KR850004135A - 납땜성 팔라디움-니켈 코팅 - Google Patents

납땜성 팔라디움-니켈 코팅 Download PDF

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Publication number
KR850004135A
KR850004135A KR1019840006282A KR840006282A KR850004135A KR 850004135 A KR850004135 A KR 850004135A KR 1019840006282 A KR1019840006282 A KR 1019840006282A KR 840006282 A KR840006282 A KR 840006282A KR 850004135 A KR850004135 A KR 850004135A
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South Korea
Prior art keywords
coating
nickel
substrate
palladium
atomic percent
Prior art date
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KR1019840006282A
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English (en)
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KR890002838B1 (ko
Inventor
웨인 업디그래프 스티이븐
Original Assignee
도늘드 에이 호우즈
이 아이 듀우판 디 네모아 앤드 캄파니
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=24203230&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR850004135(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 도늘드 에이 호우즈, 이 아이 듀우판 디 네모아 앤드 캄파니 filed Critical 도늘드 에이 호우즈
Publication of KR850004135A publication Critical patent/KR850004135A/ko
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Publication of KR890002838B1 publication Critical patent/KR890002838B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12868—Group IB metal-base component alternative to platinum group metal-base component [e.g., precious metal, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12875—Platinum group metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12882—Cu-base component alternative to Ag-, Au-, or Ni-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/1291—Next to Co-, Cu-, or Ni-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12944—Ni-base component

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • ing And Chemical Polishing (AREA)
  • Non-Insulated Conductors (AREA)
  • Coating With Molten Metal (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

내용 없음

Description

납땜성 팔라디움-니켈 코팅
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 실시예 1의 샐플 IC의 그래프로서 횡좌표는 표면하 코팅깊이(Å)를, 종좌표는 금속의 원자퍼센트를 나타낸 것이다.
제2도는 실시예 2의 샘플 2a의 그래프로서 횡좌표는 표면하 코팅깊이(Å)를, 종좌표는 금속의 원자퍼센트를 나타낸 것이다.
제3도는 실시예 2의 샘플 2b)의 그래프로서 횡좌표는 표면하 코팅깊이(Å)를 종좌표는 금속의 원자퍼센트를 나타낸 것이다.

Claims (7)

  1. 46-82원자%의 팔라디움과 18-54원자%의 니켈로 구성된 기질에 접착된 제1합금층과 96-100원자%의 금속팔라디움과 0-4원자%의 니켈로 구성된 상기 제1층을 덮는 두께 20Å 이하의 제2연속층으로 구성된 전기 전도성기질 상에 피복된 영구납땜성 팔라디움-니켈 전기도금 코팅.
  2. 제1항에 있어서, 제2층이 저 하중에서 10g의 평균력하에 2mΩ 이하의 전기접촉저항을 갖는 코팅.
  3. 제1항에 있어서 기질이 와이어인 코팅.
  4. 제1항에 있어서, 기질이 인청동합금인 코팅.
  5. 제1항에 있어서 기질이 니켈도금 구리 기제 합금인 코팅.
  6. 제1항에 있어서 제1합금층이 0.1-1.5μm 두께인 코팅.
  7. 1) 필라디움 Ⅱ 암민클로라이드 2) 니켈암민설페이트 또는 니켈클로라이드 3) 나트륨비닐설포네이트, 나트륨알릴설포네이트 및 4급 피리딘으로 구성된 군으로부터 선택된 광택제. 4) 암모늄설페이트 또는 클로라이드로 구성된 전기도금욕중에 온도 35-55℃, pH7.5-9, 전류밀도 5-25amp/sq dm에서 맹렬히 교반하면서 기질을 함침시켜 도금된 표면을 생성시킨 다음 도금된 표면을 황산 또는 염산의 정전수용액중에 침지시키는 것으로 구성된 전기전도성기질상에 영구납땜성 팔라디움-니켈 코팅을 얻는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019840006282A 1983-11-15 1984-10-11 영구 납땜성 팔라듐 - 니켈 전기도금 코팅 KR890002838B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US551,925 1983-11-15
US06/551,925 US4463060A (en) 1983-11-15 1983-11-15 Solderable palladium-nickel coatings and method of making said coatings
US551925 1983-11-15

Publications (2)

Publication Number Publication Date
KR850004135A true KR850004135A (ko) 1985-07-01
KR890002838B1 KR890002838B1 (ko) 1989-08-04

Family

ID=24203230

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019840006282A KR890002838B1 (ko) 1983-11-15 1984-10-11 영구 납땜성 팔라듐 - 니켈 전기도금 코팅

Country Status (13)

Country Link
US (1) US4463060A (ko)
EP (1) EP0146152B1 (ko)
JP (1) JPS60106993A (ko)
KR (1) KR890002838B1 (ko)
AT (1) ATE24554T1 (ko)
AU (1) AU549886B2 (ko)
BR (1) BR8405026A (ko)
CA (1) CA1255618A (ko)
DE (1) DE3461834D1 (ko)
DK (1) DK446884A (ko)
ES (1) ES536238A0 (ko)
MX (1) MX162670A (ko)
NO (1) NO165250C (ko)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4613069A (en) * 1981-11-23 1986-09-23 The United States Of America As Represented By The Secretary Of The Interior Method for soldering aluminum and magnesium
US4628165A (en) * 1985-09-11 1986-12-09 Learonal, Inc. Electrical contacts and methods of making contacts by electrodeposition
US4849303A (en) * 1986-07-01 1989-07-18 E. I. Du Pont De Nemours And Company Alloy coatings for electrical contacts
US4743346A (en) * 1986-07-01 1988-05-10 E. I. Du Pont De Nemours And Company Electroplating bath and process for maintaining plated alloy composition stable
US4846941A (en) * 1986-07-01 1989-07-11 E. I. Du Pont De Nemours And Company Electroplating bath and process for maintaining plated alloy composition stable
ATE89337T1 (de) * 1988-02-25 1993-05-15 Du Pont Elektroplattierungsbad und verfahren zum stabilhalten der zusammensetzung der plattierten legierung.
EP0335683B1 (en) * 1988-04-01 1993-10-20 E.I. Du Pont De Nemours And Company Electroplated alloy coatings having stable alloy composition
JPH0359972A (ja) * 1989-07-27 1991-03-14 Yazaki Corp 電気接点
JPH0484449A (ja) * 1990-07-27 1992-03-17 Shinko Electric Ind Co Ltd Ｔａｂテープ
US6060175A (en) * 1990-09-13 2000-05-09 Sheldahl, Inc. Metal-film laminate resistant to delamination
US5086966A (en) * 1990-11-05 1992-02-11 Motorola Inc. Palladium-coated solder ball
US5597470A (en) * 1995-06-18 1997-01-28 Tessera, Inc. Method for making a flexible lead for a microelectronic device
US5749933A (en) * 1996-03-28 1998-05-12 Johns Manville International, Inc. Apparatus and method for producing glass fibers
SG71046A1 (en) 1996-10-10 2000-03-21 Connector Systems Tech Nv High density connector and method of manufacture
JP3379412B2 (ja) * 1997-05-30 2003-02-24 松下電器産業株式会社 パラジウムめっき液とこれを用いたパラジウムめっき皮膜及びこのパラジウムめっき皮膜を有する半導体装置用リードフレーム
US7023231B2 (en) * 2004-05-14 2006-04-04 Solid State Measurements, Inc. Work function controlled probe for measuring properties of a semiconductor wafer and method of use thereof
US8636579B2 (en) 2006-11-09 2014-01-28 Wms Gaming Inc. Wagering game with pay lines extending through bonus regions
WO2012001132A1 (de) * 2010-06-30 2012-01-05 Schauenburg Ruhrkunststoff Gmbh Tribologisch belastbare edelmetall/metallschichten
US20140076798A1 (en) 2010-06-30 2014-03-20 Schauenburg Ruhrkunststoff Gmbh Tribologically Loadable Mixed Noble Metal/Metal Layers
JP6973051B2 (ja) * 2017-12-26 2021-11-24 株式会社リコー 液体吐出ヘッド、液体吐出ユニット、液体を吐出する装置
WO2020145096A1 (ja) * 2019-01-07 2020-07-16 株式会社村田製作所 濾過フィルタ
CN113993374A (zh) * 2019-06-21 2022-01-28 松下知识产权经营株式会社 动物信息管理系统和动物信息管理方法
CN113699565B (zh) * 2021-09-28 2023-07-04 万明电镀智能科技(东莞)有限公司 高耐蚀性钯镍合金镀层及其电镀方法和钯镍镀层电镀液

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4100039A (en) 1976-11-11 1978-07-11 International Business Machines Corporation Method for plating palladium-nickel alloy
US4284482A (en) * 1980-09-22 1981-08-18 Bell Telephone Laboratories, Incorporated Palladium treatment procedure
DE3108466C2 (de) * 1981-03-06 1983-05-26 Langbein-Pfanhauser Werke Ag, 4040 Neuss Verwendung eines Acetylenalkohols in einem Bad zur galvanischen Abscheidung einer Palladium/Nickel-Legierung
DE3232735C2 (de) * 1981-09-11 1984-04-26 LPW-Chemie GmbH, 4040 Neuss Verwendung einer als Glanzbildnerzusatz zu Nickelbädern bekannten Verbindung als Korrosionsschutzadditiv

Also Published As

Publication number Publication date
BR8405026A (pt) 1985-08-20
CA1255618A (en) 1989-06-13
JPS60106993A (ja) 1985-06-12
DK446884A (da) 1985-05-16
EP0146152A1 (en) 1985-06-26
DE3461834D1 (en) 1987-02-05
NO165250C (no) 1991-01-16
AU549886B2 (en) 1986-02-20
ES8602971A1 (es) 1985-12-01
ES536238A0 (es) 1985-12-01
ATE24554T1 (de) 1987-01-15
KR890002838B1 (ko) 1989-08-04
AU3329584A (en) 1985-05-30
EP0146152B1 (en) 1986-12-30
JPS623238B2 (ko) 1987-01-23
NO165250B (no) 1990-10-08
US4463060A (en) 1984-07-31
MX162670A (es) 1991-06-14
DK446884D0 (da) 1984-09-19
NO843689L (no) 1985-05-20

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