NL8303708A - Magnetische transducentkopeenheid. - Google Patents
Magnetische transducentkopeenheid. Download PDFInfo
- Publication number
- NL8303708A NL8303708A NL8303708A NL8303708A NL8303708A NL 8303708 A NL8303708 A NL 8303708A NL 8303708 A NL8303708 A NL 8303708A NL 8303708 A NL8303708 A NL 8303708A NL 8303708 A NL8303708 A NL 8303708A
- Authority
- NL
- Netherlands
- Prior art keywords
- transducer head
- magnetic
- head unit
- integrated circuit
- magnetic transducer
- Prior art date
Links
- 239000004020 conductor Substances 0.000 claims description 21
- 239000004033 plastic Substances 0.000 claims description 7
- 239000010409 thin film Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 11
- 239000000696 magnetic material Substances 0.000 description 10
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000004804 winding Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 229910052681 coesite Inorganic materials 0.000 description 2
- 229910052906 cristobalite Inorganic materials 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910052682 stishovite Inorganic materials 0.000 description 2
- 229910052905 tridymite Inorganic materials 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910000702 sendust Inorganic materials 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/33—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only
- G11B5/39—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects
- G11B5/3903—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects using magnetic thin film layers or their effects, the films being part of integrated structures
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B15/00—Driving, starting or stopping record carriers of filamentary or web form; Driving both such record carriers and heads; Guiding such record carriers or containers therefor; Control thereof; Control of operating function
- G11B15/02—Control of operating function, e.g. switching from recording to reproducing
- G11B15/12—Masking of heads; circuits for Selecting or switching of heads between operative and inoperative functions or between different operative functions or for selection between operative heads; Masking of beams, e.g. of light beams
- G11B15/14—Masking or switching periodically, e.g. of rotating heads
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/10—Structure or manufacture of housings or shields for heads
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/17—Construction or disposition of windings
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/29—Structure or manufacture of unitary devices formed of plural heads for more than one track
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3103—Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3103—Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing
- G11B5/3106—Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing where the integrated or assembled structure comprises means for conditioning against physical detrimental influence, e.g. wear, contamination
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/40—Protective measures on heads, e.g. against excessive temperature
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B15/00—Driving, starting or stopping record carriers of filamentary or web form; Driving both such record carriers and heads; Guiding such record carriers or containers therefor; Control thereof; Control of operating function
- G11B15/60—Guiding record carrier
- G11B15/602—Guiding record carrier for track selection, acquisition or following
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/10—Structure or manufacture of housings or shields for heads
- G11B5/102—Manufacture of housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31522—Next to metal
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Magnetic Heads (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57189860A JPS5979417A (ja) | 1982-10-28 | 1982-10-28 | 磁気ヘツド装置 |
| JP18986082 | 1982-10-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL8303708A true NL8303708A (nl) | 1984-05-16 |
Family
ID=16248388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL8303708A NL8303708A (nl) | 1982-10-28 | 1983-10-27 | Magnetische transducentkopeenheid. |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US4642716A (fr) |
| JP (1) | JPS5979417A (fr) |
| CA (1) | CA1209259A (fr) |
| DE (1) | DE3339037C2 (fr) |
| FR (1) | FR2535500B1 (fr) |
| GB (1) | GB2130425B (fr) |
| NL (1) | NL8303708A (fr) |
Families Citing this family (52)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59138339A (ja) * | 1983-01-28 | 1984-08-08 | Toshiba Corp | 半導体装置 |
| US4685005A (en) * | 1983-07-18 | 1987-08-04 | International Business Machines Corporation | Two-module-read, read-after-write, bi-directional tape drive |
| FR2559297B1 (fr) * | 1984-02-03 | 1990-01-12 | Commissariat Energie Atomique | Nouveau patin de vol pour tetes magnetiques d'enregistrement |
| JPS619814A (ja) * | 1984-06-25 | 1986-01-17 | Sony Corp | 複合型磁気ヘツド装置 |
| JPH0423735Y2 (fr) * | 1984-09-26 | 1992-06-03 | ||
| WO1986002189A1 (fr) * | 1984-10-05 | 1986-04-10 | Olympus Optical Co., Ltd. | Tete magnetique composee |
| EP0206771B1 (fr) * | 1985-06-20 | 1992-03-11 | Kabushiki Kaisha Toshiba | Dispositif semi-conducteur encapsulé |
| US4649447A (en) * | 1985-08-15 | 1987-03-10 | International Business Machines | Combed MR sensor |
| JPS62245511A (ja) * | 1986-04-18 | 1987-10-26 | Hitachi Ltd | 磁気抵抗効果形磁気ヘツド及びその製造方法 |
| JPS63106910A (ja) * | 1986-10-24 | 1988-05-12 | Hitachi Ltd | 薄膜磁気ヘツド |
| JPH0740600B2 (ja) * | 1987-04-30 | 1995-05-01 | 三菱電機株式会社 | 半導体装置 |
| US4739449A (en) * | 1987-06-30 | 1988-04-19 | Kaufman Lance R | Circuit package with thermal expansion relief chimney |
| GB8725467D0 (en) * | 1987-10-30 | 1987-12-02 | Honeywell Control Syst | Making current sensor |
| JPH0732215B2 (ja) * | 1988-10-25 | 1995-04-10 | 三菱電機株式会社 | 半導体装置 |
| US4910581A (en) * | 1988-12-27 | 1990-03-20 | Motorola, Inc. | Internally molded isolated package |
| JPH02124575U (fr) * | 1989-03-24 | 1990-10-15 | ||
| US5006946A (en) * | 1989-04-19 | 1991-04-09 | Tdk Corporation | Flexible polymeric resinous magnetic head supporting device |
| US5001583A (en) * | 1989-04-19 | 1991-03-19 | Tdk Corporation | Flexible polymeric resinous magnetic head supporting device |
| US5166846A (en) * | 1989-05-25 | 1992-11-24 | Sony Corporation | Magnetic head with shielded mounting |
| US5103359A (en) * | 1990-02-05 | 1992-04-07 | Maxtor Corporation | Connector apparatus for electrically coupling a transducer to the electronics of a magnetic recording system |
| US5216283A (en) * | 1990-05-03 | 1993-06-01 | Motorola, Inc. | Semiconductor device having an insertable heat sink and method for mounting the same |
| US5151559A (en) * | 1991-05-02 | 1992-09-29 | International Business Machines Corporation | Planarized thin film surface covered wire bonded semiconductor package |
| US5586388A (en) * | 1991-05-31 | 1996-12-24 | Nippondenso Co., Ltd. | Method for producing multi-board electronic device |
| JP2931477B2 (ja) * | 1991-06-07 | 1999-08-09 | シャープ株式会社 | 薄膜磁気ヘッド構造体およびその製造方法 |
| CN1058799C (zh) * | 1993-01-08 | 2000-11-22 | 国际商业机器公司 | 薄膜磁传感器和悬架组件及其制造方法以及磁盘驱动组件 |
| JPH06325322A (ja) * | 1993-03-16 | 1994-11-25 | Sharp Corp | 薄膜磁気ヘッドおよびその製造方法 |
| JPH07169015A (ja) * | 1993-12-10 | 1995-07-04 | Sony Corp | 磁気ヘッド |
| JP3262445B2 (ja) * | 1994-02-18 | 2002-03-04 | 富士通株式会社 | ヘッドアセンブリ及び記憶装置 |
| JP3753751B2 (ja) * | 1994-07-28 | 2006-03-08 | 富士通株式会社 | 記録再生装置 |
| DE69730691T2 (de) * | 1996-11-21 | 2005-09-22 | Koninklijke Philips Electronics N.V. | Magnetkopf mit integriertem schaltkreis und verfahren zu dessen herstellung |
| US5873159A (en) * | 1997-07-08 | 1999-02-23 | International Business Machines Corporation | Method of manufacturing a transducer suspension system |
| JP3761329B2 (ja) | 1997-11-17 | 2006-03-29 | 富士通株式会社 | 記憶装置 |
| JPH11185233A (ja) * | 1997-12-24 | 1999-07-09 | Tdk Corp | 磁気ヘッド装置 |
| US7116523B2 (en) | 1998-12-21 | 2006-10-03 | Hitachi Global Storage Technologies Netherlands B.V. | Interconnect module for use in a suspension assembly |
| JP3581268B2 (ja) * | 1999-03-05 | 2004-10-27 | 株式会社東芝 | ヒートシンク付半導体装置およびその製造方法 |
| JP3400378B2 (ja) | 1999-03-26 | 2003-04-28 | アルプス電気株式会社 | 薄膜磁気ヘッドを用いた回転ヘッド組立体 |
| JP2002100016A (ja) | 2000-09-21 | 2002-04-05 | Toshiba Corp | ヘッドサスペンションアッセンブリ |
| JP2003317202A (ja) * | 2002-04-11 | 2003-11-07 | Cis Electronica Industria & Comercio Ltda | 磁気読み取り装置の磁気ヘッド |
| DE10229542B4 (de) * | 2002-07-01 | 2004-05-19 | Infineon Technologies Ag | Elektronisches Bauteil mit mehrschichtiger Umverdrahtungsplatte und Verfahren zur Herstellung desselben |
| US7812683B2 (en) * | 2002-10-15 | 2010-10-12 | Marvell World Trade Ltd. | Integrated circuit package with glass layer and oscillator |
| US7791424B2 (en) * | 2002-10-15 | 2010-09-07 | Marvell World Trade Ltd. | Crystal oscillator emulator |
| US7768360B2 (en) | 2002-10-15 | 2010-08-03 | Marvell World Trade Ltd. | Crystal oscillator emulator |
| US7760039B2 (en) * | 2002-10-15 | 2010-07-20 | Marvell World Trade Ltd. | Crystal oscillator emulator |
| US20060113639A1 (en) * | 2002-10-15 | 2006-06-01 | Sehat Sutardja | Integrated circuit including silicon wafer with annealed glass paste |
| JP4919690B2 (ja) * | 2006-04-19 | 2012-04-18 | シーイエス エレクトロニカ インダストリア エ コメルスィオ リミタダ | 磁気カード読み取りシステム |
| US8629539B2 (en) | 2012-01-16 | 2014-01-14 | Allegro Microsystems, Llc | Methods and apparatus for magnetic sensor having non-conductive die paddle |
| US9812588B2 (en) | 2012-03-20 | 2017-11-07 | Allegro Microsystems, Llc | Magnetic field sensor integrated circuit with integral ferromagnetic material |
| US10234513B2 (en) | 2012-03-20 | 2019-03-19 | Allegro Microsystems, Llc | Magnetic field sensor integrated circuit with integral ferromagnetic material |
| US9494660B2 (en) | 2012-03-20 | 2016-11-15 | Allegro Microsystems, Llc | Integrated circuit package having a split lead frame |
| US9666788B2 (en) | 2012-03-20 | 2017-05-30 | Allegro Microsystems, Llc | Integrated circuit package having a split lead frame |
| US9411025B2 (en) | 2013-04-26 | 2016-08-09 | Allegro Microsystems, Llc | Integrated circuit package having a split lead frame and a magnet |
| US10991644B2 (en) | 2019-08-22 | 2021-04-27 | Allegro Microsystems, Llc | Integrated circuit package having a low profile |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US29683A (en) * | 1860-08-21 | Improvement in fastenings for cotton-bales | ||
| JPS4828958B1 (fr) * | 1969-07-22 | 1973-09-06 | ||
| US3657806A (en) * | 1970-12-28 | 1972-04-25 | Ibm | Method for manufacturing a thin-film magnetic head assembly |
| US4030189A (en) * | 1973-02-21 | 1977-06-21 | Compagnie Internationale Pour L'informatique | Method of making magnetic head devices |
| FR2218611B1 (fr) * | 1973-02-21 | 1976-09-10 | Cii | |
| JPS573132B2 (fr) * | 1974-01-19 | 1982-01-20 | ||
| JPS50156409A (fr) * | 1974-06-05 | 1975-12-17 | ||
| US3930114A (en) * | 1975-03-17 | 1975-12-30 | Nat Semiconductor Corp | Integrated circuit package utilizing novel heat sink structure |
| JPS51112317A (en) * | 1975-03-27 | 1976-10-04 | Toray Ind Inc | Magnetic head |
| JPS5269606A (en) * | 1975-12-09 | 1977-06-09 | Fujitsu Ltd | Packaging of circuits around magnetic head |
| JPS5369623A (en) * | 1976-12-03 | 1978-06-21 | Fujitsu Ltd | Magnetic head |
| NL189379C (nl) * | 1977-05-05 | 1993-03-16 | Richardus Henricus Johannes Fi | Werkwijze voor inkapselen van micro-elektronische elementen. |
| JPS5449113A (en) * | 1977-09-26 | 1979-04-18 | Mitsubishi Electric Corp | Magnetic head |
| US4218701A (en) * | 1978-07-24 | 1980-08-19 | Citizen Watch Co., Ltd. | Package for an integrated circuit having a container with support bars |
| US4209813A (en) * | 1979-01-18 | 1980-06-24 | Persci, Inc. | Dual magnetic head mounting and loading |
| US4229248A (en) * | 1979-04-06 | 1980-10-21 | Intel Magnetics, Inc. | Process for forming bonding pads on magnetic bubble devices |
| NL7908611A (nl) * | 1979-11-28 | 1981-07-01 | Philips Nv | Geintegreerde magneetkopconstructie. |
| NL7908713A (nl) * | 1979-12-03 | 1980-03-31 | Philips Nv | Magneetkopconstructie. |
| JPS56159864A (en) * | 1980-05-10 | 1981-12-09 | Yoshiro Nakamatsu | Thin film head assembly for computer magnetic disk |
| US4370802A (en) * | 1980-08-25 | 1983-02-01 | Applied Magnetics Corporation | Method of making a thin film magnetic head assembly with multiconductive connecting elements |
| US4402025A (en) * | 1980-10-17 | 1983-08-30 | Storage Technology Corporation | Servo read/write head arm assembly for magnetic disk drive |
| US4396936A (en) * | 1980-12-29 | 1983-08-02 | Honeywell Information Systems, Inc. | Integrated circuit chip package with improved cooling means |
| US4379316A (en) * | 1981-06-11 | 1983-04-05 | Siemens Corporation | Read/write head carriage assembly for a floppy disk drive |
| US4483067A (en) * | 1981-09-11 | 1984-11-20 | U.S. Philips Corporation | Method of manufacturing an identification card and an identification manufactured, for example, by this method |
| JPS5888818A (ja) * | 1981-11-19 | 1983-05-27 | Sony Corp | 磁気ヘツドの製法 |
| JPS58118017A (ja) * | 1981-12-29 | 1983-07-13 | Seiko Epson Corp | 磁気ヘツド |
| US4523243A (en) * | 1982-05-24 | 1985-06-11 | Storage Technology Corporation | Magnetoresistive transducer using an independent recessed electromagnetic bias |
| JPS5967669A (ja) * | 1982-10-12 | 1984-04-17 | Yamatake Honeywell Co Ltd | 磁気抵抗素子集積回路 |
| JPS59168968A (ja) * | 1983-03-17 | 1984-09-22 | Fujitsu Ltd | 磁気記憶装置 |
-
1982
- 1982-10-28 JP JP57189860A patent/JPS5979417A/ja active Pending
-
1983
- 1983-10-21 CA CA000439515A patent/CA1209259A/fr not_active Expired
- 1983-10-24 US US06/544,995 patent/US4642716A/en not_active Expired - Lifetime
- 1983-10-25 GB GB08328478A patent/GB2130425B/en not_active Expired
- 1983-10-27 DE DE3339037A patent/DE3339037C2/de not_active Expired - Fee Related
- 1983-10-27 NL NL8303708A patent/NL8303708A/nl not_active Application Discontinuation
- 1983-10-28 FR FR8317255A patent/FR2535500B1/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5979417A (ja) | 1984-05-08 |
| US4642716A (en) | 1987-02-10 |
| GB8328478D0 (en) | 1983-11-23 |
| FR2535500A1 (fr) | 1984-05-04 |
| FR2535500B1 (fr) | 1988-02-19 |
| GB2130425B (en) | 1986-09-17 |
| DE3339037C2 (de) | 1994-07-07 |
| DE3339037A1 (de) | 1984-05-03 |
| GB2130425A (en) | 1984-05-31 |
| CA1209259A (fr) | 1986-08-05 |
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