial value. At least 4 to 5 pattern intervals are adjusted as needed.

The weak signals detected by the open circuit sensor 13 and the noise sensor 19, respectively, are amplified by a differential amplifier 20. Since the amplifier 20 amplifies a minute signal at a predetermined amplification factor, it is configured using, for example, an operational amplifier (OP Amp). In the present embodiment, the amplifier 20 is disposed immediately after the open sensor 13 and the noise sensor 19 to eliminate the influence of external noise or the like on the detection signal.

In the power supply unit 12, a signal generating unit 10 that is an oscillator that is an inspection signal is connected. In the present embodiment, for example, a high frequency signal of 200 kHz is output to the power supply unit 12. Further, the power supply unit 12 is provided with a flat plate for supplying an alternating current signal to the conductive pattern 2 in a non-contact manner in accordance with the above-described manner. Therefore, the inspection signal is supplied to the conductive pattern via capacitive coupling between the power supply portion 12 and the conductive pattern. In addition, the inspection signal supplied to the conductive pattern is capacitively coupled between the conductive pattern and the open circuit sensor 13 to reach the open circuit sensor 13.

The drive unit 16 receives the control signal from the control unit 15 and moves the entire loading table 14 on which the inspection target is mounted at a predetermined speed in a predetermined direction, and causes the power supply unit 12, the open circuit sensor 13, and the noise sensor 19 to be moved. The conductive pattern or the like of the inspection object can be sequentially scanned in a non-contact state. Drive The movable portion 16 moves the loading table 14 in a predetermined direction by about μm.

Further, in the present embodiment, the loader 14 on which the inspection target is mounted is moved. However, instead of moving the loading table 14, for example, the power supply unit 12, the open sensor 13 and the hybrid may be constructed. The sensor 19 is an integrated unit that moves in a predetermined direction, and can sequentially scan a conductive pattern or the like of an inspection object.

That is, the power supply unit 12, the open circuit sensor 13, and the noise sensor 19 are disposed at or near one end of the conductive pattern as described above, and simultaneously perform drive control of the loading stage 14, for example, to face the figure. Move in the direction indicated by the arrow of 1. In this manner, the conductive patterns 2a to 2h which are arranged in a row on the substrate 3 are sequentially scanned, and the open states are individually checked.

The output signal from the amplifier 20 is sent to the signal processing section 21. The signal processing unit 21 performs a waveform process of converting a signal obtained by converting an amplified AC signal into a DC level, or a conversion process of converting an analog signal into a digital signal or the like. Then, the control unit 15 compares the result obtained by the processing by the signal processing unit 21 with a preset reference value, and determines whether or not the processing result is equal to or higher than the reference. The determination result is transmitted from the control unit 15 to the display unit 25.

The display unit 25 is configured by, for example, a CRT or a liquid crystal display, and visually displays whether or not the inspection target (conductive pattern) of the determination result sent from the control unit 15 is good, in a form that can be understood by the inspector. If the conductive pattern has a defective portion, the position on the substrate of the conductive pattern is also displayed. In addition, the display of the inspection result is not limited to the visual display, and may be output in the form of sound or the like. In addition, visual display and sound can also be mixed.

Next, the inspection principle of the substrate inspection apparatus according to the embodiment of the present invention will be described. In the above manner, the open circuit sensor 13 detects the detection signal (alternating current signal) flowing in the conductive pattern in a state of being capacitively coupled with the conductive pattern of the inspection object, and obtains the strength of the detection signal level. Therefore, power supply The portion 12 is moved in the direction of the arrow shown in FIG. 1, and in synchronization with this, the open sensor 13 also extracts the change in the detection result of each of the conductive patterns by moving the same distance in the same direction.

When the power supply portion 12 scans the position where the respective conductive patterns face, the conductive pattern may be supplied with an inspection signal proportional to the corresponding area of the flat plate and the conductive pattern of the power supply portion 12. Further, when the conductive pattern to which the inspection signal is supplied is not broken (open state), the inspection signal is detected by the open circuit sensor 13, but when the power supply portion 12 is positioned between the conductive patterns by scanning, the conductive pattern is supplied. Since the check signal is extremely small, the output of the open circuit sensor 13 is lowered. That is, the voltage level detected by the open circuit sensor 13 is lowered (for example, refer to FIG. 2).

Further, when the conductive pattern to be inspected has an open portion, the inspection AC signal supplied from the power supply unit 12 does not reach the open sensor 13, and the detection voltage level of the open sensor 13 is as described later. Reduced. Therefore, if it is detected that the output voltage level from the open circuit sensor 13 is greatly lowered, it can be determined that the conductive pattern at the position has a broken portion.

On the other hand, when the noise is transmitted from the outside to the inspection substrate, since the noise is attached to all the conductive patterns including the conductive pattern to be inspected, the open sensor 13 detects that the noise is supplied from the power supply unit 12. Check both the signal and the noise. On the other hand, the noise sensor 19 detects only the noise attached to the conductive pattern because the conductive pattern under the front does not check the signal flow.

Therefore, in the substrate inspection apparatus of the present embodiment, as shown in FIG. 1, the signal detected by the open sensor 13 from the inspection target pattern (the signal is mixed with the inspection signal and the noise), and the noise feeling. The detector 19 inputs signals (only noise) detected from the conductive pattern to which the inspection signal is not supplied, for example, to the positive input terminal (+) and the negative input terminal (-) of the differential amplifier 20, respectively.

The noise of the above is as described above because it is attached to the conductive pattern containing the object to be inspected. All of the conductive patterns, so the positive of the differential amplifier 20. The negative input terminal becomes a signal of the in-phase component. Therefore, the difference is obtained by the differential amplifier 20, and noise is removed from the detection signal detected by the sensor 13. In addition, the principle of using a differential amplifier, an open circuit sensor, etc. to remove noise will be explained later using a mathematical formula.

Therefore, the open circuit sensor 13 is disposed as shown in FIG. 1, and the voltage detection value at the normal time (that is, the manner in which the continuous signal of the good product is changed) is measured in advance, and a voltage value different from the signal is obtained in the inspection step (signal) In the case of a change), it can be determined that the conductive pattern is in an open state. In this way, it is possible to correctly detect whether or not the conductive pattern is broken in a simple configuration.

Fig. 2 shows an example of the inspection result of the substrate inspecting apparatus of the embodiment. The vertical axis represents the output voltage (mVpp) from the sensor, and the horizontal axis represents the moving distance (μm) of the sensor (or loading stage). 2(a) shows the measured waveform when there is no differential amplifier for the output of the sensor (open sensor 13), and FIG. 2(b) shows the detected output for the open sensor 13 by the differential amplifier. The output voltage waveform after the noise signal.

As shown in Fig. 2(a), it is difficult to specify a defective portion from a signal waveform in which noise is superimposed. On the other hand, as shown by symbols A, B, C, D, and E in Fig. 2(b) Significant waveform changes (decrease in signal level) can be detected in parts. In this manner, by disposing the differential amplifier 20 after the open circuit sensor 13 and the noise sensor 19, the influence of external noise or the like on the detection signal can be eliminated, so that the normal portion and the open portion of the conductive pattern (conductive) The detection result of the broken portion of the pattern has a large difference. Therefore, in the substrate inspection apparatus of the present embodiment, it is possible to easily identify and identify a defective portion.

In addition, the measurement conditions of the waveform shown in FIG. 2 are such that the gap between the sensor and the conductive pattern becomes 50 μm, the moving speed of the sensor becomes 30 mm/sec, and the applied voltage becomes 320 V, which is between the sensors. The distance was changed to 150 mm, and measurement was performed under the conditions.

The mathematical formula is used below to explain in detail the noise removal of the differential amplifier 20. Fig. 3 equivalently shows a measurement circuit of the substrate inspection apparatus of the embodiment including the differential amplifier 20. Fig. 4(a) shows an example of a noise signal waveform, and Fig. 4(b) shows that the inspection signal overlaps. An example of measuring the signal waveform.

In FIG. 3, v ₁ is a noise signal, v ₂ is a measurement signal, resistor R ₁ is the resistance of the noise sensor 19, and resistor R ₂ is the resistance of the open circuit sensor 13. At this time, when the voltage at the point P becomes v ₃ , the current flowing to the negative input terminal (−) flows all of the feedback resistor R _f , so i ₁ =i _f , that is, Can be established.

In addition, the voltage of the point Q v _s becomes

Point P, the voltage between points Q is assumed to be 0, that is, because v ₃ = v _s

In addition, by using the equations (3) and (4), Can be established.

When the output voltage v _out of the equation (5) is sorted here, it becomes

In the above formula (6), when R ₁ = R ₂ and R _s = R _f , it becomes The noise signal v ₁ can be removed from the measurement signal v ₂ . That is, the noise signal in the measurement signal is reduced in accordance with the in-phase removal ratio (CMRR) of the differential amplifier 20.

Next, the inspection procedure and the like of the substrate inspecting apparatus of the embodiment will be described. Fig. 5 is a flow chart showing the inspection procedure of the substrate inspecting apparatus of the embodiment. In step S1 of FIG. 5, a glass substrate (inspection substrate) on which a conductive pattern to be inspected is formed is formed on the surface, and is transported to a predetermined position of the substrate inspection apparatus in accordance with a conveyance path not shown. Then, in step S2, the inspection substrate is held and positioned by the substrate loading table 14 described above.

The substrate loading table 14 is constructed such that three-axis position control using the XYZθ angle can perform three-dimensional position control, and the inspection target substrate is positioned at a position before the measurement of a certain distance from the sensor position. For example, the open circuit sensor 13 is positioned near the right end of the conductive pattern 2a on the deepest side of the conductive pattern shown in FIG.

After positioning the inspection substrate at the measurement position in this manner, in step S3, for example, the control unit 15 controls the signal generation unit 10 to supply the high-frequency signal (inspection signal) of 200 kHz described above to the power supply unit 12. In step S5, the signal processing unit 21 performs the above-described waveform processing, signal conversion processing, and the like, and then in step S6, the control unit 15 stores the processing results in the memory (RAM 17).

In step S7, it is determined whether or not all of the conductive patterns that are to be inspected have been processed. an examination. This determination is performed, for example, based on the distance of the inspection substrate, whether or not the total of the total widths of the conductive patterns coincides with the total distance of the total of the pattern intervals. Therefore, the result of the determination in step S7 is the processing of all conductive patterns. When the inspection is not completed, the control unit 15 causes the next conductive pattern to be inspected to be positioned directly under the open sensor 13 or the like in step S8, and controls the drive unit 16 to move the inspection substrate by a predetermined distance (specifically, controlled to The open-circuit sensor 13 or the like is relatively moved in the direction of the arrow of FIG. 2 to relatively move the distance between the centers of the adjacent row-shaped conductive patterns.

Then, the control unit 15 returns the processing to step S5 and performs the same processing as the above. As a result, the above-described waveform processing or the like is continuously performed on the conductive pattern to be inspected, and the processing results corresponding to the respective patterns are sequentially stored in the RAM 17.

In this manner, in the inspection step of FIG. 5, the steps from step S5 to step S8 maintain the state in which the inspection signal is supplied to the power supply portion (the state of step S3), while checking the substrate to move (that is, the order of the unit 5) The scanning becomes a conductive pattern of the inspection object). Further, the movement of the inspection substrate may be stopped while the inspection substrate is moved by a predetermined distance (step S8), the sensor output signal is processed (step S5), and the storage processing result (step S6) is stopped. The substrate is moved to a predetermined distance (step S8), and the sensor output signal processing (step S5) and the storage processing result (step S6) are simultaneously performed, and the continuous movement is performed without stopping. Especially for the shortening of inspection time, From the step S5 to the step S8, it is effective to continuously move the inspection substrate without stopping it.

On the other hand, when the inspection is completed for all the conductive patterns to be inspected, that is, when the moving distance of the substrate is checked, and the total of the total widths of the conductive patterns and the sum of the pattern intervals are the same ( Step S7 is YES. In step S9, the processing result stored in the RAM 17 is analyzed, and based on the analysis result, it is determined whether or not the inspection object is good. Specifically, the result obtained by processing the sensor output signal is compared with the reference value, and if it is above the reference value, it is determined that the conductive pattern has no open state.

In step S10, if it is determined that the detection signal levels of the respective conductive pattern positions are all within the predetermined range, all the conductive patterns are normal, and in step S12, the control unit 15 controls the display unit 25 to display information indicating that the inspection object is good.

According to this aspect, when the inspection object is a good product, the inspection substrate is lowered to the conveyance position, loaded on the conveyance path, and transported to the next loading station. Further, when the continuous inspection is performed, the process returns to step S1, and the next substrate to be inspected is transported to a predetermined position of the substrate inspection device.

However, if one of the detection signal levels of the conductive pattern position is not within the predetermined range, the conductive pattern is regarded as defective, and the control unit 15 controls the display unit 25 to display information indicating that the inspection target is defective in step S13. Then, the inspection substrate is lowered to the conveyance position, loaded on the conveyance path, conveyed to the next loading station, or processed to remove the defective substrate from the conveyance path.

In addition, the arrangement of the conductive patterns of the inspection object on the substrate is not limited to the example in which the pattern shown in FIG. 1 is disposed on the substrate, and it is also possible to arrange a plurality of sets of inspection patterns on the same substrate. The inspection method of the present invention is applied.

In the above embodiment, the detection signals of the open circuit sensor 13 and the noise sensor 19 are used to determine whether the conductive pattern of the inspection object has an open state, but the method described below can also be used to detect the conductive state. Short circuit between patterns.

For example, in the substrate inspection apparatus shown in FIG. 1, the pattern adjacent to the conductive pattern in which the power supply unit 12 is disposed is disposed in a non-contact manner at the end portion on the side opposite to the power supply unit 12 The short-circuit sensor of the same function of the detector 13. In this case, since the short-circuit sensor is in a state of being capacitively coupled to the conductive pattern of the inspection object, when the adjacent conductive patterns are short-circuited, the inspection signal from the power supply portion 12 is supplied to the short-circuit state. pattern.

Therefore, the detection signal that is detected by the short-circuit sensor flowing through the short-circuit position becomes the detection signal level and has a strong weak. That is, the short-circuit sensor detects an inspection signal that is greater than the level of its short-circuit current. Then, the signal detected by the short-circuit sensor and the detection signal of the noise sensor 19 are respectively input to the positive input terminal (+) and the negative input terminal (-) of the differential amplifier (OP Amp) for amplification. . As a result, when the adjacent conductive patterns are short-circuited to each other, the intensity of the detection signal is different when compared with the normal time.

According to the above method, since the noise signal is attached to all the conductive patterns, it is positive for the differential amplifier. Since the negative input terminal is a signal of the in-phase component, the differential amplifier is used to obtain the difference of the signals, and the noise is removed from the detection signal of the short-circuit sensor. Further, the short-circuit sensor may be used to detect a signal by using, for example, a row-shaped conductive pattern of at least two rows adjacent to the row-shaped conductive pattern to be inspected.

Further, similarly to the open-circuit sensor of the above-described embodiment, the short-circuit sensor moves in the direction of the arrow shown in FIG. 1 in the direction of the arrow shown in FIG. 1 in the same manner as the open-circuit sensor. The electrical pattern is extracted and the result of the inspection is taken out.

As described above, when it is checked in a non-contact manner whether or not the conductive pattern arranged in a row on the substrate is good, a power supply portion for supplying an inspection signal is disposed at one end portion of the conductive pattern, and the conductive pattern is disposed at the conductive pattern In addition, an open-circuit sensor configured to detect an inspection signal at one end and a conductive pattern at a distance from a plurality of patterns of the conductive pattern are disposed at the end of the same side of the open-circuit sensor, and a noise sensor is disposed. The open circuit sensor detects the mixed signal of the check signal and the noise by using the inspection object pattern, and the noise-only signal that is detected by the noise sensor from the conductive pattern and is not mixed with the check signal, and is input to the differential signal. Amplifier.

In this case, the noise signals are correct. Since the negative input terminal becomes a signal of the same component, the difference obtained by the differential amplifier can easily remove the noise signal from the detection signal, thereby eliminating the influence of noise, and improving the detection accuracy of the open state of the conductive pattern.

In addition, when compared with the case where the additional filter is used to remove noise, since the response speed can be made extraordinarily fast, a plurality of inspection object patterns can be scanned at high speed, with the result that the inspection speed can be greatly increased or the inspection time can be shortened. The detection of defective portions of the conductive pattern can be reliably performed.

(industrial availability)

According to the present invention, it is possible to accurately and reliably detect whether or not the conductive pattern on the substrate to be inspected is good.

Further, according to the present invention, the inspection speed of the conductive pattern can be increased.

2a~2h‧‧‧ conductive pattern

3‧‧‧Substrate

10‧‧‧Signal Generation Department

11a~11c‧‧‧External noise

12‧‧‧Power Supply Department

13‧‧‧Open circuit sensor

14‧‧‧Loading station

15‧‧‧Control Department

16‧‧‧ Drive Department

17‧‧‧RAM

18‧‧‧ROM

19‧‧‧ Noise Sensor

20‧‧‧Differential Amplifier

21‧‧‧Signal Processing Department

25‧‧‧Display Department

Claims (13)

A circuit pattern inspection device for inspecting a state of a conductive pattern disposed on a substrate, comprising: a signal supply portion for transmitting a first portion of a conductive pattern to be inspected through a capacitive coupling to be non-contact The first detection unit detects a signal superimposed on the noise signal on the inspection signal in a non-contact manner by using a second portion of the conductive pattern to be inspected, as a detection signal; The second detecting unit is opposed to the conductive pattern that transmits only the noise signal from the conductive pattern to be inspected and separated by at least four to five pattern intervals, and transmits the same capacitive coupling as the first detecting unit. The noise signal is detected in a non-contact manner; the difference portion is configured to obtain the inspection signal that is different from the noise signal detected by the detection signal by the second detecting unit; and an identification unit; Whether or not the conductive pattern is good is recognized based on a change in the inspection signal obtained by the difference portion. The circuit pattern inspection device according to claim 1, wherein the identification unit recognizes a disconnection state of the conductive pattern based on an inspection signal from which the noise signal is removed. The circuit pattern inspection device according to the first aspect of the invention, further comprising: a mechanism for positioning and moving the signal supply unit, the first detecting unit, and the second detecting unit, for sequentially scanning the conductive object to be inspected pattern. The circuit pattern inspection device of claim 3, wherein the inspection signal is supplied to the vicinity of a front end of all patterns of one end portion of the conductive pattern by using the scanning Conducting a pattern and detecting the inspection signal by using the conductive pattern. The circuit pattern inspection device according to any one of claims 1 to 4, wherein the signal supply portion includes a signal supply plate member facing the conductive pattern at a certain interval, through the plate member and the conductive pattern Capacitive coupling between them provides the above-mentioned inspection signal in a non-contact manner. The circuit pattern inspection device according to any one of claims 1 to 4, wherein the first detecting unit and the second detecting unit respectively include a signal supply plate member facing the conductive pattern at a predetermined interval. The signal is detected in a non-contact manner by capacitive coupling between the signal supply plate member and the conductive pattern. A circuit pattern inspection method for inspecting a state of a conductive pattern disposed on a substrate, and for use in a circuit pattern inspection device, comprising: a first portion of a conductive pattern to be inspected, and a capacitive coupling a step of supplying a test signal by a contact method; and a first detecting step of detecting a signal overlapping with the noise signal on the inspection signal by capacitive coupling using a second portion of the conductive pattern to be inspected; The second detecting step is opposite to the conductive pattern that transmits only the noise signal from the conductive pattern to be inspected and is separated from at least four to five, and transmits the same impedance as the first detecting portion. Capacitively coupling, detecting the noise signal in a non-contact manner; and performing a difference calculation step for obtaining the inspection signal for differentiating the noise signal detected by the detection signal by the second detecting unit; And an identification step of identifying the change of the above-mentioned inspection signal obtained by the difference calculation step Whether the above conductive pattern is good. The circuit pattern inspection method of claim 7, wherein the identifying step identifies the disconnection state of the conductive pattern based on the inspection signal from which the noise signal is removed. The circuit pattern inspection method according to claim 7, further comprising the step of positioning the signal supply unit, the first detecting unit, and the second detecting unit to sequentially scan the conductive material to be inspected. pattern. The circuit pattern inspection method of claim 9, wherein the inspection signal is supplied to the conductive pattern near a front end of all patterns of one end portion of the conductive pattern by using the scanning, and the inspection is detected by using the conductive pattern signal. The circuit pattern inspection method according to any one of claims 7 to 10, wherein the signal supply portion includes a signal supply plate member facing the conductive pattern at a predetermined interval, and the signal supply plate member is transmitted through the signal supply member The capacitive coupling between the conductive patterns supplies the above-described inspection signal in a non-contact manner. The circuit pattern inspection method according to any one of claims 7 to 10, wherein the first detecting unit and the second detecting unit respectively include a signal detecting plate member facing the conductive pattern at a predetermined interval. The signal is detected in a non-contact manner by capacitive coupling between the signal detecting plate member and the conductive pattern. A circuit pattern inspection device comprising: a signal supply unit configured to move the conductive pattern to be inspected in a plurality of conductive patterns disposed on a substrate in a lateral direction and to transmit through a first portion of the conductive pattern Capacitively coupled to supply an inspection signal in a non-contact manner; the first detecting unit moves in synchronization with the signal supply unit and becomes the above-described inspection target The second portion of the conductive pattern supplies a signal superimposed on the noise signal in a non-contact manner to the inspection signal for transmitting the conductive pattern as a test signal by a capacitive coupling, and the second detecting portion is in the moving direction The first detecting unit is disposed at a predetermined distance from the first detecting portion, and is disposed to face the other conductive patterns. The first detecting unit is moved in synchronization with the first detecting unit while maintaining the predetermined interval. The pattern is separated from the other conductive patterns at a predetermined interval and transmitted only by the noise, and is capacitively coupled to the same impedance as the first detecting unit to detect the noise signal in a non-contact manner; the noise signal removing unit is removed. The noise signal detected from the inspection signal by the second detecting unit; and the recognition unit recognizes whether the conductive pattern is good or not based on a change in the inspection signal obtained by the noise signal removing unit.