SG96612A1 - Electronic component of a high frequency current suppression type and bonding wire for the same - Google Patents

Electronic component of a high frequency current suppression type and bonding wire for the same

Info

Publication number
SG96612A1
SG96612A1 SG200101994A SG200101994A SG96612A1 SG 96612 A1 SG96612 A1 SG 96612A1 SG 200101994 A SG200101994 A SG 200101994A SG 200101994 A SG200101994 A SG 200101994A SG 96612 A1 SG96612 A1 SG 96612A1
Authority
SG
Singapore
Prior art keywords
high frequency
frequency current
circuit board
printed wiring
electronic component
Prior art date
Application number
SG200101994A
Other languages
English (en)
Inventor
Yoshida Shigeyoshi
Ono Hiroshi
Kamei Koji
Original Assignee
Nec Tokin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000102294A external-priority patent/JP4243000B2/ja
Priority claimed from JP2000103025A external-priority patent/JP4398057B2/ja
Application filed by Nec Tokin Corp filed Critical Nec Tokin Corp
Publication of SG96612A1 publication Critical patent/SG96612A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
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    • H01L23/4952—Additional leads the additional leads being a bump or a wire
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    • H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Thin Magnetic Films (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Semiconductor Integrated Circuits (AREA)
SG200101994A 2000-04-04 2001-04-03 Electronic component of a high frequency current suppression type and bonding wire for the same SG96612A1 (en)

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JP2000102294A JP4243000B2 (ja) 2000-04-04 2000-04-04 電子部品用高周波電流抑制型ボンディングワイヤ及びそれを含む電子部品
JP2000103025A JP4398057B2 (ja) 2000-04-05 2000-04-05 高周波電流抑制型電子部品

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JP2001297905A (ja) * 2000-04-17 2001-10-26 Tokin Corp 高周波電流抑制体
KR200345144Y1 (ko) * 2003-11-04 2004-03-18 조인셋 주식회사 전자파 흡수기능을 구비한 반도체 패키지
US7371471B2 (en) * 2004-03-08 2008-05-13 Nec Tokin Corporation Electromagnetic noise suppressing thin film
WO2006041033A1 (ja) * 2004-10-13 2006-04-20 Toppan Forms Co., Ltd. 非接触ｉｃラベル及びその製造方法並びに製造装置
JP3972951B2 (ja) * 2005-07-04 2007-09-05 オムロン株式会社 スイッチング電源、電源装置および電子機器
SG138501A1 (en) * 2006-07-05 2008-01-28 Micron Technology Inc Lead frames, microelectronic devices with lead frames, and methods for manufacturing lead frames and microelectronic devices with lead frames
US7719112B2 (en) * 2006-08-07 2010-05-18 University Of Central Florida Research Foundation, Inc. On-chip magnetic components
CN101627450B (zh) * 2007-03-08 2013-10-30 日本电气株式会社 电容元件、印刷布线板、半导体封装以及半导体电路
WO2009081723A1 (ja) * 2007-12-20 2009-07-02 Fuji Electric Device Technology Co., Ltd. 半導体装置およびその製造方法
CA3158938C (en) * 2019-10-29 2023-08-29 Nippon Telegraph And Telephone Corporation High-frequency line connecting structure

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US4172171A (en) * 1976-11-12 1979-10-23 Fuji Photo Film Co., Ltd. Magnetic recording medium
US4760355A (en) * 1985-11-04 1988-07-26 Glen Dash Electromagnetic emission control system
US5529831A (en) * 1993-12-09 1996-06-25 Alps Electric Co., Ltd. Thin film device

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FR2233685B1 (no) * 1973-06-12 1977-05-06 Josse Bernard
JP2768981B2 (ja) * 1989-06-22 1998-06-25 シャープ株式会社 光メモリ素子
US5538802A (en) * 1992-09-18 1996-07-23 Kao Corporation Magnetic recording medium and process for producing the same
US5847951A (en) * 1996-12-16 1998-12-08 Dell Usa, L.P. Method and apparatus for voltage regulation within an integrated circuit package
EP0854669B1 (en) 1997-01-20 2003-03-26 Daido Steel Company Limited Soft magnetic alloy powder for electromagnetic and magnetic shield, and shielding members containing the same
JP4398056B2 (ja) * 2000-04-04 2010-01-13 Ｎｅｃトーキン株式会社 樹脂モールド体
JP2001291989A (ja) * 2000-04-04 2001-10-19 Tokin Corp 金属筐体を備えた電子部品

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US4172171A (en) * 1976-11-12 1979-10-23 Fuji Photo Film Co., Ltd. Magnetic recording medium
US4760355A (en) * 1985-11-04 1988-07-26 Glen Dash Electromagnetic emission control system
US5529831A (en) * 1993-12-09 1996-06-25 Alps Electric Co., Ltd. Thin film device

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DE60104470T2 (de) 2005-07-28
US20010026016A1 (en) 2001-10-04
KR20010095252A (ko) 2001-11-03
US6635961B2 (en) 2003-10-21
EP1146637B1 (en) 2004-07-28
TW503495B (en) 2002-09-21
US6903440B2 (en) 2005-06-07
US20040188833A1 (en) 2004-09-30
DE60104470D1 (de) 2004-09-02
NO20011677L (no) 2001-10-05
EP1146637A1 (en) 2001-10-17
CN1317829A (zh) 2001-10-17
MY128653A (en) 2007-02-28

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