NO20011677D0 - Elektronisk komponent for demping av höy frekvens og bondtråd for komponenten - Google Patents

Elektronisk komponent for demping av höy frekvens og bondtråd for komponenten

Info

Publication number
NO20011677D0
NO20011677D0 NO20011677A NO20011677A NO20011677D0 NO 20011677 D0 NO20011677 D0 NO 20011677D0 NO 20011677 A NO20011677 A NO 20011677A NO 20011677 A NO20011677 A NO 20011677A NO 20011677 D0 NO20011677 D0 NO 20011677D0
Authority
NO
Norway
Prior art keywords
high frequency
frequency current
circuit board
printed wiring
mounting
Prior art date
Application number
NO20011677A
Other languages
English (en)
Other versions
NO20011677L (no
Inventor
Shigeyoshi Yoshida
Hiroshi Ono
Koji Kamei
Original Assignee
Tokin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000102294A external-priority patent/JP4243000B2/ja
Priority claimed from JP2000103025A external-priority patent/JP4398057B2/ja
Application filed by Tokin Corp filed Critical Tokin Corp
Publication of NO20011677D0 publication Critical patent/NO20011677D0/no
Publication of NO20011677L publication Critical patent/NO20011677L/no

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
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  • Engineering & Computer Science (AREA)
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  • Power Engineering (AREA)
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  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Thin Magnetic Films (AREA)
  • Semiconductor Integrated Circuits (AREA)
NO20011677A 2000-04-04 2001-04-03 Elektronisk komponent for demping av höy frekvens og forbindelsesledning for komponenten NO20011677L (no)

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US7371471B2 (en) * 2004-03-08 2008-05-13 Nec Tokin Corporation Electromagnetic noise suppressing thin film
EP1801739A4 (en) * 2004-10-13 2009-07-15 Toppan Forms Co Ltd CONTACTLESS INTEGRATED CIRCUIT LABEL AND METHOD AND APPARATUS FOR MANUFACTURING THE SAME
JP3972951B2 (ja) * 2005-07-04 2007-09-05 オムロン株式会社 スイッチング電源、電源装置および電子機器
SG138501A1 (en) * 2006-07-05 2008-01-28 Micron Technology Inc Lead frames, microelectronic devices with lead frames, and methods for manufacturing lead frames and microelectronic devices with lead frames
US7719112B2 (en) * 2006-08-07 2010-05-18 University Of Central Florida Research Foundation, Inc. On-chip magnetic components
CN101627450B (zh) * 2007-03-08 2013-10-30 日本电气株式会社 电容元件、印刷布线板、半导体封装以及半导体电路
CN101933139B (zh) * 2007-12-20 2012-11-07 爱信艾达株式会社 半导体装置及其制造方法
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US4760355A (en) * 1985-11-04 1988-07-26 Glen Dash Electromagnetic emission control system
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US5847951A (en) * 1996-12-16 1998-12-08 Dell Usa, L.P. Method and apparatus for voltage regulation within an integrated circuit package
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US20010026016A1 (en) 2001-10-04
DE60104470D1 (de) 2004-09-02
US6903440B2 (en) 2005-06-07
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US20040188833A1 (en) 2004-09-30
CN1317829A (zh) 2001-10-17
DE60104470T2 (de) 2005-07-28
MY128653A (en) 2007-02-28
KR20010095252A (ko) 2001-11-03

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