JP2004191381A - Circuit pattern inspection device and circuit pattern inspection method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit inspection device capable of surely and easily detecting defects of a circuit board. <P>SOLUTION: When inspecting an inspection target pattern on which at least their ends are arranged in a line, the inspection target pattern is moved so as to cross an inspection current feed electrode 35 and an inspection signal detection sensor electrode 25 with maintaining both the ends of the inspection target pattern 15 spaced from the pattern with a predetermined distance, the inspection signal fed from the feed electrode 35 to the inspection target pattern 15 by capacity coupling is detected by the sensor electrode similarly capacity-coupled to the inspection target pattern, and when the detection signal value is below a predetermined range, it is determined to be a pattern disconnection and when the detection signal value is above the predetermined range, it is determined to be a pattern short circuit. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

  The present invention relates to a circuit pattern inspection apparatus and a circuit pattern inspection method capable of inspecting the quality of a conductive pattern formed on a substrate.

  When manufacturing a circuit board having a conductive pattern formed on a substrate, it is necessary to inspect the conductive pattern formed on the substrate for disconnection or short circuit.

  Conventionally, as a conductive pattern inspection method, for example, as in Patent Document 1, a pin is contacted at both ends of a conductive pattern, an electric signal is supplied from the pin on one end to the conductive pattern, and the pin on the other end is A contact-type inspection method (a pin-contact method) for performing a conduction test or the like of a conductive pattern by receiving the electric signal is known. The supply of the electric signal is performed by setting the metal probe on all the terminals and supplying a current to the conductive pattern from the terminals.

  This pin contact method has an advantage that the S / N ratio is high because the pin probe is brought into direct contact.

  However, in recent years, due to the increase in the density of conductive patterns, the wiring pitch for connection has also become finer, and those having a pitch of less than 50 μm have appeared. A probe card composed of a large number of narrow-pitch probes has a high manufacturing cost.

  At the same time, a new probe card must be manufactured for each use of a different wiring pattern (for each test object). For this reason, the inspection cost becomes high, which has been a major obstacle to the cost reduction of electronic components.

  Further, the probe card is fragile due to its fine structure, and it is necessary to always consider the risk of breakage in actual use.

  For this reason, as shown in Patent Document 2, a pin probe is brought into direct contact with one end of a conductor pattern to be inspected to apply an inspection signal containing an AC component, and a probe at the other end has a predetermined contact without contacting the conductor pattern. A combined contact / non-contact method has been proposed in which the test signal is detected through capacitive coupling by positioning the electrodes in a state where they are separated from each other.

  In this combined use of contact and non-contact method, since the probe at the other end of the pattern line does not need to directly contact the pattern like a pin probe, positioning accuracy can be reduced. Further, since the non-contact portion can be shared for a plurality of pattern lines, the number of probes can be reduced. Therefore, it is possible to cope with the case where the distance between the conductive patterns is fine.

  JP-A-62-269075   JP-A-11-72524

  However, in the contact / non-contact combination method, since the probes disposed at both end positions of the conductive pattern and detection signal processing from the probes are provided in accordance with the intervals at which the conductive patterns are disposed, the shape of the conductive pattern Is a predetermined type, and if the conductive pattern is different, the jig also had to be manufactured according to the pattern.

  In addition, in the contact-non-contact method, one end of the conductor pattern to be inspected for directly contacting the pin probe is also made finer, which makes it difficult for the pin probe to make contact. In addition, the risk of damage to the conductor pattern to be inspected due to contact with the pin probe has been unavoidable.

  SUMMARY An advantage of some aspects of the invention is to provide an inspection apparatus and an inspection method capable of refining a fine wiring pattern with a simple configuration and capable of coping with a change in the wiring pattern. is there. As one means for achieving the object, for example, an embodiment of the present invention has the following configuration.

  That is, an AC inspection signal is supplied from one of the inspection target areas of the inspection target pattern in which the vicinity of both ends of the inspection target area is formed in a row, and a signal from the inspection target pattern is detected from the other to perform the inspection. A circuit pattern inspection apparatus for inspecting a target pattern, comprising: a supply unit having a supply electrode for supplying the inspection signal to the inspection target pattern from one of inspection target regions of the inspection target pattern; and a signal from the inspection target pattern. Detecting means having a detecting electrode for detecting the pattern, and moving the supply electrode of the supplying means and the detecting electrode of the detecting means across the row pattern portion near both ends of the inspection target area while separating the detection electrode from the inspection target pattern. Moving means.

  For example, the pattern to be inspected is a conductive pattern formed in a substantially bar shape with a predetermined width on a substrate.

  Further, for example, the width of the detection electrode is at least a width of two rows of the pattern to be inspected.

  Further, for example, the detection means may include a first detection electrode provided at the other end position of the inspection target pattern to which an inspection signal is supplied by the supply electrode at one end position, and the supply electrode at one end position. A second detection electrode disposed at the other end of the test pattern adjacent to the test pattern supplied with the test signal by the electrode.

  Further, for example, the width of the first detection electrode is equal to or smaller than the pattern width of the pattern to be inspected.

  Further, for example, the width of the second detection electrode is not more than the pattern width of the pattern to be inspected.

  Further, for example, the moving means traverses a row-like portion near both ends of the inspection target area in a state where the supply electrode surface of the supply means and the detection electrode surface of the detection means are capacitively coupled to the inspection target pattern. It is characterized by the following.

  Further, for example, the apparatus further comprises a judging means for judging that the pattern to be inspected is normal when the detection result by the detecting means is within a predetermined range, and determining that the pattern to be inspected is defective when the detection result is out of the predetermined range. And

  Further, for example, the supply electrode of the supply unit and the detection electrode of the detection unit are moved to both ends of the pattern to be inspected determined by the determination unit to be defective, and the supply electrode of the supply unit or the detection electrode of the detection unit is moved. A second moving means for moving one of them along the pattern toward the other, and a position detecting means for detecting a detected change position based on a detection result of the detecting means are provided.

  Further, for example, a contact unit is provided for bringing one of the supply electrode of the supply unit and the detection electrode of the detection unit into contact with the pattern to be inspected.

  Further, for example, an imaging unit is provided on at least one of the supply electrode and the detection electrode moved by the second moving unit.

  Alternatively, there is provided separation control means for performing positioning control so that a distance between at least one of the supply electrode and the detection electrode moved by the second moving means and the pattern to be inspected is substantially constant. .

  For example, a separation distance control means is provided for performing positioning control so that a separation distance between at least one of the supply electrode and the detection electrode moved by the movement means and the pattern to be inspected is substantially constant.

  Further, for example, the separation processing control means includes a displacement meter that moves together with the detection electrode or the supply electrode at a position near the detection electrode or the supply electrode, and the detection electrode or the supply electrode and the object to be inspected according to a detection result of the displacement meter. The positioning control is performed in a direction orthogonal to the inspection object so that the distance from the inspection object becomes substantially constant.

  Further, for example, the separation processing control means sets an average displacement of a detection result of the displacement meter between a plurality of pitches of the test pattern as a separation distance between the detection electrode or the supply electrode and the test object, and is orthogonal to the test object. It is characterized by performing positioning control in the direction.

  Also, for example, a supply unit having a supply electrode for supplying an inspection signal to the inspection target pattern from one of the inspection target regions of the inspection target pattern in which the vicinity of both ends of the inspection target region is formed in a row, and the inspection target pattern A detection means having a detection electrode for detecting a signal from the circuit pattern inspection apparatus, wherein the supply electrode of the supply means and the detection electrode of the detection means, the supply electrode surface of the supply means and The supply electrode, the detection electrode, and the pattern to be inspected are traversed across the row pattern portion near both ends of the inspection area while maintaining the state in which the detection electrode surface of the detection means is separated from the surface of the pattern to be inspected. The inspection pattern is moved to supply an AC inspection signal from one of the inspection target areas of the inspection target pattern, and the other is supplied from the other. Circuit pattern inspection method characterized by inspecting said inspection object pattern by detecting the signal.

  Further, for example, the circuit pattern is a conductive pattern formed in a substantially bar shape with a predetermined width on a substrate.

  Further, for example, the width of the detection electrode is at least two columns of the pattern to be inspected, and a signal from the conductive pattern adjacent to the conductive pattern supplying the inspection signal is detected to short-circuit between the adjacent conductive patterns. Is detectable.

  Further, for example, a signal from a conductive pattern supplying an inspection signal from the detection electrode can be detected by a first detection electrode of the detection means to detect a disconnection between the conductive patterns, and an inspection signal is output from the detection electrode. A signal from a conductive pattern adjacent to the supplied conductive pattern is detected by a second detection electrode of the detection means, so that a short circuit between the adjacent conductive patterns can be inspected.

  Also, for example, the position of the roughly broken portion of the conductive pattern is detected from the position of the detecting means which is not detected by the detecting means.

  Further, for example, when the detection result by the detection means is within a predetermined range, the inspection target pattern is determined to be normal, and when the detection result is out of the predetermined range, the inspection target pattern is determined to be defective.

  Further, for example, the position of the inspection target pattern determined to be defective by the determination unit is identified and held, and the supply electrodes of the supply unit and the detection electrodes of the detection unit are provided at both ends of the inspection target pattern determined to be defective. And moving one of the supply electrode and the detection electrode along the pattern toward the other, and setting a change position as a defective position of the inspection target pattern based on a detection result of the detection unit. .

  Further, for example, the other of the supply electrode of the supply unit and the detection electrode of the detection unit is brought into contact with the pattern to be inspected.

  Further, for example, an imaging unit provided on one of the supply electrode and the detection electrode is moved along the pattern toward the other, and an image of a defect state at a defect position of the inspection target pattern is taken.

  Further, for example, a displacement meter that moves together with the detection electrode or the supply electrode is disposed at a position near the detection electrode or the supply electrode, and a separation distance between the detection electrode or the supply electrode and the test object is approximately equal to a detection result of the displacement meter. Positioning control is performed in a direction orthogonal to the inspection object so as to be constant, and the result of the detection electrode is made constant.

    Further, for example, the positioning of the test object is controlled by setting the average displacement of the detection result of the displacement meter between the plurality of pitches of the test pattern as the separation distance between the detection electrode or the supply electrode and the test object. A circuit pattern inspection method according to claim 25.

  As described above, according to the present invention, it is possible to reliably detect a defect in a pattern to be inspected.

  Further, it is possible to easily recognize the pattern defect status, and it is also possible to specify a specific defective portion.

  Further, even if the surface to be inspected has irregularities, the inspection can be surely performed without damaging the pattern.

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. In the following description, a circuit pattern inspection apparatus for inspecting the quality of a dot matrix pattern before bonding in a dot matrix display panel forming a liquid crystal display panel as a pattern to be inspected will be described as an example.

  However, the present invention is not limited to the example described below, and is not limited in any way as long as at least the vicinity of both ends of the inspection target area is formed in a row.

  [First Embodiment of the Invention]

  FIG. 1 is a view for explaining the principle of pattern inspection according to an embodiment of the present invention.

  In FIG. 1, reference numeral 10 denotes a substrate provided with a conductive pattern to be inspected according to the present embodiment. In the present embodiment, a glass substrate used for a liquid crystal display panel is used.

  On the surface of the glass substrate 10, conductive patterns 15 for forming a dot matrix display panel to be inspected by the circuit pattern inspection apparatus of the present embodiment are arranged in rows at regular intervals. In the example of the conductive pattern shown in FIG. 1, the width of each pattern 15 is substantially the same, and the intervals between the patterns are also substantially equal. However, in the present embodiment, the inspection can be performed in the same manner even if the pattern intervals are not equal.

  Reference numeral 20 denotes a sensor unit, reference numeral 30 denotes an inspection signal supply unit, reference numeral 50 denotes an analog signal processing circuit that processes a detection signal from the sensor unit 20 and outputs the processed signal to a control unit 60, and reference numeral 60 denotes control of the entire inspection apparatus of the present embodiment. And a control unit 70 for controlling the scalar robot 80. A control unit 70 controls the scalar robot 80 to position and hold the liquid crystal panel 10 at the inspection position and supplies the sensor electrodes of the sensor unit 20 and the inspection signal supply unit 30 under the control of the robot controller 70. This is a scalar robot that scans so that electrodes sequentially cross all connection terminals of the conductive pattern to be inspected on the liquid crystal panel 10.

  In the present embodiment, the scalar robot 80 is configured to be three-dimensionally positionable in order to position the inspection target substrate (liquid crystal panel) 10 at a predetermined inspection position. Similarly, three-dimensional positioning control is possible so that the sensor unit 20 and the inspection signal supply unit 30 are moved on the inspection target pattern while maintaining a predetermined distance from the surface of the inspection target substrate 10.

  In the above description, an example has been described in which the sensor unit 20 and the inspection signal supply unit 30 are moved on the inspection target pattern by the scalar robot 80 while maintaining the sensor unit 20 and the inspection signal supply unit 30 at a predetermined distance from the surface of the inspection target substrate 10. However, the present embodiment is not limited to the above example. The sensor unit 20 and the inspection signal supply unit 30 are fixed, and the inspection target substrate 10 is connected to the sensor unit 20 and the tip electrode 25 of the inspection signal supply unit 30. , 35 may be controlled so as to move the substrate while maintaining a predetermined distance from the surface. Even with such control, exactly the same operation and effect can be obtained.

  In the actual inspection control, when the pattern intervals are not equal or when the pattern pitches at the two ends are different, the moving distance of the sensor electrode 25 and the moving distance of the supply electrode 35 are synchronized with each other, It is necessary to control at least a part of the sensor electrode 25 so that the supply electrode 35 is at the other end position of the pattern to which the test signal is actually supplied. With this control, even if the pattern intervals are not equal or the pattern pitches at the two ends are different, it is possible to respond simply by controlling the moving speed of both electrodes of the scalar robot.

  A sensor electrode 25 and a supply electrode 35 are provided on at least the distal end surfaces of the sensor unit 20 and the test signal supply unit 30 according to the present embodiment, respectively. The sensor electrode 25 and the supply electrode 35 are formed of metal, for example, copper (Cu) or gold (Au). Each electrode may be covered with an insulating material for protection. Further, for example, a semiconductor may be used as the electrode, but the reason why the electrode is formed of metal is that the capacitance between the electrode and the conductive pattern can be increased.

  The inspection signal supply unit 30 is moved by the scalar robot 80 so as to traverse one terminal of the pattern to be inspected such as the liquid crystal panel 10 and sequentially supplies an inspection signal to each pattern to be inspected via capacitive coupling. It is desirable that the width of the supply electrode 35 at the tip is, for example, equal to or smaller than the pattern pitch of the pattern to be inspected (the pattern width and the pattern gap of the inspection pattern).

  This is because when the width of the supply electrode 35 is larger than the pattern pitch of the inspection target pattern, when the sensor electrode 25 of the sensor unit 20 detects the inspection signal, the inspection signal from the inspection target pattern other than the inspection target pattern is detected. It is because.

  However, the width of the supply electrode 35 does not necessarily have to be equal to or less than the pattern pitch of the pattern to be inspected. If only a plurality of patterns to be inspected and the pattern adjacent to this pattern can be grasped, the present embodiment described later in detail Inspection can be performed by the inspection method described above.

  The sensor unit 20 is moved by the scalar robot 80 so as to cross one terminal of the pattern to be inspected, such as the liquid crystal panel 10, and is sequentially supplied to each pattern to be inspected by the inspection signal supply unit 30 via capacitive coupling. It is for detecting an inspection signal, and it is desirable that the width of the sensor electrode 25 at the tip is wider than the width of the supply electrode 35 by at least one pitch of the pattern to be inspected.

  The detection signal from the sensor unit 20 is sent to the analog signal processing circuit 50 and subjected to analog signal processing. The analog signal subjected to the analog signal processing by the analog signal processing circuit 50 is sent to the control unit 60, and the quality of the pattern to be inspected with which the inspection signal supply unit 30 of the liquid crystal panel 10 is in contact is determined. Further, the control unit 60 also performs control of supplying the inspection signal to the inspection signal supply unit 30.

  The analog signal processing circuit 50 includes an amplifier 51 for amplifying a detection signal from the sensor unit 20, a band-pass filter 52 for removing a noise component of the detection signal amplified by the amplifier 51, and passing the detection signal. And a smoothing circuit 54 for smoothing the detection signal which has been full-wave rectified by the rectifier circuit 53. Note that the rectifier circuit 53 for performing full-wave rectification and the smoothing circuit 54 for smoothing the detection signal are not necessarily provided.

  The control unit 60 controls the entire inspection apparatus of the present embodiment, and temporarily stores a computer (CPU) 61, a ROM 62 that stores a control procedure of the CPU 61, processing progress information of the CPU 61, a detection signal, and the like. RAM 63 for storing, A / D converter 64 for converting an analog signal from analog signal processing circuit 50 into a corresponding digital signal, signal supply unit 65 for supplying an inspection signal to be supplied to inspection signal supply unit 30, inspection result and operation A display unit 66 for displaying instruction guidance and the like is provided.

  The signal supply unit 65 generates, for example, a sine wave signal of, for example, AC 200 KHz and 200 V as a test signal, and supplies the signal to the test signal supply unit 30. In this case, the band-pass filter 52 is a band-pass filter that passes the test signal of 200 KHz. It is needless to say that the inspection signal is not limited to the sine wave signal, and may be a rectangular wave or a pulse wave as long as it is an AC signal.

  Inspection control of the conductive pattern of the present embodiment having the above configuration will be described below with reference to the flowchart of FIG. FIG. 2 is a flowchart for explaining inspection control of the inspection apparatus of the present embodiment.

  When the inspection is performed by the inspection apparatus of the present embodiment, the glass substrate on which the conductive pattern to be inspected is formed is transported on a transport path (not shown) to the circuit pattern inspection apparatus position (work position) of the present embodiment. Will be. Therefore, first, in step S1, the liquid crystal panel 10 to be inspected is set in the inspection device. In this case, the substrate to be inspected that has been automatically transported may be set in the inspection apparatus by a transport robot (not shown), or may be directly set by an operator. When the inspection target is set in the inspection device, the control unit 60 activates the robot controller 70 to control the scalar robot 80, and positions the inspection target at the inspection position.

  Subsequently, in step S3, the inspection signal supply unit 30 supplies the initial position on the one end side of the inspection target pattern 15 of the inspection target (liquid crystal panel) 10 (the endmost inspection target pattern position separated by a predetermined distance). The electrode 35 is positioned, and the sensor electrode 25 of the sensor unit 20 is transported and positioned at an initial position on the other end side of the inspection target pattern (the position of the endmost inspection target pattern separated by a predetermined distance).

  In the present embodiment, the gap (distance between the pattern to be inspected and the electrode) is kept in a range of, for example, 100 μm to 200 μm. However, the gap is not limited to the above example, and the gap in the present embodiment is determined according to the size of the pattern to be inspected. If the size of the pattern is large, the gap can be widened and the size of the pattern is small. If it is small, the gap will be narrow.

  When the pattern size is very small, a coating is formed on the surface of the electrode with an insulating material so that the pattern and the electrode do not come into direct contact with each other. By controlling the gap so as to be substantially equal to the thickness of the insulating material by bringing the 30 directly into contact with the substrate, the distance between the pattern to be inspected and the electrode can be easily and accurately set to a fixed distance for the inspection.

  As a result, even with a very fine pattern, an easy and accurate inspection result can be obtained with a simple structure.

  In step S5, the signal supply unit 65 is instructed to start supplying the test signal to the supply electrode 35 of the test supply unit 30.

  Next, in step S7, the distance between the pattern and the electrodes is kept constant, the electrodes 25 and 35 of the sensor unit 20 and the inspection signal supply unit 30 are synchronized so as to cross the pattern to be inspected, and the surface of the pattern to be inspected. Then, the control for moving while controlling to keep the separation distance from the camera at a constant value is started. As a result, the sensor electrode 25 detects the signal potential from the pattern to be inspected to which the inspection signal is supplied by capacitive coupling with the supply electrode 35 thereafter.

  That is, when the supply electrode 35 is at the position of the pattern to which the inspection signal is supplied, at least a part of the sensor electrode 25 is at the other end position of the inspection target pattern to which the inspection signal is supplied, and the supply electrode 35 is The sensor electrode 25 at the other end is controlled to move by one pitch of the pattern to be inspected while the pattern to be inspected at one end is moved by one pitch.

  For this reason, in step S10, the signal processing circuit 50 is started, and control is performed so that the detection signal from the sensor electrode 25 is processed and output to the control unit 60. In the signal processing circuit 50, as described above, the detection signal from the sensor electrode 25 of the sensor section 20 is amplified to a required level by the amplifier 51, and the detection signal amplified by the amplifier 51 is passed through the bandpass signal for passing the signal of the inspection signal frequency. The signal from the band-pass filter 52 is sent to the filter 52 to remove the noise component. Thereafter, the signal from the band-pass filter 52 is full-wave rectified by the rectifier circuit 53, and the detection signal that has been subjected to the full-wave rectification is smoothed by the smoothing circuit 54. It is sent to the D conversion unit 64.

  The CPU 61 activates the A / D converter 64 to convert the input analog signal into a corresponding digital signal, and reads a detection signal detected by the sensor electrode 25 as a digital value.

  The CPU 61 sends the read detection signal to the RAM 63 in the following step S12. The RAM 63 sequentially stores the sent detection signals. The read detection signals include all of the detection signals from the normal inspection target patterns, the detection signals from the disconnected inspection target patterns, and the detection signals from the adjacent inspection target patterns short-circuited with the inspection target patterns. .

  In step S14, it is determined whether or not the inspection of the inspection target pattern has been completed, for example, whether or not the sensor electrode 25 has moved to a position beyond the last pattern of the inspection target pattern. Check to see if the test is complete).

  If the inspection has been completed only halfway through the pattern to be inspected, the process proceeds to step S16, where scanning of the electrodes is continued to supply an inspection signal to the next pattern. Then, the process returns to step S10 to continue the reading process.

  On the other hand, in step S14, when the inspection for all the inspection target patterns is completed, the process proceeds to step S20, instructs the signal supply unit 65 to stop the supply of the inspection signal, and the signal processing circuit 50, the A / D converter. The operation of the unit 64 is stopped.

  Finally, in step S22, the inspection target is removed from the inspection position, and is positioned and transported to the next transport position, and necessary post-processing is performed.

  By performing control as described above, pattern inspection can be performed without both the sensor electrode 25 and the supply electrode 35 contacting the inspection target pattern at all. For this reason, even if the substrate has a low strength, the inspection can be performed without causing a problem such as scratching the inspection target pattern.

  For this reason, even for a glass substrate for a liquid crystal display panel used for a liquid crystal display panel for a small mobile phone that does not have sufficient pattern strength, it is possible to reliably inspect the wiring pattern without damaging the wiring pattern.

  In the inspection control of the conductive pattern according to the present embodiment, while the sensor electrode 25 and the supply electrode 35 are moved across the pattern to be inspected, the AC sine wave signal which is a continuous signal from the supply electrode 35 is inspected. Since the signal is supplied to the pattern and the signal potential from the pattern to be inspected is detected by the sensor electrode 25, the detection signal, which is the signal potential obtained from the sensor electrode 25, is detected as a constant detection signal value to some extent.

  For this reason, when a plurality of inspection target patterns provided on the inspection target substrate include an open (disconnection inspection target pattern) or short (an adjacent inspection target pattern and a short-circuited inspection target pattern) defective inspection target pattern, Between a certain constant continuous detection signal value that is detected in a continuous range of a normal inspection target pattern without open or short, and a failure detection signal value detected at the defect inspection target pattern position with open or short There is a numerical difference.

  As described above, a detection signal value of a failure due to an open or a short circuit appears as a numerical value difference, that is, a change in a numerical value, among continuous detection signal values of a certain degree, and for example, the detection signal detection result is described in detail in FIG. 4 or a graph as shown in FIG. 4, it is possible to easily determine the defect of the inspection target substrate and to specify the position of the defect inspection target pattern having an open or short circuit.

  Further, the inspection apparatus changes each time when inspecting while sequentially changing the inspection target substrate, such as a change in the gap between the sensor electrode 25 and the inspection target pattern, a change in the gap between the supply electrode 35 and the inspection target pattern, and the like. The detection signal value which is constant to some extent becomes a different numerical value as an absolute value every time the inspection target substrate is changed.

  However, according to the conductive pattern inspection control of the present embodiment, the determination of the defect of the inspection target substrate and the identification of the position of the defect inspection target pattern having an open or a short circuit are performed based on the open or appearing in a certain constant continuous detection signal value. It is possible to use the numerical value difference of the detection signal value of the defect due to the short circuit, that is, the change of the relative numerical value of the detection signal.

  Therefore, a relative value such as a ratio of a defective detection signal value to a continuous detection signal value or a ratio of a change in the defective detection signal value can be used as a threshold value for determining a defect and specifying a defect position. Even if the inspection apparatus performs inspection while sequentially changing the substrate to be inspected without using a certain constant continuous detection signal value as an absolute value, it is possible to reliably determine a defect and specify a defective position.

  Note that the inspection control of the conductive pattern according to the present embodiment is not limited to the above example, and the detection signal read in step S12 is set to the threshold value based on the above relative value between step S12 and step S14. It is checked whether it is within the range. If the detection result is within the threshold range, the process proceeds to step S14. If the detection result is not within the threshold range, the test pattern supplying the test signal is the open or short-circuited defect test pattern. There may be provided a step of determining that there is a pattern and storing the position and state of the pattern to be inspected.

  FIGS. 3 and 4 show results of detection of an inspection signal by the sensor electrode 25 under the above control. FIG. 3 is a diagram illustrating an example of detection of an inspection signal when three locations of the inspection target pattern in the inspection apparatus according to the present embodiment are disconnected (open). FIG. 4 is a diagram illustrating one example of the inspection target pattern according to the present embodiment. It is a figure which shows the example of a test signal detection at the time of short circuit (short circuit) in the middle.

  When the pattern to be inspected is normal, the inspection signal (AC signal) supplied to the supply electrode 35 from the signal supply unit 65 is supplied to the pattern to be inspected that is capacitively coupled, and passes through the pattern to be inspected. The light reaches the lower part of the sensor electrode 25, is detected by the sensor electrode 25 by capacitive coupling with the sensor electrode 25, and is output to the control unit 60.

  As described above, since the supply electrode 35 and the sensor electrode 25 supply and detect the inspection signal (AC signal) while traversing the pattern to be inspected, the detection signal is continuously detected as a somewhat constant detection signal value.

  When at least a part of the inspection target pattern is disconnected, at least a part of the inspection signal (AC power) supplied from the signal supply unit 65 to the supply electrode 35 is caused by the disconnection of the inspection target pattern on the sensor electrode 25 side. , The detection signal value becomes small. Therefore, as shown in FIG. 3, the detection signal value at the disconnected inspection target pattern portion is smaller than a continuous constant value detected from the normal inspection target pattern.

  On the other hand, when the inspection target pattern is short-circuited with the adjacent inspection target pattern, the inspection signal (AC power) supplied to the supply electrode 35 from the signal supply unit 65 is adjacent to the adjacent inspection target pattern through the short-circuited portion. Since the detection signal from the sensor electrode 25 is also superimposed on the detection signal of the adjacent inspection target pattern, the detection signal value increases because the detection signal also flows to the inspection target pattern. For this reason, as shown in FIG. 4, the detection signal value of the short-circuited inspection target pattern portion is larger than a continuous constant value detected from the normal inspection target pattern.

  The disconnection and short circuit of the detection target pattern can be performed by one sensor electrode 25 as described above because the width of the sensor electrode 25 is set to be at least one pitch wider than the width of the supply electrode 35 of the inspection target pattern. Because.

  However, the width of the sensor electrode 25 does not necessarily have to be equal to or more than one pitch of the inspection target pattern from the width of the supply electrode 35, and the inspection of the disconnected inspection target pattern or the inspection target pattern short-circuited with the adjacent inspection target pattern is not necessarily required. If the inspection can be performed, for example, the configuration of the second embodiment described in detail later may be adopted.

  At this time, if a threshold value is set within a certain range to a certain constant continuous detection signal value as an absolute value, when the detection signal value is smaller than the threshold value, the disconnection of the inspection target pattern, the detection signal value is smaller than the threshold value. If it is larger, it can be determined that the inspection target pattern is short-circuited. For example, in FIG. 4, if the threshold value is set to 0.02 Vpp with respect to a constant detection signal value of 0.60 Vpp which is constant to some extent, the sensor is located at a position of about 22 mm, 42 mm, and 78 mm, which is 0.58 Vpp or less. It is determined that the inspection target pattern is disconnected.

  In addition, for a threshold value for determining a defect or specifying a defect position, using a relative value such as a ratio of a defective detection signal value to a continuous detection signal value or a ratio of a change in the defective detection signal value, for example, a continuous value. If the detected signal value decreases by 3% or more, it can be determined that the inspection pattern is broken, and if the continuous detection signal value increases by 3% or more, it can be determined that the inspection pattern is short-circuited.

  As described above, in the present embodiment, not only the absolute value can be used as the threshold value for determining the quality of the pattern, but also the relative change ratio of the detection signal value of the defective pattern to the detection signal value of the normal pattern can be determined. Since it can be used as a threshold value, even if the inspection device sequentially inspects the substrate to be inspected, the optimal threshold value can be set according to the detection result. Even if the value is low, these effects can be completely prevented, and accurate test results can be obtained.

  As described above, even if the inspection method is such that the detection signal value is minute because both the sensor unit and the inspection signal supply unit are non-contact, the difference is obtained by using the inspection apparatus of the present embodiment. Can be reliably recognized, and an easy and reliable inspection of the pattern state can be performed.

  For this reason, the quality of the pattern can be detected very accurately and easily compared to the conventional method of determining the quality using the absolute value of the detection signal value as a threshold. In addition, since there is no contact, accurate positioning accuracy is not required, and an inspection can be performed with high accuracy even on a substrate having a very fine pattern pitch to be inspected.

[Embodiment of Second Embodiment]
In the above description, an example has been described in which at least a part of the sensor electrode 25 is controlled such that the supply electrode 35 is always at the other end position of the pattern to which the test signal is actually supplied. However, the present invention is not limited to the above example. For example, a plurality of sensor electrodes 25 are provided, and one of the plurality of sensor electrodes 25 is actually supplied with a test signal by the supply electrode 35. At least one of the plurality of sensor electrodes 25 is provided at the other end of the pattern adjacent to the pattern to which the supply electrode 35 is actually supplying the inspection signal. It may be configured.

  A second embodiment according to the present invention configured as described above will be described below with reference to FIG. FIG. 5 is a diagram for explaining the configuration of the inspection apparatus according to the second embodiment of the present invention.

  In FIG. 5, the same components as those shown in FIG. 1 of the first embodiment described above are denoted by the same reference numerals, and detailed description thereof will be omitted.

  In FIG. 5, a first sensor electrode 22 and a second sensor electrode 24 are provided on at least the front end surface of the sensor unit 20. The first sensor electrode 22 and the second sensor electrode 24 are spaced apart by the pattern pitch of the pattern to be inspected, and the supply electrode 35 of the first sensor electrode 22 actually supplies an inspection signal. The second sensor electrode 24 is provided at the other end position of the received inspection target pattern, and the other end of the adjacent inspection target pattern adjacent to the received inspection target pattern to which the supply electrode 35 is actually supplying the inspection signal. It is provided in a state where it is offset to the part position.

  It is desirable that the width of the first sensor electrode 22 and the second sensor electrode 24 be equal to or smaller than the pattern width of the pattern to be inspected. This is because the first sensor electrode 22 inspects the disconnection of the pattern to be inspected by the first sensor electrode 22 and the second sensor electrode 24 inspects the short circuit between the pattern to be inspected and the adjacent pattern to be inspected. This is to realize a high inspection.

  Specifically, when the width of the first sensor electrode 22 is equal to or smaller than the pattern width of the inspection target pattern, the received inspection target pattern is disconnected, and the received inspection target pattern and the adjacent inspection target pattern are short-circuited. Even in this case, the first sensor electrode 22 is less likely to be affected by the detection signal from the test signal from the adjacent test pattern, which has flowed into the adjacent test pattern from the received test pattern through the short circuit. If the width of the second sensor electrode 24 is equal to or smaller than the pattern width of the pattern to be inspected, there is no disconnection or short circuit in the pattern to be inspected. Even when the target pattern is short-circuited, the second sensor electrode 24 is less likely to be affected by the inspection signal from the received inspection target pattern.

  As described above, in the inspection for disconnection / short circuit by the first sensor electrode 22 and the second sensor electrode 24, it is determined how the presence / absence of disconnection of the received inspection target pattern and the presence / absence of short circuit of the adjacent inspection target pattern exist. However, very accurate inspection can be realized.

  However, it is clear from the sensor electrodes 25 in the first embodiment that the widths of the first sensor electrode 22 and the second sensor electrode 24 do not necessarily have to be smaller than the pattern width of the pattern to be inspected.

  Furthermore, in the second embodiment described in detail above, the offset sensor electrode is described as the second sensor electrode 24, but is opposite to the adjacent inspection target pattern adjacent to the received inspection target pattern. By detecting a test signal from a second adjacent test pattern adjacent on the side, a third sensor electrode is provided to simultaneously detect a short circuit with two adjacent test patterns adjacent to both sides of the power receiving test pattern. It is also possible.

  Further, the sensor electrodes provided in the sensor unit 20 have no problem even if only the first sensor electrode 22 or only the second sensor electrode 24 is provided, and three or more offset sensor electrodes may be provided. Needless to say.

[Third Embodiment of the Invention]
In the above description, an example of detecting a defective pattern by moving the sensor electrode 25 and the supply electrode 35 so as to cross the end of the pattern to be inspected has been described. However, the present invention is not limited to the above example. For example, one of the sensor electrode 25 and the supply electrode 35 can be controlled to move along the pattern to be inspected, and the defective pattern is identified by the above-described control. After that, both electrodes are positioned at the defective pattern position, one electrode is moved on the pattern along the defective pattern, the detection signal value at the sensor electrode 25 is read, and the change position of the detection signal value is detected to detect a pattern defect. You may comprise so that it can be specified as an occurrence location.

  A second embodiment according to the present invention configured as described above will be described below with reference to FIGS. FIG. 6 is a diagram for explaining the electrode movement control in the inspection device of the second embodiment according to the present invention, FIG. 7 is a diagram for explaining the electrode movement control in the inspection device of the second embodiment according to the present invention, and FIG. FIG. 9 is a flowchart for explaining the pattern defect location specifying control of the second embodiment, FIG. 9 is a diagram showing an example of a defect pattern detection signal waveform at the sensor electrode 25 in the device of the second embodiment, and FIG. FIG. 4 is a diagram illustrating an example of a detection signal waveform of a sensor electrode 25 in a defective pattern.

  6, the same components as those of the first embodiment shown in FIG. 1 are denoted by the same reference numerals, and detailed description thereof will be omitted.

  In FIG. 6, a camera 26 is attached to the detection unit 20. The camera 26 is connected to, for example, a display unit 66 of the control unit 60 in order to display a captured image, and is used to observe a failure occurrence state at a pattern failure occurrence location. In addition, the inspection signal supply unit 30 is provided with probe contact means 32 to which an inspection signal supply probe for supplying an inspection signal is attached. The probe contacting means 32 and the inspection signal supply probe are used to reliably specify the location where the pattern failure has occurred.

  In the second embodiment, the scalar robot is configured to be able to control the movement of the electrodes not only in the direction of the arrow in FIG. 1 but also in the longitudinal direction of the pattern in FIG.

  Then, first, the inspection control shown in FIG. 2 of the first embodiment described above is performed to inspect whether or not the inspection target pattern has a defect. As a result of the inspection, for example, the inspection target pattern position of the inspection target pattern which is determined to be the pattern disconnection is held in the RAM 63 or the like.

  When the defective pattern is detected and the position of the defective pattern is specified in this manner, the process proceeds to the defective portion specifying process. In the defective portion specifying process according to the second embodiment, as shown by (1) in FIG. 7, the supply electrode 35 and the sensor electrode 25 are first synchronized and moved to the pattern position determined to be defective.

  Subsequently, as shown by (2) in FIG. 7, the inspection signal is sequentially read while moving the sensor electrode 25 from the pattern end toward the other end, and the position where the read signal changes rapidly (the detection signal is not detected) , Or a position that changes to a low level), and the position is specified as a pattern defective portion.

  Hereinafter, this will be described in detail with reference to the flowchart of FIG. In the second embodiment, following the processing in step S14 in the first embodiment described above, the detection signal stored in the RAM 63 is checked, and it is checked whether a defective pattern is detected. If no pattern has been detected, the process moves to step S20.

  On the other hand, if a defective pattern is detected as a result of the inspection, the signal supply unit 65 is deenergized, and the electrodes are positioned at the initial position as in step S3, and the process proceeds to the process shown in FIG. Then, after the processing shown in FIG. 8 is completed, the processing may be shifted to the processing in step S20.

  In the second embodiment, first, as shown in step S31 of FIG. 8, a defective pattern position detected in the processing of steps S1 to S16 shown in FIG. 2 is specified. For example, FIG. 9 shows a detection signal waveform when a part of the pattern is disconnected. In the example shown in FIG. 9, a signal before signal processing in the analog signal processing circuit 50 is shown. A portion indicated by a circle is a signal waveform detected as an open pattern (when two patterns are disconnected).

  Subsequently, in step S33, the robot controller 70 is activated to control the scalar robot 80 to move the sensor electrode 25 and the supply electrode 35 to the defective pattern position while synchronizing with each other. At this time, in order to perform detection with high sensitivity, positioning is performed such that the center in the width direction of the sensor electrode 25 and the supply electrode 35 is substantially at the center of the width of the defective pattern (control (1) in FIG. 7).

  Subsequently, the process proceeds to step S35, in which the signal supply unit 65 is activated to apply the inspection signal to the supply electrode 35 and supply the inspection signal to the defective pattern. Then, the robot controller 70 is activated to move the sensor electrode 25 in the direction of the supply electrode 35 along the pattern (control (2) in FIG. 7).

  At the same time, the detection signal from the sensor electrode 25 is read as shown in step S40. Then, in the subsequent step S42, it is checked whether or not the detection signal value from the sensor electrode 25 has changed significantly. If not, the process returns to step S37 to continue the movement of the sensor electrode 25.

  On the other hand, if the value of the detection signal from the sensor electrode 25 has changed significantly in step S42, the process proceeds to change step S44, in which the position where the detection signal from the sensor electrode 25 has started to change significantly and the position at which no significant change has ceased are determined. Then, an intermediate position between these positions is specified as a pattern defective portion.

  FIG. 10 shows an example of a detection signal waveform at the sensor electrode 25. As shown in FIG. 10, the inspection signal supplied by the supply electrode 35 did not reach the sensor electrode 25 up to the disconnection point, and the detection signal value was also low. Since it reaches, the detection signal value increases. For example, since the detection signal from the sensor electrode 25 specifies an intermediate position between a position where the detection signal starts to change greatly and a position where the detection signal does not change significantly, a substantially middle position of the inclined portion is determined to be a pattern defect. Specified as a location.

  In the above description, the sensor electrode 25 is moved in the direction of the supply electrode. However, instead of the sensor electrode 25, the supply electrode 35 may be moved in the direction of the sensor electrode 25.

  As described above, according to the second embodiment, a high-precision pattern inspection can be performed in a non-contact manner as in the first embodiment described above, and the sensor electrode can be connected to the X-axis. By controlling the movement in the two directions of -Y, it is possible to specify not only the inspection of whether there is a defective pattern but also a specific defective portion. For this reason, for example, a defective portion can be repaired in a short time as needed.

  In the repair of the above-mentioned defective portion, in order to determine whether or not the repair can be performed, it is desirable to be able to observe the defect occurrence state of the pattern defect occurrence portion. For example, if it is found that only dust or the like has adhered to the location where the pattern failure has occurred, it can be determined that the repair can be performed on the spot, and if the failure is fatal, it is determined that the repair is not performed. be able to. The camera 26 attached to the detection unit 20 is used for observing the failure occurrence state at the pattern failure occurrence location. Since the camera 26 is attached to the detection unit 20, the photographing of the camera 26 is started in step S35, the photographing is continued while steps S40 and S42 are performed, and the pattern failure in step S42 is performed. Shooting is continued until after the location is specified. The image of the pattern defect occurrence location photographed in this manner is displayed on the display unit 66 during the continuation of the photographing and after the pattern defect occurrence location is specified, and is used to observe the defect occurrence state of the pattern defect occurrence location. .

  In addition, the state of a defective portion of the pattern varies from a completely disconnected state or a short-circuited state to a partially disconnected state or a partially short-circuited state due to a deposit such as dust. In this partially disconnected or partially short-circuited state, a detection signal waveform as shown in FIG. 10 may not be obtained in an inspection in which both the sensor electrode 25 and the supply electrode 35 are not in contact. In such a case, if the probe contact means 32 is operated to bring the inspection signal supply probe into contact with one end of the defective pattern, and then the sensor electrode 25 is moved on the pattern along the defective pattern, the pattern can be reliably removed. It is possible to specify a failure occurrence location.

  Note that a contact-type sensor probe is used instead of the sensor electrode 25 at the other end of the defective pattern, and the non-contact supply electrode 35 is brought into contact with the sensor at the other end of the defective pattern by bringing the sensor probe into contact with the other end. It may be moved in the direction of the probe.

[Embodiment of the fourth invention]
In the above description, an example in which the scalar robot 80 controls the movement of the sensor electrode 25 and the supply electrode 35 two-dimensionally mainly in the XY directions has been described. This is because the substrate to be inspected was a liquid crystal panel, and the glass substrate had high smoothness. When inspecting a substrate having a large pattern thickness or a large inspection substrate in which unevenness on the surface cannot be avoided, not only the above two-dimensional control but also control in the vertical direction (Z direction). What is necessary is just to comprise, so that even if there is unevenness of the board | substrate to be inspected, it may be good so that an inspection result may be obtained.

  A third embodiment according to the present invention configured to control not only two-dimensional control but also the vertical direction (Z direction) will be described below with reference to FIG. FIG. 11 is a diagram for explaining the configuration of the inspection apparatus according to the third embodiment of the present invention. 11, the same components as those shown in FIG. 1 of the first embodiment described above are denoted by the same reference numerals, and detailed description thereof will be omitted.

  In FIG. 11, a laser displacement meter 28 is attached to the detection unit 20 and a laser displacement meter 38 is attached to the inspection signal supply unit 30. The detection unit 20 and the inspection signal A distance measuring unit 90 for measuring the distance between the supply unit 30 and the surface of the substrate to be inspected is provided.

  In addition, the scalar robot 80 is configured to be capable of two-dimensionally controlling the detection unit 20 and the inspection signal supply unit 30 and to be capable of positioning control in a direction (vertical direction) orthogonal to the drawing.

  In the third embodiment having the above configuration, the distance measuring unit 90 activates the laser displacement meters 28 and 38 simultaneously with the movement of the electrodes, and measures the distance between each electrode and the surface of the substrate to be inspected. , And outputs the measurement result to the control unit 60. Further, the control unit 60 averages the measurement results of the measurement distances while the electrodes from the distance measurement unit 90 move by a certain distance, and controls the distance between the electrodes and the pattern so that the averaged distances are constant. I have.

  For example, the distance between the electrode and the substrate surface is controlled according to the average of the distances of three inspection target patterns.

  The reason for averaging the distances in this way is to prevent abrupt Z-direction control and to make the control gentle, and to reduce the effects of noise, measurement errors, and the like.

  Performing not only the X-Y direction but also the Z-direction control in this way is particularly effective for inspection of large substrates. For example, in the inspection of a pattern to be inspected on the surface of a large flat display panel, the curvature of the substrate surface cannot be avoided, and even in such a case, it is possible to effectively prevent the electrode from being in contact with the pattern.

  When the pattern is thick, the range of the measurement distance to be averaged may be narrowed to enable more sensitive detection.

  FIG. 2 is a diagram for explaining a pattern inspection principle according to an embodiment of the present invention.   5 is a flowchart for explaining inspection control of the inspection apparatus according to the embodiment.   FIG. 5 is a diagram illustrating an example of a detection signal when three adjacent test target patterns are short-circuited (short-circuited) in the test apparatus according to the present embodiment;   FIG. 7 is a diagram illustrating an example of a detected waveform when one of the inspection target patterns in the inspection apparatus according to the present embodiment is disconnected (open) in the middle.   It is a figure showing the composition of the inspection device of a 2nd embodiment concerning the present invention.   It is a figure showing the composition of the inspection device of a 3rd embodiment concerning the present invention.   It is a figure for explaining electrode movement control in the inspection device of a 3rd embodiment.   13 is a flowchart for explaining pattern defect location identification control according to the third embodiment.   FIG. 13 is a diagram illustrating an example of a defective pattern detection signal waveform at a sensor electrode in the device according to the third embodiment.   FIG. 7 is a diagram illustrating an example of a detection signal waveform of a sensor electrode in a defective pattern.   It is a figure for explaining the composition of the inspection device of a 4th embodiment concerning the present invention.

Explanation of reference numerals

Reference Signs List 10 Glass substrate 15 Conductive pattern 20 Sensor unit 22 First sensor electrode 24 Second sensor electrode 25 Sensor electrode 26 Camera 28 Laser displacement meter 30 Inspection signal supply unit 32 Probe contact means 35 Supply electrode 38 Laser displacement meter 50 Analog signal Processing circuit 51 Amplifier 52 Band pass filter 53 Rectifier circuit 54 Smoothing circuit 60 Control unit 70 Robot controller 80 Scalar robot 61 CPU
62 ROM
63 RAM
64 A / D converter 65 Signal supply unit 66 Display unit

Claims (26)

An inspection signal of alternating current is supplied from one of the inspection target regions of the inspection target pattern in which the vicinity of both ends of the inspection target region is formed in a row, and a signal from the inspection target pattern is detected from the other to detect the inspection target pattern. A circuit pattern inspection apparatus for inspecting
Supply means having a supply electrode for supplying the inspection signal to the inspection target pattern from one of the inspection target areas of the inspection target pattern,
Detecting means having a detecting electrode for detecting a signal from the pattern to be inspected,
Moving means for moving the supply electrode of the supply means and the detection electrode of the detection means apart from the pattern to be inspected and moving across the row pattern portion near both ends of the inspection area. Pattern inspection device.   2. The circuit pattern inspection apparatus according to claim 1, wherein the inspection target pattern is a conductive pattern formed in a substantially bar shape with a predetermined width on the substrate.   3. The circuit pattern inspection apparatus according to claim 1, wherein the width of the detection electrode is at least a width of two rows of the pattern to be inspected.   The detection means includes a first detection electrode disposed at the other end position of the inspection target pattern to which the inspection signal is supplied by the supply electrode at one end position, and an inspection performed by the supply electrode at one end position. 3. The circuit pattern inspection according to claim 1, further comprising a second detection electrode disposed at the other end position of the inspection target pattern adjacent to the inspection target pattern to which a signal is supplied. 4. apparatus.   The circuit pattern inspection apparatus according to claim 4, wherein the width of the first detection electrode is equal to or smaller than the pattern width of the pattern to be inspected.   The circuit pattern inspection device according to claim 4, wherein a width of the second detection electrode is equal to or smaller than a pattern width of a pattern to be inspected.   The moving means is configured to move across a row portion near both ends of the inspection target area in a state where a supply electrode surface of the supply means and a detection electrode surface of the detection means are capacitively coupled to the inspection target pattern. 7. The circuit pattern inspection apparatus according to claim 1, wherein:   The apparatus further comprises a judging means for judging that the pattern to be inspected is normal when the result of detection by the detecting means is within a predetermined range, and determining that the pattern to be inspected is defective when the result of detection is out of the predetermined range. The circuit pattern inspection device according to any one of claims 1 to 7.   The supply electrode of the supply unit and the detection electrode of the detection unit are moved to both ends of the pattern to be inspected determined by the determination unit to be defective, and either one of the supply electrode of the supply unit or the detection electrode of the detection unit is moved. 9. The circuit according to claim 8, further comprising: a second moving unit that moves the second line along the pattern toward the other, and a position detecting unit that detects a detected change position based on a detection result of the detecting unit. Pattern inspection device.   The circuit pattern inspection apparatus according to claim 9, further comprising: a contact unit configured to contact one of a supply electrode of the supply unit and a detection electrode of the detection unit with a pattern to be inspected.   The circuit pattern inspection apparatus according to claim 9, wherein at least one of the supply electrode and the detection electrode moved by the second moving unit includes an imaging unit.   The apparatus according to claim 1, further comprising a separation control unit configured to perform positioning control so that a distance between at least one of the supply electrode and the detection electrode moved by the second movement unit and the pattern to be inspected is substantially constant. The circuit pattern inspection device according to any one of claims 9 to 11.   4. The apparatus according to claim 1, further comprising a separation distance control unit configured to perform positioning control such that a separation distance between at least one of the supply electrode and the detection electrode moved by the movement unit and the pattern to be inspected is substantially constant. The circuit pattern inspection device according to claim 12.   The separation processing control means includes a displacement meter that moves together with the detection electrode or the supply electrode at a position near the detection electrode or the supply electrode, and separates the detection electrode or the supply electrode from the inspection object according to a detection result of the displacement meter. 14. The circuit pattern inspection apparatus according to claim 12, wherein positioning control is performed in a direction orthogonal to the inspection target so that a distance becomes substantially constant.   The separation processing control means positions an average displacement of the detection result of the displacement meter between a plurality of pitches of the test pattern as a separation distance between the detection electrode or the supply electrode and the test object in a direction orthogonal to the test object. The circuit pattern inspection apparatus according to claim 14, wherein the circuit pattern inspection apparatus performs control. Supply means having a supply electrode for supplying an inspection signal to the inspection target pattern from one of the inspection target regions of the inspection target pattern in which the vicinity of both ends of the inspection target region is formed in a row, and a signal from the inspection target pattern A pattern inspection method in a circuit pattern inspection apparatus having a detection means having a detection electrode for detecting
The supply electrode of the supply unit and the detection electrode of the detection unit, the supply electrode surface of the supply unit and the supply electrode while maintaining a state in which the detection electrode surface of the detection unit is separated from the surface of the pattern to be inspected. The detection electrode and the pattern to be inspected are moved across the columnar pattern portions near both ends of the inspection area, an AC inspection signal is supplied from one of the inspection areas of the inspection pattern, and the inspection object is supplied from the other. A circuit pattern inspection method, wherein the inspection target pattern is inspected by detecting a signal from the pattern.   17. The circuit pattern inspection method according to claim 16, wherein the circuit pattern is a conductive pattern formed in a substantially bar shape with a predetermined width on a substrate.   The width of the detection electrode is at least two rows of the pattern to be inspected, and a signal from the conductive pattern adjacent to the conductive pattern supplying the inspection signal can be detected to detect a short circuit between the adjacent conductive patterns. The circuit pattern inspection method according to claim 17, wherein:   A signal from the conductive pattern supplying an inspection signal from the detection electrode is detected by the first detection electrode of the detection means to enable disconnection between the conductive patterns, and an inspection signal is supplied from the detection electrode. 18. A signal from a conductive pattern adjacent to a conductive pattern which is present is detected by a second detection electrode of the detection means, and a short circuit between the adjacent conductive patterns can be inspected. The described circuit pattern inspection method.   20. The circuit pattern inspection method according to claim 16, wherein a position of the roughly disconnected portion of the conductive pattern is detected from a position of the detection unit which is not detected by the detection unit.   17. The method according to claim 16, further comprising: judging that the pattern to be inspected is normal when the result of detection by the detecting means is within a predetermined range, and that the pattern to be inspected is defective when the result of detection is out of the predetermined range. Item 21. The circuit pattern inspection method according to any one of Items 20 to 20.   The determination unit identifies and holds the position of the inspection target pattern determined to be defective, and moves the supply electrode of the supply unit and the detection electrode of the detection unit to both ends of the inspection target pattern determined to be defective. 22. The method according to claim 21, wherein one of the supply electrode and the detection electrode is moved along the pattern toward the other, and a change position is determined as a defective position of the inspection target pattern based on a detection result of the detection unit. The circuit pattern inspection method according to 1.   23. The circuit pattern inspection method according to claim 22, wherein one of the supply electrode of the supply unit and the detection electrode of the detection unit is brought into contact with a pattern to be inspected.   23. The imaging device according to claim 22, wherein an imaging unit provided on one of the supply electrode and the detection electrode is moved along the pattern toward the other, and an image of a defective state at a defective position of the pattern to be inspected is taken. A circuit pattern inspection method according to claim 23.   A displacement meter that moves together with the detection electrode or the supply electrode is disposed at a position near the detection electrode or the supply electrode, and a separation distance between the detection electrode or the supply electrode and the test object becomes substantially constant according to a detection result of the displacement meter. 25. The circuit pattern inspection method according to claim 16, wherein the positioning control is performed in a direction orthogonal to the inspection object to stabilize the result of the detection electrode.   26. The positioning control of the inspection object, wherein an average displacement of the detection result of the displacement meter between the plurality of inspection object pattern pitches is set as a separation distance between the detection electrode or the supply electrode and the inspection object. The circuit pattern inspection method according to 1.

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