NO165250C - Elektrisk ledende substrat forsynt med et palladiumnikkelbelegg og fremsgangsmaate ved fremstilling av det belagte substrat. - Google Patents

Elektrisk ledende substrat forsynt med et palladiumnikkelbelegg og fremsgangsmaate ved fremstilling av det belagte substrat.

Info

Publication number
NO165250C
NO165250C NO843689A NO843689A NO165250C NO 165250 C NO165250 C NO 165250C NO 843689 A NO843689 A NO 843689A NO 843689 A NO843689 A NO 843689A NO 165250 C NO165250 C NO 165250C
Authority
NO
Norway
Prior art keywords
layer
procedure
manufacturing
palladium
electric conductive
Prior art date
Application number
NO843689A
Other languages
English (en)
Other versions
NO165250B (no
NO843689L (no
Inventor
Stephen Wayne Updegraff
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=24203230&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=NO165250(C) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Du Pont filed Critical Du Pont
Publication of NO843689L publication Critical patent/NO843689L/no
Publication of NO165250B publication Critical patent/NO165250B/no
Publication of NO165250C publication Critical patent/NO165250C/no

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12868—Group IB metal-base component alternative to platinum group metal-base component [e.g., precious metal, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12875—Platinum group metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12882—Cu-base component alternative to Ag-, Au-, or Ni-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/1291—Next to Co-, Cu-, or Ni-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12944—Ni-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • ing And Chemical Polishing (AREA)
  • Non-Insulated Conductors (AREA)
  • Coating With Molten Metal (AREA)
  • Lead Frames For Integrated Circuits (AREA)
NO843689A 1983-11-15 1984-09-17 Elektrisk ledende substrat forsynt med et palladiumnikkelbelegg og fremsgangsmaate ved fremstilling av det belagte substrat. NO165250C (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/551,925 US4463060A (en) 1983-11-15 1983-11-15 Solderable palladium-nickel coatings and method of making said coatings

Publications (3)

Publication Number Publication Date
NO843689L NO843689L (no) 1985-05-20
NO165250B NO165250B (no) 1990-10-08
NO165250C true NO165250C (no) 1991-01-16

Family

ID=24203230

Family Applications (1)

Application Number Title Priority Date Filing Date
NO843689A NO165250C (no) 1983-11-15 1984-09-17 Elektrisk ledende substrat forsynt med et palladiumnikkelbelegg og fremsgangsmaate ved fremstilling av det belagte substrat.

Country Status (13)

Country Link
US (1) US4463060A (no)
EP (1) EP0146152B1 (no)
JP (1) JPS60106993A (no)
KR (1) KR890002838B1 (no)
AT (1) ATE24554T1 (no)
AU (1) AU549886B2 (no)
BR (1) BR8405026A (no)
CA (1) CA1255618A (no)
DE (1) DE3461834D1 (no)
DK (1) DK446884A (no)
ES (1) ES536238A0 (no)
MX (1) MX162670A (no)
NO (1) NO165250C (no)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4613069A (en) * 1981-11-23 1986-09-23 The United States Of America As Represented By The Secretary Of The Interior Method for soldering aluminum and magnesium
US4628165A (en) * 1985-09-11 1986-12-09 Learonal, Inc. Electrical contacts and methods of making contacts by electrodeposition
US4849303A (en) * 1986-07-01 1989-07-18 E. I. Du Pont De Nemours And Company Alloy coatings for electrical contacts
US4743346A (en) * 1986-07-01 1988-05-10 E. I. Du Pont De Nemours And Company Electroplating bath and process for maintaining plated alloy composition stable
US4846941A (en) * 1986-07-01 1989-07-11 E. I. Du Pont De Nemours And Company Electroplating bath and process for maintaining plated alloy composition stable
ATE89337T1 (de) * 1988-02-25 1993-05-15 Du Pont Elektroplattierungsbad und verfahren zum stabilhalten der zusammensetzung der plattierten legierung.
EP0335683B1 (en) * 1988-04-01 1993-10-20 E.I. Du Pont De Nemours And Company Electroplated alloy coatings having stable alloy composition
JPH0359972A (ja) * 1989-07-27 1991-03-14 Yazaki Corp 電気接点
JPH0484449A (ja) * 1990-07-27 1992-03-17 Shinko Electric Ind Co Ltd Ｔａｂテープ
US6060175A (en) * 1990-09-13 2000-05-09 Sheldahl, Inc. Metal-film laminate resistant to delamination
US5086966A (en) * 1990-11-05 1992-02-11 Motorola Inc. Palladium-coated solder ball
US5597470A (en) * 1995-06-18 1997-01-28 Tessera, Inc. Method for making a flexible lead for a microelectronic device
US5749933A (en) * 1996-03-28 1998-05-12 Johns Manville International, Inc. Apparatus and method for producing glass fibers
SG71046A1 (en) 1996-10-10 2000-03-21 Connector Systems Tech Nv High density connector and method of manufacture
JP3379412B2 (ja) * 1997-05-30 2003-02-24 松下電器産業株式会社 パラジウムめっき液とこれを用いたパラジウムめっき皮膜及びこのパラジウムめっき皮膜を有する半導体装置用リードフレーム
US7023231B2 (en) * 2004-05-14 2006-04-04 Solid State Measurements, Inc. Work function controlled probe for measuring properties of a semiconductor wafer and method of use thereof
US8636579B2 (en) 2006-11-09 2014-01-28 Wms Gaming Inc. Wagering game with pay lines extending through bonus regions
WO2012001132A1 (de) * 2010-06-30 2012-01-05 Schauenburg Ruhrkunststoff Gmbh Tribologisch belastbare edelmetall/metallschichten
US20140076798A1 (en) 2010-06-30 2014-03-20 Schauenburg Ruhrkunststoff Gmbh Tribologically Loadable Mixed Noble Metal/Metal Layers
JP6973051B2 (ja) * 2017-12-26 2021-11-24 株式会社リコー 液体吐出ヘッド、液体吐出ユニット、液体を吐出する装置
WO2020145096A1 (ja) * 2019-01-07 2020-07-16 株式会社村田製作所 濾過フィルタ
CN113993374A (zh) * 2019-06-21 2022-01-28 松下知识产权经营株式会社 动物信息管理系统和动物信息管理方法
CN113699565B (zh) * 2021-09-28 2023-07-04 万明电镀智能科技(东莞)有限公司 高耐蚀性钯镍合金镀层及其电镀方法和钯镍镀层电镀液

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4100039A (en) 1976-11-11 1978-07-11 International Business Machines Corporation Method for plating palladium-nickel alloy
US4284482A (en) * 1980-09-22 1981-08-18 Bell Telephone Laboratories, Incorporated Palladium treatment procedure
DE3108466C2 (de) * 1981-03-06 1983-05-26 Langbein-Pfanhauser Werke Ag, 4040 Neuss Verwendung eines Acetylenalkohols in einem Bad zur galvanischen Abscheidung einer Palladium/Nickel-Legierung
DE3232735C2 (de) * 1981-09-11 1984-04-26 LPW-Chemie GmbH, 4040 Neuss Verwendung einer als Glanzbildnerzusatz zu Nickelbädern bekannten Verbindung als Korrosionsschutzadditiv

Also Published As

Publication number Publication date
BR8405026A (pt) 1985-08-20
CA1255618A (en) 1989-06-13
JPS60106993A (ja) 1985-06-12
DK446884A (da) 1985-05-16
EP0146152A1 (en) 1985-06-26
DE3461834D1 (en) 1987-02-05
AU549886B2 (en) 1986-02-20
ES8602971A1 (es) 1985-12-01
ES536238A0 (es) 1985-12-01
ATE24554T1 (de) 1987-01-15
KR890002838B1 (ko) 1989-08-04
AU3329584A (en) 1985-05-30
EP0146152B1 (en) 1986-12-30
JPS623238B2 (no) 1987-01-23
NO165250B (no) 1990-10-08
US4463060A (en) 1984-07-31
MX162670A (es) 1991-06-14
DK446884D0 (da) 1984-09-19
KR850004135A (ko) 1985-07-01
NO843689L (no) 1985-05-20

Similar Documents

Publication Publication Date Title
NO165250C (no) Elektrisk ledende substrat forsynt med et palladiumnikkelbelegg og fremsgangsmaate ved fremstilling av det belagte substrat.
KR940006425A (ko) 투명 면상 히터 및 그 제조방법
US4770946A (en) Surface-treated magnesium or magnesium alloy, and surface treatment process therefor
KR910002975A (ko) 직조표면을 갖는 폴리이미드 기질 및 상기 기질의 금속화처리
JPH01306574A (ja) ＳｎまたはＳｎ合金被覆材料
EP0293981A3 (en) Processes for the manufacture of superconducting inorganic compounds and the products of such processes
DE3476684D1 (en) Amorphous transition metal alloy, thin gold coated, electrical contact
JPS63121693A (ja) コネクタ−用端子
DE3870911D1 (de) Verfahren zur herstellung einer stromlos abgeschiedenen, loetbaren metallschicht.
JPS61276982A (ja) マグネシユウム合金へのメツキ方法
JPS5945754B2 (ja) 時計用外装部品
JPS6486527A (en) Ccb tape carrier
US3807971A (en) Deposition of non-porous and durable tin-gold surface layers in microinch thicknesses
JPH03115583A (ja) 光吸収体及びその製造方法
JPS61284593A (ja) 接触子用銅合金条の製造方法
US2211582A (en) Process of electrolytically coating nonconductive materials
JPH03104250A (ja) フレキシブル回路基板及びその製造方法
JPS63255377A (ja) 透明導電膜パタ−ン上の金属電極層
JPS6417450A (en) Formation of bump
JPS5560043A (en) Sealing parts
Sterling Electroplating Electrical Contacts
JPS56142886A (en) Tin plating method for aluminum alloy
Shinga et al. Silver-Coated Electric Materials and a Method for Their Production
JPS63239789A (ja) 接触子の製造方法
JPS59106175A (ja) スイツチ用回路板の製造方法